Vacuum cavity type quick pressing machine

Abstract

The utility model relates to the technical field of flexible circuit board rapid pressing machines, and discloses a vacuum cavity type rapid pressing machine which comprises a rack, a fixed mold heating assembly, a movable mold heating assembly, a movable mold driving device, a vacuum sealing cover assembly and a heat conduction supporting plate. The vacuum sealing cover assembly comprises a vacuum cover body and a vacuum negative pressure device communicated with an inner cavity of the vacuum cover body. The fixed mold heating assembly is positioned in the vacuum cover body; the heat-conducting supporting plate is in sealing fit with the inner cavity of the vacuum cover body; the heat conduction supporting plate is pushed by the movable mold heating assembly to enter the inner cavity of the vacuum cover body in a matched mode and move close to the fixed mold heating assembly so that the heat conduction supporting plate and the fixed mold heating assembly can press the flexible circuit board. According to the vacuum cavity type fast pressing machine provided by the utility model, air residues in the pressing process are eliminated by utilizing a vacuum environment, bubble-free and high-flatness hot pressing of the flexible circuit board is realized, the flatness of the flexible circuit board is better ensured, and the vacuum cavity type fast pressing machine is suitable for hot pressing of flexible circuit boards with different specifications and is wide in application range.

Description

Technical Field

[0001] The utility model relates to the technical field of flexible circuit board fast presses, in particular to a vacuum chamber type fast press. Background Art

[0002] Due to its light weight, flexibility and good electrical performance, flexible circuit boards are widely used in fields such as consumer electronics, automotive electronics, and medical electronics. However, in the manufacturing process of flexible circuit boards, the hot pressing step using a flexible circuit board fast press is particularly crucial, directly related to the product yield and performance stability. Traditional hot pressing equipment often fails to completely remove air during the pressing process, resulting in bubbles inside the product, affecting the flatness and conductivity of the circuit board.

[0003] To solve the above problems, a Chinese patent with the patent number CN219834492U discloses a vacuum fast-pressing sealed cavity device, including a fixed mold assembly, a moving mold assembly, a traceless sealing ring structure, and a vacuum negative pressure flow channel. The fixed mold assembly includes a fixed mold mounting plate, a fixed mold heating plate, a fixed mold heat conducting plate, and a fixed mold pressing plate connected in sequence from top to bottom; the moving mold assembly includes a moving mold mounting plate, a moving mold heating plate, a moving mold heat conducting plate, and a moving mold pressing plate connected in sequence from bottom to top; there is a pressing cavity between the fixed mold pressing plate and the moving mold pressing plate; traceless sealing ring structures with corresponding positions are provided on both the fixed mold pressing plate and the moving mold pressing plate; the vacuum negative pressure flow channel is connected to the pressing cavity. By using a vacuum device to pump air from the vacuum negative pressure flow channel, a vacuum environment is formed in the pressing cavity, which is beneficial for the soft film layer on the product to be pressed to better adhere to the hard sheet. Then, by using the fixed mold heating plate and the moving mold heating plate for two-way heating, and conducting heat through the fixed mold heat conducting plate, the fixed mold pressing plate, the moving mold heat conducting plate, and the moving mold pressing plate, the product to be pressed is hot-pressed into shape. Under the action of the vacuum negative pressure environment and hot pressing, the product to be pressed can be quickly formed. However, the vacuum environment formed by combining the fixed mold assembly, the moving mold assembly, the traceless sealing ring structure, and the vacuum negative pressure flow channel of this vacuum fast-pressing sealed cavity device is relatively small, and it can only perform hot pressing on flexible circuit boards of a single specification or within the range of the traceless sealing ring structure, with a relatively limited scope of use. Summary of the Utility Model

[0004] The purpose of the utility model is to overcome the problems of the prior art and provide a vacuum chamber type fast press.

[0005] To achieve the above purpose, the utility model adopts the following scheme:

[0006] A vacuum chamber type fast press, comprising a frame, a fixed mold heating assembly, a moving mold heating assembly and a moving mold driving device; the fixed mold heating assembly is installed on the frame; the moving mold heating assembly is arranged below the fixed mold heating assembly corresponding to the position of the fixed mold heating assembly, and approaches or moves away from the fixed mold heating assembly under the drive of the moving mold driving device; the vacuum chamber type fast press further comprises:

[0007] A vacuum sealing cover assembly, which comprises a vacuum cover body and a vacuum negative pressure device communicated with the inner cavity of the vacuum cover body; the fixed mold heating assembly is located inside the vacuum cover body;

[0008] A heat conducting support plate, which is hermetically fitted with the inner cavity of the vacuum cover body; the heat conducting support plate can be pushed by the moving mold heating assembly to be adapted to enter the inner cavity of the vacuum cover body, and moves close to the fixed mold heating assembly to press a flexible circuit board with the fixed mold heating assembly.

[0009] Further, the vacuum cover body is connected to the frame through a lifting assembly and can reciprocate in the up and down direction relative to the fixed mold heating assembly.

[0010] Further, the fixed mold heating assembly is connected to the frame through mounting columns; the vacuum cover body can be hermetically sleeved on the mounting columns and cover the fixed mold heating assembly.

[0011] Further, the lifting assembly comprises a lifting cylinder, a guiding sliding sleeve and a guiding column; the vacuum cover body is connected to the frame through the lifting cylinder; the guiding sliding sleeve is connected to the frame; a guiding column connected to the vacuum cover body can be movably sleeved inside the guiding sliding sleeve.

[0012] Further, the number of the lifting cylinders is 2; the number of the guiding sliding sleeves is the same as that of the guiding columns; the number of the guiding columns is at least 2.

[0013] Further, the heat conducting support plate is placed on a supporting and moving device; and can be moved above the moving mold heating assembly under the drive of the supporting and moving device.

[0014] Further, the supporting and moving device comprises:

[0015] A moving bracket, which is movably connected to the frame and is located between the fixed mold heating assembly and the moving mold heating assembly; the heat conducting support plate is placed on the moving bracket;

[0016] The moving bracket has a plate opening corresponding to the position of the heat conducting support plate for the moving mold heating assembly to pass through;

[0017] When the moving die driving device drives the moving die heating component to approach the fixed die heating component, the moving die heating component passes through the plate opening and pushes the heat conduction support plate to fit into the inner cavity of the vacuum cover body, and approaches and moves towards the fixed die heating component to press the flexible circuit board with the fixed die heating component;

[0018] A moving driving device, which is connected to the frame and is drivably connected to the moving bracket, and drives the moving bracket to reciprocate in the front-back direction relative to the frame.

[0019] Further, the moving driving device includes a motor, a chain, a main sprocket, a secondary sprocket, a rotating shaft, a rolling gear and a rack; the motor is connected to the frame and is located below the moving bracket; the rack is connected to the bottom end of the moving bracket; the rotating shaft is rotatably connected to the frame;

[0020] The sprocket and the rolling gear are respectively sleeved on the rotating shaft; the rolling gear is meshed and connected with the rack; the output shaft of the motor is connected with the main sprocket; the main sprocket and the secondary sprocket are connected by the chain for transmission.

[0021] Further, the moving bracket is movably connected to the frame through rollers and wheel rails.

[0022] Further, the moving die driving device is a hydraulic cylinder; two hydraulic cylinders are arranged side by side on the frame and are both connected to the moving die heating component; the heat conduction support plate is a silicon steel plate.

[0023] Compared with the existing technology, the utility model has the following advantages:

[0024] On the basis of the frame, the fixed die heating component, the moving die heating component and the moving die driving device, the utility model adds a vacuum sealing cover component and a heat conduction support plate. The vacuum cover body and the vacuum negative pressure device form the vacuum sealing cover component. The moving die driving device is used to drive the moving die heating component, the heat conduction support plate and the flexible circuit board to be pressed on the heat conduction support plate into the inner cavity of the vacuum cover body. The heat conduction support plate and the vacuum cover body form a sealed inner cavity environment. The heat conduction support plate and the flexible circuit board to be pressed approach the fixed die heating component. Secondly, under the negative pressure vacuum action of the vacuum negative pressure device, the air in the vacuum cover is exhausted to form a vacuum environment. The air residue during the pressing process is eliminated by using the vacuum environment. Then, the fixed die heating component and the moving die heating component are used to press the flexible circuit board to be pressed. Combining the fast and accurate heating and pressing technologies, the bubble-free and high flatness hot pressing of the flexible circuit board is realized, the generation of bubbles is avoided, the yield and performance stability of the flexible circuit board are significantly improved, the flatness of the flexible circuit board is better guaranteed, it is suitable for the hot pressing of flexible circuit boards of different specifications, has a wide range of uses, and meets the manufacturing requirements of high-precision electronic products. Brief Description of the Drawings

[0025] The present application will be further described in detail below in conjunction with the drawings and specific embodiments.

[0026] Figure 1 It is an exploded three-dimensional structural schematic diagram of the vacuum chamber type fast press of the present utility model.

[0027] Figure 2 It is a three-dimensional structural schematic diagram of the vacuum chamber type fast press of the present utility model.

[0028] Figure 3 It is one of the partial three-dimensional structural schematic diagrams of the vacuum chamber type fast press of the present utility model.

[0029] Figure 4 It is the second of the partial three-dimensional structural schematic diagrams of the vacuum chamber type fast press of the present utility model.

[0030] The figure includes:

[0031] Frame 1, fixed mold heating component 2, moving mold heating component 3, moving mold driving device 4, vacuum sealing cover component 5, vacuum cover body 51, heat conduction support plate 6, lifting component 7, lifting cylinder 71, guiding sliding sleeve 72, guiding column 73, mounting column 8, supporting and moving device 9, moving bracket 91, moving driving device 92, motor 921, chain 922, main sprocket 923, auxiliary sprocket 924, rotating shaft 925, rolling gear 926, rack 927, roller 93, wheel rail 94. Specific Embodiments

[0032] The specific embodiments of the present utility model will be further described in detail below in conjunction with the drawings and embodiments. The following embodiments are used to illustrate the present utility model, but are not used to limit the scope of the present utility model.

[0033] As Figures 1 to 4As shown in the figure, a vacuum chamber type fast press includes a frame 1, an outer housing, a fixed mold heating assembly 2, a moving mold heating assembly 3, a moving mold driving device 4, a vacuum sealing cover assembly 5, and a heat conducting support plate 6. The outer housing is provided on the outer side of the frame 1, and the outer housing is preferably made of sheet metal. The fixed mold heating assembly 2 is installed on the frame 1. The moving mold heating assembly 3 is arranged below the fixed mold heating assembly 2 corresponding to the position of the fixed mold heating assembly 2, and approaches or moves away from the fixed mold heating assembly 2 under the drive of the moving mold driving device 4. The vacuum sealing cover assembly 5 includes a vacuum cover body 51 and a vacuum negative pressure device communicated with the inner cavity of the vacuum cover body 51. The fixed mold heating assembly 2 is located inside the vacuum cover body 51. The heat conducting support plate 6 is in sealed cooperation with the inner cavity of the vacuum cover body 51. The heat conducting support plate 6 can be adapted to enter the inner cavity of the vacuum cover body 51 under the push of the moving mold heating assembly 3, and approaches the fixed mold heating assembly 2 to press the flexible circuit board. A special sealing structure, such as a sealing ring, is adopted between the heat conducting support plate 6 and the inner cavity of the vacuum cover body 51 to ensure that the vacuum environment is not damaged during the pressing process. Specifically, the fixed mold heating assembly 2 successively includes an upper backing plate, an upper heating plate, and an upper silicon steel plate from top to bottom. The moving mold heating assembly 3 successively includes a lower backing plate and a lower heating plate from bottom to top. Both the upper heating plate and the lower heating plate can be powered on for heating. The fixed mold heating assembly 2 and the moving mold heating assembly 3 are mainly used for preheating and heat pressing the flexible circuit board. The moving mold driving device 4 drives the moving mold heating assembly 3 and the heat conducting support plate 6 to move along a preset track, quickly and accurately approaching the fixed mold heating assembly 2 to complete the pressing action of the flexible circuit board. The design of the moving mold driving device 4 needs to ensure the smoothness and accuracy during the pressing process to reduce potential damage to the flexible circuit board. Therefore, the moving mold driving device 4 is a hydraulic cylinder. The two hydraulic cylinders are arranged side by side on the frame 1 and are both connected to the moving mold heating assembly 3. Preferably, the heat conducting support plate 6 is a silicon steel plate, equivalent to the lower silicon steel plate, which, like the upper silicon steel plate, plays a good heat conducting role and better realizes the high flatness heat pressing of the flexible circuit board.

[0034] It can be seen from this that on the basis of the frame 1, the fixed mold heating component 2, the moving mold heating component 3, and the moving mold driving device 4, the vacuum sealing cover component 5 and the heat-conducting support plate 6 are added to the vacuum chamber type fast press. The vacuum sealing cover component 5 is formed by the vacuum cover body 51 and the vacuum negative pressure device. The moving mold driving device 4 is used to drive the moving mold heating component 3, the heat-conducting support plate 6, and the flexible circuit board to be pressed on the heat-conducting support plate 6 into the inner cavity of the vacuum cover body 51. The heat-conducting support plate 6 and the vacuum cover body 51 form a sealed inner cavity environment. The heat-conducting support plate 6 and the flexible circuit board to be pressed are close to the fixed mold heating component 2. Secondly, under the negative pressure vacuum action of the vacuum negative pressure device, the air in the vacuum cover is exhausted to form a vacuum environment. The air residue during the pressing process is eliminated by using the vacuum environment. Then, the flexible circuit board to be pressed is pressed by the fixed mold heating component 2 and the moving mold heating component 3. Combining the fast and precise heating and pressing technologies, the bubble-free and high flatness hot pressing of the flexible circuit board is realized, the generation of bubbles is avoided, the yield and performance stability of the flexible circuit board are significantly improved, the flatness of the flexible circuit board is better guaranteed, it is suitable for the hot pressing of flexible circuit boards of different specifications, has a wide range of uses, and meets the manufacturing requirements of high-precision electronic products. Specifically, when hot pressing the flexible circuit board to be pressed, both the fixed mold heating component 2 and the moving mold heating component 3 are located in the vacuum cover body 51. The vacuum environment is large, which reduces the restrictions of the fixed mold heating component 2 and the moving mold heating component 3 on the flexible circuit board to be pressed, and more specifications of the hot-pressed flexible circuit board can be selected.

[0035] In this embodiment, the vacuum cover 51 is connected to the frame 1 through a lifting assembly 7 and can reciprocate in the up and down direction relative to the fixed mold heating assembly 2. Among them, the fixed mold heating assembly 2 is connected to the frame 1 through mounting posts 8; the vacuum cover 51 can be hermetically and movably sleeved on the mounting posts 8 and cover the fixed mold heating assembly 2. Specifically, the lifting assembly 7 includes a lifting cylinder 71, a guiding sliding sleeve 72 and a guiding post 73; the vacuum cover 51 is connected to the frame 1 through the lifting cylinder 71; the guiding sliding sleeve 72 is connected to the frame 1; a guiding post 73 connected to the vacuum cover 51 can be movably sleeved in the guiding sliding sleeve 72. By setting the combination of the lifting cylinder 71, the guiding sliding sleeve 72 and the guiding post 73 to form the lifting assembly 7, when thermally pressing a flexible circuit board, first use the lifting assembly 7 to drive the vacuum cover 51 to move downward. Secondly, use the moving mold driving device 4 to drive the moving mold heating assembly 3, the heat conducting support plate 6 and the flexible circuit board to be pressed on the heat conducting support plate 6 into the inner cavity of the vacuum cover 51. The heat conducting support plate 6 and the vacuum cover 51 form a sealed inner cavity environment. The heat conducting support plate 6 and the flexible circuit board to be pressed are close to the fixed mold heating assembly 2. Then, under the negative pressure vacuum action of the vacuum negative pressure device, the air in the vacuum cover is exhausted to form a vacuum environment. Use the vacuum environment to eliminate the air residue during the pressing process. Finally, press the flexible circuit board to be pressed through the fixed mold heating assembly 2 and the moving mold heating assembly 3. Combining the fast and precise heating and pressing technologies, the bubble-free and high flatness thermal pressing of the flexible circuit board is realized, the generation of bubbles is avoided, the yield and performance stability of the flexible circuit board are significantly improved, the flatness of the flexible circuit board is better guaranteed, it is applicable to the thermal pressing of flexible circuit boards of different specifications, has a wide range of uses, and meets the manufacturing requirements of high-precision electronic products. In addition, the design of the guiding sliding sleeve 72 and the guiding post 73 can enhance the stability of the up and down movement of the vacuum cover 51.

[0036] To enhance the stability of the up and down movement of the vacuum cover 51, the number of the lifting cylinders 71 is 2; the number of the guiding sliding sleeves 72 and the guiding posts 73 is the same; the number of the guiding posts 73 is at least 2. In this embodiment, there are 4 guiding posts 73, and correspondingly, there are also 4 guiding sliding sleeves 72. The 4 guiding posts 73 are evenly distributed around the vacuum cover 51.

[0037] In this embodiment, the heat-conducting support plate 6 is placed on a support moving device 9; and it can be moved above the moving mold heating assembly 3 by the drive of the support moving device 9. Among them, the support moving device 9 includes a moving bracket 91 and a moving driving device 92. The moving bracket 91 is movably connected to the frame 1 and is located between the fixed mold heating assembly 2 and the moving mold heating assembly 3; preferably, the moving bracket 91 is movably connected to the frame 1 through rollers 93 and wheel rails 94, and stable movement of the moving bracket 91 on the frame 1 can be achieved. The heat-conducting support plate 6 is placed on the moving bracket 91; the moving bracket 91 has a plate opening at a position corresponding to the heat-conducting support plate 6 through which the moving mold heating assembly 3 can pass; the moving driving device 92 is connected to the frame 1 and is in transmission connection with the moving bracket 91, and drives the moving bracket 91 to reciprocate in the front-back direction relative to the frame 1; when the moving mold driving device 4 drives the moving mold heating assembly 3 to approach the fixed mold heating assembly 2, the moving mold heating assembly 3 passes through the plate opening and pushes the heat-conducting support plate 6 to fit into the inner cavity of the vacuum cover body 51, and approaches and moves towards the fixed mold heating assembly 2 to press the flexible circuit board with the fixed mold heating assembly 2. By using the moving driving device 92 to drive the moving bracket 91 to reciprocate in the front-back direction relative to the frame 1, the movable moving bracket 91 can be used to carry the heat-conducting support plate 6, which is convenient for loading, reduces manual operation, has high automation, and quickly conveys the flexible circuit board to be pressed above the moving mold heating assembly 3, so as to facilitate the subsequent vacuum hot pressing of the flexible circuit board.

[0038] For the mobile driving device 92, specifically, the mobile driving device 92 includes a motor 921, a chain 922, a main sprocket 923, a secondary sprocket 924, a rotating shaft 925, a rolling gear 926 and a gear rack 927; the motor 921 is connected to the frame 1 and is located below the mobile carriage 91; the gear rack 927 is connected to the bottom end of the mobile carriage 91; the rotating shaft 925 is rotatably connected to the frame 1; preferably, the rotating shaft 925 can be rotatably connected to the frame 1 by bearings. The sprocket and the rolling gear 926 are respectively sleeved on the rotating shaft 925; the rolling gear 926 is meshed with the gear rack 927; the output shaft of the motor 921 is connected to the main sprocket 923; the main sprocket 923 and the secondary sprocket 924 are connected by the chain 922 for transmission. A transmission structure is formed by the chain 922, the main sprocket 923, the secondary sprocket 924, the rotating shaft 925, the rolling gear 926 and the gear rack 927. Driven by the rotation of the motor 921, the transmission structure transmits power to the mobile carriage 91, enabling the mobile carriage 91 to reciprocate in the front-back direction relative to the frame 1. Furthermore, the movable mobile carriage 91 can be used to transport the heat-conducting pallet 6, facilitating loading, reducing manual operation, having high automation, and quickly conveying the flexible circuit board to be pressed above the moving die heating assembly 3 for subsequent vacuum hot pressing of the flexible circuit board.

[0039] The working process of the present utility model is as follows:

[0040] When it is necessary to hot press the flexible circuit board to be pressed, first place the flexible circuit board to be pressed on the heat-conducting pallet 6, and then use the mobile driving device 92 to drive the mobile carriage 91, the heat-conducting pallet 6 and the flexible circuit board to be pressed to move relative to the rear of the frame 1, so that the heat-conducting pallet 6 and the flexible circuit board to be pressed move above the moving die heating assembly 3. Then, use the lifting assembly 7 to drive the vacuum cover 51 to move downward. Secondly, use the moving die driving device 4 to drive the moving die heating assembly 3, the heat-conducting pallet 6 and the flexible circuit board to be pressed on the heat-conducting pallet 6 into the inner cavity of the vacuum cover 51. The heat-conducting pallet 6 and the vacuum cover 51 form a sealed inner cavity environment, and the heat-conducting pallet 6 and the flexible circuit board to be pressed approach the fixed die heating assembly 2. Then, under the negative pressure vacuum action of the vacuum negative pressure device, the air in the vacuum cover is exhausted to form a vacuum environment, and the vacuum environment is used to eliminate the air residue during the pressing process. Finally, the flexible circuit board to be pressed is pressed by the fixed die heating assembly 2 and the moving die heating assembly 3. Combining the fast and precise heating and pressing technologies, the bubble-free and high-flatness hot pressing of the flexible circuit board is achieved to form the pressed flexible circuit board. Finally, the lifting assembly 7 resets, the moving die driving device 4 resets, the heat-conducting pallet 6 and the pressed flexible circuit board return to the mobile carriage 91, and the mobile carriage 91 is driven to move away from the moving die heating assembly 3 to complete the hot pressing production of the flexible circuit board.

[0041] In summary, the embodiment of the present utility model provides a vacuum chamber type fast press. Among them, on the basis of the frame 1, the fixed mold heating component 2, the moving mold heating component 3, and the moving mold driving device 4, a vacuum sealing cover component 5 and a heat conduction support plate 6 are added. The vacuum sealing cover component 5 is formed by using the vacuum cover body 51 and the vacuum negative pressure device. The moving mold driving device 4 is used to drive the moving mold heating component 3, the heat conduction support plate 6, and the flexible circuit board to be pressed on the heat conduction support plate 6 into the inner cavity of the vacuum cover body 51. The heat conduction support plate 6 and the vacuum cover body 51 form a sealed inner cavity environment. The heat conduction support plate 6 and the flexible circuit board to be pressed are close to the fixed mold heating component 2. Secondly, under the negative pressure vacuum action of the vacuum negative pressure device, the air in the vacuum cover is exhausted to form a vacuum environment. The air residue during the pressing process is eliminated by using the vacuum environment. Then, the fixed mold heating component 2 and the moving mold heating component 3 are used to press the flexible circuit board to be pressed. Combining the fast and accurate heating and pressing technologies, the bubble-free and high flatness hot pressing of the flexible circuit board is realized, the generation of bubbles is avoided, the yield and performance stability of the flexible circuit board are significantly improved, the flatness of the flexible circuit board is better guaranteed, it is applicable to the hot pressing of flexible circuit boards of different specifications, has a wide range of uses, and meets the manufacturing requirements of high-precision electronic products.

[0042] The above are only the preferred embodiments of the present application. It should be noted that for those of ordinary skill in the art, without departing from the technical principle of the present application, several improvements and substitutions can be made, and these improvements and substitutions should also be regarded as the protection scope of the present application.

Claims

1. A vacuum chamber type fast pressing machine, comprising a frame, a fixed mold heating assembly, a movable mold heating assembly and a movable mold driving device; the fixed mold heating assembly is mounted on the frame; the movable mold heating assembly is arranged below the fixed mold heating assembly at a position corresponding to the fixed mold heating assembly, and is driven by the movable mold driving device to approach or move away from the fixed mold heating assembly; characterized in that: The vacuum chamber type fast press also includes: A vacuum sealing cover assembly comprises a vacuum cover body and a vacuum negative pressure device connected to the inner cavity of the vacuum cover body; the fixed mold heating assembly is located in the vacuum cover body; A heat-conducting support plate is sealed and matched with the inner cavity of the vacuum cover; the heat-conducting support plate can be adapted to enter the inner cavity of the vacuum cover through the push of the movable mold heating assembly, and move close to the fixed mold heating assembly to press the flexible circuit board with the fixed mold heating assembly.

2. The vacuum chamber type fast press machine according to claim 1, characterized in that: The vacuum cover is connected to the frame through a lifting assembly and can reciprocate in the up and down directions relative to the fixed mold heating assembly.

3. The vacuum chamber type fast press machine according to claim 2, characterized in that: The fixed mold heating component is connected to the frame via a mounting column; the vacuum cover can be movably sleeved on the mounting column and cover the fixed mold heating component.

4. The vacuum chamber type fast press machine according to claim 2 or 3, characterized in that: The lifting assembly includes a lifting cylinder, a guide sleeve and a guide column; the vacuum cover is connected to the frame through the lifting cylinder; the guide sleeve is connected to the frame; the guide sleeve is movably sleeved with a guide column connected to the vacuum cover.

5. The vacuum chamber type fast press machine according to claim 4, characterized in that: The number of the lifting cylinders is 2; the number of the guide sleeves and the number of the guide columns are the same; and the number of the guide columns is at least 2.

6. The vacuum chamber type fast press machine according to claim 1, characterized in that: The heat-conducting support plate is placed on a support moving device and can be moved to the top of the moving mold heating component by the driving of the support moving device.

7. The vacuum chamber type fast press machine according to claim 6, characterized in that: The supporting moving device comprises: A movable bracket, which is movably connected to the frame and is located between the fixed mold heating assembly and the movable mold heating assembly; the heat-conducting support plate is placed on the movable bracket; The movable bracket has a plate opening at a position corresponding to the heat-conducting support plate for the movable mold heating assembly to pass through; When the movable mold driving device drives the movable mold heating assembly to approach the fixed mold heating assembly, the movable mold heating assembly pushes the heat-conducting support plate through the plate opening to fit into the inner cavity of the vacuum housing, and moves toward the fixed mold heating assembly to press the flexible circuit board with the fixed mold heating assembly; The moving drive device is connected to the frame and is drivably connected to the moving bracket, and drives the moving bracket to reciprocate in the front-rear direction relative to the frame.

8. The vacuum chamber type fast press machine according to claim 7, characterized in that: The mobile driving device comprises a motor, a chain, a main sprocket, a secondary sprocket, a rotating shaft, a rolling gear and a gear bar; the motor is connected to the frame and is located below the mobile bracket; the gear bar is connected to the bottom end of the mobile bracket; the rotating shaft is rotatably connected to the frame; The sprocket and the rolling gear are respectively mounted on the rotating shaft; the rolling gear is meshed and connected with the gear bar; the output shaft of the motor is connected with the main sprocket; the main sprocket is connected with the secondary sprocket through the chain transmission.

9. The vacuum chamber type fast press machine according to claim 7, characterized in that: The movable bracket is movably connected to the frame via rollers and wheel rails.

10. The vacuum chamber type fast press machine according to claim 1, characterized in that: The movable mold driving device is a hydraulic cylinder; two hydraulic cylinders are installed side by side on the frame and are both connected to the movable mold heating assembly; the heat-conducting support plate is a silicon steel plate.

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