Memory module testing device

Abstract

The utility model relates to the technical field of testing equipment, in particular to a memory module testing device, which comprises a PCB (printed circuit board), a limiting piece, a double-end testing needle, a lining plate, a lining plate fixing piece and a gland, and is characterized in that the PCB is provided with screw holes, positioning holes, embedded nuts and spring ejector pin mounting holes which are in one-to-one correspondence with memory modules; the lining plate and the limiting piece are provided with needle holes through which the double-end test needle can pass; the double-end test needle is clamped between the limiting piece and the lining plate, and needle heads at two ends are exposed and are respectively connected with a golden finger bonding pad of the memory module and a golden finger bonding pad of the PCB; threaded holes are formed in the lining plate fixing piece and the limiting piece, and the lining plate fixing piece and the limiting piece are movably connected through screws so as to fix the lining plate in the limited space and allow the lining plate to move; the gland comprises an upper cover and a hinge type structural member, a buckle is installed at the front end of the hinge type structural member, after the gland is pressed, the buckle is automatically locked through elastic force released by a spring, and unlocking can be achieved by upwards pulling the buckle.

Description

Technical Field

[0001] The utility model relates to the technical field of test equipment, and particularly relates to a memory module test device. Background Art

[0002] In the existing computer memory technology field, with the increasing demand for computing performance, especially for devices such as thin and light laptops, high-performance desktop computers, servers, and gaming handhelds, higher requirements are put forward for the performance, power consumption, and scalability of memory modules. Traditionally, these devices mostly use SO-DIMM (Small Outline Dual In-line Memory Module) memory modules, which are connected to the motherboard through standardized connector slots. Although this method performs well in terms of compatibility and ease of use, its limitations gradually emerge under the trend of pursuing higher frequencies, larger bandwidths, and lower power consumption.

[0003] To overcome the limitations of SO-DIMM modules, the industry has introduced CAMM2 (Compression Attached Memory Module), an innovative technology. As a compression attached memory module, CAMM2 abandons the traditional connector slot design and instead adopts a direct installation mechanism similar to that of the CPU. Under this mechanism, the gold finger pads of the CAMM2 memory module directly contact the on-board test pins on the motherboard, and a more stable connection is achieved through the fastening method of positioning posts and screws. This design not only improves the physical stability of the memory module but also retains its excellent characteristics of ultra-high frequency, higher bandwidth, and lower power consumption, while endowing the system with stronger expandability.

[0004] Specifically, a single CAMM2 memory module can provide dual-channel functions, which greatly promotes the synchronous improvement of computer memory capacity and bandwidth, provides a more solid hardware foundation for high-performance applications such as AI computing and big data analysis, and enables these complex tasks to run more efficiently on the computer platform.

[0005] However, despite the significant performance advantages of CAMM2 memory modules, their production testing process faces challenges that cannot be ignored. Since the CAMM2 module needs to be locked with screws during installation, this step is particularly cumbersome during large-scale testing. Repeatedly disassembling and assembling screws not only seriously affects the testing efficiency, increases labor costs, but also may damage the motherboard due to improper operation, thereby driving up the cost of the entire production testing. This problem has become one of the main bottlenecks restricting the large-scale commercial application of CAMM2 memory modules and urgently requires the industry and the outside world to jointly seek solutions. Summary of the Utility Model

[0006] To overcome the deficiencies of the prior art, the present application provides a memory module testing device, aiming to optimize the testing process through technological innovation, reduce the number of screw disassembly and assembly operations, improve testing efficiency, and simultaneously reduce the potential damage risk to the motherboard, thereby effectively reducing the mass production testing cost of CAMM2 memory modules and promoting the wide application and development of this technology.

[0007] The technical means adopted by the present utility model to solve its technical problems is as follows: A memory module testing device, the improvement lies in that it includes: a PCB circuit board, a limiting member, a double-headed test pin, a lining plate, a lining plate fixing member, and a pressing cover. Among them, screw holes, positioning holes, embedded nuts, and spring ejector pin mounting holes corresponding one-to-one with the memory modules are provided on the PCB circuit board; needle holes through which the double-headed test pins can pass are provided on the lining plate and the limiting member. The double-headed test pins are clamped between the limiting member and the lining plate, and both ends of the needles are exposed, respectively connecting the gold finger pads of the memory module and the gold finger pads of the PCB circuit board; threaded holes are provided on both the lining plate fixing member and the limiting member, and the two are movably connected by screws to fix the lining plate in a limited space and allow it to move; the pressing cover includes an upper cover and a hinge-type structural member. A buckle is installed at the front end of the hinge-type structural member. After the pressing cover is pressed, the buckle automatically locks by releasing the elastic force of the spring, and the buckle can be unlocked by pulling it upwards.

[0008] In the above technical solution, the limiting member is in a concave structure, and the diameter of the needle hole on the limiting member is slightly larger than the diameter of the double-headed test pin.

[0009] In the above technical solution, the needle hole on the lining plate is in a shape that is smaller at the top and larger at the bottom; lining plate positioning posts and positioning holes for limiting are provided on the lining plate.

[0010] In the above technical solution, the upper cover is made of a metal material, and a heat dissipation silica gel is provided on the inner side; screw holes through which screws can pass are provided at the head of the upper cover.

[0011] In the above technical solution, a conductive pad or a conductive coating is further provided on the inner side of the upper cover of the pressing cover.

[0012] In the above technical solution, the testing device further includes a detachable dust cover, and the dust cover covers the memory module and the test pin area.

[0013] In the above technical solution, a sealing strip or a magnetic border is provided at the edge of the dust cover.

[0014] In the above technical solution, the dust cover is made of a transparent or semi-transparent material.

[0015] The beneficial effects of the present utility model are as follows: The number of times of screwing and unscrewing during the test of the CAMM2 memory module is reduced, the test efficiency is improved, and at the same time, the potential damage risk to the main board is reduced, thereby effectively reducing the batch production test cost of the CAMM2 memory module and promoting the wide application and development of this technology. Description of the Drawings

[0016] Figure 1 It is a schematic diagram of a memory module test device shown in an embodiment of the present utility model;

[0017] Figure 2 It is a schematic diagram of a PCB circuit board shown in an embodiment of the present utility model;

[0018] Figure 3 It is a schematic diagram of the memory module test process shown in an embodiment of the present utility model;

[0019] Figure 4 It is a schematic diagram of a limiting member shown in an embodiment of the present utility model;

[0020] Figure 5 It is a schematic diagram of a lining plate shown in an embodiment of the present utility model. Detailed Embodiments

[0021] The present utility model will be further described below in conjunction with the drawings and embodiments.

[0022] The concept, specific structure and technical effects of the present utility model will be clearly and completely described below in conjunction with the embodiments and drawings, so as to fully understand the purpose, features and effects of the present utility model. Obviously, the described embodiments are only part of the embodiments of the present utility model, rather than all embodiments. Based on the embodiments of the present utility model, other embodiments obtained by those skilled in the art without creative efforts shall fall within the scope of protection of the present utility model. In addition, all the connection / connection relationships involved in the patent do not simply refer to the direct connection of components, but refer to the more optimal connection structure that can be formed according to the specific implementation situation by adding or reducing connection accessories. Each technical feature in the present utility model can be combined interactively without conflicting with each other.

[0023] As Figure 1 shown, the present application provides a memory module test device, including a PCB circuit board 1, a limiting member 2, a double-headed test needle 3, a lining plate 4, a lining plate fixing member 5, and a gland 6, wherein:

[0024] As Figure 2 shown, screw holes 7, positioning holes 8, embedded nuts 9, and spring ejector pin mounting holes 10 corresponding to the memory modules are provided on the PCB circuit board 1.

[0025] In a possible implementation, as Figure 2 shown, an adjustable-height spring thimble 11 is installed in the spring thimble mounting hole 10 on the PCB circuit board 1, which is used to adapt to the gold finger pads of memory modules with different heights and ensure stable contact between the double-headed test pins and the gold finger pads.

[0026] The lining plate 4 and the limiting member 2 are provided with pin holes through which the double-headed test pins 3 can pass;

[0027] The double-headed test pins 3 are clamped between the limiting member 2 and the lining plate 4, and both ends of the needles are exposed and respectively connected to the gold finger pads of the memory module and the gold finger pads of the PCB circuit board 1;

[0028] Threaded holes 12 are provided on both the lining plate fixing member 5 and the limiting member 2, and the two are movably connected by screws to fix the lining plate 4 in a limited space and allow it to move;

[0029] As Figure 3 shown, the pressure cover 6 includes an upper cover 61 and a hinge-type structural member 62. A buckle 13 is installed at the front end of the hinge-type structural member 62. After the pressure cover 6 is pressed, the buckle 13 automatically locks by releasing the elastic force of the spring, and the buckle 13 can be unlocked by pulling it upward.

[0030] After the pressure cover 6 is opened, the memory module A is placed in the test device. After the pressure cover 6 is closed, the buckle 12 automatically locks by releasing the elastic force of the spring, and the buckle 12 can be unlocked by pulling it upward. At this time, the on-board test pins of the main board B are in stable contact with the test device. When performing a large number of subsequent tests, only the pressure cover 6 needs to be opened to replace the memory module, without repeatedly disassembling and assembling screws, nor causing damage to the main board.

[0031] In a possible implementation, as Figure 4 - 5 shown, the limiting member 2 is in a concave structure shape, and the diameter of the pin hole on the limiting member 2 is slightly larger than the diameter of the double-headed test pin 3.

[0032] The pin hole on the lining plate 4 is in a shape that is smaller at the top and larger at the bottom; the lining plate 4 is provided with a lining plate positioning post 13 and a positioning hole 14 for limiting.

[0033] In a possible implementation, the upper cover 61 is made of a metal material, and a heat dissipation silica gel is provided on the inner side; screw holes through which screws can pass are provided at the head of the upper cover 61.

[0034] In a possible implementation, a conductive pad or a conductive coating is further provided on the inner side of the upper cover 61 of the pressure cover 6 to provide additional electrical connection protection during the pressing process and reduce the influence of static electricity on the test process.

[0035] In a possible implementation, the test device further includes a detachable dust cover that covers the memory module and the test probe area to reduce the influence of dust and impurities on the test process and improve the accuracy and reliability of the test.

[0036] In a possible implementation, a sealing strip or a magnetic border is provided at the edge of the dust cover to enhance the dustproof effect and ensure a tight fit between the dust cover and the main body of the test device.

[0037] In a possible implementation, the dust cover is made of a transparent or translucent material to facilitate observing the test process and the status of the memory module without removing the dust cover.

[0038] The above is a specific description of the preferred embodiments of the present utility model. However, the present utility model is not limited to the above embodiments. Those skilled in the art can make various equivalent deformations or substitutions without departing from the spirit of the present utility model, and these equivalent deformations or substitutions are all included within the scope defined by the claims of this application.

Claims

1. A memory module testing device, characterized in that: include: PCB circuit board, limiter, double-ended test needle, lining plate, lining plate fixing parts, gland, among which, The PCB circuit board is provided with screw holes, positioning holes, embedded nuts and spring ejector mounting holes corresponding to the memory modules one by one; The lining plate and the limiting member are provided with pinholes through which the double-ended test pin can pass; The double-ended test needle is clamped between the stopper and the lining plate, and the needles at both ends are exposed, respectively connected to the gold finger pads of the memory module and the gold finger pads of the PCB circuit board; The lining plate fixing member and the limiting member are both provided with threaded holes, and the two are movably connected by screws to fix the lining plate in a limited space and allow it to move; The pressure cover comprises an upper cover and a hinged structure. A buckle is arranged at the front end of the hinged structure. After the pressure cover is pressed, the buckle is automatically locked by releasing the elastic force of a spring, and the buckle can be unlocked by pressing upward.

2. The memory module testing device according to claim 1, characterized in that: The limiting member is in a concave structure, and the diameter of the pinhole on the limiting member is slightly larger than the diameter of the double-headed test needle.

3. The memory module testing device according to claim 1, characterized in that: The pinhole on the lining plate is small at the top and large at the bottom; the lining plate is provided with a lining plate positioning column and a positioning hole for limiting position.

4. The memory module testing device according to claim 1, characterized in that: The upper cover is made of metal, and heat dissipation silica gel is arranged on the inner side; the head of the upper cover is provided with screw holes for screws to pass through.

5. The memory module testing device according to claim 1, characterized in that: A conductive pad or a conductive coating is also provided on the inner side of the upper cover of the gland.

6. The memory module testing device according to claim 1, characterized in that: The testing device also includes a detachable dust cover, which covers the memory module and the testing pin area.

7. The memory module testing device according to claim 6, characterized in that: The edge of the dust cover is provided with a sealing strip or a magnetic frame.

8. The memory module testing device according to claim 6, characterized in that: The dust cover is made of transparent or translucent material.

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