Wafer positioning device and wafer detection equipment

Abstract

The utility model relates to the technical field of semiconductor front channel detection, and relates to a wafer placing table, in particular to a wafer positioning device and wafer detection equipment. External force is provided for the driven disc to enable the driven disc to rotate relative to the fixed disc, and the driven disc rotates to drive the plurality of clamping pieces to move oppositely, so that the size change of a positioning plane is realized, the transfer placement of a wafer to be detected on a machine table is realized, and the handover and positioning of the wafer are realized. Compared with a clamping and leaning piece moving in the vertical direction in the prior art, the clamping and leaning piece has the advantages that the structural design and machining difficulty are simplified in a linear motion mode, the actions of a connecting and positioning mechanism are simplified, and the connecting and positioning accuracy and the control precision are improved.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor front-end detection, and relates to a wafer placement table, and in particular to a wafer positioning device and a wafer detection device. Background Art

[0002] In the prior art of wafer detection equipment, most of the time when the wafer is transferred from the EFEM robot to the workpiece table of the detection equipment, pin needles are used for transfer, that is, a plurality of pins that can move in the vertical direction are arranged around the chuck of the workpiece table. When the pins rise, they catch the wafer transferred by the EFEM, and then lower to place the wafer on the chuck. This method can only perform material transfer, and the position of the wafer on the chuck mainly depends on the movement accuracy of the EFEM robot and the workpiece table, etc. Summary of the Invention

[0003] In view of this, the purpose of the present invention is to provide a wafer positioning device and a wafer detection device, which can realize wafer transfer and positioning.

[0004] In a first aspect, a wafer positioning device includes: a fixed disk and a driven disk that are connected to each other and coaxially arranged, and the driven disk can rotate relative to the fixed disk by an external force; at least two clamping members in the same plane, and at least two of the clamping members can move towards each other relative to the center of the fixed disk through the rotation of the driven disk, forming a positioning plane with a variable area; the moving towards each other includes moving towards each other and moving away from each other.

[0005] In some specific implementation manners, a limiting channel is provided on the fixed disk, and at least two of the clamping members are arranged in the limiting channel and move synchronously relative to the fixed disk in the limiting channel.

[0006] In some specific implementation manners, at least two of the clamping members are connected to the driven disk through corresponding connecting members.

[0007] In some specific implementation manners, the connecting member includes a connecting rod and a cam follower fixedly connected to the connecting rod, and the cam follower is connected to the driven disk.

[0008] In some specific implementation manners, the connecting rod has an L-shaped structure, its short end is connected to the cam follower, and its long end is connected to the clamping member.

[0009] In some specific implementation manners, the cam follower is arranged in a radial groove opened on the driven disk, and the radial groove extends along the direction towards the center of the driven disk.

[0010] In some specific implementation manners, a short shaft connected to the fixed disk is provided at the elbow of the connecting rod, and a bearing is provided between the short shaft and the fixed disk.

[0011] In some specific implementation manners, a pre-tightening mechanism is provided on the driven disk and is connected to one side of the short end of the connecting rod, and is used to provide a tensile force to the connecting rod so that the cam follower fits with the radial groove.

[0012] In some specific implementation manners, the pre-tightening mechanism includes a pre-tightening spring. One end of the pre-tightening spring is connected to the connecting rod, and the other end is fixedly connected to the fixed disk.

[0013] In some specific implementation manners, the number of the clamping members is three, and the number of the limiting channels corresponding to the clamping members is three.

[0014] In some specific implementation manners, the limiting channel is an arc-shaped structure.

[0015] In some specific implementation manners, there is a planar rotation relationship between adjacent limiting channels, and the planar rotation relationships between the limiting channels are the same.

[0016] In some specific implementation manners, the fixed disk and the driven disk are coaxially arranged, and the driven disk and the extension seat of the fixed disk are connected by a bushing or a bearing.

[0017] In some specific implementation manners, the power component includes any one of a lead screw stepper motor and a linear motor. The power component outputs a force in the linear motion direction and drives the driven disk to rotate.

[0018] In a second aspect, a wafer detection device is provided, which includes the wafer positioning device according to any one of the above, and further includes a carrying device; the rotating device includes a carrying shaft and a carrying platform arranged at the upper end of the carrying shaft. Channels are formed in the driven disk and the fixed disk, and the carrying shaft passes through the channels, and the carrying platform is placed above the fixed disk.

[0019] In some specific implementation manners, by rotating the driven disk, a plurality of clamping members are driven to move along the limiting channels, and the plurality of clamping members form a positioning plane with an area not larger than the size of the wafer.

[0020] In some specific implementation manners, the plurality of clamping members form a positioning plane with an area equal to the size of the wafer.

[0021] In some specific implementation manners, the driven disk is driven to rotate by the output linear motion of the lead screw stepper motor.

[0022] The embodiments of the present invention bring the following beneficial effects:

[0023] An embodiment of the present invention provides a wafer positioning device and a wafer detection device. By applying an external force to the driven disk, the driven disk rotates relative to the fixed disk, and the rotation of the driven disk drives a plurality of clamping members to move towards each other, thereby realizing the dimensional change of the positioning plane, realizing the transfer and placement of the wafer to be detected on the machine table, and realizing the handover and positioning of the wafer. Compared with the clamping members that move vertically in the prior art, the clamping members in this embodiment simplify the structural design and processing difficulty through a linear motion mode, simplify the mechanism actions of handover and positioning, and improve the accuracy and control precision of handover and positioning.

[0024] Other features and advantages of the present disclosure will be described in the following description, or some features and advantages can be inferred from the description or determined without doubt, or can be obtained by implementing the above technologies of the present disclosure.

[0025] To make the above objects, features, and advantages of the present disclosure more obvious and understandable, the following specifically lists preferred embodiments and, in conjunction with the accompanying drawings, details are described as follows. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] To more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the following will briefly introduce the drawings required for use in the description of the specific embodiments or the prior art. Obviously, the following drawings are some embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0027] Figure 1 Schematic structural diagram of the wafer positioning device provided by the embodiment of the present invention;

[0028] Figure 2 Schematic structural diagram of the fixed disk provided by the embodiment of the present invention;

[0029] Figure 3 Schematic structural diagram of the connecting member provided by the embodiment of the present invention;

[0030] Figure 4 Schematic connection structure diagram of the power component provided by the embodiment of the present invention;

[0031] Figure 5 Schematic structural diagram of the wafer detection device provided by the embodiment of the present invention.

[0032] Reference numerals: 100 - wafer positioning device; 200 - wafer detection device;

[0033] 110 - Fixed disk; 120 - Driven disk; 130 - Clamping member; 140 - Connecting member; 150 - Power component; 160 - Channel; 210 - Carrying platform; 220 - Carrying shaft;

[0034] 111 - Limit channel; 112 - Extension base; 113 - Bush;

[0035] 121 - Radial groove;

[0036] 141 - Connecting rod; 142 - Cam follower; 143 - Short shaft; 144 - Elbow; 145 - Pre - tightening spring;

[0037] 151 - Lead screw stepper motor; 152 - Slide block. Detailed implementation mode

[0038] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are some, but not all, of the embodiments of the present invention. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts fall within the scope of protection of the present invention.

[0039] The wafer positioning device provided by the embodiments of the present application is applied to the semiconductor front - end detection scenario, specifically for the scenario of detecting wafers. In this scenario, the detection method is to scan the wafer surface along a specific path by laser, obtain the optical information of each position on the wafer surface, and determine whether there are defects on the wafer surface based on this optical information. Among them, when the laser scans, the wafer is in a rotating motion state.

[0040] In the actual detection scenario for the above process, a wafer transportation unit and a wafer placement unit need to be configured. The wafer transportation unit is used to transport the wafer to be detected to the wafer placement unit. The wafer placement unit is a rotating table, and the rotation of the rotating table of the wafer placement unit cooperates with the laser scanning to realize the detection of the wafer surface.

[0041] Among them, when the wafer transportation unit transports the wafer to the placement unit, a wafer receiving and positioning device needs to be configured to receive and fix the wafer to be detected in the transportation unit above the rotating table and be received again by the rotating table. And this device is the wafer positioning device provided by this embodiment, which is used to receive and fix the wafer to be detected and cooperate with other mechanisms of the rotating table to realize the transfer of the wafer.

[0042] Herein, the "wafer" in this embodiment generally refers to a substrate formed of semiconductor or non-semiconductor materials. Examples include (but are not limited to) single crystal silicon, gallium arsenide, gallium nitride, and indium phosphide. Such substrates can typically be found and / or processed in semiconductor manufacturing facilities. In some cases, the wafer may only include the substrate (i.e., a bare die). Alternatively, the wafer may include one or more different material layers formed on the substrate. One or more layers formed on the wafer may be "patterned" or "unpatterned". For example, the wafer may include multiple bare dies with repeatable pattern features.

[0043] Regarding the structure of the wafer positioning device in this embodiment, please refer to Figure 1 , the wafer positioning device 100 includes a fixed disk 110 and a driven disk 120, where the fixed disk is a non-movable mechanism and the driven disk is a mechanism that can be moved by an external force.

[0044] Herein, the movement direction of the driven disk is a rotational movement relative to the fixed disk. Specifically, the driven disk rotates based on the axis of the fixed disk. Then, in this embodiment, the fixed disk and the driven disk are connected to each other and coaxially arranged.

[0045] It should be noted that the fixation of the fixed disk is not drawn in Figure 1 , and it is fixed by connecting to an external fixing mechanism. Since the non-moving state of the fixed disk is not the main technical feature in this embodiment, it will not be elaborated in this embodiment.

[0046] Herein, it further includes at least two clamping members in the same plane, and these clamping members can move towards each other relative to the center of the fixed disk through the rotational movement of the driven disk. A plane is formed between the multiple clamping members, and this plane is a positioning plane with a variable area.

[0047] Specifically, the formed plane is used to place the wafer to be detected, that is, the wafer to be detected is placed on the top surfaces of the multiple clamping members. The wafer transfer unit transports the wafer to be detected into this plane to achieve the positioning and placement of the wafer during the intermediate transfer process.

[0048] In this embodiment, the movement of the clamping members towards each other includes moving closer to each other and moving away from each other. It can be understood that within the same movement time, at least two clamping members perform the same movement relative to the fixed disk, with the same movement path and movement state, and the same movement stroke, starting position relative to the fixed disk, and ending position relative to the fixed disk.

[0049] By the movement of the clamping members towards each other, the positioning plane always maintains the same central point, and only the relative positions of the clamping members cause corresponding changes in the area of the positioning plane.

[0050] The reason for the change in the area of ​​the positioning plane is that when transferring and receiving the wafer, the initial size must be larger than the wafer. When positioning, the size of the positioning plane must be able to fix the wafer. When transferring to the next link, the size of the positioning area must be larger than the wafer size to make the wafer leave this plane.

[0051] The size of the positioning plane for fixing the wafer should be smaller than the size of the wafer, so that the wafer can be placed in contact with the top surface of the clamp.

[0052] Preferably, the size of the positioning plane is the same as the size of the wafer. Moreover, the size can be changed and adjusted according to wafers of different sizes, for example, the size of the positioning plane corresponding to an eight-inch wafer is the same as that of the twelve-inch wafer.

[0053] The size of the positioning plane includes but is not limited to any one of area and diameter.

[0054] Therefore, this embodiment realizes the change of the positioning plane when the wafer is transported through the above structure, and can stably realize the stable positioning of the wafer during the transport process.

[0055] In another implementation of this embodiment, in order to stably place the wafer on this device, the optimal number of clamping members is three based on the principle that three points form a circle, that is, the number of clamping members set in this embodiment is three. That is, a circular positioning plane is formed by three clamping members, and the area of ​​this positioning plane should not be larger than the wafer area when the wafer is placed, and the diameter of this positioning plane should not be larger than the wafer diameter when the wafer is placed.

[0056] The three clamping members are respectively driven by the rotational motion of the driven disk to move toward each other.

[0057] In order to realize the relative movement of the above-mentioned three clamping members, and the same movement path and movement state during the movement, the same movement stroke, the starting position relative to the fixed disk, and the end position relative to the fixed disk, the embodiment of the present application provides a limited channel on the fixed disk, and the clamping members are configured in the limited channel to move toward each other relative to the fixed disk in the limited channel.

[0058] See also Figure 2 Regarding the structure of the fixed plate and the limiting channel, the limiting channel is an arc-shaped structure, and in order to ensure that the multiple clamping members are in a relationship of moving toward each other, a specific positional relationship is set between the above-mentioned multiple limiting channels.

[0059] Specifically, for the planar rotation relationship between adjacent limiting channels, the so-called planar rotation relationship means that for one of the adjacent limiting channels, the other limiting channel is obtained by rotating based on the plane of the fixed disk.

[0060] In this embodiment, the rotation angle includes any angle between 270° and 300°, and preferably 300° is the rotation angle. After the above planar rotation relationship, the limiting channels are in the Figure 2 layout form shown, with their arc concave sides facing the same direction, all facing the circumferential direction of the fixed disk, and for the above-mentioned limiting channels, the circles formed by their centers are concentric with the fixed disk.

[0061] In summary, for the wafer positioning device provided in the embodiment of the present application, an external force is applied to the driven disk to make it rotate relative to the fixed disk, and the clamping member connected to the driven disk moves synchronously. And through the limiting channels provided on the fixed disk, the movement of the clamping member changes from the rotational movement of the driven disk to move along the arc structure of the limiting channel, so that relative movement is formed between multiple clamping members, and the size of the positioning plane changes.

[0062] Among them, when the driven disk rotates clockwise, the clamping member moves along the limiting channel towards the center of the fixed disk, reducing the area of the positioning size. When the driven disk rotates counterclockwise, the clamping member moves along the limiting channel away from the center of the fixed disk, increasing the area of the positioning plane.

[0063] Please refer to Figure 1 again. For the clamping member in this embodiment, it is connected to the driven disk through a connecting member, that is, the driven disk drives the clamping member to move through the connecting member.

[0064] Among them, referring to Figure 3 for the specific structure of the connecting member, the connecting member in this embodiment includes a connecting rod and a cam follower fixedly connected to one end of the connecting rod. The cam follower is connected to the driven disk, and the other end of the connecting rod is connected to the clamping member.

[0065] In Figure 3 it can be seen that the connecting rod adopts an L-shaped structure in this embodiment. The setting of the L-shaped structure is used to realize the change of the movement path of the clamping member, that is, to change the movement path of the driven disk, changing the rotational movement path of the driven disk, so that the clamping member realizes the movement relative to the center of the fixed disk.

[0066] Among them, the cam follower is arranged in a radial groove opened on the driven disk, and the radial groove extends towards the center of the driven disk.

[0067] In order to make the state of the connecting rod more stable during movement and the movement of the clamping member more conform to the trajectory of the arc-shaped limiting channel, in this embodiment, a short shaft connected to the fixed disk is provided at the elbow of the connecting rod, and a bearing is provided between the short shaft and the fixed disk. When the driven disk rotates relative to the fixed disk, the driven disk pushes the cam follower through the radial groove, so that the connecting rod drives the clamping member to rotate around the bearing at its elbow, thereby realizing the clamping member approaching or departing from the center of the fixed disk.

[0068] Since there is a gap between the radial groove of the driven disk and the cam follower, it will affect the repeatability accuracy of the mechanism.

[0069] To solve this problem, a pre-tightening mechanism is also provided in this embodiment, which is connected to one side of the short end of the connecting rod and is used to provide a tensile force to the connecting rod, so that the cam follower fits against one side in the radial groove, reducing the accuracy impact caused by the gap.

[0070] As for the pre-tightening mechanism, as long as it can provide a tensile force to the connecting rod. In a feasible way, the pre-tightening mechanism includes a pre-tightening spring, where one end of the pre-tightening spring is connected to the connecting rod and the other end is connected to the fixed disk. When the driven disk rotates relative to the fixed disk, the pre-tightening spring is stretched, and its spring force makes the radial groove of the driven disk and the pushing cam follower always contact with only one side, thereby eliminating the transmission gap.

[0071] For the above wafer positioning device, by setting a connecting member, the clamping member moves correspondingly when the driven disk moves.

[0072] In this embodiment, for the above wafer positioning device, the rotational movement of the driven disk is realized based on an external force, and this external force can include various power components.

[0073] Please refer to Figure 1 , for this embodiment, the power component includes any one of a lead screw stepper motor and a linear motor. Among them, the lead screw stepper motor is preferably selected. The lead screw stepper motor outputs a force in the linear motion direction and drives the driven disk to rotate.

[0074] Refer to Figure 4 , regarding this lead screw stepper motor, it is installed on the vertical plate, and the vertical plate is fixed at the bottom plate. The nut of the lead screw stepper motor is installed on the slider, and one end of the connecting rod is connected through a small bearing, and the other end of the connecting rod is connected to the driven disk through another small bearing.

[0075] Through the above method, the movement of the lead screw stepper motor is transformed into the rotational movement of the rotating disk relative to the fixed disk.

[0076] Regarding the connection relationship between the fixed disk and the driven disk, the fixed disk and the driven disk are coaxially arranged, and the extension seat of the driven disk is connected to the fixed disk through a bushing or a bearing. Through this structure, the fixation of the fixed disk and the movement of the driven disk relative to the fixed disk can be achieved.

[0077] An embodiment of the present application provides a wafer positioning device. By applying an external force to the driven disk, the driven disk rotates relative to the fixed disk, and the rotation of the driven disk drives a plurality of clamping members to move towards each other, thereby realizing the change in the area of the positioning plane, realizing the transfer and placement of the wafer to be detected on the machine table, and realizing the handover and positioning of the wafer.

[0078] Compared with the clamping members that move in the vertical direction in the prior art, the clamping members in this embodiment simplify the structural design and processing difficulty through a linear motion mode, simplify the mechanism actions of handover and positioning, and improve the accuracy and control precision of handover and positioning.

[0079] Refer to Figure 5 , an embodiment of the present application also provides a wafer detection device 200, which includes the above-mentioned wafer positioning device and also includes a carrying device. The rotating device includes a carrying shaft 220 and a carrying platform 210 arranged at the upper end of the carrying shaft.

[0080] Please continue to refer to Figure 1 , in order to enable the passage of the carrying shaft in this embodiment, channels 160 are opened in the driven disk and the fixed disk. The carrying shaft passes through the channels, and the carrying platform is placed above the fixed disk.

[0081] Finally, an explanation is given on how the wafer detection device provided in this embodiment performs wafer handover and positioning.

[0082] For the carrying platform in the wafer detection device, it descends along with the carrying shaft, and the clamping members synchronously move towards the center of the fixed disk to the material receiving position.

[0083] The external EFEM manipulator wafer fork carries the wafer into the wafer detection device. The manipulator descends and places the wafer on the top surfaces of the three clamping members to complete the placement, and then the manipulator withdraws from the EFEM.

[0084] The carrying platform rises along with the carrying shaft until the top surface of the carrying platform contacts the wafer to carry the wafer.

[0085] The carrying platform adsorbs the wafer, and the carrying platform rises along with the carrying shaft until the wafer separates from the three clamping members.

[0086] The clamping members synchronously move away from the center of the fixed disk until the area of the placement space is larger than the wafer to remove the clamping members.

[0087] After the carrier stage descends along with the carrier shaft until the wafer is lower than the top surface of the clamping member, the clamping member moves towards the center until the side surface of the clamping member contacts the side surface of the wafer, completing the wafer positioning. The clamping member moves outwards synchronously and no longer contacts the edge of the wafer, thus realizing handover and positioning. The carrier stage rotates to enter the detection program.

[0088] In this embodiment, the carrier device in the wafer detection equipment is the final wafer placement position, which can realize vertical movement and rotational movement. The vertical movement of the carrier device is used to transport the wafer placed on the positioning device to the carrier stage, and the rotational movement is to rotate the wafer on the carrier stage and cooperate with the optical device to detect the wafer.

[0089] Regarding how the carrier stage realizes the stability of wafer placement in the above process, relevant technical means in the prior art can be referred to, including but not limited to vacuum adsorption and other means, which will not be elaborated in this embodiment.

[0090] In the description of the present invention, it should be noted that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation to the present invention. In addition, the terms "first", "second", "third" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0091] Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements on some or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A wafer positioning device, characterized in that: include: A fixed disk and a driven disk are connected to each other and coaxially arranged, and the driven disk can rotate relative to the fixed disk by an external force; At least two clamping members are located in the same plane, and at least two of the clamping members can move toward each other relative to the center of the fixed disk through the rotational movement of the driven disk to form a positioning plane with variable size; the movement toward each other includes movement toward each other and movement away from each other.

2. The wafer positioning device according to claim 1, characterized in that: A limiting channel is provided on the fixed disk, and at least two clamping members are arranged in the limiting channel and move synchronously relative to the fixed disk in the limiting channel.

3. The wafer positioning device according to claim 1, characterized in that: At least two of the clamping members are connected to the driven disk via corresponding connecting members.

4. The wafer positioning device according to claim 3, characterized in that: The connecting member comprises a connecting rod and a cam follower fixedly connected to the connecting rod, and the cam follower is connected to the driven disk.

5. The wafer positioning device according to claim 4, characterized in that: The connecting rod is in an L-shaped structure, with a short end connected to the cam follower and a long end connected to the clamping member.

6. The wafer positioning device according to claim 5, characterized in that: The cam follower is arranged in a radial groove opened on the driven disk, and the radial groove extends toward the center direction of the driven disk.

7. The wafer positioning device according to claim 5, characterized in that: The elbow of the connecting rod is provided with a short shaft connected with the fixing plate, and a bearing is provided between the short shaft and the fixing plate.

8. The wafer positioning device according to claim 6, characterized in that: A pre-tightening mechanism is arranged on the driven disk, and the pre-tightening mechanism is connected to one side of the short end of the connecting rod, and is used to provide a tensile force to the connecting rod so that the cam follower fits with the radial groove.

9. The wafer positioning device according to claim 8, characterized in that: The pre-tightening mechanism comprises a pre-tightening spring, one end of which is connected to the connecting rod, and the other end of which is fixedly connected to the fixing plate.

10. The wafer positioning device according to claim 2, characterized in that: The number of the clamping members is three, and the number of the limiting channels relative to the clamping members is three.

11. The wafer positioning device according to claim 10, characterized in that: The limiting channel is an arc-shaped structure.

12. The wafer positioning device according to claim 11, characterized in that: There is a planar rotation relationship between adjacent limiting channels, and the planar rotation relationship between multiple limiting channels is the same.

13. The wafer positioning device according to claim 1, characterized in that: The fixed disk is coaxially arranged with the driven disk, and the driven disk is connected with an extension seat of the fixed disk via a shaft sleeve or a bearing.

14. The wafer positioning device according to claim 1, characterized in that: The power component outputs a force in a linear motion direction and drives the driven disk to rotate; the power component includes any one of a screw stepping motor and a linear motor.

15. A wafer inspection device, characterized in that: It includes the wafer positioning device described in any one of claims 1-14, and also includes a carrying device; the carrying device includes a carrying shaft and a carrying platform arranged at the upper end of the carrying shaft, a channel is opened in the driven disk and the fixed disk, the carrying shaft passes through the channel, and the carrying platform is placed above the fixed disk.

16. The wafer inspection device according to claim 15, characterized in that: The driven disk is rotated to drive the plurality of clamping members to move along the limiting channel, and the plurality of clamping members form a positioning plane whose size is not greater than that of the wafer.

17. The wafer inspection device according to claim 16, characterized in that: A plurality of clamping members form a positioning plane having a size equal to that of the wafer.

18. The wafer inspection device according to claim 16, characterized in that: The driven disk is driven to rotate by outputting linear motion through the screw stepping motor.

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