Chip test seat with heat dissipation module

Abstract

The utility model relates to the technical field of chip test seats, and discloses a chip test seat with a heat dissipation module, which comprises a chip test base and a cover body structure arranged above the chip test base. The cover body structure comprises an upper cover plate, a rectangular penetrating opening formed in the top of the upper cover plate, a pressing block movably arranged at the bottom of the upper cover plate, a heat dissipation module installed on the top of the pressing block, a nut which is installed on the outer side of the top of the pressing block and movably penetrates through the rectangular penetrating opening, and a rotating block connected with the nut in a screwed mode. According to the utility model, the rotating angle of the pressing block can be limited within 180 degrees through the limiting pin, namely, the pressing block can be switched between test positions by rotating at most a half circle, so that the downward pressing stroke can be effectively limited, the rotating mode of the upper cover of the test seat in the prior art is solved, the upper cover of the test seat can be fastened completely through multiple manual operation and rotation, the actions are multiple, and the test efficiency is high. The problems that standardization cannot be achieved, the pressing force of the upper cover cannot be accurately controlled, and the chip may be damaged are solved.

Description

Technical Field

[0001] The utility model relates to the technical field of chip test sockets, in particular to a chip test socket with a heat dissipation module. Background Art

[0002] A chip is the core component in a microprocessor or multi-core processor. Before a chip is assembled into a terminal product, it usually goes through these processes such as chip design, wafer manufacturing, wafer testing, packaging, finished product testing, and board-level packaging. After the chip is packaged, it is generally tested to separate the good products from the bad products.

[0003] The traditional test method is to place the chip in the middle of the bottom of the chip test socket, and then cover the lid to make the pins of the chip contact the PIN pins. At this time, the performance test of the chip can be carried out. The chip is clamped between the base and the lid of the chip test socket, in a relatively enclosed space, and basically cannot dissipate heat or the heat dissipation effect is very poor.

[0004] With the rapid development of 5G and big data, the demand for high-power chips is getting higher and higher. At the same time, with the increase of power, the heat generation of the chips is gradually increasing. If a chip with a relatively large power (such as a chip about 8W) works in a closed space of the test socket for a long time, the temperature of the chip can reach above 130°C, which will cause test accidents such as the burning of the test base and the damage of the chip.

[0005] In the Chinese patent with the publication number CN 114496949 A, a heat dissipation cover for a chip test socket is disclosed. The heat dissipation cover for the chip test socket includes: a connecting seat, a folding cover, and a heat dissipation device. The connecting seat is used to connect the test base of the chip test socket. The folding cover is rotatably connected to the connecting seat, and the folding cover can be opened and closed relative to the connecting seat. A heat dissipation device is provided between the connecting seat and the folding cover, and the heat dissipation device can move axially along the folding cover. The heat dissipation device includes a heat conduction block and a semiconductor refrigeration sheet; the heat conduction block includes a heat conduction end and a heat dissipation end, and the heat conduction end is configured to be able to abut against the chip to be tested, and the heat dissipation end is communicated with the outside of the heat dissipation cover of the chip test socket. The semiconductor refrigeration sheet includes an endothermic surface and a heat dissipation surface. After being energized, the endothermic surface cools the chip to be tested and quickly transfers the heat to the heat dissipation surface, enhancing the heat dissipation capacity of the heat dissipation device and realizing the cooling of high-power chips.

[0006] However, the inventor found that due to the relatively large tolerance caused by the welding of the chip, and the rotation method of the upper cover of the test socket completely relies on manual operation (at least 2 turns) to rotate and fasten. There are many operations, which cannot be standardized, and the pressing force of the upper cover cannot be accurately controlled, and the chip may be damaged. Summary of the Utility Model

[0007] The purpose of the utility model is to solve the problems existing in the prior art, and to propose a chip test socket with a heat dissipation module.

[0008] To achieve the above object, the utility model adopts the following technical solutions:

[0009] A chip test socket with a heat dissipation module, including a chip test base and a cover structure arranged above the chip test base. The cover structure includes an upper cover plate, a rectangular through hole opened at the top of the upper cover plate, a pressing block movably arranged at the bottom of the upper cover plate, a heat dissipation module installed on the top of the pressing block, a nut installed on the outer side of the top of the pressing block and movably passing through the rectangular through hole, and a rotating block screwed with the nut. Travel limit blocks are arranged on both sides of the bottom of the rotating block, and a limit pin is arranged on the top of the upper cover plate and is located on the rotation path of the travel limit blocks.

[0010] Preferably, the upper cover plate is detachably connected to the chip test base through a snap structure.

[0011] Preferably, the heat dissipation module includes a heat sink installed on the top of the pressing block and a heat dissipation fan located on the top of the heat sink.

[0012] Preferably, the snap structure includes limit blocks arranged on both sides of the chip test base and snap members rotatably installed on both sides of the upper cover plate through a rotating shaft.

[0013] Preferably, the upper and lower ends of the rotating block are penetrated, and both the heat dissipation fan and the heat sink are located inside the rotating block.

[0014] Compared with the prior art, the beneficial effects of the utility model are as follows:

[0015] In the utility model, through the arranged limit pin, the rotation angle of the pressing block can be limited within 180°, that is, it can be rotated at most half a circle to switch between the test positions, so that the downward pressing stroke can be effectively limited, solving the problems in the rotation mode of the upper cover of the test socket in the prior art, which completely depends on manual multiple operations to rotate and fasten, with many actions, unable to be standardized, unable to accurately control the pressing force of the upper cover, and the chip may be damaged. Description of the Drawings

[0016] Figure 1 Is a perspective view of the chip test socket with a heat dissipation module proposed by the utility model;

[0017] Figure 2 Is a front view of the chip test socket with a heat dissipation module proposed by the utility model;

[0018] Figure 3 Is a rear view of the chip test socket with a heat dissipation module proposed by the utility model;

[0019] Figure 4 Is a top view of the chip test socket with a heat dissipation module proposed by the utility model;

[0020] Figure 5 The bottom view of the chip test socket with a heat dissipation module proposed by the present utility model;

[0021] Figure 6 The left view of the chip test socket with a heat dissipation module proposed by the present utility model;

[0022] Figure 7 The right view of the chip test socket with a heat dissipation module proposed by the present utility model;

[0023] Figure 8 The cross-sectional view of the chip test socket with a heat dissipation module proposed by the present utility model.

[0024] In the figure: 1. Chip test base; 2. Upper cover plate; 3. Rectangular through-hole; 4. Pressing block; 5. Nut; 6. Rotating block; 7. Stroke limiting block; 8. Limit pin; 9. Heat sink; 10. Heat dissipation fan; 11. Limiting block; 12. Buckling member. Specific embodiments

[0025] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments.

[0026] Refer to Figures 1 - 8 , a chip test socket with a heat dissipation module, including a chip test base 1 and a cover structure arranged above the chip test base 1. The cover structure includes an upper cover plate 2, a rectangular through-hole 3 opened at the top of the upper cover plate 2, a pressing block 4 movably arranged at the bottom of the upper cover plate 2, a heat dissipation module installed at the top of the pressing block 4, a nut 5 installed outside the top of the pressing block 4 and movably passing through the rectangular through-hole 3, and a rotating block 6 threadedly connected to the nut 5. The rotating block 6 is rotatably connected to the upper cover plate 2 through a bearing. Stroke limiting blocks 7 are arranged on both sides of the bottom of the rotating block 6. A limit pin 8 is arranged at the top of the upper cover plate 2, and the limit pin 8 is located on the rotation path of the stroke limiting block 7.

[0027] When the device is in use, the chip to be tested is placed in the chip test base 1, and then the upper cover plate 2 is fixed thereon. The chip is pressed by the pressing block 4, and then the rotating block 6 is rotated. By using the threaded structure with the nut 5, the pressing block 4 is pushed downward. Through the arranged limit pin 8, the rotation angle of the pressing block 4 can be limited within 180°, that is, it can be rotated at most half a turn to switch between the test positions, so that the downward pressing stroke can be effectively limited, solving the problems in the prior art that the rotation mode of the upper cover of the test socket completely depends on manual operation and rotation multiple times to fasten, with many actions, unable to be standardized, unable to accurately control the pressing force of the upper cover, and the chip may be damaged.

[0028] In this embodiment, the upper cover plate 2 is detachably connected to the chip test base 1 through a snap structure.

[0029] In this embodiment, the heat dissipation module includes a heat sink 9 installed on the top of the pressing block 4 and a heat dissipation fan 10 located on the top of the heat sink 9. When the heat dissipation fan 10 is started, the heat of the chip is sucked out through the heat sink 9 to achieve the cooling of the chip.

[0030] In this embodiment, the snap structure includes limiting blocks 11 provided on both sides of the chip test base 1 and snap members 12 rotatably installed on both sides of the upper cover plate 2 through a rotating shaft. The snap members 12 are L-shaped. By inserting the snap members 12 into the limiting blocks 11 in an opposing manner, the chip test base 1 and the upper cover plate 2 can be fixed together.

[0031] In this embodiment, the upper and lower ends of the rotating block 6 are in through communication, and both the heat dissipation fan 10 and the heat sink 9 are located inside the rotating block 6.

[0032] The above is only a preferred specific embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present utility model, according to the technical solution of the present utility model and its inventive concept, makes equivalent substitutions or changes, and all should be covered within the protection scope of the present utility model.

Claims

1. A chip test socket with a heat dissipation module, comprising a chip test base and a cover structure disposed above the chip test base, characterized in that: The cover structure includes an upper cover plate, a rectangular through-hole opened at the top of the upper cover plate, a pressing block movably arranged at the bottom of the upper cover plate, a heat dissipation module installed on the top of the pressing block, a nut installed on the outer side of the top of the pressing block and movably passing through the rectangular through-hole, and a rotating block screwed to the nut. Travel limit blocks are arranged on both sides of the bottom of the rotating block, and a limit pin is arranged on the top of the upper cover plate and is located on the rotation path of the travel limit blocks.

2. The chip test socket with a heat dissipation module according to claim 1, characterized in that: The upper cover plate is detachably connected to the chip test base through a snap structure.

3. The chip test socket with a heat dissipation module according to claim 1, characterized in that: The heat dissipation module includes a heat sink installed on the top of the pressing block and a heat dissipation fan located on the top of the heat sink.

4. The chip test socket with a heat dissipation module according to claim 2, characterized in that: The snap structure includes limit blocks arranged on both sides of the chip test base and snap members rotatably installed on both sides of the upper cover plate through a rotating shaft.

5. The chip test socket with a heat dissipation module according to claim 3, wherein: The upper and lower ends of the rotating block are communicated with each other, and both the heat dissipation fan and the heat sink are located inside the rotating block.

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