Four-layer heat dissipation circuit board structure
By setting air permeable holes and thermally conductive convex columns on the thermally conductive metal layer of the circuit board, and filling in insulation filling layers between different levels, the problem of heat accumulation inside the circuit board is solved, better heat dissipation effect is achieved, and the service life of the circuit board is extended.
Patent Information
- Application Number
- CN202422015514.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-19
- Publication Date
- 2025-07-01
- Estimated Expiration
- 2034-08-19
AI Technical Summary
Existing circuit boards are prone to damage due to heat accumulation during use, which affects their service life.
A four-layer heat dissipation circuit board structure is designed, and the effective dissipation of heat is achieved by setting multiple breathable holes and thermally conductive convex columns on the thermally conductive metal layer and filling the insulating filling layer between different layers of the circuit board.
It effectively solves the problem of heat accumulation inside the circuit board. Heat can be directly dissipated out through the thermally conductive convex columns, and air circulates through the breathable holes, further improving the heat dissipation function of the circuit board and extending its service life.
Smart Images
Figure CN223053167U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of circuit boards, in particular to a four-layer heat dissipation circuit board structure. Background Art
[0002] China Authorization Announcement No. CN220554197U, the authorization announcement date is March 1, 2024, and specifically relates to a PCB board with a buffer protection structure, including a PCB board body, the PCB board body includes a base layer, a reinforcement layer, a heat-conducting layer, a protective coating and an electronic device layer distributed from bottom to top; the four corners of the PCB board body are fixedly installed with mounting blocks. During the use of the utility model, through the setting of the reinforcement layer and the heat-conducting layer, the first metal layer and the second metal layer can be used to enhance the anti-fracture phenomenon of the PCB board body, and the PCB board can be prevented from being broken. At the same time, the characteristics of the first metal layer and the second metal layer and the heat-conducting layer can be used to export the heat of the PCB, and the heat on the PCB board can be prevented from being too high, causing the PCB board to be damaged. Through the setting of the protective pad, the corners of the PCB board can be buffered and protected, and the corners of the PCB board can be prevented from contacting the ground when the PCB board falls, causing the PCB board to be damaged, and the service life of the PCB board can be improved. The defect of the prior art is that the heat of the heat-conducting layer is difficult to dissipate to the outside, resulting in heat accumulation in the inner layer of the PCB body, which affects the service life. In view of this situation, improvement is urgently needed. Utility Model Content
[0003] Based on this, the purpose of the utility model is to provide a four-layer heat dissipation circuit board structure with good internal heat dissipation function and improved service life.
[0004] The utility model provides a four-layer heat dissipation circuit board structure, including a circuit board body, wherein the circuit board body includes, from top to bottom, a first inner layer board, a first circuit layer, a second inner layer board, a second circuit layer, a third inner layer board, a first heat conductive metal layer, a core board, a second heat conductive metal layer, a fourth inner layer board, a third circuit layer, a fifth inner layer board, a fourth circuit layer, and a sixth inner layer board;
[0005] The first heat-conducting metal layer is linearly and evenly provided with a plurality of first air holes along the width direction thereof;
[0006] The second heat-conducting metal layer is linearly and evenly provided with a plurality of second air permeable holes along the width direction thereof;
[0007] On opposite sides of the first heat-conducting metal layer in the length direction, a number of equally spaced first extension parts are integrally formed. On the upper surfaces of the first extension parts, first heat-conducting convex columns are integrally formed. On opposite sides of the second heat-conducting metal layer in the length direction, a number of equally spaced second extension parts are integrally formed. On the lower surfaces of the second extension parts, second heat-conducting convex columns are integrally formed; a first insulating filling layer is filled and arranged between two adjacent first extension parts; a second insulating filling layer is filled and arranged between two adjacent second extension parts;
[0008] Insulating coatings are coated on opposite side surfaces of the first heat-conducting metal layer and the second heat-conducting metal layer; insulating coatings are coated on the outer side surfaces of the first heat-conducting convex columns and the second heat-conducting convex columns; through holes for the first heat-conducting convex columns to penetrate are formed in the first inner layer board, the first circuit layer, the second inner layer board, the second circuit layer, and the third inner layer board; through holes for the second heat-conducting convex columns to penetrate are formed in the fourth inner layer board, the third circuit layer, the fifth inner layer board, the fourth circuit layer, and the sixth inner layer board.
[0009] Preferably, a first protective coating is provided on the upper surface of the first inner layer board.
[0010] Preferably, a second protective coating is provided on the lower surface of the sixth inner layer board.
[0011] Preferably, insulating heat-conducting layers are coated on the inner side walls of the through holes of the first inner layer board, the second inner layer board, and the third inner layer board.
[0012] Preferably, insulating heat-conducting layers are coated on the inner side walls of the through holes of the fourth inner layer board, the fifth inner layer board, and the sixth inner layer board.
[0013] The beneficial effects of the present utility model are as follows: The first heat-conducting metal layer and the second heat-conducting metal layer are provided. A number of first heat-conducting convex columns of the first heat-conducting metal layer extend out of the circuit board body, and a number of second heat-conducting convex columns of the second heat-conducting metal layer extend out of the circuit board body, effectively solving the problem of heat accumulation inside the circuit board body. Heat can directly dissipate outward through the first heat-conducting convex columns and the second heat-conducting convex columns. Moreover, a number of first air holes are linearly and evenly distributed along the width direction of the first heat-conducting metal layer, and a number of second air holes are linearly and evenly distributed along the width direction of the second heat-conducting metal layer, enabling air to pass through the first air holes and the second air holes, thereby further enhancing the heat dissipation function inside the circuit board body, and directly improving the service life. BRIEF DESCRIPTION OF THE DRAWINGS
[0014] Figure 1 It is a three-dimensional exploded view of the present utility model.
[0015] The reference numerals are: the first protective coating 10, the first inner layer board 11, the first circuit layer 12, the second inner layer board 13, the second circuit layer 14, the third inner layer board 15, the first heat-conducting metal layer 17, the core board 18, the second heat-conducting metal layer 19, the first insulating filling layer 16, the third circuit layer 20, the fifth inner layer board 21, the fourth circuit layer 22, the sixth inner layer board 23, the second protective coating 24, the second heat-conducting stud 25, the second insulating filling layer 26, the first heat-conducting stud 27, the first ventilation hole 28, the second ventilation hole 29, the fourth inner layer board 30, the first extension part 31, and the second extension part 32. Detailed implementation manners
[0016] To further understand the features, technical means, specific purposes and functions achieved by the present utility model, the present utility model will be further described in detail below in conjunction with the specific implementation manners and the drawings.
[0017] In the present utility model, unless otherwise clearly specified and defined, terms such as "installation", "connection", "connection", "fixation" and the like shall be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or an integral connection; it may be a mechanical connection or an electrical connection; it may be directly connected, or indirectly connected through an intermediate medium, and it may be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific situations.
[0018] Please refer to Figure 1 As shown, the present utility model provides a four-layer heat dissipation circuit board structure, including a circuit board body, which successively includes a first inner layer board 11, a first circuit layer 12, a second inner layer board 13, a second circuit layer 14, a third inner layer board 15, a first heat-conducting metal layer 17, a core board 18, a second heat-conducting metal layer 19, a fourth inner layer board 30, a third circuit layer 20, a fifth inner layer board 21, a fourth circuit layer 22, and a sixth inner layer board 23 from top to bottom;
[0019] A plurality of first ventilation holes 28 are linearly and evenly arranged along the width direction of the first heat-conducting metal layer 17;
[0020] A plurality of second ventilation holes 29 are linearly and evenly arranged along the width direction of the second heat-conducting metal layer 19;
[0021] On opposite sides in the length direction of the first heat-conducting metal layer 17, a number of equally spaced first extension parts 31 are integrally formed. On the upper surfaces of the first extension parts 31, first heat-conducting convex columns 27 are integrally formed. On opposite sides in the length direction of the second heat-conducting metal layer 19, a number of equally spaced second extension parts 32 are integrally formed. On the lower surfaces of the second extension parts 32, second heat-conducting convex columns 25 are integrally formed; a first insulating filling layer 16 is filled and arranged between two adjacent first extension parts 31; a second insulating filling layer 26 is filled and arranged between two adjacent second extension parts 32; the heights of the first heat-conducting convex columns 27 and the second heat-conducting convex columns 25 are lower than or equal to the outer side surface of the circuit board body. The positions of the first heat-conducting convex columns 27 and the second heat-conducting convex columns 25 are set to avoid the circuit positions of the first circuit layer 12, the second circuit layer 14, the third circuit layer 20, and the fourth circuit layer 22.
[0022] Insulating coatings are coated on the opposite side surfaces of the first heat-conducting metal layer 17 and the second heat-conducting metal layer 19; insulating coatings are coated on the outer side surfaces of the first heat-conducting convex columns 27 and the second heat-conducting convex columns 25; through holes for the first heat-conducting convex columns 27 to penetrate are provided in the first inner layer board 11, the first circuit layer 12, the second inner layer board 13, the second circuit layer 14, and the third inner layer board 15; through holes for the second heat-conducting convex columns 25 to penetrate are provided in the fourth inner layer board 30, the third circuit layer 20, the fifth inner layer board 21, the fourth circuit layer 22, and the sixth inner layer board 23.
[0023] A first protective coating 10 is provided on the upper surface of the first inner layer board 11.
[0024] A second protective coating 24 is provided on the lower surface of the sixth inner layer board 23.
[0025] Insulating heat-conducting layers are coated on the inner side walls of the through holes of the first inner layer board 11, the second inner layer board 13, and the third inner layer board 15. Insulating heat-conducting layers are coated on the inner side walls of the through holes of the fourth inner layer board 30, the fifth inner layer board 21, and the sixth inner layer board 23. Through such a structural setting, the heat of the first heat-conducting metal layer and the second heat-conducting metal layer is dissipated with the assistance of the insulating heat-conducting layer.
[0026] In this embodiment, the first heat-conducting metal layer and the second heat-conducting metal layer are provided. A number of first heat-conducting convex columns of the first heat-conducting metal layer extend out of the circuit board body, and a number of second heat-conducting convex columns of the second heat-conducting metal layer extend out of the circuit board body, effectively solving the problem of heat accumulation inside the circuit board body. The heat can be directly dissipated outward through the first heat-conducting convex columns and the second heat-conducting convex columns. Moreover, a plurality of first air-permeable holes are linearly and evenly distributed along the width direction of the first heat-conducting metal layer, and a plurality of second air-permeable holes are linearly and evenly distributed along the width direction of the second heat-conducting metal layer, enabling air to pass through the first air-permeable holes and the second air-permeable holes, thereby further enhancing the heat dissipation function inside the circuit board body, and directly enhancing the service life.
[0027] The above-described embodiments merely represent one implementation mode of the present utility model. The description is relatively specific and detailed, but it should not be construed as a limitation on the scope of the patent of the present utility model. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present utility model, several modifications and improvements can still be made, and these all fall within the protection scope of the present utility model. Therefore, the protection scope of the patent of the present utility model shall be subject to the appended claims.
Claims
1. A four-layer heat dissipation circuit board structure, comprising a circuit board body, characterized in that: The circuit board body comprises, from top to bottom, a first inner layer board (11), a first circuit layer (12), a second inner layer board (13), a second circuit layer (14), a third inner layer board (15), a first heat-conducting metal layer (17), a core board (18), a second heat-conducting metal layer (19), a fourth inner layer board (30), a third circuit layer (20), a fifth inner layer board (21), a fourth circuit layer (22), and a sixth inner layer board (23); The first heat-conducting metal layer (17) is linearly and evenly provided with a plurality of first air permeable holes (28) along its width direction; The second heat-conducting metal layer (19) is provided with a plurality of second air-permeable holes (29) evenly distributed linearly along its width direction; A plurality of equidistant first extension portions (31) are integrally formed on opposite sides in the length direction of the first heat-conducting metal layer (17), and a first heat-conducting convex column (27) is integrally formed on the upper surface of each of the first extension portions (31); a plurality of equidistant second extension portions (32) are integrally formed on opposite sides in the length direction of the second heat-conducting metal layer (19), and a second heat-conducting convex column (25) is integrally formed on the lower surface of each of the second extension portions (32); a first insulating filling layer (16) is filled between two adjacent first extension portions (31); and a second insulating filling layer (26) is filled between two adjacent second extension portions (32); The first heat-conducting metal layer (17) and the second heat-conducting metal layer (19) are coated with an insulating coating on their opposite sides; the outer sides of each of the first heat-conducting protrusions (27) and the second heat-conducting protrusions (25) are coated with an insulating coating; the first inner layer board (11), the first circuit layer (12), the second inner layer board (13), the second circuit layer (14), and the third inner layer board (15) are all provided with through holes for the first heat-conducting protrusions (27) to pass through; and the fourth inner layer board (30), the third circuit layer (20), the fifth inner layer board (21), the fourth circuit layer (22), and the sixth inner layer board (23) are all provided with through holes for the second heat-conducting protrusions (25) to pass through.
2. A four-layer heat dissipation circuit board structure according to claim 1, characterized in that: The upper surface of the first inner layer plate (11) is provided with a first protective coating (10).
3. The four-layer heat dissipation circuit board structure according to claim 1, characterized in that: The lower surface of the sixth inner layer plate (23) is provided with a second protective coating (24).
4. The four-layer heat dissipation circuit board structure according to claim 1, characterized in that: The inner side walls of the through holes of the first inner layer plate (11), the second inner layer plate (13) and the third inner layer plate (15) are all coated with an insulating heat-conducting layer.
5. The four-layer heat dissipation circuit board structure according to claim 1, characterized in that: The inner side walls of the through holes of the fourth inner layer plate (30), the fifth inner layer plate (21) and the sixth inner layer plate (23) are all coated with an insulating heat-conducting layer.