Base plate for drilling processing of circuit board
By designing a circuit board drilling pad with a chip removal structure, the problem that conventional pad boards cannot effectively clean the drilling debris is solved, ensuring the quality of the circuit board processing and improving the production efficiency, and further improving the processing stability and tool life through adsorbents and heat conductors are used.
Patent Information
- Application Number
- CN202421976017.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-15
- Publication Date
- 2025-07-01
- Estimated Expiration
- 2034-08-15
AI Technical Summary
Conventional circuit board pads cannot effectively clean residual drilling debris, resulting in reduced board processing quality, which may damage drilling tools, increase production costs and reduce efficiency.
A pad for drilling and processing of circuit boards is designed, including chip removal structure, air intake joint, air hole, chip removal joint and feed port. By setting up chip removal zone and blowing zone, the air flow and negative pressure joint are used to achieve timely cleaning of surface debris.
Effectively clean impurities and debris on the pads, avoid affecting the processing quality of the circuit board, ensure production quality and efficiency, and fix the pads through adsorbents to prevent displacement, reduce the drill bit temperature through the heat conductor, and extend the tool life.
Smart Images
Figure CN223053200U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to a circuit board backing plate, in particular to a backing plate for circuit board drilling processing. Background Art
[0002] The circuit board backing plate is an important part in the mechanical drilling processing of the circuit board, which can effectively prevent the occurrence of undercut and burr on the circuit board substrate (processed sheet material). At the same time, it can extend the drilling needle stroke and play a role in protecting the drilling needle and the drilling machine table surface for the drilling processing of through holes.
[0003] When the circuit board is mechanically drilled, a large amount of copper foil chips, resin chips and glass fiber chips will be generated, which need to be cleaned in time. Usually, a nozzle connected to a compressed air supply device is used to blow the chips on the backing plate. However, if the drilling chips are not completely cleared from the processing table surface, some of the blown chips will still fall back to the surface of the backing plate. The conventional backing plate cannot effectively clean the residual chips by itself. When there are sundries between the backing plate and the circuit board, the circuit board will be bent and deformed when pressing the plate during drilling, forming voids, etc., which will not only affect the processing quality of the circuit board, but also may cause damage to the drilling tool, affect the performance and reliability of the circuit board, and may lead to an increase in production cost and a decrease in production efficiency. Summary of the Utility Model
[0004] In order to overcome the shortcomings that the conventional backing plate has a single structure and cannot effectively clean the residual chips by itself. When there are sundries between the backing plate and the circuit board, the circuit board will be bent and deformed when pressing the plate during drilling, forming voids, etc., which will not only affect the processing quality of the circuit board, but also may cause damage to the drilling tool, affect the performance and reliability of the circuit board, and may lead to an increase in production cost and a decrease in production efficiency. The purpose of the utility model is to provide a backing plate for circuit board drilling processing with a chip removal structure, which can clean the surface chips in time and effectively.
[0005] The technical solution is: a backing plate for circuit board drilling processing, including a backing plate body, an air inlet joint, air holes, a chip discharge joint and a feed port. The chip discharge joint is arranged on the left side of the backing plate, the air inlet joint is arranged on the right side of the backing plate body. Raised parts are arranged on both the left and right sides of the backing plate body. The raised part on the left side is set as a chip removal area, and the raised part on the right side is set as a chip blowing area. A feed port is opened in the right part of the raised part on the left side, and the feed port is communicated with the chip discharge joint. A plurality of air holes are opened in the left part of the raised part on the right side, and the air holes are all communicated with the air inlet joint. A flat table surface is arranged between the raised parts of the backing plate body, and this table surface is set as a plate placing area.
[0006] Furthermore, it further includes a flow guiding plate. Flow guiding plates are arranged on both the left and right sides of the backing plate body, and the two flow guiding plates are respectively located near the air holes in the chip blowing area and near the feed port in the chip removal area.
[0007] Further, it further includes an adsorbing member and an L-shaped air passage. The adsorbing members are symmetrically arranged on the front and rear sides of the pad body. Negative pressure connectors are provided on the adsorbing members. L-shaped air passages are opened in the adsorbing members. One side opening of the L-shaped air passage communicates with the negative pressure connector of the adsorbing member, and the other side opening is at the bottom of the adsorbing member. One side of the bottom of the adsorbing member is flush with the bottom of the pad body.
[0008] Further, it further includes a heat conducting sheet, a first heat conducting groove and a second heat conducting groove. The heat conducting sheet penetrates through the lower part of the pad body. There are no less than three first heat conducting grooves opened on the heat conducting sheet. No less than three second heat conducting grooves are opened on the left and right sides of the lower part of the pad body. And the first heat conducting groove communicates with the second heat conducting groove on the same line.
[0009] Further, it further includes an aluminum plate. The aluminum plate is embedded and installed in the plate placing area of the pad body.
[0010] Further, the whole pad body is integrally formed, and the internal material is evenly distributed.
[0011] Beneficial effects: 1. The utility model achieves the effect that by arranging a chip removing mechanism on the pad, impurities and chips on the pad are cleaned in time, so as to avoid the adhesion of incompletely processed chips on the pad, which affects the processing quality of the circuit board and ensures the production quality and efficiency.
[0012] 2. By arranging the adsorbing member, when the pad is in use, the drilling pad is firmly adsorbed on the processing table through the adsorbing member, so as to avoid the force displacement of the pad during processing and ensure the orderly progress of processing.
[0013] 3. By arranging the heat dissipation member, the pad is effectively dissipated heat, the heat generated during drilling is quickly taken away, the temperature of the drill bit during work is reduced, the wear of the drill bit caused by overheating is reduced, the best working state of the drill bit is maintained, and the processing accuracy and efficiency are ensured. BRIEF DESCRIPTION OF THE DRAWINGS
[0014] Figure 1 It is a three-dimensional structural schematic diagram of the utility model.
[0015] Figure 2 It is a three-dimensional structural schematic diagram of the utility model with the aluminum plate and the adsorbing member hidden.
[0016] Figure 3 It is a bottom view of the utility model.
[0017] Figure 4 It is a three-dimensional structural schematic diagram of the heat conducting sheet of the utility model.
[0018] Names and serial numbers of components in the figure: 1. Pad body, 2. Blowing area, 21. Air inlet joint, 22. Air hole, 3. Chip removal area, 31. Chip discharge joint, 32. Feed port, 4. Plate placing area, 5. Deflector, 6. Adsorption accessory, 61. L-shaped air duct, 7. Heat conducting sheet, 71. First heat conducting groove, 8. Second heat conducting groove, 9. Aluminum plate. Specific implementation mode
[0019] The following further describes the present utility model in combination with the embodiments shown in the attached drawings.
[0020] Embodiment 1: A pad for circuit board drilling and processing, as Figures 1-3 shown, includes a pad body 1, an air inlet joint 21, an air hole 22, a chip discharge joint 31 and a feed port 32. The pad body 1 is made of a composite material and has good high temperature resistance and anti-deformation properties. There is a chip discharge joint 31 on the left side of the pad body 1 for connecting an external negative pressure chip removal device, and an air inlet joint 21 for connecting an external high-pressure air source is provided on the right side of the pad body 1. Raised parts are provided on both the left and right sides of the pad body 1. The raised part on the left is set as a chip removal area 3 that can discharge chips from the pad body 1, and the raised part on the right is set as a blowing area 2 that blows high-pressure air onto the pad body 1 for chip blowing. The right part of the raised part on the left is provided with a feed port 32 for sucking chips, and the feed port 32 is communicated with the chip discharge joint 31. The chips flow into the chip discharge joint 31 through the feed port 32 along with the air flow and are discharged from the processing area through the chip removal device. A plurality of air holes 22 for blowing air outwards are opened on the left part of the raised part on the right, and the air holes 22 are all communicated with the air inlet joint 21. A flat table is provided between the raised parts of the pad body 1, and this table is set as a plate placing area 4 for placing the circuit board;
[0021] During the processing, the drilling equipment drills the circuit board. When drilling, the material chips on the circuit board will be generated as the drill bit penetrates and are discharged outwards along with the rotating drill bit. The generated chips will stay on the circuit board surface and the processing table. When changing the board, after manual chip cleaning, there may still be chips left on the pad body 1. At this time, by connecting a high-pressure air source to the air inlet joint 21 and connecting an external chip removal device to the chip discharge joint 31, the air flow is discharged from the air holes 22 and blows towards the feed port 32. Under the operation of the chip removal device, a large suction force will be generated near the suction port 32 to further clean the chips blown onto the pad body 1 and ensure that there are no residual chips on the pad.
[0022] Embodiment 2: On the basis of Embodiment 1, as Figures 1-2As shown in the figure, it further includes a deflector 5. Deflectors 5 for guiding the airflow are provided on both the left and right sides of the pad body 1. A number of arc-shaped bumps for changing the airflow direction are provided on the deflector 5. The two deflectors 5 are respectively located near the air holes 22 in the blowing area 2 and near the feeding port 32 in the chip removal area 3. According to the arrangement of the two deflectors 5, when the high-pressure chip blowing airflow blows outwards from the air holes 22, the right deflector 5 will gather the high-speed airflow blown out from the multiple air holes 22, making the gas flow direction tend to be consistent, reducing the outward dispersion of the airflow, and effectively blowing and cleaning the plate placing area 4 of the pad body 1. At the same time, the left deflector 5 will gather the airflow entraining debris and guide it into the feeding port 32, efficiently cleaning the plate placing area 4. Through the guidance of the airflow by the deflector 5, the number of debris splashing outwards due to impact is reduced, improving the chip removal process and effect.
[0023] In a specific embodiment: As Figure 1 and Figure 3 shown in the figure, it further includes an adsorbent 6 and an L-shaped air duct 61. Adsorbents 6 capable of quickly fixing the pad on the drilling table are symmetrically provided on the front and back sides of the pad body 1. Negative pressure connectors for connecting external suction and pressure equipment are provided on the adsorbents 6. L-shaped air ducts 61 are opened in the adsorbents 6. One side opening of the L-shaped air duct 61 is communicated with the negative pressure connector of the adsorbent 6, and the other side opening is at the bottom of the adsorbent 6. When the suction and pressure equipment works, a negative pressure will be formed at the lower end opening of the L-shaped air duct 61. When a smooth object approaches the negative pressure area of the adsorbent 6, it will be firmly adsorbed. One side of the bottom of the adsorbent 6 is flush with the bottom of the pad body 1. When the adsorbent 6 works, the bottom of the pad body 1 will be closely attached to the plate placing table of the drilling equipment, fixed and reliable, and the whole pad body 1 is in a flat state without inclination.
[0024] In a specific embodiment: As Figures 3-4 shown in the figure, it further includes a heat conducting sheet 7, a first heat conducting groove 71 and a second heat conducting groove 8. A heat conducting sheet 7 for improving the heat dissipation effect of the pad is penetrated through the lower part of the pad body 1. No less than three first heat conducting grooves 71 for increasing the heat conducting area of the heat conducting sheet 7 are opened on the heat conducting sheet 7. No less than three second heat conducting grooves 8 are opened on the left and right sides of the lower part of the pad body 1, and the first heat conducting groove 71 communicates with the second heat conducting groove 8 on the same line;
[0025] The heat conducting sheet 7 is made of metal with good thermal conductivity, and is provided with dense protrusions on the heat conducting sheet 7, which are embedded in the inner side of the pad body 1. The contact area between the heat conducting sheet 71 and the pad body 1 is increased through a large number of protrusions, thereby effectively increasing the heat dissipation effect. At the same time, by providing a heat conducting groove 2 8 connected to the heat conducting groove 1 71, the heat conducting groove 1 71 is connected to the outside world, increasing the contact area between the heat conducting sheet 71 and the gas flowing outside, further enhancing the heat dissipation performance, effectively reducing the working temperature when the drill bit contacts the pad, reducing the wear of the drill bit due to overheating, maintaining the best working state of the drill bit, and ensuring processing accuracy and efficiency.
[0026] In a specific embodiment: Figure 1 As shown, an aluminum plate 9 is also included. The board placement area 4 of the pad body 1 is embedded with an aluminum plate 9 with a smooth surface and a soft texture. The smooth aluminum plate 9 can prevent the circuit board from being scratched. At the same time, the soft aluminum plate can effectively avoid the swing of the drill needle when drilling into the pad body 1, reduce the generation of burrs during drilling, and further improve the heat dissipation effect of the pad body 1.
[0027] In a preferred embodiment: the pad body 1 is an integrally formed design, and the internal material is evenly distributed. During use, when the drill bit drills in, the evenly distributed internal material can effectively prevent local overheating of the pad. At the same time, it ensures that the pad will not deform when subjected to force, thereby ensuring the flatness and stability of the pad.
[0028] The above is only a specific implementation of the utility model, but the protection scope of the utility model is not limited thereto. Any technician familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed by the utility model, which should be included in the protection scope of the utility model. Therefore, the protection scope of the utility model should be based on the protection scope of the claims.
Claims
1. A backing plate for drilling a circuit board, comprising a backing plate body (1); It is characterized in that It also includes an air intake joint (21), air holes (22), a chip removal joint (31) and a feed port (32). The left side of the pad is provided with a chip removal joint (31), and the right side of the pad body (1) is provided with an air intake joint (21). Both left and right sides of the pad body (1) are provided with raised parts. The raised part on the left is provided as a chip removal area (3), and the raised part on the right is provided as a blowing area (2). The right part of the raised part on the left is provided with a feed port (32), and the feed port (32) is connected to the chip removal joint (31). The left part of the raised part on the right is provided with a plurality of air holes (22), and the air holes (22) are all connected to the air intake joint (21). A flat table is provided between the raised parts of the pad body (1), and the table is provided as a plate placing area (4).
2. A circuit board drilling pad as claimed in claim 1, characterized in that: It also includes a guide plate (5), wherein the guide plates (5) are arranged on both the left and right sides of the pad body (1), and the two guide plates (5) are respectively located near the air holes (22) of the blowing zone (2) and near the feed port (32) of the chip removal zone (3).
3. A circuit board drilling pad as claimed in claim 2, characterized in that: It also includes an adsorption component (6) and an L-shaped air duct (61), wherein the adsorption components (6) are symmetrically arranged on the front and rear sides of the pad body (1), and the adsorption components (6) are each provided with a negative pressure connector, and the adsorption components (6) are each provided with an L-shaped air duct (61), and one side opening of the L-shaped air duct (61) is connected to the negative pressure connector of the adsorption component (6), and the other side opening is located at the bottom of the adsorption component (6), and one side of the bottom of the adsorption component (6) is flush with the bottom of the pad body (1).
4. A circuit board drilling pad as claimed in claim 3, characterized in that: It also comprises a heat conducting sheet (7), a heat conducting groove 1 (71) and a heat conducting groove 2 (8); the heat conducting sheet (7) is provided on the lower part of the pad body (1); the heat conducting sheet (7) has at least three heat conducting grooves 1 (71); the lower part of the pad body (1) has at least three heat conducting grooves 2 (8) on both left and right sides; and the heat conducting groove 1 (71) is connected to the heat conducting groove 2 (8) on the same line.
5. A circuit board drilling pad as claimed in claim 4, characterized in that: It also includes an aluminum plate (9), and the aluminum plate (9) is embedded in the plate placement area (4) of the pad body (1).
6. A backing plate for drilling a circuit board as claimed in claim 5, characterized in that: The pad body (1) is an integrally formed design, and the internal material is evenly distributed.