Material taking and placing mechanism and silicon wafer processing equipment

Abstract

The utility model provides a material taking and placing mechanism and silicon wafer processing equipment, and the material taking and placing mechanism comprises a pedestal; the first adsorption assembly is arranged on the base, and the first adsorption assembly comprises a plurality of first adsorption pieces arranged in the first direction; the second adsorption assembly and the first adsorption assembly are arranged in a spaced mode in the second direction, the second adsorption assembly comprises at least two sub-adsorption assemblies arranged side by side in the first direction, each sub-adsorption assembly comprises a rotatable suction cup, and the rotating center line of each suction cup extends in the third direction; the first direction, the second direction and the third direction intersect with each other. According to the material taking and placing mechanism, at least two sub-adsorption assemblies are arranged in the second adsorption assembly, the suction cup in each sub-adsorption assembly can rotate independently, the rotation radius can be reduced, the arrangement space of equipment is saved, and the stability of the suction cups is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of silicon wafer processing equipment, and more specifically, to a pick-and-place mechanism and a silicon wafer processing equipment. Background Art

[0002] In the process of single-sided coating of silicon wafers, it is necessary to suck the silicon wafers through an adsorption structure for loading and unloading. The adsorption structure includes two suction cups. During the loading process, the two suction cups first suck the silicon wafer simultaneously, then one of the two suction cups remains stationary, and the other needs to rotate 180°, and then the silicon wafer is attached to the silicon wafer on the stationary suction cup. Similarly, during the unloading process, one of the two suction cups also needs to rotate 180° to ensure coating on the same side of the silicon wafer.

[0003] However, in order to increase the number of silicon wafers adsorbed at one time, the existing suction cups need to increase the number of their own adsorption sheets, resulting in a long length of the suction cup, a large rotation radius, a large occupied space, and poor stability. Summary of the Utility Model

[0004] The utility model provides a new technical solution for a pick-and-place mechanism, which can at least solve one of the problems of the existing suction cup, such as long length, large rotation radius, large occupied space, and poor stability.

[0005] The utility model also provides a silicon wafer processing equipment, including the above pick-and-place mechanism.

[0006] According to a first aspect of the utility model, there is provided a pick-and-place mechanism, including: a base; a first adsorption component, the first adsorption component is arranged on the base, and the first adsorption component includes a plurality of first adsorption sheets arranged along a first direction; a second adsorption component, the second adsorption component is spaced apart from the first adsorption component along a second direction, the second adsorption component includes at least two sub-adsorption components arranged side by side along the first direction, each sub-adsorption component includes a rotatable suction cup, and the rotation center line of each suction cup extends along a third direction, and the first direction, the second direction, and the third direction intersect respectively.

[0007] Optionally, the first direction, the second direction, and the third direction are perpendicular to each other.

[0008] Optionally, each sub-adsorption component further includes: a first mounting plate, the first mounting plate is connected to the base; a first driving member, the first driving member is arranged on the first mounting plate, and the first driving member is connected to the suction cup to drive the suction cup to rotate.

[0009] Optionally, each of the sub-adsorption components further includes: a first translation component, which is disposed on the base and connected to the first mounting plate for driving the first mounting plate to move along the first direction.

[0010] Optionally, the first translation component includes: a connecting member connected to the first mounting plate; a lead screw extending along the first direction and screwed to the connecting member, the lead screw being rotatable about its own axis to drive the connecting member to move along the first direction; a second driving member connected to the lead screw for driving the lead screw to rotate about its own axis.

[0011] Optionally, the picking and placing mechanism further includes: a second translation component respectively connected to the first adsorption component and the second adsorption component for driving the first adsorption component and the second adsorption component to approach or move away from each other along the second direction.

[0012] Optionally, the second translation component includes: a second mounting plate connected to the first translation component; a third mounting plate connected to the first adsorption component; an endless conveyor belt disposed on the base, the endless conveyor belt including two layers of belt bodies, the two layers of belt bodies respectively extending along the second direction, the first mounting plate being connected to one of the two layers of belt bodies, the second mounting plate being connected to the other of the two layers of belt bodies, the endless conveyor belt being movable in the forward or reverse direction to drive the first mounting plate and the second mounting plate to approach or move away from each other.

[0013] Optionally, each of the suction cups includes a plurality of second adsorption sheets, the suction cup having an original state and a mirror state, the first driving member being capable of driving the suction cup to rotate 180° to switch from the original state to the mirror state or from the mirror state to the original state, and when the suction cup is in the original state or the mirror state, the plurality of second adsorption sheets of each suction cup are arranged along the first direction.

[0014] Optionally, the first adsorption sheet and the first adsorption sheet have the same structure.

[0015] According to a second aspect of the present invention, there is provided a silicon wafer processing apparatus including the picking and placing mechanism according to any one of the above embodiments.

[0016] According to the material taking and placing mechanism of the utility model, at least two sub-adsorption components are arranged in the second adsorption component, and the suction cup in each sub-adsorption component can rotate independently, which is conducive to reducing the rotation radius, saving the layout space of the equipment, and improving the stability of the suction cup. At the same time, it is also conducive to increasing the distance of the second adsorption component as a whole in the first direction, thereby increasing the number of silicon wafers adsorbed at a single time. For a half-piece flower basket with a large capacity, only one material taking or unloading is required, and there is no need to do it in batches, which is conducive to improving the efficiency of taking and placing.

[0017] Other features and advantages of the present invention will become apparent from the following detailed description of exemplary embodiments of the present invention with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate embodiments of the present invention and, together with the description, serve to explain the principles of the present invention.

[0019] Figure 1 It is a three-dimensional diagram of a material taking and placing mechanism according to an embodiment of the utility model;

[0020] Figure 2 yes Figure 1 A magnified view of the structure in the middle;

[0021] Figure 3 This is a front view of a material taking and placing mechanism according to an embodiment of the utility model;

[0022] Figure 4 It is a top view of a material taking and placing mechanism according to an embodiment of the utility model;

[0023] Figure 5 It is a side view of a material taking and placing mechanism according to an embodiment of the utility model;

[0024] Figure 6 It is a top view schematic diagram of the first adsorption component and the second adsorption component when the material taking and placing mechanism according to an embodiment of the utility model is in the first state;

[0025] Figure 7 It is a top view schematic diagram of the first adsorption component and the second adsorption component when the material taking and placing mechanism according to an embodiment of the utility model is in the second state;

[0026] Figure 8 It is a top view schematic diagram of the first adsorption component and the second adsorption component when the material taking and placing mechanism according to an embodiment of the utility model is in the third state;

[0027] Figure 9It is a top view schematic diagram of the first adsorption component and the second adsorption component when the pick-and-place mechanism according to an embodiment of the present utility model is in the fourth state;

[0028] Figure 10 It is a top view schematic diagram of the first adsorption component and the second adsorption component when the pick-and-place mechanism according to an embodiment of the present utility model is in the fifth state.

[0029] Reference numerals

[0030] 100, Pick-and-place mechanism;

[0031] 10, Base;

[0032] 20, First adsorption component; 21, First adsorption sheet;

[0033] 30, Second adsorption component; 30a, Sub-adsorption component; 31, Suction cup; 311, Second adsorption sheet; 3111, Extension part; 312, Preset axis; 32, First mounting plate; 34, First translation component; 341, Connecting piece; 342, Lead screw; 343, Second driving part;

[0034] 40, Second translation component; 41, Second mounting plate; 42, Third mounting plate; 43, Ring conveyor belt. Detailed implementation manners

[0035] Now, various exemplary embodiments of the present utility model will be described in detail with reference to the accompanying drawings. It should be noted that: Unless otherwise specifically stated, the relative arrangements of components and steps, numerical expressions and values set forth in these embodiments do not limit the scope of the present utility model.

[0036] The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way a limitation on the present utility model or its application or use.

[0037] Technologies, methods and devices known to those of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, the said technologies, methods and devices should be regarded as part of the specification.

[0038] In all the examples shown and discussed here, any specific value should be construed as merely exemplary and not as a limitation. Therefore, other examples of the exemplary embodiments may have different values.

[0039] It should be noted that: Similar reference numerals and letters denote similar items in the following drawings. Therefore, once an item is defined in one drawing, it does not need to be further discussed in subsequent drawings.

[0040] First, the pick-and-place mechanism 100 according to the embodiment of the present utility model will be specifically described below with reference to the accompanying drawings.

[0041] As shown Figures 1 to 5 in the figure, the pick-and-place mechanism 100 according to an embodiment of the present utility model includes: a base 10, a first adsorption assembly 20, and a second adsorption assembly 30.

[0042] Specifically, the first adsorption assembly 20 is disposed on the base 10. The first adsorption assembly 20 includes a plurality of first adsorption sheets 21 arranged along a first direction. The second adsorption assembly 30 is spaced apart from the first adsorption assembly 20 along a second direction. The second adsorption assembly 30 includes at least two sub-adsorption assemblies 30a arranged side by side along the first direction. Each sub-adsorption assembly 30a includes a rotatable suction cup 31. The rotation center line of each suction cup 31 extends along a third direction. The first direction, the second direction, and the third direction intersect respectively.

[0043] In other words, the pick-and-place mechanism 100 according to an embodiment of the present utility model mainly consists of a base 10, a first adsorption assembly 20, and a second adsorption assembly 30.

[0044] Among them, the pick-and-place mechanism 100 can pick and place silicon wafers by adsorption. The base 10 may be provided with a first adsorption assembly 20 and a second adsorption assembly 30. The first adsorption assembly 20 and the second adsorption assembly 30 can adsorb silicon wafers respectively.

[0045] The first adsorption assembly 20 may include a plurality of first adsorption sheets 21. Each first adsorption sheet 21 can adsorb one silicon wafer. The plurality of first adsorption sheets 21 can be arranged at intervals along the first direction. The thickness direction of the first adsorption sheet 21 can extend along the first direction.

[0046] The first adsorption assembly 20 and the second adsorption assembly 30 can be spaced apart along the second direction. Therefore, two rows of silicon wafers can be adsorbed simultaneously by using the first adsorption assembly 20 and the second adsorption assembly 30.

[0047] The second adsorption assembly 30 may mainly consist of a plurality of sub-adsorption assemblies 30a. The number of sub-adsorption assemblies 30a may be ≥2. The plurality of sub-adsorption assemblies 30a can be arranged side by side along the first direction. Each sub-adsorption assembly 30a may include a suction cup 31. The suction cup 31 can adsorb a silicon wafer. Each suction cup 31 can rotate around a preset axis 312. The preset axis 312 can extend along the third direction. The first direction, the second direction, and the third direction can intersect.

[0048] In the coating process, single-sided coating of silicon wafers is required. Therefore, the silicon wafers need to be bonded in pairs and then sent into the coating equipment. Taking the second adsorption assembly 30 including two sub-adsorption assemblies 30a as an example, the working process of the pick-and-place mechanism 100 of this embodiment will be described below.

[0049] The first adsorption component 20 and the second adsorption component 30 respectively adsorb a row of silicon wafers. Two suction cups 31 in the second adsorption component 30 respectively rotate 180° around their respective preset axes 312. The second adsorption component 30 moves a certain distance in the positive direction of the first direction, so that the two rows of silicon wafers are misaligned. The first adsorption component 20 and the second adsorption component 30 approach each other, so that the two rows of silicon wafers cross. The second adsorption component 30 moves a certain distance in the direction of the first direction, so that the silicon wafers are attached to each other in pairs, and then the silicon wafers attached to each other in pairs are sent into a coating device.

[0050] After the coating is completed, the first adsorption component 20 and the second adsorption component 30 perform the above actions in the reverse order, so that the coated silicon wafers are divided into two rows and discharged, so as to ensure that the coating is performed on the same side of the silicon wafers, that is, the coating layer on the silicon wafers faces the same side when discharging.

[0051] Thus, according to the pick-and-place mechanism 100 of the embodiment of the present invention, at least two sub-adsorption components 30a are provided in the second adsorption component 30, and the suction cups 31 in each sub-adsorption component 30a can rotate independently, which is beneficial to reducing the rotation radius, saving the layout space of the device, and improving the stability of the suction cups 31. At the same time, it is also beneficial to increase the distance of the second adsorption component 30 as a whole in the first direction, thereby increasing the number of silicon wafers adsorbed at one time. For a large-capacity half-wafer flower basket, only one pick-up or discharge is required, and there is no need to perform it in batches, which is beneficial to improving the pick-and-place efficiency.

[0052] According to an embodiment of the present invention, the first direction, the second direction, and the third direction are perpendicular to each other, which is beneficial to the regular arrangement and quick pick-and-place of the silicon wafers.

[0053] For example, as Figures 1 to 5 shown, the first direction and the second direction can be horizontal directions perpendicular to each other, and the third direction can be a vertical direction.

[0054] According to some other embodiments of the present invention, each sub-adsorption component 30a further includes a first mounting plate 32 and a first driving member. The first mounting plate 32 is connected to the base 10, the first driving member is disposed on the first mounting plate 32, and the first driving member is connected to the suction cup 31 to drive the suction cup 31 to rotate.

[0055] That is to say, each sub-adsorption component 30a can mainly be composed of a first mounting plate 32, a first driving member, and a suction cup 31. Among them, the first mounting plate 32 can be connected to the base 10, and this connection can include but is not limited to direct connection and indirect connection. The first driving member can be fixed on the first mounting plate 32, and the driving end of the first driving member can be connected to the suction cup 31 for driving the suction cup 31 to rotate around the preset axis 312.

[0056] The suction cup 31 may include a connecting plate and a rotating shaft. A plurality of adsorption structures may be provided at the bottom of the connecting plate for adsorbing the silicon wafer. The rotating shaft may be disposed in the middle of the connecting plate and may be connected to the first driving member, and the first driving member may include, but is not limited to, a servo reduction motor.

[0057] Therefore, the second adsorption assembly 30 may include a plurality of first mounting plates 32 and a plurality of first driving members, such that each suction cup 31 can be independently driven by the first driving member, and the two first mounting plates 32 are independent of each other and do not interfere with each other.

[0058] In some specific embodiments of the present invention, each sub-adsorption assembly 30a further includes a first translation assembly 34. The first translation assembly 34 is disposed on the base 10 and is connected to the first mounting plate 32 for driving the first mounting plate 32 to move in the first direction.

[0059] Specifically, a first translation assembly 34 may be connected to the base 10, and the connection between the first translation assembly 34 and the base 10 may include, but is not limited to, direct connection and indirect connection.

[0060] The movable end of the first translation assembly 34 may move in the first direction, and the first mounting plate 32 may be movably connected to the first translation assembly 34. Therefore, under the movement of the first translation assembly 34, the first mounting plate 32, the first driving member, and the corresponding suction cup 31 may move in the first direction.

[0061] Each suction cup 31 may include a plurality of second adsorption sheets 311. In the initial state, the gap between the two suction cups 31 is very small, and the distance between the two closest second adsorption sheets 311 on the two suction cups 31 may be equal to the distance between any two adjacent second adsorption sheets 311 on any one suction cup 31, so that the second adsorption assembly 30 can adsorb the silicon wafers from the equally spaced receiving grooves in the flower basket.

[0062] At this time, if the two suction cups 31 rotate, they will interfere with each other. It is necessary to drive the corresponding suction cups 31 to move away from each other in the first direction through the two first translation assemblies 34, increasing the distance between the two suction cups 31, that is, from Figure 6 the state shown to Figure 7 the state shown, and then perform a 180° rotation.

[0063] In addition, before the two rows of silicon wafers cross, the corresponding suction cups 31 can be driven by the plurality of first translation assemblies 34 to move simultaneously in the positive direction of the first direction to stagger the two rows of silicon wafers. After the two rows of silicon wafers cross, the corresponding suction cups 31 can be driven by the plurality of first translation assemblies 34 to move simultaneously in the reverse direction of the first direction to make the crossed silicon wafers fit together in pairs.

[0064] According to some alternative embodiments of the present utility model, the first translation assembly 34 includes a connecting member 341, a lead screw 342, and a second driving member 343. The connecting member 341 is connected to the first mounting plate 32. The lead screw 342 extends along a first direction and is screwed to the connecting member 341. The lead screw 342 is rotatable about its own axis to drive the connecting member 341 to move along the first direction. The second driving member 343 is connected to the lead screw 342 and is used to drive the lead screw 342 to rotate about its own axis.

[0065] In other words, the first translation assembly 34 may mainly be composed of the connecting member 341, the lead screw 342, and the second driving member 343. The connecting member 341 may be fixedly connected to the first mounting plate 32 and move synchronously with the first mounting plate 32. A threaded hole may be provided on the connecting member 341. The axis of the threaded hole may extend along the first direction. The lead screw 342 may extend along the first direction and be screwed to the threaded hole on the connecting member 341.

[0066] The second driving member 343 may be directly or indirectly connected to the base 10. The second driving member 343 may have a rotatable output end. The output end of the second driving member 343 may be connected to the lead screw 342 to drive the lead screw 342 to rotate about its own axis. The position of the second driving member 343 is fixed in the first direction. Thus, during the rotation of the lead screw 342, the connecting member 341 can be driven to move along the first direction, so that the suction cup 31 moves along the first direction.

[0067] In this embodiment, by setting the lead screw 342 to be screwed to the connecting member 341 and providing power by the second driving member 343, on the one hand, the displacement accuracy of the suction cup 31 can be improved, and on the other hand, it is beneficial to obtain a large axial force. At the same time, the lead screw 342 transmission has the advantages of strong load-bearing capacity and smooth operation without noise.

[0068] Optionally, the second driving member 343 may include a motor.

[0069] According to some other embodiments of the present utility model, the loading and unloading mechanism 100 further includes a second translation assembly 40. The second translation assembly 40 is respectively connected to the first adsorption assembly 20 and the second adsorption assembly 30 and is used to drive the first adsorption assembly 20 and the second adsorption assembly 30 to approach or move away from each other along a second direction.

[0070] Specifically, the second translation assembly 40 may be provided on the base 10. Both the first adsorption assembly 20 and the second adsorption assembly 30 are connected to the second translation assembly 40. By using the second translation assembly 40, the first adsorption assembly 20 and the second adsorption assembly 30 can be driven to approach or move away from each other along the second direction, so that the two rows of silicon wafers cross or separate.

[0071] In some specific embodiments of the present utility model, the second translation assembly 40 includes a second mounting plate 41, a third mounting plate 42, and an endless conveyor belt 43. The second mounting plate 41 is connected to the first translation assembly 34. The third mounting plate 42 is connected to the first adsorption assembly 20. The endless conveyor belt 43 is disposed on the base 10. The endless conveyor belt 43 includes two layers of belt bodies. The two layers of belt bodies extend along the second direction respectively. The first mounting plate 32 is connected to one of the two layers of belt bodies, and the second mounting plate 41 is connected to the other layer of the two layers of belt bodies. The endless conveyor belt 43 is movable in the forward or reverse direction to drive the first mounting plate 32 and the second mounting plate 41 to approach or move away from each other.

[0072] In other words, the second translation assembly 40 may mainly consist of a second mounting plate 41, a third mounting plate 42, and an endless conveyor belt 43. Among them, the first translation assembly 34 may be connected to the bottom of the second mounting plate 41 and move along the second direction together with the second mounting plate 41. The second translation assembly 40 may be connected to the third mounting plate 42 and move along the second direction together with the third mounting plate 42.

[0073] An endless conveyor belt 43 is provided on the substrate. The endless conveyor belt 43 may include upper and lower layers of belt bodies. For the convenience of description, the two layers of belt bodies may be defined as the upper belt body and the lower belt body. The upper belt body and the lower belt body may extend along the second direction respectively. During the rotation of the endless conveyor belt 43, the moving directions of the upper belt body and the lower belt body are opposite.

[0074] The second mounting plate 41 is connected to the upper belt body and the third mounting plate 42 is connected to the lower belt body, or the second mounting plate 41 is connected to the lower belt body and the third mounting plate 42 is connected to the upper belt body. Thus, driven by the endless conveyor belt 43, the second mounting plate 41 and the third mounting plate 42 can move towards or away from each other, that is, the first adsorption assembly 20 and the second adsorption assembly 30 can approach or move away from each other.

[0075] According to some alternative embodiments of the present utility model, each suction cup 31 includes a plurality of second suction sheets 311. The suction cup 31 has an original state and a mirror state. The first driving member can drive the suction cup 31 to rotate 180° to switch from the original state to the mirror state or from the mirror state to the original state. When the suction cup 31 is in the original state or the mirror state, the plurality of second suction sheets 311 of each suction cup 31 are arranged along the first direction.

[0076] Specifically, each suction cup 31 has a plurality of second suction sheets 311 arranged along the first direction.

[0077] Such as Figure 6As shown, when both suction cups 31 are in their original states, then both suction cups 31 are driven by their respective first driving members to rotate 180° around a preset axis 312. The rotation directions of the two suction cups 31 can be the same or opposite, which is not limited herein. After the rotation is completed, both suction cups 31 are in the mirror image states as shown in Figure 8 . When the suction cup 31 is in its original state or mirror image state, a plurality of second adsorption sheets 311 on the suction cup 31 are arranged at intervals along a first direction. The distance between two adjacent second adsorption sheets 311 can be equal to the distance between two adjacent first adsorption sheets 21.

[0078] According to some other embodiments of the present invention, the first adsorption sheets 21 have the same structure, which is beneficial to reducing the types of parts of the pick-and-place mechanism 100 and enabling the first adsorption assembly 20 and the second adsorption assembly 30 to have substantially the same performance in the function of adsorbing silicon wafers.

[0079] Specifically, both the first adsorption sheet 21 and the second adsorption sheet 311 are in sheet structures, and adsorption holes are provided on the surfaces of the first adsorption sheet 21 and the second adsorption sheet 311. The adsorption holes can be communicated with a negative pressure generating mechanism for generating an adsorption force. Extension parts 3111 are provided at the bottoms of the first adsorption sheet 21 and the second adsorption sheet 311. Since the specifications of silicon wafers include whole wafers and half wafers, and the length of a half silicon wafer is longer, the provision of the extension parts 3111 is beneficial to adsorbing half silicon wafers, improving the stability of the silicon wafers, and preventing the silicon wafers from shaking and falling.

[0080] It should be noted that Figures 6 to 10 the densely arranged line segments along the first direction on the first adsorption assembly 20 and the two suction cups 31 in can be used to represent the front orientations of the first adsorption assembly 20 and the two suction cups 31.

[0081] The operation process of the pick-and-place mechanism 100 of this embodiment will be described in detail below.

[0082] The pick-and-place mechanism 100 has at least five states.

[0083] Initially, as shown in Figure 6 , the pick-and-place mechanism 100 is in a first state. At this time, the first adsorption assembly 20 and the second adsorption assembly 30 are spaced apart along a second direction, and the half silicon wafers in the carrier can be adsorbed and picked up. At this time, the fronts of the first adsorption assembly 20 and the two suction cups 31 face each other, and the two suction cups 31 are in their original states.

[0084] Two first translation assemblies 34 drive the corresponding suction cups 31 to move away from each other along the first direction, so that the gap between the two suction cups 31 increases, and the pick-and-place mechanism 100 is switched to the second state as shown in Figure 7 .

[0085] Two first driving members drive the corresponding suction cups 31 to rotate 180° around the preset axis 312, so that the material taking and placing mechanism 100 is switched to the third state as shown in Figure 8 the figure. At this time, the fronts of the two suction cups 31 and the front of the first adsorption assembly 20 face the same side, and the two suction cups 31 are in a mirror state.

[0086] Two first translation assemblies 34 drive the corresponding suction cups 31 to approach each other along the first direction, so that the material taking and placing mechanism 100 is switched to the fourth state as shown in Figure 8 the figure. At this time, two rows of silicon wafers are opposite to each other one by one in the second direction.

[0087] Two first translation assemblies 34 drive the corresponding suction cups 31 to move forward along the first direction, so that the material taking and placing mechanism 100 is switched to the fifth state as shown in Figure 8 the figure. At this time, in the first direction, the distance between the ends of the first adsorption assembly 20 and the second adsorption assembly 30 can be S, so that the two rows of silicon wafers are staggered.

[0088] The second translation assembly 40 drives the first adsorption assembly 20 and the second adsorption assembly 30 to approach each other along the second direction, so that the two rows of silicon wafers cross.

[0089] Two first translation assemblies 34 drive the corresponding suction cups 31 to move in the reverse direction along the first direction, so that the crossed silicon wafers are attached to each other in pairs, and then the silicon wafers attached to each other in pairs are sent into the coating equipment.

[0090] The embodiment of the present invention also provides a silicon wafer processing device, which includes the material taking and placing mechanism 100 according to any of the above embodiments. Since the material taking and placing mechanism 100 according to the embodiment of the present invention has the above technical effects, therefore, the silicon wafer processing device according to the embodiment of the present invention also has corresponding technical effects, that is, it is beneficial to reduce the rotation radius, save the layout space of the device, and at the same time it is beneficial to increase the overall distance of the second adsorption assembly 30 in the first direction, thereby increasing the number of silicon wafers adsorbed at one time. For a large-capacity half-piece flower basket, only one material taking or blanking is required, and there is no need to carry out in batches, which is beneficial to improving the material taking and placing efficiency.

[0091] Although some specific embodiments of the present invention have been described in detail by way of examples, those skilled in the art should understand that the above examples are only for illustration and not for limiting the scope of the present invention. Those skilled in the art should understand that the above embodiments can be modified without departing from the scope and spirit of the present invention. The scope of the present invention is defined by the appended claims.

Claims

1. A pick-and-place mechanism, characterized in that, Comprising: A base; A first adsorption assembly, the first adsorption assembly being provided on the base, the first adsorption assembly including a plurality of first adsorption sheets arranged along a first direction; A second adsorption assembly, the second adsorption assembly being spaced apart from the first adsorption assembly along a second direction, the second adsorption assembly including at least two sub-adsorption assemblies arranged side by side along the first direction, each sub-adsorption assembly including a rotatable suction cup, the rotation center line of each suction cup extending along a third direction, and the first direction, the second direction, and the third direction intersecting respectively.

2. The pick-and-place mechanism according to claim 1, characterized in that, The first direction, the second direction, and the third direction are perpendicular to each other.

3. The pick-and-place mechanism according to claim 1, characterized in that, Each sub-adsorption assembly further includes: A first mounting plate, the first mounting plate being connected to the base; A first driving member, the first driving member being provided on the first mounting plate, the first driving member being connected to the suction cup to drive the suction cup to rotate.

4. The pick-and-place mechanism according to claim 3, wherein Each sub-adsorption assembly further includes: A first translation assembly, the first translation assembly being provided on the base, the first translation assembly being connected to the first mounting plate for driving the first mounting plate to move along the first direction.

5. The pick-and-place mechanism according to claim 4, characterized in that The first translation assembly includes: A connecting member, the connecting member being connected to the first mounting plate; A lead screw, the lead screw extending along the first direction and being screwed to the connecting member, the lead screw being rotatable about its own axis to drive the connecting member to move along the first direction; A second driving member, the second driving member being connected to the lead screw for driving the lead screw to rotate about its own axis.

6. The pick-and-place mechanism according to claim 4, characterized in that, Further comprising: A second translation assembly, the second translation assembly being respectively connected to the first adsorption assembly and the second adsorption assembly for driving the first adsorption assembly and the second adsorption assembly to approach or move away from each other along the second direction.

7. The pick-and-place mechanism according to claim 6, characterized in that, The second translation assembly includes: A second mounting plate, the second mounting plate being connected to the first translation assembly; A third mounting plate, the third mounting plate being connected to the first adsorption assembly; An endless conveyor belt, the endless conveyor belt being provided on the base, the endless conveyor belt including two layers of belt bodies, the two layers of belt bodies respectively extending along the second direction, the first mounting plate being connected to one of the two layers of belt bodies, the second mounting plate being connected to the other of the two layers of belt bodies, and the endless conveyor belt being movable in the forward or reverse direction to drive the first mounting plate and the second mounting plate to approach or move away from each other.

8. The pick-and-place mechanism according to claim 3, characterized in that, Each suction cup includes a plurality of second adsorption sheets, the suction cup having an original state and a mirror state, and the first driving member is capable of driving the suction cup to rotate 180° to switch from the original state to the mirror state or from the mirror state to the original state. When the suction cup is in the original state or the mirror state, the plurality of second adsorption sheets of each suction cup are arranged along the first direction.

9. The pick-and-place mechanism according to claim 8, wherein, The first adsorption sheet and the first adsorption sheet have the same structure.

10. A silicon wafer processing device, characterized in that, Comprising: The pick-and-place mechanism according to any one of claims 1-9.

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