Heat dissipation foam

Abstract

The heat dissipation foam comprises a heat dissipation foam base layer used for supporting, heat dissipation guide holes used for guiding are formed in the inner end face of the heat dissipation foam base layer at equal intervals, and positioning holes are formed in the upper end face of the heat dissipation foam base layer at equal intervals in a penetrating mode. One group of heat dissipation silica gel layers is arranged on the outermost side of the foam, the other group of heat dissipation silica gel layers is arranged at the bottom of the foam, the two groups of heat dissipation silica gel layers can quickly and stably adsorb external heat energy, and meanwhile, the two groups of net-shaped heat conduction plates and the heat dissipation silica gel layers are supported and limited, so that the overall supporting stability and compressive strength of the foam can be improved, and the service life of the foam is prolonged. Meanwhile, the heat dissipation guide holes are arranged in a through hole shape and can be matched with the two sets of net-shaped heat dissipation fins to conduct heat exchange on heat energy adsorbed by the heat conduction fins and the net-shaped heat conduction plate to the maximum degree, and the overall heat dissipation efficiency of the foam is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of foam equipment, in particular to a heat dissipation foam. Background Technique

[0002] The heat dissipation foam is a material with good heat insulation and moisture absorption properties, usually made of materials such as polyester fiber or polyester foam, and it plays an important role in heat dissipation in electronic devices.

[0003] For example, the utility model patent with the publication number: CN220733307U, discloses a heat dissipation foam, which includes a heat dissipation foam, an upper heat conduction layer, a lower heat conduction layer, an adhesive layer and a release paper layer. The heat dissipation foam is arranged between the upper heat conduction layer and the lower heat conduction layer. The adhesive layer is arranged at the bottom of the lower heat conduction layer, and the release paper layer covers the outer surface of the adhesive layer. The heat dissipation foam includes a first heat dissipation layer, a foam layer and a second heat dissipation layer. The foam layer is arranged between the first heat dissipation layer and the second heat dissipation layer. A plurality of heat dissipation holes are orderly arranged on the foam layer, and the heat dissipation holes are arranged in a wavy line shape. The above heat dissipation foam can increase the contact area between the heat dissipation holes and air by arranging wavy heat dissipation holes in the foam layer, improve the heat dissipation efficiency, and also set elastic heat conduction sheets and heat conduction layers on the heat dissipation foam to improve the heat conduction efficiency and further improve the heat dissipation efficiency. Moreover, the elastic heat conduction sheet can quickly rebound and reset after the foam is pressed, avoiding the heat dissipation holes from being pressed and collapsed, so that air cannot flow into the heat dissipation holes to affect the heat dissipation efficiency.

[0004] Although the above heat dissipation foam has a certain heat dissipation function, the efficiency of heat absorption, heat conduction and heat dissipation of the foam only through the heat dissipation holes is insufficient, which reduces the overall heat dissipation performance of the foam. Therefore, there is an urgent need for a heat dissipation foam to solve the above problems. Content of the Utility Model

[0005] The purpose of the utility model is to provide a heat dissipation foam to solve the problems put forward in the above background technique.

[0006] To achieve the above purpose, the utility model provides the following technical solution: a heat dissipation foam, including a heat dissipation foam base layer for support, heat dissipation guide holes for guiding are equidistantly opened on the inner end surface of the heat dissipation foam base layer, and positioning holes are equidistantly and throughly opened on the upper end surface of the heat dissipation foam base layer,

[0007] A heat conduction device, there are two groups of the heat conduction devices in total, and the two groups of heat conduction devices are fixedly arranged on the inner end surface of the heat dissipation foam base layer through the positioning holes;

[0008] An adhesive layer, the adhesive layer is fixedly arranged on the lower end surface of the heat conduction device located at the lower part;

[0009] The release paper layer is fixedly arranged on the lower end surface of the adhesive layer.

[0010] Preferably, the heat conduction device includes a heat dissipation silica gel layer. A fixing mesh groove is formed on the inner end surface of the heat dissipation silica gel layer, and fixing holes are equidistantly formed from the upper end surface to the bottom and penetrate through the heat dissipation silica gel layer. A heat conduction sheet is fixedly arranged on the upper end surface of the heat dissipation silica gel layer, and heat conduction shafts are equidistantly arranged on the lower end surface of the heat conduction sheet. A mesh-shaped heat conduction plate is arranged near the heat conduction sheet on the upper end surface of the heat conduction shaft, and a heat dissipation fin is fixedly arranged at the center of the lower end surface of the heat conduction shaft.

[0011] Preferably, the heat conduction shaft is fixedly connected to the heat dissipation silica gel layer through the fixing hole, and the heat conduction shaft is slidably connected to the positioning hole, which can provide a sufficient limiting basis for the subsequent sliding of the heat dissipation fin inside the heat dissipation guide hole.

[0012] Preferably, the heat conduction sheet is fixedly attached to the upper end surface of the heat dissipation silica gel layer. The heat conduction sheet is made of metal material, which can effectively improve the subsequent adsorption and guiding efficiency of human energy.

[0013] Preferably, the mesh-shaped heat conduction plate is fixedly arranged inside the heat dissipation silica gel layer through the fixing mesh groove. The mesh-shaped heat conduction plate can improve the stability of the foam while further improving the adsorption efficiency of the heat energy inside the foam.

[0014] Preferably, the heat dissipation fin is slidably arranged inside the heat dissipation foam base layer through the heat dissipation guide hole. When the foam is subjected to external pressure, the heat dissipation fin can provide a sufficient linear guiding basis for the buffering of the heat dissipation foam base layer through the heat dissipation guide hole, improving the stability of the foam support.

[0015] Compared with the prior art, the beneficial effects of the present utility model are as follows:

[0016] 1. In the present utility model, one group of heat dissipation silica gel layers is arranged on the outermost side of the foam, and the other group is arranged at the bottom of the foam. The two groups of heat dissipation silica gel layers can quickly and stably adsorb external heat energy. At the same time, the support and limitation of the two groups of mesh-shaped heat conduction plates and the heat dissipation silica gel layer can improve the overall support stability and compressive strength of the foam. At the same time, the heat dissipation guide hole is arranged in a through-hole shape, which can cooperate with the two groups of mesh-shaped heat dissipation fins to maximize the heat exchange of the heat energy adsorbed by the heat conduction sheet and the mesh-shaped heat conduction plate, improving the overall heat dissipation efficiency of the foam. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 is the exploded view of the main body of the present utility model;

[0018] Figure 2 is the structural schematic diagram of the main body of the present utility model;

[0019] Figure 3 Exploded view of the heat conduction device of the present utility model;

[0020] Figure 4 Structural schematic diagram of the heat conduction device of the present utility model.

[0021] In the figure: 1 - heat conduction device, 2 - positioning hole, 3 - heat dissipation foam base layer, 4 - heat dissipation guide hole, 5 - adhesive layer, 6 - release paper layer, 11 - heat dissipation silica gel layer, 12 - fixing hole, 13 - fixing mesh groove, 14 - heat conduction sheet, 15 - mesh-shaped heat conduction plate, 16 - heat conduction shaft, 17 - heat dissipation fin. Specific embodiments

[0022] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all of the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present utility model.

[0023] Please refer to Figures 1-4 , an embodiment provided by the present utility model: a heat dissipation foam, including a heat dissipation foam base layer 3 for support, heat dissipation guide holes 4 for guiding are equidistantly opened on the inner end surface of the heat dissipation foam base layer 3, and positioning holes 2 are equidistantly penetrated and opened on the upper end surface of the heat dissipation foam base layer 3,

[0024] Heat conduction device 1, there are two groups of heat conduction devices 1 in total, and the two groups of heat conduction devices 1 are fixedly arranged on the inner end surface of the heat dissipation foam base layer 3 through the positioning holes 2;

[0025] Adhesive layer 5, the adhesive layer 5 is fixedly arranged on the lower end surface of the lower heat conduction device 1;

[0026] Release paper layer 6, the release paper layer 6 is fixedly arranged on the lower end surface of the adhesive layer 5.

[0027] The heat conduction device 1 includes a heat dissipation silica gel layer 11, a fixing mesh groove 13 is opened on the inner end surface of the heat dissipation silica gel layer 11, and fixing holes 12 are equidistantly opened from the upper end surface to the bottom of the heat dissipation silica gel layer 11, a heat conduction sheet 14 is fixedly arranged on the upper end surface of the heat dissipation silica gel layer 11, and heat conduction shafts 16 are equidistantly arranged on the lower end surface of the heat conduction sheet 14, a mesh-shaped heat conduction plate 15 is arranged near the heat conduction sheet 14 on the upper end surface of the heat conduction shaft 16, and a heat dissipation fin 17 is fixedly arranged at the center of the lower end surface of the heat conduction shaft 16.

[0028] The heat conduction shaft 16 is fixedly connected to the heat dissipation silica gel layer 11 through the fixing hole 12, and the heat conduction shaft 16 is slidably connected to the positioning hole 2, which can provide a sufficient limiting basis for the subsequent sliding of the heat dissipation fin 17 inside the heat dissipation guide hole 4.

[0029] The heat conducting sheet 14 is fixedly attached to the upper end surface of the heat dissipating silica gel layer 11. The heat conducting sheet 14 is made of metal material, which can effectively improve the subsequent adsorption and guiding efficiency for people.

[0030] The mesh-shaped heat conducting plate 15 is fixedly arranged inside the heat dissipating silica gel layer 11 through the fixed mesh groove 13. The mesh-shaped heat conducting plate 15 can improve the stability of the foam while further improving the adsorption efficiency of the heat energy inside the foam.

[0031] The heat sink 17 is slidably arranged inside the heat dissipating foam base layer 3 through the heat dissipation guide hole 4. When the foam is subjected to external pressure, the heat sink 17 can provide a sufficient linear guiding basis for the buffering of the heat dissipating foam base layer 3 through the heat dissipation guide hole 4, improving the stability of the foam support.

[0032] Working principle: When in use, one set of heat dissipating silica gel layers 11 is arranged on the outermost side of the foam, and the other set is arranged at the bottom of the foam. The two sets of heat dissipating silica gel layers 11 can quickly and stably adsorb the external heat energy. At the same time, the support and limitation of the two sets of mesh-shaped heat conducting plates 15 and the heat dissipating silica gel layers 11 can improve the overall support stability and compressive strength of the foam. At the same time, the heat dissipation guide hole 4 is arranged in a through-hole shape, which can cooperate with the two sets of mesh-shaped heat sinks 17 to conduct maximum heat exchange for the heat energy adsorbed by the heat conducting sheet 14 and the mesh-shaped heat conducting plate 15, improving the overall heat dissipation efficiency of the foam.

[0033] Although the embodiments of the present invention have been shown and described, for those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principle and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A heat dissipation foam, comprising a heat dissipation foam base layer (3) for support, wherein the inner end surface of the heat dissipation foam base layer (3) is provided with heat dissipation guide holes (4) for guidance at equal intervals, and the upper end surface of the heat dissipation foam base layer (3) is provided with positioning holes (2) at equal intervals, characterized in that: A heat-conducting device (1), wherein two groups of the heat-conducting device (1) are provided, and the two groups of the heat-conducting device (1) are fixedly arranged on the inner end surface of the heat-dissipating foam base layer (3) through the positioning holes (2); An adhesive layer (5), the adhesive layer (5) being fixedly arranged on the lower end surface of the heat conducting device (1) located at the lower part; A release paper layer (6), wherein the release paper layer (6) is fixedly arranged on the lower end surface of the adhesive layer (5).

2. The heat dissipation foam according to claim 1, characterized in that: The heat-conducting device (1) comprises a heat-dissipating silicone layer (11), the inner end surface of the heat-dissipating silicone layer (11) is provided with a fixed mesh groove (13), and the upper end surface of the heat-dissipating silicone layer (11) is provided with fixed holes (12) at equal intervals from the bottom to the upper end surface, a heat-conducting sheet (14) is fixedly arranged on the upper end surface of the heat-dissipating silicone layer (11), and a heat-conducting shaft (16) is equidistantly arranged on the lower end surface of the heat-conducting sheet (14), a mesh heat-conducting plate (15) is arranged on the upper end surface of the heat-conducting shaft (16) near the heat-conducting sheet (14), and a heat-dissipating sheet (17) is fixedly arranged at the center of the lower end surface of the heat-conducting shaft (16).

3. The heat dissipation foam according to claim 2, characterized in that: The heat-conducting shaft (16) is fixedly connected to the heat-dissipating silica gel layer (11) through the fixing hole (12), and the heat-conducting shaft (16) is slidably connected to the positioning hole (2).

4. The heat dissipation foam according to claim 2, characterized in that: The heat conducting sheet (14) is fixedly bonded to the upper end surface of the heat dissipating silica gel layer (11).

5. The heat dissipation foam according to claim 2, characterized in that: The mesh-type heat-conducting plate (15) is fixedly disposed inside the heat-dissipating silica gel layer (11) through the fixed mesh groove (13).

6. The heat dissipation foam according to claim 2, characterized in that: The heat sink (17) is slidably disposed inside the heat dissipation foam base layer (3) through the heat dissipation guide hole (4).

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