Packaging device test fixture

Abstract

The utility model provides a test fixture for a packaging device, which belongs to the technical field of microwave test and comprises an upper fixture body and a lower fixture body, and the upper fixture body is provided with a vacuum through hole; the lower clamp body is provided with an accommodating cavity for accommodating a to-be-tested packaging device, and the accommodating cavity is positioned below the vacuum through hole; an upper connector and a lower connector which are used for connecting signals are further arranged in the lower clamp body. The upper connector is arranged on the outer side of the accommodating cavity, and the lower connector is arranged at the bottom of the accommodating cavity; during testing, the upper clamp body presses the to-be-tested packaging device arranged in the accommodating cavity, and an upper surface bonding pad of the to-be-tested packaging device is connected with the testing plate below the lower clamp body through the upper clamp body and the upper connector; and the lower surface bonding pad of the to-be-tested packaging device is connected with the test board through the lower connector, so that the double-sided test of the packaging device is realized. According to the utility model, the double-sided test of the packaging device can be realized, and the packaging device has the advantages of good heat dissipation effect and accurate test data.

Description

Technical Field

[0001] The utility model belongs to the technical field of microwave testing, and particularly relates to a test fixture for a packaging device that can be used for flip-chip packaging. Background Art

[0002] Compared with traditional front packaging, flip-chip packaging has the advantages of small volume, high pad density, excellent heat dissipation characteristics, etc. In common flip-chip packaging, the lower surface is usually the area where functional pads are laid, and the upper surface only serves as a heat dissipation area and does not have functions such as power supply and grounding. When testing such flip-chip packaging devices, only contact testing of the lower surface is required. Based on common flip-chip packaging, a special flip-chip packaging is derived. Its characteristics are that the lower surface is the area where functional pads are laid, and the upper surface is the heat dissipation and grounding area: the functional pads on the lower surface can provide functions such as power supply, signal input, signal output, and grounding, and corresponding functional connections are required; the pads on the upper surface provide heat dissipation functions and need to be grounded. Since the upper surface of such a package is the heat dissipation channel of the device and needs to be grounded, higher requirements are put forward for the test fixture of this type of device, and the current test fixture has the following problems:

[0003] (1) Unable to achieve vacuum adsorption: Since the upper structure is an embedded probe structure, it is impossible to embed through holes for adsorption, so the vacuum suction function of the device cannot be realized, and an automatic test process cannot be adopted.

[0004] (2) Limitations in testing heat-generating devices: When heat is generated during device testing, since the probe and the device are in point-to-face contact and do not have the ability to absorb and dissipate heat, it is easy for heat to accumulate in the device and the temperature to rise, which will lead to a decrease in device performance and data that cannot represent the device performance level.

[0005] (3) Poor device position consistency: Both its upper and lower structures are embedded with probes, and the probes have a considerable amount of expansion and contraction. When the test device clamps the device, due to the absence of a positioning frame, it is impossible to ensure the consistency of the device position during testing.

[0006] (4) Complicated operation of maintaining and replacing probes: Both its upper and lower structures only have a pressing function, and moreover, they cannot achieve grounding treatment of the upper surface of the device, and both are embedded with probes. When the probes reach the maintenance period and lifespan, all the probes of the upper and lower structures need to be operated. Summary of the Utility Model

[0007] An embodiment of the utility model provides a test fixture for a packaging device, aiming to solve the problems of inability to vacuum adsorb, poor heat dissipation, and poor position consistency proposed by the prior art.

[0008] To achieve the above object, the technical solution adopted by the utility model is: to provide a test fixture for a packaging device, including:

[0009] The upper clamping body is provided with vacuum through holes; and

[0010] The lower clamping body is provided with a receiving cavity for receiving the packaged device to be tested, and the receiving cavity is located below the vacuum through holes; an upper connector and a lower connector for connecting signals are further provided in the lower clamping body; the upper connector is arranged outside the receiving cavity, and the lower connector is arranged at the bottom of the receiving cavity;

[0011] When testing, the upper clamping body presses the packaged device to be tested placed in the receiving cavity, and the upper surface pads of the packaged device to be tested are connected to the test board below the lower clamping body through the upper clamping body and the upper connector;

[0012] The lower surface pads of the packaged device to be tested are connected to the test board through the lower connector.

[0013] In an implementable manner, a pressing boss protruding downward is arranged at the middle part of the upper clamping body, and the vacuum through holes penetrate through the pressing boss.

[0014] In an implementable manner, ventilation capillary holes vertically penetrating through the vacuum through holes are arranged on the pressing boss.

[0015] In an implementable manner, a guiding inclined surface is arranged on the inner wall of the receiving cavity.

[0016] In an implementable manner, the upper connector is a spring probe, including an upper connecting probe, a lower connecting probe and a spring. A guiding hole is arranged along the axis of the upper connecting probe, and the lower connecting probe is slidably connected in the guiding hole; the spring is arranged in the guiding hole and is squeezed and deformed by the upper connecting probe and the lower connecting probe; the structure of the lower connector is the same as that of the upper connector.

[0017] In an implementable manner, a mounting hole for mounting the upper connector is arranged on the lower clamping body, and the mounting hole has a limiting step for limiting the upper connector.

[0018] In an implementable manner, a positioning structure is further arranged between the upper clamping body and the lower clamping body. The positioning structure includes a positioning hole arranged on the lower surface of the upper clamping body and a positioning pin arranged on the upper surface of the lower clamping body, and the positioning pin is matched with the positioning hole.

[0019] In an implementable manner, there are two groups of the positioning structures, which are symmetrically arranged along the center line of the vacuum through holes.

[0020] The test fixture for packaging devices provided by the present utility model has the following beneficial effects compared with the prior art: (1) Vacuum through-holes are provided on the upper fixture body, enabling the upper fixture body to have three functions. First, the upper fixture body has the basic function of pressing the packaging device to be tested. Second, in cooperation with the sorting equipment, the fixture can achieve the functions of automatic loading and unloading. The upper fixture body also serves as a tool for grasping the packaging device and can suck the packaging device to the test position of the lower fixture body through vacuum adsorption, that is, the packaging device can be sucked into the accommodation cavity through the upper fixture body to achieve automatic loading of the packaging device, and then by applying pressure to the upper fixture body, the packaging device is pressed tightly. The third function of the upper fixture body is to form a signal path for the upper surface pads of the test device, enabling the upper surface pads of the test device to be transmitted to the test board through the upper fixture body and the upper connector, realizing grounding of the upper surface grounding area. Therefore, not only the test connection of the lower surface pads of the test device is achieved, but also the test connection of the upper surface pads can be realized simultaneously; (2) The upper fixture body and the lower fixture body have a large surface area and a large heat dissipation area. When the packaging device generates heat, the heat is quickly transferred to the fixture body through the pads, improving the heat dissipation effect, thereby enhancing the data accuracy of the test performance of the packaging device. The heat dissipation effect can be improved by adjusting the material of the fixture body; (3) An accommodation cavity is provided inside the lower fixture body, and the packaging device is placed in the accommodation cavity, which has a limiting effect on the packaging device. Then, with the large-area contact and pressing of the upper fixture body, the consistency of the position of the packaging device during testing can be ensured, thereby improving the accuracy of the test data; (4) Both the upper connector and the lower connector are provided on the lower fixture body, with a simple structure, convenient installation, easy pressing operation, and simplicity in test maintenance and component replacement. When maintaining and replacing the connectors, only the lower fixture body needs to be operated, and there is no need to check and disassemble the upper fixture body, greatly reducing the complexity of the operation. Description of the Drawings

[0021] Figure 1 Schematic structural diagram of the test fixture for packaging devices provided by an embodiment of the present utility model;

[0022] Figure 2 Schematic structural diagram of the test fixture for packaging devices provided by an embodiment of the present utility model before testing;

[0023] Figure 3 Schematic structural diagram of the test fixture for packaging devices provided by an embodiment of the present utility model during testing;

[0024] Figure 4 Schematic structural diagram of the test fixture for packaging devices provided by an embodiment of the present utility model after testing;

[0025] Description of the reference numerals:

[0026] 1. Upper clamping body; 11. Ventilation capillary holes; 12. Vacuum through holes; 13. Compression bosses; 2. Lower clamping body; 21. Accommodation cavity; 22. Lower connector; 23. Upper connector; 24. Guide inclined surface; 3. Test board; 4. Encapsulated device. Detailed implementation manners

[0027] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present utility model clearer and more understandable, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present utility model and are not used to limit the present utility model.

[0028] Please refer to Figures 1 to 4 simultaneously, and a test fixture for an encapsulated device provided by the present utility model will be described. The test fixture for the encapsulated device includes: an upper clamping body 1 and a lower clamping body 2. The upper clamping body 1 is provided with vacuum through holes 12; the lower clamping body 2 is provided with an accommodation cavity 21 for accommodating the to-be-tested encapsulated device 4, and the accommodation cavity 21 is located below the vacuum through holes 12; an upper connector 23 and a lower connector 22 for connecting signals are further provided in the lower clamping body 2; the upper connector 23 is arranged outside the accommodation cavity 21, and the lower connector 22 is arranged at the bottom of the accommodation cavity 21; when testing, the upper clamping body 1 presses the to-be-tested encapsulated device 4 placed in the accommodation cavity 21, and the upper surface pads of the to-be-tested encapsulated device 4 are connected to the test board 3 below the lower clamping body 2 through the upper clamping body 1 and the upper connector 23; the lower surface pads of the to-be-tested encapsulated device 4 are connected to the test board 3 through the lower connector 22, so as to realize the double-sided test of the encapsulated device 4.

[0029] The test fixture for the encapsulation device 4 provided by the present utility model has the following beneficial effects compared with the prior art: (1) Vacuum through holes 12 are provided on the upper clamping body 1, so that the upper clamping body 1 has three functions. First, the upper clamping body 1 has the basic function of pressing the encapsulation device 4 to be tested. Second, the fixture has the functions of automatic loading and unloading. The upper clamping body 1 also serves as a tool for grasping the encapsulation device 4 and can cooperate with vacuum adsorption to suck the encapsulation device 4 to the test position of the lower clamping body 2, that is, the encapsulation device 4 can be sucked into the accommodation cavity 21 through the upper clamping body 1 to realize the automatic loading of the encapsulation device 4, and then by applying pressure to the upper clamping body 1, the encapsulation device 4 is pressed tightly. The third function of the upper clamping body 1 is to form a signal path for the upper surface pads of the test device, so that the upper surface pads of the test device are transmitted to the test board 3 through the upper clamping body 1 and the upper connector 23 to realize grounding of the upper surface grounding area. Therefore, not only the test connection of the lower surface pads of the test device is realized, but also the test connection of the upper surface pads can be realized, so as to realize the double-sided test of the encapsulation device 4. (2) The upper clamping body 1 and the lower clamping body 2 have a large surface area and a large heat dissipation area. When the encapsulation device 4 generates heat, the heat is quickly transferred to the clamping body through the pads, improving the heat dissipation effect, and thus improving the data accuracy of the test performance of the encapsulation device 4. The heat dissipation effect can be improved by adjusting the material of the clamping body. (3) An accommodation cavity 21 is provided in the lower clamping body 2, and the encapsulation device 4 is placed in the accommodation cavity 21, which has a limiting effect on the encapsulation device 4. Then, by using the large-area contact and pressing of the upper clamping body 1, the consistency of the position of the encapsulation device 4 during testing can be ensured, thereby improving the accuracy of the test data. (4) The upper connector 23 and the lower connector 22 are both provided on the lower clamping body 2, with a simple structure, convenient installation, easy pressing operation, and simplicity in test maintenance and component replacement. When maintaining and replacing the connectors, only the lower clamping body 2 needs to be operated, and there is no need to check and disassemble the upper clamping body 1, greatly reducing the complexity of the operation.

[0030] The upper clamping body 1 of the present application is installed on a force application mechanism such as a sorter, a press, or a manipulator to realize the automatic pressing of the upper clamping body 1, and the connection between the non-grounding pads on the upper surface of the device and the test board 3 can be completed by changing the shape, size, and material of the upper clamping body 1 to realize double-sided contact testing.

[0031] In some embodiments, as shown in Figures 1 to 4 shown, a pressing boss 13 protruding downward is provided in the middle part of the upper clamping body 1, and the vacuum through hole 12 penetrates through the pressing boss 13. When the surface-to-surface contact is too large, there will be a flatness problem, resulting in poor flattening and pressing. Therefore, the downward protruding pressing boss 13 is provided to reduce the contact area with the encapsulation device 4 and improve the stability of pressing.

[0032] Furthermore, as shown in Figures 1 to 4As shown, when the upper fixture body 1 is first pressed against the lower fixture body 2, the pressing boss 13 extends into the accommodating cavity 21. In this way, sufficient contact between the upper connector 23 and the upper fixture body 1 can be achieved, and sufficient pressing of the upper fixture body 1 on the packaged device 4 can also be ensured.

[0033] In some embodiments, referring to Figures 1 to 4 As shown, ventilation capillary holes 11 vertically penetrating the vacuum through holes 12 are provided on the pressing boss 13. When the heat absorption and dissipation capabilities of the upper fixture body 1 are insufficient, external air communicates with the vacuum through holes 12 through the ventilation capillary holes 11. At this time, air flows from the outside into the vacuum through holes 12, and part of the heat of the upper fixture body 1 is taken away with the air flow, thereby enhancing the heat dissipation ability of the upper fixture body 1.

[0034] In some embodiments, referring to Figures 1 to 4 As shown, a guiding inclined surface 24 is provided on the inner wall of the accommodating cavity 21. It guides the placement of the packaged device 4, enables the packaged device 4 to be smoothly placed into the accommodating cavity 21, and avoids knocking of the packaged device 4.

[0035] In some embodiments, referring to Figures 1 to 4 As shown, the upper connector 23 is a spring probe, including an upper connection probe, a lower connection probe, and a spring. A guiding hole is provided along the axis of the upper connection probe, and the lower connection probe is slidably connected in the guiding hole; the spring is arranged in the guiding hole and is elastically deformed by the extrusion of the upper connection probe and the lower connection probe; the structure of the lower connector 22 is the same as that of the upper connector 23. The upper connector 23 and the lower connector 22 adopted in this application are both spring probes, which can be purchased or slightly modified. When the spring probe is pressed down by the upper fixture body 1, it is elastically deformed, so that the upper end can be in close contact with the upper fixture body 1 and the packaged device 4, and the lower end can be in close contact with the test board 3, realizing reliable connection of the circuit or signal.

[0036] In some embodiments, referring to Figures 1 to 4 As shown, an installation hole for installing the upper connector 23 is provided on the lower fixture body 2, and the installation hole has a limiting step for limiting the upper connector 23.

[0037] In some embodiments, referring to Figures 1 to 4 As shown, a positioning structure is further provided between the upper fixture body 1 and the lower fixture body 2. The positioning structure includes a positioning hole provided on the lower surface of the upper fixture body 1 and a positioning pin provided on the upper surface of the lower fixture body 2, and the positioning pin cooperates with the positioning hole. Through the cooperation of the positioning pin and the positioning hole, the consistency of the pressing positions of the upper fixture body 1 and the lower fixture body 2 is ensured, the time wasted in adjusting the position when pressing down the upper fixture body 1 is reduced, and the test efficiency is improved.

[0038] In some embodiments, referring to Figures 1 to 4As shown, there are two sets of positioning structures, symmetrically arranged along the center line of the vacuum through-hole 12. A single set of positioning structures will give the upper jig body 1 the freedom of rotation, while the two sets of positioning structures form two-point positioning, improving the accuracy and convenience of positioning.

[0039] For the test fixture provided in this application, taking the flip-chip package device as an example, the specific working process is as follows:

[0040] Before testing: Refer to Figures 1 to 2 As shown, the upper jig body 1 is in close contact with the package device 4, and the package device 4 is sucked by evacuating the vacuum through-hole 12 with a vacuum pump. At this time, the lower jig body 2 is placed on the test board 3, and the upper ends of the upper connector 23 and the lower connector 22 protrude beyond the upper surface of the lower jig body 2. At this time, the two connectors are deformed to a certain extent under the gravity of the lower jig body 2 and are in close contact with the test board 3 to achieve connection.

[0041] During testing: Refer to Figure 3 , the upper jig body 1 presses down, guides and positions the package device 4 through the guiding inclined surface 24, and places the package device 4 into the accommodating cavity 21. Then the upper jig body 1 continues to apply pressure. The upper jig body 1 contacts the upper end of the upper connector 23 and applies force to the upper connector 23 to achieve contact connection with the upper connector 23. The upper jig body 1 applies force to the package device 4, and the package device 4 applies force to the lower connector 22. The upper connector 23 and the lower connector 22 deform due to spring compression, realizing the connection between the lower surface pads of the package device 4 and the lower connector 22. At this time, the upper and lower pads of the package device 4 complete the functional connection with the test board 3 and can be tested. The heat generated by the package device 4 during testing is quickly conducted from the upper surface of the package device 4 to the upper jig body 1 in close contact with it. When the package device 4 generates serious heat and the heat dissipation capacity needs to be improved, air can pass through the ventilation capillary holes 11 from the outside to the inside of the vacuum through-hole 12 through the ventilation capillary holes 11, forming a small amount of air flow and taking away the heat absorbed by the upper jig body 1.

[0042] After testing: Refer to Figure 4 , the upper jig body 1 is lifted. The package device 4 is in close contact with the upper jig body 1 due to the vacuum adsorption in the vacuum through-hole 12 and rises with it until the package device 4 disconnects the connection with the lower connector 22 and the upper connector 23 in the lower jig body 2. The lower connector 22 and the upper connector 23 elastically reset and deform back to normal, and part of them protrudes beyond the upper surface of the lower jig body 2.

[0043] When the lower connector 22 and the upper connector 23 reach the maintenance cycle or service life, only the lower jig body 2 needs to be disassembled, maintained, and the connecting parts replaced, without operating on the upper jig body 1. The maintenance is simple and convenient.

[0044] In the above embodiments, the descriptions of the respective embodiments each have their own focuses. For parts not described or recorded in a certain embodiment, reference may be made to the relevant descriptions of other embodiments.

[0045] The above are only the preferred embodiments of the present utility model and are not intended to limit the present utility model. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present utility model shall be included within the protection scope of the present utility model.

Claims

1. A packaged device test fixture, characterized in that: include: The upper clamp body (1) is provided with a vacuum through hole (12); as well as The lower clamp body (2) is provided with a receiving cavity (21) for receiving the packaged device (4) to be tested, and the receiving cavity (21) is located below the vacuum through hole (12); an upper connector (23) and a lower connector (22) for connecting signals are also provided in the lower clamp body (2); the upper connector (23) is arranged on the outside of the receiving cavity (21), and the lower connector (22) is arranged at the bottom of the receiving cavity (21); During testing, the upper clamp body (1) presses the packaged device (4) to be tested placed in the accommodating cavity (21), and the upper surface pad of the packaged device (4) to be tested is connected to the test board (3) below the lower clamp body (2) through the upper clamp body (1) and the upper connector (23); The lower surface pad of the packaged device (4) to be tested is connected to the test board (3) via the lower connector (22).

2. The packaged device test fixture according to claim 1, characterized in that: A pressing boss (13) protruding downward is provided in the middle of the upper clamp body (1), and the vacuum through hole (12) passes through the pressing boss (13).

3. The packaged device test fixture as claimed in claim 2, characterized in that: The pressing boss (13) is provided with a ventilation capillary hole (11) vertically penetrating the vacuum through hole (12).

4. The packaged device test fixture according to claim 1, characterized in that: The inner wall of the accommodating cavity (21) is provided with a guiding inclined surface (24).

5. The packaged device test fixture according to claim 1, characterized in that: The upper connector (23) is a spring probe, comprising an upper connecting probe, a lower connecting probe and a spring; the upper connecting probe is provided with a guide hole along its axis, and the lower connecting probe is slidably connected in the guide hole; the spring is arranged in the guide hole and is deformed by the compression and expansion of the upper connecting probe and the lower connecting probe; the structure of the lower connector (22) is the same as that of the upper connector (23).

6. The packaged device test fixture according to claim 1, characterized in that: The lower clamp body (2) is provided with a mounting hole for mounting the upper connector (23), and the mounting hole has a limiting step for limiting the position of the upper connector (23).

7. The packaged device test fixture according to claim 1, characterized in that: A positioning structure is also provided between the upper clamp body (1) and the lower clamp body (2), and the positioning structure comprises a positioning hole provided on the lower surface of the upper clamp body (1) and a positioning pin provided on the upper surface of the lower clamp body (2), and the positioning pin cooperates with the positioning hole.

8. The packaged device test fixture as claimed in claim 7, characterized in that: The positioning structures are divided into two groups and are symmetrically arranged along the center line of the vacuum through hole (12).

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