Hot plug structure of chip low-grid test board

Abstract

The utility model relates to the technical field of semiconductors, in particular to a chip low-grid test board hot plug structure, which comprises a male board fixing seat and a female board fixing seat, the male board fixing seat comprises a power plug, the female board fixing seat comprises a power jack, the power plug corresponds to the power jack, a male board probe board is arranged in the male board fixing seat, and the female board probe board is arranged in the female board fixing seat. According to the chip low-grid test board hot plug structure provided by the utility model, signal transmission is not influenced by independent transmission of a power supply, so that the success rate of chip test results is improved; the signal line is connected to the magnetic suction spring probe male head and the magnetic suction spring probe female head, and the magnetic suction spring probe male head and the magnetic suction spring probe female head are in butt joint through magnetic force, so that poor contact caused by interface damage in the plugging process is avoided.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductors, and particularly relates to a hot plug structure for a chip low-level test board. Background Art

[0002] A chip is a carrier of a circuit, which can miniaturize the circuit and has certain special functions. A chip is an entity product obtained by designing, manufacturing, and packaging and testing an integrated circuit with semiconductor as the raw material. Since the chip is small in size and complex in function, it is necessary to detect the functions of the chip after production.

[0003] Most of the existing chip tests are hot plug structures, specifically composed of a PCB board and a gold finger contact interface. Power and signals are transmitted to the PCB board through the gold finger contacts, and then received from the PCB board at each low-level test port. However, this structure has problems. For example, long-term hot plugging can easily deform and damage the gold fingers of the interface, resulting in poor contact. When the gold fingers transmit power and signals simultaneously, the power current may affect the signal transmission, resulting in a low success rate of chip test results. Summary of the Utility Model

[0004] In view of the above technical problems existing in the prior art, the utility model provides a hot plug structure for a chip low-level test board.

[0005] To achieve the above object, the utility model provides the following technical solutions:

[0006] A hot plug structure for a chip low-level test board includes a male board fixing seat and a female board fixing seat. The male board fixing seat is provided with a power plug, and the female board fixing seat is provided with a power socket. The power plug corresponds to the power socket, and the male board fixing seat and the female board fixing seat are plugged and unplugged through the power plug and the power socket;

[0007] A male board probe board is arranged inside the male board fixing seat. A magnetic spring probe male head is arranged inside the male board probe board. A fixing cover plate is further arranged on the male board fixing seat, and the male board probe board is fixed inside the male board fixing seat through the fixing cover plate;

[0008] A female board probe board is arranged inside the female board fixing seat. A magnetic spring probe female head magnetically matched with the magnetic spring probe male head is arranged inside the female board probe board. A limiting plate is further arranged on the female board fixing seat, and the female board probe board is fixed inside the female board fixing seat through the limiting plate.

[0009] Preferably, the male board probe board includes a male board probe board body and extension plate A. A pair of extension plate A are respectively arranged at both ends of the male board probe board body. The male board probe board body includes an upper body A and a lower body A;

[0010] The motherboard probe board includes a motherboard probe board body and an extension board B. A pair of extension boards B are respectively arranged at both ends of the motherboard probe board body, and the motherboard probe board body includes an upper body B and a lower body B.

[0011] Preferably, the public board probe board is embeddedly connected to the public board fixing seat, and the motherboard probe board is embeddedly connected to the motherboard fixing seat;

[0012] A groove A adapted to the lower body A is provided in the public board fixing seat, and an inner step A adapted to the extension board A is provided in the groove A. A groove B adapted to the lower body B is provided in the motherboard fixing seat, and an inner step B adapted to the extension board B is provided in the groove B.

[0013] Preferably, a fixing cover plate groove is provided on the fixing cover plate, a limiting plate groove is provided on the limiting plate, the upper body A is arranged in the fixing cover plate groove, and the upper body B is arranged in the limiting plate groove.

[0014] Preferably, the public board probe board and the motherboard probe board are in corresponding positions, the fixing cover plate and the limiting plate are in corresponding positions. When the power plug is inserted into the power jack, the public board probe board is connected to the motherboard probe board, the fixing cover plate is connected to the limiting plate, and the magnetic spring probe male head is magnetically connected to the magnetic spring probe female head.

[0015] Preferably, the number of the public board probe board, the fixing cover plate, the motherboard probe board and the limiting plate is all one pair.

[0016] Advantages of the present utility model:

[0017] A hot plugging structure of a chip low-level formatting test board provided by the present utility model includes a public board fixing seat and a motherboard fixing seat. The public board fixing seat includes a power plug, and the motherboard fixing seat includes a power jack. The power plug and the power jack are corresponding. A public board probe board is provided in the public board fixing seat, a magnetic spring probe male head is provided in the public board probe board, a motherboard probe board is provided in the motherboard fixing seat, and a magnetic spring probe female head is provided in the motherboard probe board. For the hot plugging structure of the chip low-level formatting test board provided by the present utility model, the separate transmission of the power supply will not affect the signal transmission, thereby improving the success rate of the chip test result. The signal line is connected to the magnetic spring probe male head and the magnetic spring probe female head, and the magnetic spring probe male head and the magnetic spring probe female head are docked by magnetic force, avoiding poor contact caused by damage to the interface during the plugging and unplugging process. Description of the drawings

[0018] Figure 1 It is an expanded view of a hot plugging structure of a chip low-level formatting test board.

[0019] Figure 2 It is a side view of the public board fixing seat and the motherboard fixing seat.

[0020] Figure 3It is an exploded view of the common board fixing seat and components.

[0021] Figure 4 It is an exploded view of the motherboard fixing seat and components.

[0022] Figure 5 It is a three-dimensional view of the common board probe board and the motherboard probe board.

[0023] Reference numerals: common board fixing seat 1, groove A101, inner step A102, power plug 103, common board probe board 110, common board probe board body 111, upper body A112, lower body A113, extension board A114, magnetic spring probe male head 115, fixed cover plate 120, fixed cover plate groove 121;

[0024] Motherboard fixing seat 2, groove B201, inner step B202, power socket 203, motherboard probe board 210, motherboard probe board body 211, upper body B212, lower body B213, extension board B214, magnetic spring probe female head 215, limit plate 220, limit plate groove 221. Detailed implementation manners

[0025] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Without conflict, the following embodiments and the features in the embodiments can be combined with each other.

[0026] As Figures 1 to 5 shown, a hot plugging structure of a chip low-level formatting test board includes a common board fixing seat 1 and a motherboard fixing seat 2. The common board fixing seat 1 is provided with a power plug 103, and the motherboard fixing seat 2 is provided with a power socket 203. The positions of the power plug 103 and the power socket 203 correspond to each other. Among them, the power plug 103 is a banana plug male head, the power socket 203 is a banana plug female head, and the common board fixing seat 1 and the motherboard fixing seat 2 are connected by plugging and unplugging the power plug 103 and the power socket 203.

[0027] The public board fixing seat 1 is provided with a public board probe board 110. The public board probe board 110 is provided with a plurality of magnetic spring probe male heads 115. The plurality of magnetic spring probe male heads 115 are equidistantly distributed. The public board fixing seat 1 is further provided with a fixing cover plate 120. The fixing cover plate 120 is detachably connected to the public board fixing seat 1 through bolt fasteners. The mother board fixing seat 2 is provided with a mother board probe board 210. The mother board probe board 210 is provided with a plurality of magnetic spring probe female heads 215. The plurality of magnetic spring probe female heads 215 are equidistantly distributed. The limiting plate 220 is detachably connected to the mother board fixing seat 2 through bolt fasteners. The number of the public board probe board 110 and the fixing cover plate 120, and the mother board probe board 210 and the limiting plate 220 is the same and both are a pair. The public board probe board 110 and the mother board probe board 210 are in corresponding positions, and the fixing cover plate 120 and the limiting plate 220 are in corresponding positions. Among them, the power supply lines of each test port on the test board are aggregated to the power supply plug 103 and the power supply jack 203, and the signal lines of each test port on the test board are connected to the magnetic spring probe male heads 115 and the magnetic spring probe female heads 215. When the power supply plug 103 in the public board fixing seat 1 is inserted into the power supply jack 203 of the mother board fixing seat 2, the power supply is turned on. When the public board fixing seat 1 reaches the limiting position, the outer surface of the fixing cover plate 120 abuts against the outer surface of the limiting plate 220. At this time, the magnetic spring probe male heads 115 and the magnetic spring probe female heads 215 are adsorbed together under the action of magnetic force, and the signal lines are connected.

[0028] Furthermore, the public board probe board 110 is embedded in the public board fixing seat 1, and the mother board probe board 210 is embedded in the mother board fixing seat 2. The public board probe board 110 includes a public board probe board body 111 and a pair of extension plates A114. The pair of extension plates A114 are respectively arranged at both ends of the public board probe board body 111. The public board probe board body 111 includes an upper body A112 and a lower body A113. The mother board probe board 210 includes a mother board probe board body 211 and a pair of extension plates B214. The pair of extension plates B214 are respectively arranged at both ends of the mother board probe board body 210. The mother board probe board body 211 includes an upper body B212 and a lower body B213.

[0029] The common board fixing base 1 is provided with a groove A101. Inside the groove A101, there are a pair of inner stepped platforms A102. The lower body A113 is adapted to the groove A101 and is arranged inside the groove A101. The extension plate A114 is adapted to the inner stepped platform A102 and is arranged on the inner stepped platform A102. At this time, the bottom surface of the extension plate A114 abuts against the top surface of the inner stepped platform A101. The mother board fixing base 2 is provided with a groove B201. Inside the groove B201, there are a pair of inner stepped platforms B202. The lower body B213 is matched with the groove B201 and is arranged inside the groove B201. The extension plate B214 is adapted to the inner stepped platform B202 and is arranged on the inner stepped platform B202. At this time, the bottom surface of the extension plate B214 abuts against the upper top surface of the inner stepped platform B202.

[0030] The common board probe board 110 is fixed inside the common board fixing base 1 through a fixing cover plate 120. The mother board probe board 210 is fixed inside the mother board fixing base 2 through a limiting plate 220. The fixing cover plate 120 is provided with a fixing cover plate groove 121, and the limiting plate 220 is provided with a limiting plate groove 221. The fixing cover plate groove 121 is adapted to the upper body A112, and the limiting plate groove 221 is adapted to the upper body B212. The upper body A112 is arranged inside the fixing cover plate groove 121, and the upper body B212 is arranged inside the limiting plate groove 221. At this time, the bottom surfaces of the fixing cover plate 120 and the limiting plate 220 abut against the top surfaces of the extension plate A114 and the extension plate B214. Since the lower body A113 of the common board probe board 110 is arranged inside the groove A101 in the common board fixing base 1, and the lower body B213 of the mother board probe board 210 is arranged inside the groove B201 in the mother board fixing base 2, and then the fixing cover plate 120 fixes the upper body A112 of the common board probe board 110, and the limiting plate 220 fixes the upper body B212 of the mother board probe board 210, making its structure more compact.

[0031] In summary, since the power supply and the signal line are separately arranged, the power supply and the signal are transmitted separately, thus avoiding the influence of the power supply current on the signal and improving the qualified rate of product testing. The signal line is connected to the magnetic spring probe male head 115 and the magnetic spring probe female head 215. The magnetic spring probe male head 115 and the magnetic spring probe female head 215 are magnetically docked, avoiding poor contact caused by damage to the interface during the plugging and unplugging process.

[0032] Therefore, the detailed description of the embodiments of the present invention provided in the drawings above is not intended to limit the scope of the claimed present invention, but merely represents selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative efforts belong to the scope of protection of the present invention.

[0033] In the description of the present utility model, it should be noted that the orientation or positional relationship indicated by the terms "middle", "upper", "lower", "horizontal", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship in which the product of the present utility model is customarily placed during use. It is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present utility model. In addition, the terms "first", "second", etc. are only used for distinguishing descriptions and cannot be understood as indicating or implying relative importance.

[0034] In the description of the present utility model, it should be noted that unless otherwise clearly specified and defined, the terms "set", "connected", "connected to" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection. It can be a mechanical connection or an electrical connection. It can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific situations.

Claims

1. A hot-swap structure for a low-level chip test board, comprising a male board fixing seat (1) and a motherboard fixing seat (2), characterized in that: The male board fixing seat (1) includes a power plug (103), and the female board fixing seat (2) includes a power socket (203). The power plug (103) corresponds to the power socket (203), and the male board fixing seat (1) and the female board fixing seat (2) are connected by plugging and unplugging through the power plug (103) and the power socket (203). A male plate probe plate (110) is arranged in the male plate fixing seat (1), a magnetic spring probe male head (115) is arranged in the male plate probe plate (110), a fixing cover plate (120) is also arranged on the male plate fixing seat (1), and the male plate probe plate (110) is fixed in the male plate fixing seat (1) through the fixing cover plate (120); A motherboard probe plate (210) is arranged in the motherboard fixing seat (2), and a magnetic spring probe female head (215) which is magnetically matched with a magnetic spring probe male head (115) is arranged in the motherboard probe plate (210). A limiting plate (220) is also arranged on the motherboard fixing seat (2), and the motherboard probe plate (210) is fixed in the motherboard fixing seat (2) via the limiting plate (220).

2. A hot-swap structure for a low-level chip test board according to claim 1, characterized in that: The male probe board (110) comprises a male probe board body (111) and an extension board A (114), wherein a pair of extension boards A (114) are respectively arranged at two ends of the male probe board body (111), and the male probe board body (111) comprises an upper body A (112) and a lower body A (113); The motherboard probe board (210) includes a motherboard probe board body (211) and an extension board B (214), wherein a pair of extension boards B (214) are respectively arranged at two ends of the motherboard probe board (210) body, and the motherboard probe board body (211) includes an upper body B (212) and a lower body B (213).

3. A hot-swap structure for a low-grid chip test board according to claim 2, characterized in that: The male board probe plate (110) is embeddedly connected to the male board fixing seat (1), and the female board probe plate (210) is embeddedly connected to the female board fixing seat (2); The male plate fixing seat (1) is provided with a groove A (101) adapted to the lower body A (113), and the groove A (101) is provided with an inner step A (102) adapted to the extension plate A (114); the female plate fixing seat (2) is provided with a groove B (201) adapted to the lower body B (213), and the groove B (201) is provided with an inner step B (202) adapted to the extension plate B (214).

4. A hot-swap structure for a low-level chip test board according to claim 2, characterized in that: The fixed cover plate (120) is provided with a fixed cover plate groove (121), the limiting plate (220) is provided with a limiting plate groove (221), the upper body A (112) is arranged in the fixed cover plate groove (121), and the upper body B (212) is arranged in the limiting plate groove (221).

5. The hot-swap structure of a low-level chip test board according to claim 1, characterized in that: The male probe board (110) and the female probe board (210) correspond in position, the fixed cover (120) and the limit plate (220) correspond in position, and when the power plug (103) is inserted into the power socket (203), the male probe board (110) and the female probe board (210) are connected, the fixed cover (120) and the limit plate (220) are connected, and the magnetic spring probe male head (115) and the magnetic spring probe female head (215) are magnetically connected.

6. A hot-swap structure for a low-level chip test board according to claim 5, characterized in that: The number of the male probe plate (110), the fixed cover plate (120), the female probe plate (210) and the limiting plate (220) is a pair.

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