Film needle card

Abstract

The embodiment of the utility model discloses a film needle card. The thin film needle card comprises a base, a pressing plate, a circuit board, a thin film component and an elastic supporting structure, the thin film component comprises a testing end and connecting ends, the connecting ends are uniformly arranged along the circumferential direction of the testing end, the testing end protrudes out of the connecting ends in a first direction, and the testing end is electrically connected with the connecting ends through a flexible circuit board structure; and the elastic supporting structure is elastically supported between the testing end and the base. According to the embodiment of the invention, the test end can be elastically supported, so that after the electrical connection points on the test end abut against the electrical connection points on the to-be-tested chip due to levelness difference, the electrical connection points which are in contact with the to-be-tested chip firstly are prevented from being extruded by overlarge extrusion force to be damaged; the elastic deformation of the elastic support structure is utilized to ensure that the electric connection points on the test end can stably abut against the electric connection points on the chip to be tested.

Description

Technical Field

[0001] This application relates to the technical field of wafer testing, and particularly to a thin film probe card. Background Art

[0002] When using a thin film probe card to test semiconductor devices, first, the needles are aligned on the machine table. After the needles are inserted, the probe card makes contact with the chip under test. The input and output signals will finally be transmitted to the chip under test through a customized printed circuit board, signal traces on the thin film, and the tip parts. However, when the currently used thin film probe card contacts the electrical connection points on the chip under test, it is very easy to have problems such as some tips not making proper contact with the chip under test or some tips being damaged by being pressed by the chip under test due to the difference in the levelness of all the tips. Utility Model Content

[0003] This application aims to solve at least one of the technical problems existing in the prior art. For this purpose, this application provides a thin film probe card to solve the problems that some tips do not make proper contact with the chip under test or some tips are damaged by being pressed by the chip under test.

[0004] This application provides a thin film probe card, including: a base, a pressing plate, a circuit board, a thin film component, and an elastic support structure;

[0005] The thin film component includes a test end and a connection end. The connection ends are evenly arranged along the circumference of the test end. The test end protrudes from the connection end in a first direction. The test end and the connection end are electrically connected through a flexible circuit board structure;

[0006] The elastic support structure elastically supports between the test end and the base and is used to provide an elastic force in the first direction for the test end;

[0007] The pressing plate is connected to the base and is used to fix the connection end;

[0008] The circuit board is arranged on the base and is electrically connected to the connection end.

[0009] Based on the thin film probe card, through the pressing plate, the connection end of the thin film component can be fixed on the base. Through the elastic force in the first direction provided by the elastic support structure, the test end can be elastically supported. Thus, after some electrical connection points on the test end first abut against the electrical connection points on the chip under test due to the difference in levelness, by using the elastic deformation generated by the elastic support structure in the direction opposite to the first direction, it can be avoided that the electrical connection points that first contact the chip under test are damaged by excessive extrusion force; at the same time, by using the elastic deformation of the elastic support structure, it can also ensure that all the electrical connection points on the test end can stably and reliably abut against the electrical connection points on the chip under test, ensuring the reliability and stability of the operation of the thin film probe card.

[0010] In one embodiment of the above-mentioned thin film pin card, at least part of the circuit board forms the pressing plate.

[0011] And / or,

[0012] An avoidance portion for avoiding the electrical connection points on the connection end is provided on the pressing plate, and the circuit board is electrically connected to the connection end through the avoidance portion.

[0013] In one embodiment of the above-mentioned thin film pin card, some of the electrical connection points on the circuit board correspond one-to-one with the electrical connection points on the connection end in the first direction, and the circuit board is connected to the base through a connecting member extending in the first direction.

[0014] Furthermore, based on the above-mentioned circuit board, after the circuit board is connected to the base through the connecting member, a pressing force can be provided to the connection end in the first direction or the direction opposite to the first direction, so that while the circuit board is fixed on the base, the connection end of the thin film component is fixed between the base and the circuit board, and there is no need to separately provide a fixing structure for the connection end of the thin film component, thereby further simplifying the overall structure.

[0015] In one embodiment of the above-mentioned thin film pin card, a transfer interface is provided on the circuit board, the transfer interface corresponds one-to-one with the electrical connection points on the connection end in the first direction, and an elastic structure having elasticity in the first direction is provided between the transfer interface and the connection end.

[0016] In one embodiment of the above-mentioned thin film pin card, the test end includes a needle arm and a needle tip. The needle arm extends perpendicular to the first direction and is attached to the surface of the thin film component. The needle arm is used to electrically connect the needle tip and the connection end. The needle tip protrudes from the surface of the test end in the first direction and is used to electrically connect to the chip under test.

[0017] In one embodiment of the above-mentioned thin film pin card, the thin film component further includes a polyimide film. The test end is formed at the center of the polyimide film, the connection end is formed at the outer edge of the polyimide film, and electrical connection lines are arranged in the polyimide film to connect the test end and the connection end.

[0018] In one embodiment of the above-mentioned thin film pin card, the elastic support structure includes a support column. The support column extends in the first direction and has elasticity in the first direction. The first end of the support column is elastically supported on the back surface of the thin film component opposite to the test end, and the second end of the support column is elastically supported on the base.

[0019] In one embodiment of the above-mentioned thin film pin card, a stepped portion for avoiding the thin film component is provided on the circumferential side surface of the support column.

[0020] In one embodiment of the above-mentioned thin film needle card, the elastic support structure further includes an elastic seat that is elastic in a first direction, and the elastic seat is elastically supported between the support column and the base.

[0021] In one embodiment of the above-mentioned thin film needle card, the elastic seat elastically abuts against the outer edge of the end face of the support column, and an avoidance space for avoiding the center of the support column is formed at the center of the elastic seat.

[0022] Furthermore, based on the setting of the avoidance space, a suspended state can be formed at the center of the connection position between the support column and the base. The avoidance space is oppositely arranged with the tip of the test end in the first direction, so that the elastic deformation range of the part of the support column for supporting the tip in the first direction can be further increased, and the tip can be further effectively protected.

[0023] One or more of the above embodiments of the present application have at least one or more of the following beneficial effects:

[0024] Through the pressure plate, the connection end of the thin film component can be fixed on the base. Through the elastic force in the first direction provided by the elastic support structure, the test end can be elastically supported. Thus, after some electrical connection points on the test end come into contact with the electrical connection points on the chip under test first due to the difference in flatness, the elastic deformation generated by the elastic support structure in the direction opposite to the first direction can be utilized to avoid the electrical connection points that come into contact with the chip under test first from being squeezed by excessive extrusion force and causing damage; at the same time, by using the elastic deformation of the elastic support structure, it can also ensure that all the electrical connection points on the test end can stably and reliably abut against the electrical connection points on the chip under test, ensuring the reliability and stability of the operation of the thin film needle card.

[0025] Additional aspects and advantages of the present application will be given in part in the following description, become apparent in part from the following description, or be learned through the practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Referring to the accompanying drawings, the disclosure of the present application will become more understandable. It is easy for those skilled in the art to understand that these drawings are only for illustrative purposes and are not intended to limit the protection scope of the present application. In addition, similar numbers in the drawings are used to represent similar components, where:

[0027] Figure 1 is a schematic structural diagram of the thin film needle card described in the embodiment of the present application;

[0028] Figure 2 is a schematic structural diagram of the needle arm and the tip described in the embodiment of the present application.

[0029] Description of Reference Numerals

[0030] 1. Base; 2. Circuit board; 21. Adapter; 3. Film component; 31. Test end; 311. Needle arm; 312. Needle tip; 32. Connecting end; 4. Connector; 51. Support column; 511. Stepped portion; 52. Elastic seat; 521. Avoidance space. DETAILED DESCRIPTION

[0031] Some embodiments of the present application are described below with reference to the accompanying drawings. Those skilled in the art should understand that these embodiments are only used to explain the technical principles of the present application and are not intended to limit the protection scope of the present application.

[0032] When the thin film needles currently in use contact the electrical connection points on the chip to be tested, it is easy for part of the needle tips to fail to contact the chip to be tested, or part of the needle tips to be crushed and damaged by the chip to be tested, due to the difference in the levelness of all the needle tips.

[0033] Based on this, the present application provides a thin film needle card, which can fix the connecting end of the thin film component on the base through a pressure plate, and can elastically support the test end through the elastic force in the first direction provided by the elastic support structure, so that the electrical connection points on the test end can be offset against the electrical connection points on the chip to be tested due to the difference in horizontality, and then the elastic deformation of the elastic support structure in a direction opposite to the first direction can be used to avoid the electrical connection points that first contact the chip to be tested from being squeezed by excessive squeezing force and causing them to be crushed and damaged; at the same time, the elastic deformation of the elastic support structure can also ensure that the electrical connection points on all test ends can stably and reliably abut against the electrical connection points on the chip to be tested, thereby ensuring the reliability and stability of the thin film needle card.

[0034] The present application will be described in detail below through specific embodiments.

[0035] Reference Figure 1 and Figure 2As shown, this embodiment provides a thin-film needle card, including: a base 1, a pressing plate, a circuit board 2, a thin-film component 3, and an elastic support structure; the thin-film component 3 includes a test end 31 and a connection end 32, the connection ends 32 are uniformly arranged along the circumference of the test end 31, and the test end 31 protrudes from the connection end 32 in the first direction. It should be understood that the first direction refers to the direction in which the test end 31 faces the chip to be tested. The test end 31 and the connection end 32 are electrically connected through a flexible circuit board structure. It should be noted that the flexible circuit board structure between the test end 31 and the connection end 32 refers to a thin-film structure with flexibility and a circuit board structure with electrical connection lines arranged inside; the elastic support structure elastically supports between the test end 31 and the base 1 and is used to provide an elastic force in the first direction for the test end 31; the pressing plate is connected to the base 1 and is used to fix the connection end 32; the circuit board 2 is arranged on the base 1 and is electrically connected to the connection end 32.

[0036] For the thin-film needle card provided in this embodiment, the connection end 32 of the thin-film component 3 can be fixed on the base 1 through the pressing plate, and the test end 31 can be elastically supported by the elastic force in the first direction provided by the elastic support structure. Thus, after some electrical connection points on the test end 31 come into contact with the electrical connection points on the chip to be tested first due to the difference in levelness, the elastic deformation generated by the elastic support structure in the direction opposite to the first direction can be utilized to avoid the electrical connection points that come into contact with the chip to be tested first from being squeezed by an excessive extrusion force and causing damage; at the same time, by using the elastic deformation of the elastic support structure, it can also ensure that all the electrical connection points on the test end 31 can stably and reliably abut against the electrical connection points on the chip to be tested, ensuring the reliability and stability of the operation of the thin-film needle card.

[0037] In some embodiments, at least part of the circuit board 2 forms the pressing plate, that is to say, the connection end 32 of the thin-film component 3 can be directly fixed on the base 1 through the circuit board 2, thus eliminating the need for a pressing plate and simplifying the overall structure, and / or, the pressing plate is provided with an avoidance portion for avoiding the electrical connection points on the connection end 32, and the circuit board 2 is electrically connected to the connection end 32 through the avoidance portion. It should be understood that at this time, the pressing plate needs to tightly fix the area other than the area where the electrical connection points are arranged on the connection end 32, and an avoidance portion is arranged in the area of the electrical connection points to facilitate the electrical connection between the circuit board 2 and the electrical connection points on the connection end 32.

[0038] In some further embodiments, some of the electrical connection points on the circuit board 2 correspond one-to-one with the electrical connection points on the connection end 32 in the first direction, and the circuit board 2 is connected to the base 1 through a connecting member 4 extending in the first direction; the connecting member 4 can be structures such as bolts, screws, rivets, and buckles. After the circuit board 2 is connected to the base 1 through the connecting member 4, a pressing force in the first direction or the direction opposite to the first direction is provided to the connection end 32, so that while the circuit board 2 is fixed on the base 1, the connection end 32 of the thin film component 3 can be fixed between the base 1 and the circuit board 2, and there is no need to separately provide a fixing structure for the connection end 32 of the thin film component 3, thereby further simplifying the overall structure.

[0039] In some embodiments, a transfer interface 21 is provided on the circuit board 2. Specifically, the transfer interface 21 is electrically connected to the circuit board 2, and the transfer interface 21 corresponds one-to-one with the electrical connection points on the connection end 32 in the first direction. An elastic structure having elasticity in the first direction is provided between the transfer interface 21 and the connection end 32; among them, the transfer interface 21 can have elasticity, so as to realize the fixation of the connection end 32 while elastically abutting against the electrical connection points on the connection end 32 to realize the electrical connection between the circuit board 2 and the connection end 32; it can also be that an elastic buffer structure is provided between the connection end 32 and the transfer interface 21, and the electrical connection points on the connection end 32 can be pin structures inserted into the transfer interface 21 to realize electrical connection, or can also form a plug-in fit structure of a male head and a female seat with the transfer interface 21.

[0040] Continue to refer to Figure 1 and Figure 2 As shown, the test end 31 includes a needle arm 311 and a needle tip 312. The needle arm 311 extends in a direction perpendicular to the first direction and is attached to the surface of the thin film component 3. The needle arm 311 is used to electrically connect the needle tip 312 and the connection end 32. The needle tip 312 protrudes from the surface of the test end 31 in the first direction and is used to electrically connect with the chip to be tested; specifically, the needle arm 311 can be a planar structure to increase the contact area with the test end 31 and ensure the stability of the needle tip 312 during the test work.

[0041] Further, the position on the needle tip 312 for contacting the chip to be tested is a planar structure, so as to increase the contact area, ensure stability, and at the same time reduce the pressure received by the needle tip 312 to protect the electrical contact points on the needle tip 312 and the chip to be tested; specifically, the needle tip 312 can be made of nickel-chromium alloy, or can also be made of other materials with strong electrical conductivity and relatively high strength.

[0042] In some embodiments, the thin film component 3 further includes a polyimide film. A test end 31 is formed at the center of the polyimide film, and a connection end 32 is formed at the outer edge of the polyimide film. Electric connection lines are arranged in the polyimide film to connect the test end 31 and the connection end 32. At this time, the polyimide film can be a square or circular structure. The center position bulges in the first direction towards the chip to be tested to form the test end 31. The center position has a planar structure that matches the electrical connection points of the chip to be tested. The tip 312 and the needle arm 311 are arranged on this planar structure. The connection end 32 is flexibly connected to the test end 31 through the polyimide film.

[0043] Continuing to refer to Figure 1 As shown, in some embodiments, the elastic support structure includes a support column 51. The support column 51 extends in the first direction and has elasticity in the first direction. The first end of the support column 51 is elastically supported on the back surface of the thin film component 3 opposite to the test end 31, and the second end of the support column 51 is elastically supported on the base 1. The support column 51 can specifically be a columnar spring structure, or a rubber column structure, or other elastic structures that can elastically support the test end 31 in the first direction.

[0044] In some embodiments, a stepped portion 511 for avoiding the thin film component 3 is provided on the circumferential side surface of the support column 51. It should be noted that the stepped portion 511 is designed following the curved surface change of the thin film component 3 to ensure that there is a set interval between the circumferential side surface of the support column 51 and the thin film component 3, avoiding the thin film component 3 being affected by the support column 51.

[0045] In some embodiments, the elastic support structure further includes an elastic seat 52 that has elasticity in the first direction. The elastic seat 52 is elastically supported between the support column 51 and the base 1. Through the arrangement of the elastic seat 52 and the support column 51, a double elastic buffering effect can be formed. The elastic seat 52 can specifically be a spring or rubber structure, etc.

[0046] In some further embodiments, the elastic seat 52 elastically abuts against the outer edge of the end face of the support column 51. An avoidance space 521 for avoiding the center of the support column 51 is formed at the center of the elastic seat 52. Specifically, the elastic seat 52 can be a columnar spring, and the avoidance space 521 is formed at the center of the columnar spring. The elastic seat 52 can also include a plurality of elastic structures arranged along the circumferential direction of the support column 51, and the avoidance space 521 is formed at the center of the support column 51. Through the arrangement of the avoidance space 521, a suspended state can be formed at the center of the connection position between the support column 51 and the base 1. The avoidance space 521 is oppositely arranged with the tip 312 on the test end 31 in the first direction, so as to further increase the elastic deformation range of the part of the support column 51 that supports the tip 312 in the first direction and further effectively protect the tip 312.

[0047] In the description of this specification, the descriptions referring to terms such as "one embodiment", "some embodiments", "examples", "specific examples", or "some examples" etc. mean that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of this application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0048] In addition, the terms "first" and "second" are used for descriptive purposes only and cannot be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include at least one of such features. In the description of this application, "a plurality of" means at least two, such as two, three, etc., unless otherwise specifically and clearly defined.

[0049] Although the embodiments of this application have been shown and described above, it can be understood that the above embodiments are exemplary and should not be construed as limiting this application. Those of ordinary skill in the art can make changes, modifications, substitutions, and variations to the above embodiments within the scope of this application.

Claims

1. A thin film pin card, characterized in that, Comprising: A base (1), a pressing plate, a circuit board (2), a thin film component (3), and an elastic support structure; The thin film component (3) includes a test end (31) and a connection end (32). The connection ends (32) are uniformly arranged along the circumference of the test end (31). The test end (31) protrudes in a first direction from the connection ends (32). The test end (31) and the connection ends (32) are electrically connected through a flexible circuit board structure; The elastic support structure elastically supports between the test end (31) and the base (1), and is used to provide an elastic force in the first direction for the test end (31); The pressing plate is connected to the base (1), and is used to fix the connection ends (32); The circuit board (2) is arranged on the base (1), and is electrically connected to the connection ends (32).

2. The thin film needle card according to claim 1, wherein At least part of the circuit board (2) forms the pressing plate, and / or, The pressing plate is provided with an avoidance portion for avoiding the electrical connection points on the connection ends (32). The circuit board (2) is electrically connected to the connection ends (32) through the avoidance portion.

3. The thin film needle card according to claim 2, characterized in that, Part of the electrical connection points on the circuit board (2) correspond one-to-one with the electrical connection points on the connection ends (32) in the first direction. The circuit board (2) is connected to the base (1) through a connecting member (4) extending in the first direction.

4. The thin film pin card according to claim 3, characterized in that, The circuit board (2) is provided with an adapter (21). The adapter (21) corresponds one-to-one with the electrical connection points on the connection ends (32) in the first direction. An elastic structure having elasticity in the first direction is provided between the adapter (21) and the connection ends (32).

5. The thin film needle card according to claim 1, wherein The test end (31) includes a needle arm (311) and a needle tip (312). The needle arm (311) extends perpendicular to the first direction and is attached to the surface of the thin film component (3). The needle arm (311) is used to electrically connect the needle tip (312) and the connection ends (32). The needle tip (312) protrudes in the first direction from the surface of the test end (31), and is used to electrically connect to a chip to be tested.

6. The thin film needle card according to claim 1, wherein, The thin film component (3) further includes a polyimide film. The test end (31) is formed at the center of the polyimide film, and the connection ends (32) are formed at the outer edge of the polyimide film. Electric connection lines are arranged in the polyimide film to connect the test end (31) and the connection ends (32).

7. The thin film pin card according to any one of claims 1 to 6, characterized in that, The elastic support structure includes a support column (51). The support column (51) extends in the first direction and has elasticity in the first direction. The first end of the support column (51) elastically supports on the back surface of the thin film component (3) opposite to the test end (31), and the second end of the support column (51) elastically supports on the base (1).

8. The thin film needle card according to claim 7, characterized in that, A stepped portion (511) for avoiding the thin film component (3) is provided on the circumferential side surface of the support column (51).

9. The film needle card according to claim 7, wherein The elastic support structure further includes an elastic seat (52) having elasticity in the first direction. The elastic seat (52) elastically supports between the support column (51) and the base (1).

10. The thin film pin card according to claim 9, characterized in that, The elastic seat (52) is elastically abutted against the outer edge of the end face of the support column (51), and an avoidance space (521) for avoiding the center of the support column (51) is formed at the center of the elastic seat (52).

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