Projection device
By using assembled thermal fixtures and thermal materials in the DLP projector, the problem of heat transfer to low-temperature components is solved, and efficient heat dissipation and maintenance of component performance is achieved.
Patent Information
- Application Number
- CN202422128397.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-30
- Publication Date
- 2025-07-01
- Estimated Expiration
- 2034-08-30
AI Technical Summary
In DLP projector, heat from high-temperature heating components is easily transferred to low-temperature components, affecting the heat dissipation and performance of low-temperature components.
The thermally conductive fixture with assembled structure is used to set high-temperature and low-temperature components on different thermally conductive fixtures, and is connected by fasteners. The design contacts are arranged in different directions to reduce the heat transfer cross-section and distance, and heat-dissipating materials and heat-dissipating fins are used for heat dissipation.
Effectively dissipate heat at high temperature components, prevent heat from being transferred to low temperature components, maintain high performance work of each component, and improve heat dissipation efficiency.
Smart Images
Figure CN223051631U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of projection devices, in particular to a projection device. Background Art
[0002] During the development of DLP (Digital Light Processing) projectors, the brightness is getting higher and higher, and the power of the DLP board and the boost board is also getting larger and larger, posing high requirements for heat dissipation. When two different heat-generating components are arranged on the same heat-conducting bracket, it is easy to cause heat to transfer to the component with lower heat generation, hindering the heat dissipation of the component with lower heat generation, and excessive heat accumulation may even affect the performance of the component.
[0003] For example, the main control board of an intelligent projector mainly consists of three parts: an Android board, a DLP board, and a boost board. Among them, the Android board has a low thermal power and the chip is not resistant to high temperatures, the DLP board has a high thermal power and the chip is not resistant to high temperatures, and the boost board has a very high thermal power and each component is resistant to high temperatures. To address the problem of high heat on the main board, the main board, the boost board, and the DLP board can all be attached to the same metal bracket for fixation and heat dissipation; although this method can dissipate heat from the main board, the area of high-heat components will have an impact on the low-heat chip area, which is not conducive to the chip maintaining high-performance operation. Summary of the Utility Model
[0004] To solve the above technical problems, the utility model provides a projection device that can effectively dissipate heat from heat-generating components while preventing the heat of relatively high-temperature components from being transferred to relatively low-temperature components.
[0005] To achieve the above object, the utility model adopts the following technical solutions:
[0006] The utility model discloses a projection device, which includes a body shell, a first heat-conducting fixing bracket, a second heat-conducting fixing bracket, a first heat-generating device, a second heat-generating device, and a fastener. The first heat-conducting fixing bracket and the second heat-conducting fixing bracket are installed inside the body shell, and the first heat-conducting fixing bracket and the second heat-conducting fixing bracket are spliced through the fastener; a first contact part is provided on the first heat-conducting fixing bracket, a second contact part is provided on the second heat-conducting fixing bracket, the first heat-generating device is in contact with the first contact part, and the second heat-generating device is in contact with the second contact part.
[0007] Preferably, the first contact part and the second contact part are arranged along a first direction, and an interval part extending along a second direction is formed at the splicing position of the first heat-conducting fixing bracket and the second heat-conducting fixing bracket. The first direction is perpendicular to the second direction, and the center connection line of the first contact part and the second contact part passes through the interval part.
[0008] Preferably, a convex first connecting portion is formed on one side of the first heat-conducting fixing frame close to the second heat-conducting fixing frame, and a convex second connecting portion is formed on one side of the second heat-conducting fixing frame close to the first heat-conducting fixing frame. The first connecting portion and the second connecting portion are stacked on each other and fixedly connected by the fastener.
[0009] Preferably, the number of the first connecting portions and the second connecting portions is at least two and they correspond to each other one by one, and a spacing portion is formed between adjacent first connecting portions.
[0010] Preferably, the first connecting portion protrudes from both ends and / or the middle of one side of the first heat-conducting fixing frame close to the second heat-conducting fixing frame. Correspondingly, the second connecting portion protrudes from both ends and / or the middle of one side of the second heat-conducting fixing frame close to the first heat-conducting fixing frame.
[0011] Preferably, the projection device includes a main control board, the main control board is fixedly connected to the first heat-conducting fixing frame and the second heat-conducting fixing frame, and the first heat-generating device and the second heat-generating device are different chips on the main control board respectively.
[0012] Preferably, the projection device further includes heat dissipation fins. The heat generation amount of the second heat-generating device is higher than that of the first heat-generating device, and the heat dissipation fins are fixedly arranged on the back surface of the second heat-conducting fixing frame corresponding to the second contact portion.
[0013] Preferably, the first heat-conducting fixing frame includes a first plate body and two first side wings vertically connected to opposite sides of the first plate body. The second heat-conducting fixing frame includes a second plate body and two second side wings vertically connected to opposite sides of the second plate body. The first side wings and the second side wings are fixedly connected by the fastener. The first contact portion is located on the first plate body, and the second contact portion is located on the second plate body.
[0014] Preferably, the first contact portion is located on one side of the first plate body away from the second plate body; the second contact portion is located on one side of the second plate body away from the first plate body.
[0015] Preferably, the projection device further includes a projection optical machine. The first heat-conducting fixing frame and the second heat-conducting fixing frame enclose a receiving space, and the projection optical machine is arranged in the receiving space.
[0016] Compared with the prior art, the beneficial effects of the present utility model are as follows: For the projection device disclosed in the present utility model, by designing the heat-conducting fixing frame into an assembled structure, heat transfer can be reduced. Among them, the first heating device and the second heating device are respectively in contact connection with the mutually spliced first heat-conducting fixing frame and the second heat-conducting fixing frame, that is, relatively high-temperature components and relatively low-temperature components can be respectively arranged on different mutually assembled heat-conducting fixing frames to reduce heat transfer, thereby preventing the heat of relatively high-temperature components from being transferred to relatively low-temperature components. Therefore, by respectively contacting different heating devices with two mutually spliced heat-conducting fixing frames, it is possible to both dissipate heat from high-temperature / intermediate-temperature components and prevent the heat of high-temperature components from being transferred to intermediate-temperature components.
[0017] In a further aspect, the present utility model also has the following beneficial effects:
[0018] (1) By arranging the first contact portion and the second contact portion at intervals along the first direction, an interval portion extending in a second direction perpendicular to the first direction is formed at the splicing position of the first heat-conducting fixing frame and the second heat-conducting fixing frame, and by making the center connection line of the first contact portion and the second contact portion pass through the interval portion, it is possible to make the connection cross-section between the first contact portion and the second contact portion smaller and the heat transfer path longer, so that it can be achieved that: even if the heat conductivity of the first heat-conducting fixing frame and the second heat-conducting fixing frame is very good, heat will not be quickly transferred to the opposite side of the interval portion.
[0019] (2) The first heat-conducting fixing frame and the second heat-conducting fixing frame are only in contact through the first connection portion and the second connection portion, which can further reduce the heat-conducting cross-section.
[0020] (3) The first heating device and the second heating device are respectively in contact with the contact portions on the two opposite surfaces of the first heat-conducting fixing frame and the second heat-conducting fixing frame, which can make the distance between the heating devices as far as possible, and further reduce the influence of heat transfer. BRIEF DESCRIPTION OF THE DRAWINGS
[0021] Figure 1 is a schematic diagram of the internal structure of the projection device according to the preferred embodiment of the present utility model;
[0022] Figure 2 is Figure 1 the internal exploded structure diagram of the projection device in
[0023] Figure 3 is Figure 2 the enlarged schematic diagram of part A in
[0024] Figure 4 is a schematic diagram of the internal structure of the projection device in a further embodiment;
[0025] Figure 5 isFigure 4 Schematic diagram of the internal explosion structure of the projection device
[0026] Description of the reference numerals in the drawings:
[0027] 10. Heat-conducting fixing bracket; 11. First heat-conducting fixing bracket; 111. First contact part; 112. First connecting part; 12. Second heat-conducting fixing bracket; 121. Second contact part; 122. Second connecting part; 13. Third heat-conducting fixing bracket; 101. Upper heat-conducting fixing bracket; 1011. Upper plate body; 1012. Upper side wing; 102. Lower heat-conducting fixing bracket; 1021. Lower plate body; 1022. Lower side wing
[0028] 20. Main control board; 30. Fastener; 40. Spacer; 50. Heat dissipation fins; 51. Heat-conducting foam; 60. Projection optical machine; 70. Fan Detailed implementation manners
[0029] The following provides a detailed description of the implementation manners of the present utility model. It should be emphasized that the following description is merely exemplary and is not intended to limit the scope of the present utility model and its applications
[0030] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element. In addition, the connection can be for a fixing function or for a circuit / signal connection function
[0031] It should be understood that the orientation or positional relationship indicated by the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the embodiments of the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present utility model
[0032] In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the embodiments of the present utility model, "a plurality" means two or more, unless otherwise specifically defined
[0033] Such as Figure 1 And Figure 2As shown, a preferred embodiment of the utility model discloses a projection device, including a body shell, a heat-conducting fixing frame 10, a heating device and a fastener 30, the heat-conducting fixing frame 10 includes a first heat-conducting fixing frame 11 and a second heat-conducting fixing frame 12, the heating device includes a first heating device and a second heating device, the first heat-conducting fixing frame 11 and the second heat-conducting fixing frame 12 are installed in the body shell, and the first heat-conducting fixing frame 11 and the second heat-conducting fixing frame 12 are spliced by the fastener 30; the first heat-conducting fixing frame 11 is provided with a first contact portion 111, the second heat-conducting fixing frame 12 is provided with a second contact portion 121, the first heating device contacts the first contact portion 111, and the second heating device contacts the second contact portion 121.
[0034] In a specific embodiment, the projection device further includes a bracket, the body shell and the bracket are rotatably connected, the bracket part extends into the body shell and is fixed to the heat-conducting fixing frame 10 in the body shell to ensure the stability of the structure. The body shell is provided with components such as a projection optical machine 60, a fan 70, a main control board 20, and a speaker (not shown in the figure), and the heat-conducting fixing frame 10 plays the role of fixing these components, wherein the DMD chip of the projection optical machine 60 and the chip on the main control board 20 have a high heat generation, so they can be contacted with the heat-conducting fixing frame 10 in the present application to achieve heat dissipation. For example, the main control board 20 in this embodiment is fixedly connected to the first heat-conducting fixing frame 11 and the second heat-conducting fixing frame 12, and the first heat-generating device and the second heat-generating device are different chips arranged on the main control board 20, and the chip is located on the side of the main control board 20 facing the heat-conducting fixing frame 10. The heat-conducting fixing frame 10 can be made of metal or other materials with high thermal conductivity, for example.
[0035] The first contact portion 111 and the second contact portion 121 are arranged along the first direction, and the first heat-conducting fixing frame 11 and the second heat-conducting fixing frame 12 form a spacer 40 extending along the second direction at the joint, the first direction and the second direction are perpendicular to each other, and the center line of the first contact portion 111 and the second contact portion 121 passes through the spacer 40. The first heat-conducting fixing frame 11 and the second heat-conducting fixing frame 12 are connected by fasteners and the spacer 40 extending along the second direction is formed at the joint, which has lower heat conduction efficiency than integral molding or connection by heat-conducting silicone, and the heat on the first heat-conducting fixing frame 11 and the second heat-conducting fixing frame 12 is not easy to be transferred to each other. At the same time, the first heat-conducting fixing frame 11 and the second heat-conducting fixing frame 12 are respectively made of metal materials. The metal material itself is easy to conduct heat, which is conducive to effectively conducting the heat of the chips that the first heat-conducting fixing frame 11 and the second heat-conducting fixing frame 12 are in contact with, thereby alleviating the high temperature pressure of the chip during operation; in addition, the splicing structure combined with the metal material of the heat-conducting fixing frame can make the hardness of the connection part strong enough to effectively avoid breakage at the connection position.
[0036] Based on the principle of heat conduction, when the temperature at one end of a fixed material is higher than that at the other end, heat will automatically transfer from the hot end to the cold end; according to the formula of Fourier's law: In the formula, ΔQ refers to the amount of heat transferred through the cross-section ΔS in the positive x-axis direction within the time Δt, and ΔS is the cross-sectional area of the isotropic solid material in the x-axis direction. refers to the temperature change rate of the material in the x-axis direction. The negative sign indicates that heat transfers to the low-temperature area, and the constant λ is the thermal conductivity. Through this Fourier's law, it can be known that the amount of heat transferred in the x-axis direction per unit time is proportional to the cross-sectional area of the conduction channel in this direction, that is, the smaller the cross-sectional area, the slower the heat transfer. Therefore, by arranging the first contact portion 111 and the second contact portion 121 at intervals along the first direction, an interval portion 40 extending in the second direction perpendicular to the first direction is formed at the splicing position of the first heat-conducting fixing frame 11 and the second heat-conducting fixing frame 12, and by making the center connection line of the first contact portion 111 and the second contact portion 121 pass through the interval portion 40, the connection cross-section between the first contact portion 111 and the second contact portion 121 can be made smaller, and the heat transfer path can be made longer, so that it can be achieved that: even if the first heat-conducting fixing frame 11 and the second heat-conducting fixing frame 12 have good thermal conductivity, heat will not quickly transfer to the opposite side of the interval portion 40.
[0037] Furthermore, the first contact portion 111 and the second contact portion 121 can be formed in the structure of bosses respectively, so as to raise a certain area on the first heat-conducting fixing frame 11 and the second heat-conducting fixing frame 12 respectively to contact the chip, thereby avoiding collisions between other electronic components on the main control board 20 and the first heat-conducting fixing frame 11 and the second heat-conducting fixing frame 12. Among them, the structure of the boss can be integrally formed with the first heat-conducting fixing frame 11 and the second heat-conducting fixing frame 12 respectively, or can be formed by a flexible heat-conducting material; among them, by the structure of the boss formed by a flexible heat-conducting material, the possibility of damage to the chip directly contacting the first heat-conducting fixing frame 11 and the second heat-conducting fixing frame 12 made of metal materials due to the vibration of the internal structure can be further reduced; specifically, the flexible heat-conducting material is, for example, heat-conducting foam.
[0038] Such as Figure 3, on one side of the first heat-conducting fixing frame 11 close to the second heat-conducting fixing frame 12, a protruding first connecting portion 112 is formed. On one side of the second heat-conducting fixing frame 12 close to the first heat-conducting fixing frame 11, a protruding second connecting portion 122 is formed. The first connecting portion 112 and the second connecting portion 122 are stacked on each other and are fixedly connected by a fastener 30. Only the first connecting portion 112 and the second connecting portion 122 are in contact between the first heat-conducting fixing frame 11 and the second heat-conducting fixing frame 12, which can further reduce the heat-conducting cross-section. Further, the number of both the first connecting portion 112 and the second connecting portion 122 is at least two and they correspond one by one, and a spacing portion is formed between adjacent first connecting portions 112. Still further, the first connecting portion 112 protrudes at both ends and / or the middle of one side of the first heat-conducting fixing frame 11 close to the second heat-conducting fixing frame 12. Correspondingly, the second connecting portion 122 protrudes at both ends and / or the middle of one side of the second heat-conducting fixing frame 12 close to the first heat-conducting fixing frame 11.
[0039] As Figure 4 , in a further embodiment, the projection device further includes heat-dissipating fins 50. The heat generation amount of the second heat-generating device is higher than that of the first heat-generating device. The heat-dissipating fins 50 are fixedly arranged on the back surface of the second heat-conducting fixing frame 12 corresponding to the second contact portion 121. Specifically, as Figure 5 , the heat-dissipating fins 50 are fixed on the back surface corresponding to the second contact portion 121 by a heat-conducting adhesive material such as a heat-conducting foam 51. Other areas of the heat-dissipating fins 50 are spaced from both the first heat-conducting fixing frame 11 and the second heat-conducting fixing frame 12, so as to prevent the heat from being transferred to the heat-dissipating fins 50 and then conducted back to the first heat-conducting fixing frame 11 and the second heat-conducting fixing frame 12. A fan 70 is further provided at the bottom of the first heat-conducting fixing frame 11 and the second heat-conducting fixing frame 12. The heat-dissipating fins 50 are located on the air inlet side of the fan 70, which is beneficial to quickly dissipate heat from the second heat-generating device with a higher heat generation amount on the second contact portion 121.
[0040] As Figure 4 , in a further embodiment, the projection device further includes a third heat-conducting fixing frame 13. The first heat-conducting fixing frame 11 and the second heat-conducting fixing frame 12 together form an upper heat-conducting fixing frame 101, and the third heat-conducting fixing frame 13 forms a lower heat-conducting fixing frame 102. Combining Figure 5, the upper heat-conducting fixing frame 101 includes an upper plate body 1011 and two upper side wings 1012 vertically connected to opposite sides of the upper plate body 1011. The lower heat-conducting fixing frame 102 includes a lower plate body 1021 and two lower side wings 1022 vertically connected to opposite sides of the lower plate body 1021. The upper side wings 1012 and the lower side wings 1022 are firmly connected by fasteners 30. The first contact portion 111 and the second contact portion 121 are respectively located on the upper plate body 1011. A third contact portion is provided on the lower plate body 1021. The third contact portion is similar to the first contact portion 111 and the second contact portion 121 and can also be formed in the structure of a boss, which will not be elaborated here.
[0041] Furthermore, the projection device further includes a third heating device. The third heating device is in contact with the third contact portion. The first contact portion 111 and the second contact portion 121 are respectively located on the side of the upper plate body 1011 away from the lower plate body 1021, and the third contact portion is located on the side of the lower plate body 1021 away from the upper plate body 1011. Correspondingly, the first heating device and the second heating device are respectively in contact connection with the side of the upper plate body 1011 away from the lower plate body 1021, and the third heating device is in contact connection with the side of the lower plate body 1021 away from the upper plate body 1011. Among them, the upper heat-conducting fixing frame 101 and the lower heat-conducting fixing frame 102 enclose a containing space, and the projection optical machine 60 and the fan 70 are respectively arranged in the containing space. In a specific embodiment, the projection optical machine 60 and the fan 70 are fixedly connected in the containing space, and the upper heat-conducting fixing frame 101 and the lower heat-conducting fixing frame 102 are fixedly connected to the body shell. By dividing the heat-conducting fixing frame in the projection device into the upper heat-conducting fixing frame 101 and the lower heat-conducting fixing frame 102, two high-heat generating devices can be placed on opposite sides, namely the top and the bottom, and at this time the heat transfer distance is farther.
[0042] In a specific example, for instance, the first heating device is a DLP board, the second heating device is a driving board, and the third heating device is an Android board. The DLP board, the driving board, and the Android board are respectively in contact with the first contact portion 111 on the first heat-conducting fixing frame 11, the second contact portion 121 on the second heat-conducting fixing frame 12, and the third contact portion on the third heat-conducting fixing frame 13, so that the heat interference among the three is reduced to a greater extent.
[0043] In some other embodiments, the heat-conducting fixing bracket 10 can also be only divided into upper and lower heat-conducting fixing brackets that are fixedly connected through the fastener 30, and the upper and lower heat-conducting fixing brackets are fixed by screws on the left and right sides. The main control board 20 is divided into a first main board (DLP + driver board) and a second main board (Android board). Among them, the first main board (DLP + driver board) is integrally fixed above the upper heat-conducting fixing bracket through screws, and the second main board (Android board) is fixed to the bottom of the lower heat-conducting fixing bracket through screws, that is, located between the lower heat-conducting fixing bracket and the body shell of the projection device. The main heat-generating chips on each main board are respectively connected to the heat-conducting fixing bracket through heat-conducting foam to transfer heat; in this way, the high-heat components and the low-heat components can be separated by the interval formed at the splicing part, and the distance between each heat-generating device can be made as far as possible to minimize the influence of heat transfer to the greatest extent.
[0044] The background part of the present utility model may include background information about the problems or environment of the present utility model, rather than the prior art described by others. Therefore, the content included in the background art section is not an admission by the applicant of the prior art.
[0045] The above content is a further detailed description of the present utility model in combination with specific / preferred embodiments, and it cannot be determined that the specific implementation of the present utility model is only limited to these descriptions. For those of ordinary skill in the technical field to which the present utility model belongs, without departing from the concept of the present utility model, several alternatives or modifications can be made to these described embodiments, and these alternative or modified forms should all be regarded as belonging to the protection scope of the present utility model. In the description of this specification, the description with reference to terms such as "an embodiment", "some embodiments", "preferred embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present utility model. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in a suitable manner in any one or more embodiments or examples. In addition, without contradiction, those skilled in the art can combine and combine the different embodiments or examples described in this specification and the features of different embodiments or examples. Although the embodiments of the present utility model and their advantages have been described in detail, it should be understood that various changes, substitutions, and alterations can be made herein without departing from the scope defined by the appended claims.
Claims
1. A projection device, characterized in that: The invention comprises a body shell, a first heat-conducting fixing frame, a second heat-conducting fixing frame, a first heating device, a second heating device and a fastener, wherein the first heat-conducting fixing frame and the second heat-conducting fixing frame are installed in the body shell, and the first heat-conducting fixing frame and the second heat-conducting fixing frame are spliced by the fastener; the first heat-conducting fixing frame is provided with a first contact portion, the second heat-conducting fixing frame is provided with a second contact portion, the first heating device contacts the first contact portion, and the second heating device contacts the second contact portion.
2. The projection device according to claim 1, characterized in that: The first contact portion and the second contact portion are arranged along a first direction, and the first heat-conducting fixing frame and the second heat-conducting fixing frame form a spacing portion extending along a second direction at a joint, the first direction and the second direction are perpendicular to each other, and a center line connecting the first contact portion and the second contact portion passes through the spacing portion.
3. The projection device according to claim 1, characterized in that: A protruding first connection portion is formed on one side of the first heat-conducting fixing frame close to the second heat-conducting fixing frame, and a protruding second connection portion is formed on one side of the second heat-conducting fixing frame close to the first heat-conducting fixing frame. The first connection portion and the second connection portion are stacked on each other and fastened and connected by the fastener.
4. The projection device according to claim 3, characterized in that: The number of the first connection parts and the number of the second connection parts are both at least two and they correspond to each other one by one, and a spacing part is formed between adjacent first connection parts.
5. The projection device according to claim 3, characterized in that: The first connection portion is protruded from both ends and / or the middle of the first heat-conducting fixing frame on one side close to the second heat-conducting fixing frame, and correspondingly, the second connection portion is protruded from both ends and / or the middle of the second heat-conducting fixing frame on one side close to the first heat-conducting fixing frame.
6. The projection device according to claim 1, characterized in that: It comprises a main control board, which is fixedly connected to the first heat-conducting fixing frame and the second heat-conducting fixing frame, and the first heating device and the second heating device are different chips on the main control board respectively.
7. The projection device according to claim 1, characterized in that: It also includes a heat dissipation fin. The heat generated by the second heat-generating device is higher than that of the first heat-generating device. The heat dissipation fin is fixedly arranged on the back side of the second heat-conducting fixing frame corresponding to the second contact portion.
8. The projection device according to claim 1, characterized in that: The first heat-conducting fixing frame includes a first plate body and two first side wings vertically connected to opposite sides of the first plate body, the second heat-conducting fixing frame includes a second plate body and two second side wings vertically connected to opposite sides of the second plate body, the first side wing and the second side wing are fastened together by the fastener, the first contact portion is located on the first plate body, and the second contact portion is located on the second plate body.
9. The projection device according to claim 8, characterized in that: The first contact portion is located on a side of the first plate body away from the second plate body; the second contact portion is located on a side of the second plate body away from the first plate body.
10. The projection device according to claim 8, characterized in that: It also includes a projection light engine. The first heat-conducting fixing frame and the second heat-conducting fixing frame are enclosed to form a containing space. The projection light engine is arranged in the containing space.