Radio frequency resistor structure suitable for coaxial mismatched load

Abstract

The utility model discloses a radio frequency resistor structure suitable for a coaxial mismatched load. The radio frequency resistor structure comprises a substrate, an electrode block I, an electrode block II and a resistor block, the first electrode block and the second electrode block are both arranged on the front face of the substrate. A resistance block is arranged between the first electrode block and the second electrode block and connected with the first electrode block and the second electrode block. The second electrode block is connected with a grounding structure. Through the structural design, the resistor paste with proper resistance value can be selected to prepare a resistor block with a specific size according to specific power, frequency and standing wave requirements proposed by customers, so that a resistor chip with corresponding resistance value required to be matched with a mismatched load can be quickly produced; compared with the prior art, the radio frequency resistor chip has the advantages that the condition that the chip structure needs to be repeatedly designed due to the change of power and frequency requirements is reduced, namely, the radio frequency resistor chip used by mismatched loads with various specifications and parameters can be quickly prepared, the production time and cost are reduced, and meanwhile, certain use cost is saved for customers.

Description

Technical Field

[0001] The utility model relates to the technical field of microwave measurement, and more specifically, to a radio frequency resistor structure suitable for a coaxial mismatch load. Background Art

[0002] In the field of microwave measurement, a mismatch load absorbs part of the microwave power and reflects part of the microwave power, having a certain fixed voltage standing wave ratio, and is mainly used for testing and analysis. When performing microwave measurement, the use of a mismatch load will increase the complexity and difficulty of the test. In order to accurately simulate different load conditions and obtain reliable test results, it is necessary to use mismatch loads with various different specifications and parameters for testing.

[0003] Customized mismatch loads will increase the cost of system testing. Especially when multiple mismatch loads with different specifications and parameters are required, the cost issue will become more prominent.

[0004] In view of this, this application is specifically proposed. Content of the Utility Model

[0005] The technical problem to be solved by the utility model is that when mismatch loads with various different specifications and parameters are required for testing, customized mismatch loads will increase the cost of system testing. The purpose is to provide a radio frequency resistor structure suitable for a coaxial mismatch load. When resistor chips with different resistance values are needed, only the size of the resistor block needs to be changed according to the resistance value, and there is no need to carry out repeated design, that is, radio frequency resistor chips used for mismatch loads with various specifications of parameters can be quickly prepared, reducing the production time and cost, and at the same time saving a certain amount of usage cost for customers.

[0006] The utility model is realized through the following technical solutions:

[0007] A radio frequency resistor structure suitable for a coaxial mismatch load, comprising a substrate, a first electrode block, a second electrode block, and a resistor block;

[0008] Both the first electrode block and the second electrode block are arranged on the front surface of the substrate;

[0009] A resistor block is arranged between the first electrode block and the second electrode block, and the resistor block is connected to both the first electrode block and the second electrode block;

[0010] The second electrode block is connected with a grounding structure.

[0011] When resistor chips with different resistance values are needed for the utility model, only the size of the resistor block needs to be changed according to the resistance value, and there is no need to carry out repeated design, that is, radio frequency resistor chips used for mismatch loads with various specifications of parameters can be quickly prepared, reducing the production time and cost, and at the same time saving a certain amount of usage cost for customers.

[0012] In a specific embodiment, the grounding structure includes a side grounding layer disposed on the side wall of the substrate on the side where the second electrode block is located, and the side grounding layer is connected to the second electrode block.

[0013] In a specific embodiment, the grounding structure further includes a bottom grounding layer disposed on the back surface of the substrate opposite to the surface where the first electrode block and the second electrode block are located, and the bottom grounding layer is connected to the side grounding layer.

[0014] The present utility model provides a side grounding layer and a bottom grounding layer connected to the second electrode block to achieve a good grounding effect. In addition, the setting of the bottom grounding layer can also facilitate the welding of the RF resistance structure during use.

[0015] In a specific embodiment, the substrate is made of beryllium oxide substrate. Beryllium oxide has excellent thermal conductivity, especially below 300 °C, and its thermal conductivity is about 300 Wm -1 K -1 , much higher than other ceramic materials such as alumina. Beryllium oxide has a high resistivity and is classified as an electrical insulator. It also has excellent thermal stability and corrosion resistance, and can maintain stable performance at high temperatures. Therefore, it is selected as the carrier of the RF resistance chip.

[0016] In a specific embodiment, both the side grounding layer and the bottom grounding layer are made of conductive silver paste through a thick film process.

[0017] In a specific embodiment, both the first electrode block and the second electrode block are made of conductive silver paste through a thick film process.

[0018] In a specific embodiment, the resistance block is made of resistance paste through a thick film process.

[0019] In a specific embodiment, the resistance block has multiple size models, which respectively match the power conditions required by multiple mismatch loads. The resistance block can use different-sized squares as the design standard pattern according to the required power. When RF resistance chips with different resistance values are needed, there is no need for repeated design. Only by selecting the corresponding resistance size according to the power can the RF resistance structure be prepared, reducing production time and cost.

[0020] In a specific embodiment, the length of the second electrode block covers the length range of the side where the side grounding layer is located.

[0021] In a specific embodiment, the side grounding layer covers the entire area of the side of the substrate, and the bottom grounding layer covers the entire area of the back surface of the substrate.

[0022] The side grounding layer and bottom grounding layer of the present utility model cover the entire side and bottom of the substrate, enabling better grounding conduction and facilitating soldering at the bottom of the substrate.

[0023] Compared with the prior art, the present utility model has the following advantages and beneficial effects:

[0024] For a radio frequency resistor structure applicable to a coaxial mismatch load provided by an embodiment of the present utility model, when resistor chips with different resistance values are required, only the size of the resistor block needs to be changed according to the resistance value, and there is no need for repeated design. That is, radio frequency resistor chips used for mismatch loads with various specifications of parameters can be quickly prepared, reducing production time and costs, and saving certain usage costs for customers at the same time. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the technical solutions of the exemplary embodiments of the present utility model, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present utility model and should not be regarded as limiting the scope. For those of ordinary skill in the art, other related drawings can be obtained based on these drawings without creative efforts.

[0026] Figure 1 It is a front view of the radio frequency resistor structure provided by an embodiment of the present utility model;

[0027] Figure 2 It is a side view of the radio frequency resistor structure provided by an embodiment of the present utility model;

[0028] Figure 3 It is a rear view of the radio frequency resistor structure provided by an embodiment of the present utility model;

[0029] Figure 4 It is a three-dimensional view of the radio frequency resistor structure provided by an embodiment of the present utility model.

[0030] Marks in the drawings and corresponding component names:

[0031] 1 - Substrate, 2 - First electrode block, 3 - Second electrode block, 4 - Resistor block, 5 - Side grounding layer, 6 - Bottom grounding layer. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0032] To make the objectives, technical solutions, and advantages of the present utility model more clearly understood, the present utility model will be further described in detail below in conjunction with the embodiments and the drawings. The illustrative embodiments and descriptions thereof of the present utility model are only used to explain the present utility model and are not intended to limit the present utility model.

[0033] In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present utility model. However, it will be apparent to those of ordinary skill in the art that: the present utility model may be practiced without these specific details. In other embodiments, well-known structures have not been described in detail in order to avoid obscuring the present utility model.

[0034] Throughout the specification, references to "one embodiment", "an embodiment", "one example" or "an example" mean that a particular feature, structure, or characteristic described in connection with the embodiment or example is included in at least one embodiment of the present utility model. Thus, the phrases "one embodiment", "an embodiment", "one example" or "an example" appearing throughout the specification do not necessarily all refer to the same embodiment or example. Furthermore, the particular features, structures, or characteristics may be combined in any suitable combination and / or sub-combination in one or more embodiments or examples. In addition, those of ordinary skill in the art should understand that the diagrams provided herein are for illustrative purposes only and are not necessarily drawn to scale. The term "and / or" used herein includes any and all combinations of one or more of the associated listed items.

[0035] In the description of the present utility model, the orientation or positional relationship indicated by the terms "front", "rear", "left", "right", "upper", "lower", "vertical", "horizontal", "high", "low", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the protection scope of the present utility model.

[0036] Embodiment

[0037] As Figures 1 - 4 shown, a radio frequency resistor structure applicable to a coaxial mismatch load provided by an embodiment of the present utility model includes a substrate 1, a first electrode block 2, a second electrode block 3, and a resistor block 4;

[0038] Both the first electrode block 2 and the second electrode block 3 are disposed on the front surface of the substrate 1;

[0039] A resistor block 4 is disposed between the first electrode block 2 and the second electrode block 3, and the resistor block 4 is connected to both the first electrode block 2 and the second electrode block 3;

[0040] The second electrode block 3 is connected to a grounding structure.

[0041] When different resistance values of resistor chips are needed in the present utility model, it is only necessary to change the size of the resistor block according to the resistance value, without the need for repeated design, and the radio frequency resistor chips used for mismatch loads with various specifications of parameters can be quickly prepared, reducing the production time and cost, and at the same time saving a certain amount of usage cost for customers.

[0042] In a specific embodiment, the grounding structure includes a side grounding layer 5 provided on the side wall of the substrate 1 on the side where the electrode block two 3 is located, and the side grounding layer 5 is connected to the electrode block two 3.

[0043] In a specific embodiment, the grounding structure further includes a bottom grounding layer 6 provided on the back surface of the substrate 1 opposite to the surface where the electrode block one 2 and the electrode block two 3 are located, and the bottom grounding layer 6 is connected to the side grounding layer 5.

[0044] The present utility model provides a side grounding layer and a bottom grounding layer and connects them to the electrode block two 3 to achieve a good grounding effect. In addition, the setting of the bottom grounding layer can also facilitate the welding of the radio frequency resistor structure during use.

[0045] In a specific embodiment, the substrate 1 uses a beryllium oxide substrate. Beryllium oxide has excellent thermal conductivity, especially below 300 °C, and its thermal conductivity is about 300 Wm -1 K -1 , which is much higher than other ceramic materials such as alumina. Beryllium oxide has a relatively high resistivity and is classified as an electrical insulator. It also has excellent thermal stability and corrosion resistance, and can maintain stable performance at high temperatures, so it is selected as the carrier of the radio frequency resistor chip.

[0046] In a specific embodiment, both the side grounding layer 5 and the bottom grounding layer 6 are made by thick film process using conductive silver paste.

[0047] In a specific embodiment, both the electrode block one 2 and the electrode block two 3 are made by thick film process using conductive silver paste.

[0048] In a specific embodiment, the resistor block 4 is made by thick film process using resistor paste.

[0049] In a specific embodiment, the resistor block 4 has various size models, which respectively match the power conditions required for various mismatch loads. Among them, the resistor block can use different sizes of squares as the design standard graphics according to the required power size, so that when different resistance value resistor chips are needed, there is no need for repeated design. Only by selecting the corresponding resistor size according to the power size can the radio frequency resistor structure be prepared, reducing the production time and cost.

[0050] In a specific embodiment, the length of the second electrode block 3 covers the length range of the side where the side grounding layer 5 is located.

[0051] In a specific embodiment, the side grounding layer 5 covers the entire area of the side surface of the substrate 1, and the bottom grounding layer 6 covers the entire area of the back surface of the substrate 1.

[0052] The side grounding layer and the bottom grounding layer of the present utility model cover the entire side surface and the bottom surface of the substrate, which can better conduct grounding and facilitate the soldering of the bottom of the substrate.

[0053] Through the above structural design, according to the specific power, frequency and standing wave requirements proposed by customers, a resistor paste with an appropriate resistance value can be selected to prepare a resistor block with a specific size, so as to quickly produce a resistor chip with a corresponding resistance value required for the mismatch load. Such a resistor structure reduces the situation of repeated design of the chip structure due to changes in power and frequency requirements, improves the production efficiency of the resistor chip, and significantly reduces the usage cost of customers.

[0054] The above specific embodiments have further detailed the purpose, technical solutions and beneficial effects of the present utility model. It should be understood that the above are only specific embodiments of the present utility model and are not used to limit the protection scope of the present utility model. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present utility model shall be included in the protection scope of the present utility model.

Claims

1. A radio frequency resistor structure suitable for coaxial mismatched loads, characterized in that: It comprises a substrate (1), an electrode block 1 (2), an electrode block 2 (3), and a resistor block (4); The electrode block 1 (2) and the electrode block 2 (3) are both arranged on the front side of the substrate (1); A resistor block (4) is disposed between the electrode block 1 (2) and the electrode block 2 (3), and the resistor block (4) is connected to both the electrode block 1 (2) and the electrode block 2 (3); The electrode block 2 (3) is connected to a grounding structure.

2. The radio frequency resistor structure suitable for coaxial mismatched load according to claim 1, characterized in that: The grounding structure comprises a side grounding layer (5) arranged on the side wall of the substrate (1) on the side where the second electrode block (3) is located, and the side grounding layer (5) is connected to the second electrode block (3).

3. The radio frequency resistor structure suitable for coaxial mismatched load according to claim 2, characterized in that: The grounding structure further comprises a bottom grounding layer (6) arranged on the back side of the substrate (1) opposite to the side where the electrode block 1 (2) and the electrode block 2 (3) are located, and the bottom grounding layer (6) is connected to the side grounding layer (5).

4. The radio frequency resistor structure suitable for coaxial mismatched load according to claim 3, characterized in that: The side grounding layer (5) and the bottom grounding layer (6) are both made of conductive silver paste through thick film processing.

5. The radio frequency resistor structure suitable for coaxial mismatched load according to claim 1, characterized in that: The substrate (1) is a beryllium oxide substrate.

6. The radio frequency resistor structure suitable for coaxial mismatched load according to claim 1, characterized in that: The electrode block 1 (2) and the electrode block 2 (3) are both made of conductive silver paste through thick film processing.

7. The radio frequency resistor structure suitable for coaxial mismatched load according to claim 1, characterized in that: The resistor block (4) is made of resistor paste through a thick film process.

8. The radio frequency resistor structure suitable for coaxial mismatched load according to claim 1, characterized in that: The resistor block (4) has a variety of sizes and models, respectively matching the power conditions required by a variety of mismatched loads.

9. The radio frequency resistor structure suitable for coaxial mismatched load according to claim 3, characterized in that: The length of the electrode block 2 (3) covers the length range of the side where the side grounding layer (5) is located.

10. The radio frequency resistor structure suitable for coaxial mismatched load according to claim 9, characterized in that: The side grounding layer (5) covers the entire area of ​​the side surface of the substrate (1), and the bottom grounding layer (6) covers the entire area of ​​the back surface of the substrate (1).

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