Novel backlight light bar and display module thereof
By canceling the LED bracket, the LED chip is directly patched on the PCB board and plugged with colloid to fill it with phosphor, which realizes low-cost and efficient backlight strip manufacturing, solves the problem of luminous angle limitation and light leakage, and improves the performance of the display module.
Patent Information
- Application Number
- CN202421896576.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-06
- Publication Date
- 2025-07-01
- Estimated Expiration
- 2034-08-06
AI Technical Summary
The high manufacturing cost of existing display backlight strips, limited light emission angle and light leakage problems have not been effectively solved.
Cancel the LED bracket, directly paste the LED chip on the PCB board, and use colloid to form a groove to fill the phosphor. Finally, assemble the light guide plate to achieve the same white light solution as conventional LED packaging technology.
It reduces manufacturing costs and time, improves the connection stability between LED chips and PCB boards, eliminates the limitation of light emission angle, enhances product flexibility and market competitiveness, and solves the light leakage problem.
Smart Images
Figure CN223051613U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the technical field of LED backlight display, and particularly relates to a novel backlight strip and a display module thereof. Background Art
[0002] In the existing display backlight strip technology, LED chips usually need to be SMT pasted after encapsulation and binning processes to ensure their stability and light-emitting effect on the PCB. However, the equipment required for these processes is relatively expensive, the processes are not only complex but also time-consuming in production, resulting in high manufacturing costs. At the same time, traditional LED backlight strips usually require the configuration of LED brackets, and the LED brackets limit the light-emitting angle of the backlight strip, making the dot pitch arrangement design scheme of the backlight strip relatively limited, reducing the compatibility of the product with new schemes and market competitiveness. In addition, in the prior art, the light guide plate (LGP) of the display is supported by pads, and the assembly alignment requirements of the LGP and the light strip in the Y direction are relatively high during assembly and mass production, and misalignment is likely to occur, resulting in the light leakage problem (Light Leakage Issue). Therefore, the light leakage problem is also an important problem to be solved in the prior art.
[0003] Therefore, in view of the above technical problems, the utility model provides a novel backlight strip and a display module thereof. The light strip cancels the LED bracket, directly pastes the LED chips on the PCB board, then uses a colloid to enclose the LED chips on the entire light strip, fills phosphor powder in the entire colloid circle, and finally assembles the light guide plate to achieve the same white light scheme as the conventional LED packaging technology, so as to solve one or more of the above problems. Summary of the Utility Model
[0004] In view of the above problems existing in the prior art, the utility model provides a novel backlight strip, which includes a PCB board, LED chips, a colloid and phosphor powder. The LED chips are installed on the PCB board, the colloid adheres to the PCB board and encloses the LED chips to form a groove, and the phosphor powder is filled in the groove.
[0005] Optionally, the colloid is a white glue strip.
[0006] Optionally, the LED chips are attached to the PCB board by a chip-on-board process.
[0007] Optionally, the outer end face of the groove is larger than the bottom face.
[0008] Optionally, the phosphor powder completely covers the LED chips.
[0009] Optionally, the LED chips are attached to the PCB board at equal intervals.
[0010] The present utility model also provides a display module, which includes the above-mentioned novel backlight bar and a light guide plate. The light guide plate is assembled in the groove, and the groove restricts the front-back movement of the light guide plate.
[0011] Optionally, the light guide plate is embedded and installed in the groove.
[0012] Optionally, the light guide plate is assembled with the novel backlight bar in an up-and-down side-in type or a left-and-right side-in type.
[0013] The technical solution of the present utility model has the following advantages or beneficial effects:
[0014] For the novel backlight bar and its display module provided by the present utility model, the LED chips are directly surface-mounted on the PCB board for the backlight bar, and then the entire LED chips on the PCB board are blocked by white glue strips. Then, phosphor powder is filled in the entire white glue circle, and finally, a light guide plate is assembled to obtain the display module. The novel backlight bar of the present utility model realizes the same white light solution as the conventional LED packaging technology, omits the complex packaging and binning processes in the conventional technology, saves the expensive costs brought by LED packaging equipment and other costs, thereby reducing the manufacturing cost and time. At the same time, this process also improves the connection stability and reliability between the LED chips and the PCB board. The novel backlight bar of the present utility model no longer uses an LED bracket, thereby eliminating the limitation of the LED bracket on the light-emitting angle of the LED chips, which makes the arrangement scheme of the backlight bar more flexible and can be adjusted according to different product design requirements, increasing the compatibility of the product with the new scheme and enhancing the market competitiveness. The display module of the present utility model embeds the LGP (light guide plate) in the white glue strip circle, completely wrapping its end part, restricting the front-back (i.e., Y-direction) movement of the LGP, enabling the perfect alignment of the LGP and the backlight bar, effectively solving the Light Leakage Issue, and improving the light-emitting effect and overall performance of the display module. Description of the Drawings
[0015] With reference to the accompanying drawings, the embodiments of the present utility model are described more fully. However, the accompanying drawings are only for illustration and explanation and do not constitute a limitation to the scope of the present utility model.
[0016] Figure 1 It is a three-dimensional schematic diagram of the novel backlight bar of the present utility model;
[0017] Figure 2 It is a side view schematic diagram of the novel backlight bar of the present utility model;
[0018] Figure 3 It is a top view schematic diagram of the novel backlight bar of the present utility model;
[0019] Figure 4 Schematic diagram of an in - type display module with light guide plates on the upper and lower sides
[0020] Figure 5 Schematic diagram of an in - type display module with light guide plates on the left and right sides
[0021] Figure 6 Schematic diagram of the XY direction of the assembly of the light guide plate and the backlight strip
[0022] Illustration description:
[0023] 1. PCB board; 2. LED chip; 3. White rubber strip; 4. Phosphor; 10. Backlight strip; 20. Light guide plate Specific implementation mode
[0024] To facilitate the understanding of the present utility model, the present utility model will be described more comprehensively below with reference to the relevant drawings. The preferred embodiments of the present utility model are given in the drawings. However, the present utility model can be implemented in many other different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure content of the present utility model more thorough and comprehensive.
[0025] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly on the other element or there can also be an intermediate element. When an element is considered to be "connected" to another element, it can be directly connected to the other element or there may be an intermediate element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are only for the purpose of illustration.
[0026] In the description of the present utility model, unless otherwise defined, all the technical and scientific terms used in the present utility model have the same meaning as commonly understood by those skilled in the technical field to which the present utility model belongs. The terms used in the description of the present utility model in this specification are only for the purpose of describing specific embodiments and are not intended to limit the present utility model. The term "and / or" used herein includes any and all combinations of one or more of the related listed items.
[0027] In the description of the present utility model, technical terms such as "first", "second", etc. are only used to distinguish different objects and cannot be understood as indicating or implying relative importance or implicitly indicating the quantity, specific order or primary - secondary relationship of the indicated technical features. In the description of the embodiments of the present application, the meaning of "a plurality" is more than two, unless otherwise clearly and specifically defined.
[0028] Such as Figures 1 - 3As shown in the figure, an embodiment of the present utility model provides a new type of backlight strip 10, which includes a PCB board 1, an LED chip 2, a colloid, and a phosphor 4. The PCB board 1 is the assembly main body, and the LED chip 2 is the light source component. The LED chip 2 is installed on the PCB board 1. Specifically, a plurality of LED chips 2 are arranged on the surface of the PCB board 1 at equal intervals. Preferably, in this embodiment, the LED chip 2 is installed by a chip - on - board process, so that the LED chip 2 is firmly attached to the surface of the PCB board 1.
[0029] Furthermore, after the installation of the LED chip 2 is completed, the colloid is attached to the PCB board 1 and surrounds the LED chip 2 to form a groove, which is used to fit the light guide plate 20 for assembly. Specifically, the colloid can be bonded to the surface of the PCB board 1 by an adhesive method. Preferably, in this embodiment, the colloid is a white glue strip 3, and the white glue strip 3 is beneficial to ensuring that the light source emitted by the LED chip 2 is not interfered.
[0030] Furthermore, the phosphor 4 is filled in the groove to form a phosphor layer covering the LED chip 2. The phosphor layer needs to completely cover the LED chip 2. The phosphor layer can directly fix the LED chip 2 firmly without using an LED bracket. Preferably, in this embodiment, the outer end surface of the groove formed by the white glue strip 3 is larger than the bottom surface to facilitate the embedding and installation of the light guide plate 20 into the groove.
[0031] The backlight strip 10 of the present utility model directly chips the LED chip 2 on the PCB board 1, then uses the white glue strip 3 to surround the LED chips 2 on the entire PCB board 1, and then fills the phosphor 4 in the entire white glue circle to achieve the same white light solution as the conventional LED packaging technology. It omits the complex packaging and binning processes in the conventional technology, saves the expensive costs brought by LED packaging equipment and other costs, thereby reducing the manufacturing cost and time, and realizing a low - cost and high - efficiency manufacturing process; at the same time, this process also improves the connection stability and reliability between the LED chip 2 and the PCB board 1. And this new type of backlight strip 10 no longer uses an LED bracket, thus eliminating the limitation of the LED bracket on the light - emitting angle of the LED chip 2. This makes the arrangement scheme of the backlight strip 10 more flexible, can be adjusted according to different product design requirements, increases the compatibility of the product with the new scheme, and enhances the market competitiveness.
[0032] Furthermore, as Figures 4 - 5As shown in the figure, the present utility model also provides a display module, which includes the above-mentioned novel backlight strip 10 and a light guide plate 20. The light guide plate 20 is assembled in a groove, and the groove restricts the forward and backward movement of the light guide plate 20. Specifically, the light guide plate 20 is embedded in the groove. The bottom surface of the light guide plate 20 faces the phosphor layer, and its side surfaces are clamped by the groove, so that the ends of the light guide plate 20 are completely wrapped by the white glue strip 3, achieving the purpose of restricting the forward and backward movement of the light guide plate 20 (i.e., the Y direction as shown in Figure 6 ). Preferably, the light guide plate 20 can be assembled with the novel backlight strip 10 in an upper and lower side-in mode (as shown in Figure 4 ) or in a left and right side-in mode (as shown in Figure 5 ).
[0033] During the manufacturing process of the display module, first, the LED chips 2 are directly surface-mounted on the surface of the PCB board 1, and then the LED chips 2 are surrounded by the white glue strip 3. Next, the phosphor powder 4 is filled in the circle of the surrounded white glue strip 3 to improve the light-emitting effect of the LED chips 2. Finally, the light guide plate 20 is embedded into the circle of the white glue strip 3 filled with the phosphor powder 4 so that its ends are completely wrapped; the entire manufacturing process is simple and efficient, reducing the manufacturing cost and time.
[0034] In the display module of the present utility model, the light guide plate 20 (LGP) is embedded in the circle of the white glue strip 3 so that its ends are completely wrapped, restricting the movement of the LGP in the Y direction, enabling the perfect alignment of the LGP and the backlight strip 10, effectively solving the light leakage problem, and improving the light-emitting effect and overall performance of the backlight strip 10.
[0035] In some embodiments, the inner side surface of the groove can also be a vertical plane or an inner inclined plane, as long as it can satisfy the assembly of the light guide plate 20 and can restrict the movement of the light guide plate 20 in the Y direction.
[0036] The technical features of the above-described embodiments can be combined arbitrarily. For the sake of brevity of description, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, it should be considered as the scope recorded in this specification.
[0037] The above-described embodiments only represent several implementation manners of the present utility model. Their descriptions are relatively specific and detailed, but they should not be construed as a limitation to the scope of the patent application. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present utility model, several modifications and improvements can still be made, and these all belong to the protection scope of the present utility model. Therefore, the protection scope of the patent of the present utility model should be subject to the appended claims.
Claims
1. A new type of backlight strip, characterized in that: The invention comprises a PCB board, an LED chip, a colloid and fluorescent powder. The LED chip is mounted on the PCB board. The colloid is attached to the PCB board and surrounds the LED chip to form a groove. The fluorescent powder is filled in the groove.
2. The novel backlight strip as claimed in claim 1, characterized in that: The colloid is a white glue strip.
3. The novel backlight strip as claimed in claim 1, characterized in that: The LED chip is attached to the PCB board by using a patch process.
4. The novel backlight strip as claimed in claim 1, characterized in that: The outer end surface of the groove is larger than the bottom surface.
5. The novel backlight strip as claimed in claim 1, characterized in that: The fluorescent powder completely covers the LED chip.
6. The novel backlight strip as claimed in claim 3, characterized in that: The LED chips are attached to the PCB board at equal intervals.
7. A display module, characterized in that: It comprises a new backlight strip and a light guide plate as described in any one of claims 1 to 6, wherein the light guide plate is assembled in the groove, and the groove limits the forward and backward movement of the light guide plate.
8. The display module according to claim 7, wherein: The light guide plate is embedded in the groove.
9. The display module according to claim 8, wherein: The light guide plate is assembled with the novel backlight strip in an upper and lower side-entry type or a left and right side-entry type.