Packaging module testing device

Abstract

The utility model provides a packaging module testing device, and relates to the technical field of module testing, and the packaging module testing device comprises a testing seat, a lifting mechanism installed on the testing seat, and a testing mechanism detachably installed on the testing seat. The testing mechanism is designed to be detachable and is fixedly arranged at a specific position of the testing seat, so that the testing mechanism can be conveniently and quickly replaced, and the testing requirements of various packaging modules can be met. In addition, the testing mechanism is kept still in the whole testing process, and the testing line connected to the testing mechanism is also kept still. The design effectively prevents the test line from swinging or shaking caused by movement in the test process, so that the service life of the test line is prolonged, and the accuracy of a test result is ensured. The packaging module is placed between the lifting mechanism and the testing mechanism, and the lifting mechanism is matched with the testing mechanism to clamp and position the packaging module through accurate lifting action, so that the testing mechanism can be electrically connected with the packaging module to test the packaging module.

Description

Technical Field

[0001] This application relates to the technical field of module testing, and more particularly, to a packaging module testing device. Background Art

[0002] When the existing testing device tests the IGBT packaging module, it usually presses the test board through a pressing mechanism so that the probes on the test board can contact the pins of the packaging module placed on the test seat. However, in this process, since the test wire is connected to the test board, the pressing and releasing actions of the test board will cause the test wire to swing. The repeated swinging of the test wire will not only affect the service life of the test wire, but also the back-and-forth movement of the test wire will cause instability in the test process, thereby affecting the reliability of the test results.

[0003] In addition, in the current design of the testing device, the test board and the test seat are usually an integrated structure. This means that each testing device can only match with IGBT modules of a specific packaging type and cannot meet the testing requirements of multiple packaging modules. This one-to-one testing method greatly limits the flexibility and versatility of the testing device, increasing the testing cost and time. Summary of the Utility Model

[0004] The purpose of this application is to provide a packaging module testing device for the deficiencies in the above-mentioned existing technologies.

[0005] To achieve the above purpose, the technical solutions adopted in the embodiments of this application are as follows:

[0006] The embodiments of this application provide a packaging module testing device, including a test seat, a lifting mechanism installed on the test seat, and a testing mechanism detachably installed on the test seat. The lifting mechanism and the testing mechanism are used to place the packaging module, and the lifting mechanism cooperates with the testing mechanism to clamp the packaging module so that the packaging module is electrically connected to the testing mechanism.

[0007] Optionally, the testing mechanism includes a test board installed on the test seat and a probe group fixed to the test board, and the probe group contacts the pins of the packaging module.

[0008] Optionally, the packaging module testing device further includes at least two support legs installed on the test seat, and the test board is installed on the test seat through the support legs.

[0009] Optionally, the packaging module testing device further includes a bracket installed on the side of the test board close to the lifting mechanism, and the bracket has a receiving groove for matching with the packaging module.

[0010] Optionally, the lifting mechanism includes a driving component installed on the test seat and a lifting plate drivingly connected to the driving component, and the driving component cooperates with the lifting plate and the testing mechanism to clamp the packaging module.

[0011] Optionally, the driving assembly includes a handle, a first connecting rod, and a second connecting rod. One end of the handle is rotatably connected to the test base, the other end of the handle is rotatably connected to the first connecting rod, one end of the first connecting rod away from the handle is rotatably connected to the second connecting rod, and one end of the second connecting rod away from the first connecting rod is drivingly connected to the lifting plate.

[0012] Optionally, the package module testing device further includes a guiding sleeve installed on the test base, and the guiding sleeve is sleeved on the outer periphery of the second connecting rod.

[0013] Optionally, the package module testing device further includes a guiding rod installed on the test base, the lifting plate is slidably connected to the test base through the guiding rod, and the driving assembly drives the lifting plate to move along the axial direction of the guiding rod.

[0014] Optionally, the testing mechanism further includes a test instrument, and the test instrument is electrically connected to the probe group.

[0015] Optionally, the lifting mechanism further includes a reset member installed between the driving assembly and the lifting plate, and the reset member is used to provide a reset force to make the package module tend to move in a direction away from the testing mechanism.

[0016] The beneficial effects of the present application include:

[0017] The present application provides a package module testing device, including a test base, a lifting mechanism installed on the test base, and a testing mechanism detachably installed on the test base. The test base serves as the foundation of the entire device, ensuring the stable installation and coordinated operation of each component. The testing mechanism is designed to be detachable and fixedly installed at a specific position on the test base, facilitating the rapid replacement of the testing mechanism to meet the testing requirements of various package modules. In addition, the testing mechanism remains stationary throughout the testing process, and the test wires connected to the testing mechanism also remain stationary. This design effectively avoids the swinging or jitter of the test wires during the testing process, thereby extending the service life of the test wires and ensuring the accuracy of the test results. The package module is placed between the lifting mechanism and the testing mechanism, and the lifting mechanism, through precise lifting actions, cooperates with the testing mechanism to clamp and position the package module, enabling the testing mechanism to be electrically connected to the package module for testing the package module. This clamping method can effectively prevent the package module from being displaced or loosened during the testing process, ensuring the continuity of the testing and the accuracy of the data. Description of the Drawings

[0018] To more clearly illustrate the technical solutions of the embodiments of the present application, the following will briefly introduce the accompanying drawings required in the embodiments. It should be understood that the following drawings only show some embodiments of the present application and should not be regarded as limiting the scope. For those of ordinary skill in the art, without creative efforts, other related drawings can also be obtained based on these drawings.

[0019] Figure 1 It is a schematic structural diagram of a packaging module testing device provided by an embodiment of the present application;

[0020] Figure 2 It is a schematic structural diagram of a testing mechanism provided by an embodiment of the present application.

[0021] Icons: 10 - testing base; 21 - driving component; 211 - handle; 212 - first connecting rod; 213 - second connecting rod; 22 - lifting plate; 30 - testing mechanism; 31 - testing plate; 32 - probe group; 40 - support leg; 50 - bracket; 60 - guiding sleeve; 70 - guiding rod. Detailed implementation manners

[0022] To make the objectives, technical solutions, and advantages of the embodiments of the present application clearer, the following will clearly and completely describe the technical solutions in the embodiments of the present application with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are some, but not all, of the embodiments of the present application. Usually, the components of the embodiments of the present application described and shown in the accompanying drawings here can be arranged and designed in various different configurations.

[0023] Therefore, the following detailed description of the embodiments of the present application provided in the drawings is not intended to limit the scope of the present application to be protected, but merely represents the selected embodiments of the present application. It should be noted that, without conflict, the various features in the embodiments of the present application can be combined with each other, and the combined embodiments are still within the protection scope of the present application.

[0024] It should be noted that similar reference numerals and letters indicate similar items in the following drawings. Therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings.

[0025] In the description of the present application, it should be noted that the orientation or positional relationship indicated by terms such as "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship in which the product of this application is usually placed during use. It is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be construed as a limitation on the present application. In addition, terms such as "first", "second", "third", etc. are only used for distinguishing descriptions and cannot be understood as indicating or implying relative importance.

[0026] In addition, terms such as "horizontal" and "vertical" do not mean that the components are required to be absolutely horizontal or hanging vertically, but can be slightly inclined. For example, "horizontal" only means that its direction is more horizontal relative to "vertical", and does not mean that the structure must be completely horizontal, but can be slightly inclined.

[0027] In the description of the present application, it should also be noted that unless otherwise clearly specified and limited, the terms "set", "installed", "connected", "coupled" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific situations.

[0028] The embodiment of the present application provides a packaging module testing device for testing an IGBT packaging module, as Figure 1 shown, the packaging module testing device includes a test seat 10, a lifting mechanism installed on the test seat 10, and a testing mechanism 30 detachably installed on the test seat 10.

[0029] Specifically, the test seat 10 serves as the basis of the packaging module testing device, which is used to ensure the stable installation and coordinated operation of each component. The test seat 10 is made of a strong and stable structural material, which can effectively withstand the pressure from the lifting mechanism and the testing mechanism 30, and provide solid support for the entire testing process. Through reasonable layout and structural design, the test seat 10 is provided with positioning structures for installing the lifting mechanism and the testing mechanism 30, so as to ensure the precise docking and firm connection between each component.

[0030] As one of the core components of the encapsulation module testing device, the lifting mechanism is installed above the test base 10. Its function is to achieve the clamping and positioning of the encapsulation module through precise lifting actions. The design of the lifting mechanism can include a height adjustment mechanism, which can adjust the clamping position according to different specifications of the encapsulation module to ensure that the encapsulation module is reliably clamped between the lifting mechanism and the testing mechanism 30. The stable movement of the lifting mechanism can avoid damaging the encapsulation module during the clamping process and ensure that the encapsulation module can accurately dock with the testing mechanism 30.

[0031] The testing mechanism 30 is another key component. Its structure is designed to be detachable and is installed at a specific position on the test base 10 to facilitate the rapid replacement of the testing mechanism 30 to meet the testing requirements of multiple products under one type of encapsulation module or multiple encapsulation modules. In addition, the testing mechanism 30 remains stationary throughout the testing process. Due to the fixation of the testing mechanism 30, the test wires connected to the testing mechanism 30 also remain stationary. This design can effectively avoid the swinging or jitter of the test wires during the testing process, thereby extending the service life of the test wires and further ensuring the accuracy of the test results. The stationary state of the test wires can reduce the signal interference introduced by the movement of the test wires, ensure the stability of signal transmission, and thus improve the reliability of the test.

[0032] During actual testing, the encapsulation module is placed between the lifting mechanism and the testing mechanism 30. Through the up and down movement of the lifting mechanism, the encapsulation module is gradually clamped until a reliable electrical connection is achieved with the testing mechanism 30. This clamping method can effectively prevent the encapsulation module from shifting or loosening during the testing process, ensuring the continuity of the test and the accuracy of the data.

[0033] In summary, the encapsulation module testing device provided by the embodiment of the present application, through the organic combination of the test base 10, the lifting mechanism, and the testing mechanism 30, can not only achieve the stable clamping and efficient electrical connection of the encapsulation module, but also reduce the variables and uncertainties during the testing process, and can also adapt to different sizes and types of encapsulation modules, thereby effectively improving the efficiency, accuracy, and flexibility of the test.

[0034] Optionally, the testing mechanism 30 includes a test board 31 installed on the test base 10 and a probe group 32 fixed to the test board 31. The probe group 32 contacts the pins of the encapsulation module.

[0035] Specifically, as Figure 2As shown, the test mechanism 30 consists of a test board 31 installed on the test base 10 and a probe group 32 fixed to the test board 31. The test board 31, as the core part of the test mechanism 30, is fixedly installed on the test base 10 to ensure its stability during the test process. The test board 31 is made of high-strength materials, which can not only withstand the mechanical pressure applied during the test process but also provide the necessary structural support. The design of the test board 31 can not only ensure the precise positioning of the probe group 32 but also make the entire packaging module test device have high rigidity and stability, avoiding poor contact between the probe group 32 and the pins of the packaging module caused by the deformation of the board body during the test process. The probe group 32 is fixedly installed on the test board 31 and is the key component for the electrical connection between the test mechanism 30 and the packaging module. When the packaging module is placed between the test mechanism 30 and the lifting mechanism, the lifting mechanism presses down the packaging module to make its pins in close contact with the probes of the probe group 32, thus achieving a stable electrical connection.

[0036] Among them, the probe group 32 consists of multiple probes, and these probes are precisely arranged according to the layout of the pins of the packaging module. For example, the PIM3 packaging module has 7 different types, and the main difference between these types lies in the different positions of the pins. To cope with these differences, the packaging module test device can be equipped with 7 different test mechanisms 30, and the probe group 32 of each test mechanism 30 is matched with the pins of the corresponding type of packaging module to ensure precise electrical connection and an effective test process. By configuring a dedicated test mechanism 30 for each type of PIM3 packaging module, the packaging module test device can adapt to the pin layouts of different modules, thereby improving applicability. This flexibility enables the test device to avoid complex adjustments or modifications when facing different types of packaging modules and only needs to be replaced with the corresponding test mechanism 30. This design can not only improve the test efficiency but also reduce the complexity of operation, ensuring the quickness and efficiency of the test process.

[0037] Generally speaking, the combined design of the test board 31 and the probe group 32 can greatly improve the test accuracy of the packaging module. The precise contact between the probe group 32 and the pins of the packaging module can ensure the lossless transmission of electrical signals, thereby improving the reliability of the test data. In addition, since the probe group 32 is fixed on the test board 31, this structure can eliminate the interference introduced by the movement or vibration of the probes during the test process, thereby further enhancing the stability of the test. The fixed probe group 32 design can also reduce the movement of the test wires and avoid signal loss caused by the swinging of the test wires.

[0038] Optionally, the test mechanism 30 further includes a test instrument, and the test instrument is electrically connected to the probe group 32.

[0039] Specifically, the probe group 32 is in direct contact with the pins of the packaging module, enabling it to effectively capture the electrical signals of the packaging module. These signals are transmitted through electrical connections to the test instrument, which analyzes and processes these signals and finally displays various electrical performance indicators of the packaging module. Through this design, the test device can accurately evaluate the electrical characteristics of the packaging module to ensure that it meets the predetermined performance standards.

[0040] The test instrument is usually fixedly installed at an easily operable position of the test device for convenient real-time monitoring and data reading. The probe group 32 is connected to the test instrument through test lines, forming a complete signal transmission channel. The design of this channel needs to consider the integrity and anti-interference of signal transmission to ensure the accuracy of test data. The layout of the test lines usually adopts a shielding design to prevent external electromagnetic interference from affecting the test results.

[0041] Generally speaking, the test instrument in the test mechanism 30 forms a complete and efficient electrical test system through the electrical connection with the probe group 32. This system can accurately and real-time monitor the electrical performance of the packaging module, providing reliable test data for the operator.

[0042] Optionally, the packaging module test device further includes at least two support legs 40 installed on the test base 10, and the test board 31 is installed on the test base 10 through the support legs 40.

[0043] Specifically, the setting of the support legs 40 can play a dual role of support and isolation. As Figure 1 and Figure 2 shown, the support legs 40 are installed at the bottom of the test base 10 and suspend and fix the test board 31 above the test base 10 at an appropriate height. In this way, a gap can be formed between the test board 31 and the test base 10. This gap can provide a dedicated channel for the layout of the test lines, enabling the test lines to be led out from below the test board 31 and connected to the test instrument to ensure smooth and stable signal transmission.

[0044] The support legs 40 are installed at the bottom of the test base 10 through a firm mechanical connection method, usually using bolt connection, buckle or other high-strength fixing methods to ensure that the support legs 40 will not loosen or shift under stress. The upper end of the support legs 40 is fixedly connected to the test board 31. Through this support structure, the test board 31 is suspended above the test base 10 and maintains an appropriate gap with the bottom of the test base 10. The material of the support legs 40 is usually selected as a metal or alloy material with high strength and durability to ensure its stability and durability during long-term use.

[0045] Generally speaking, by precisely designing the height and quantity of the support legs 40, it can be ensured that the gap between the test board 31 and the test socket 10 is wide enough to accommodate and arrange the test lines. The test board 31 is fixed at a relatively high position through the support legs 40. This design not only maintains the stability of the test board 31 but also creates favorable conditions for the layout of the test lines. Through this gap, the test lines can pass vertically downward from the bottom of the test board 31 and be connected to the test instrument, avoiding the messy accumulation of the test board 31 within the packaging module testing device.

[0046] Optionally, the packaging module testing device further includes a bracket 50 installed on one side of the test board 31 close to the lifting mechanism. The bracket 50 has a receiving groove for matching with the packaging module.

[0047] Specifically, the setting of the bracket 50 is to ensure the accurate positioning of the packaging module during the testing process. The packaging module needs to be accurately docked with the probe group 32 or the connector of the testing mechanism 30 during the test. Even a slight deviation may cause poor electrical contact, thereby affecting the accuracy of the test data. As Figure 1 and Figure 2 shown, the bracket 50 is fixedly installed on the test board 31, and its position is aligned with the lifting mechanism to ensure that the packaging module always remains in the specified position during the placement process. The receiving groove is precisely designed according to the shape and size of the packaging module, enabling the packaging module to be firmly embedded therein and preventing displacement caused by external forces or vibrations during the test.

[0048] The bracket 50 is fixed above the test board 31 by a reliable mechanical method, usually connected by screws or welding, etc., to ensure that it will not loosen or fall off during long-term use. The design of the bracket 50 should fully consider the shape and size of the packaging module. Its size and shape are precisely measured and processed to ensure that the packaging module can fit tightly. The connecting part of the bracket 50 and the test board 31 has high rigidity and can withstand the pressure and impact that may occur during the test, maintaining the stable positioning of the packaging module.

[0049] When the packaging module is placed in the testing device, the operator only needs to place it in the receiving groove to ensure its accurate docking with the probe or connector of the testing mechanism 30. The physical constraint provided by the bracket 50 can effectively prevent any displacement of the packaging module during the test, ensuring the consistency and repeatability of the test operation. In combination with the lifting mechanism, the bracket 50 can further ensure the accuracy of its positioning and the stability of the electrical connection when the packaging module is pressed down.

[0050] In summary, by installing the bracket 50 on one side of the test board 31 close to the lifting mechanism and designing a structure with a matching receiving groove, accurate positioning of the packaging module can be achieved. This design can not only enhance the stability and reliability of the testing process, but also simplify the operation steps, improve the testing efficiency and the overall performance of the packaging module testing device.

[0051] Optionally, the lifting mechanism includes a driving component 21 installed on the test seat 10 and a lifting plate 22 drivingly connected to the driving component 21. The driving component 21 cooperates with the test mechanism 30 via the lifting plate 22 to clamp the packaging module.

[0052] Specifically, as Figure 1 shown, the driving component 21 transmits mechanical power to cause the lifting plate 22 to move vertically along a set path. The driving component 21 can adopt various forms, such as motor drive, pneumatic system, hydraulic device or manual operation, etc., and is selected according to specific application requirements. The lifting plate 22 serves as the direct force-receiving part of the driving component 21 and undergoes precise vertical displacement through a tight connection with the driving component 21. This displacement can ensure that the packaging module can be firmly clamped between the test mechanism 30 and the lifting plate 22 during the testing process, thereby achieving reliable electrical connection.

[0053] The lifting plate 22 and the driving component 21 are tightly connected by integral molding, screws, hinges or other mechanical connection methods, enabling it to perform smooth lifting and lowering movements under the action of the driving component 21. The lower surface of the lifting plate 22 usually has a flat or adapted clamping structure to ensure that the packaging module can be evenly stressed when being pressed, and will not be damaged or have poor electrical connection due to uneven pressure. At the same time, the driving component 21 is firmly connected to the test seat 10 to provide stable support and ensure the accuracy of the lifting movement.

[0054] When the driving component 21 is activated, the lifting plate 22 starts to descend and gradually applies pressure to the packaging module, pressing it against the fixed test mechanism 30. This process ensures that the pins or contact points of the packaging module can accurately contact the probe group 32 or the connector of the test mechanism 30, thereby achieving electrical connection. By adjusting the force of the driving component 21 and the movement range of the lifting plate 22, the operator can precisely control the clamping force to adapt to different specifications and types of packaging modules.

[0055] Generally speaking, the use of the driving component 21 makes the movement of the lifting plate 22 stable and controllable, which can improve the testing accuracy. Secondly, the design of the lifting plate 22 enables the packaging module to be evenly stressed, thus avoiding physical damage or poor electrical contact caused by improper clamping.

[0056] Optionally, the driving assembly 21 includes a handle 211, a first connecting rod 212 and a second connecting rod 213, one end of the handle 211 is rotatably connected to the test seat 10, the other end of the handle 211 is rotatably connected to the first connecting rod 212, the end of the first connecting rod 212 away from the handle 211 is rotatably connected to the second connecting rod 213, and the end of the second connecting rod 213 away from the first connecting rod 212 is drivingly connected to the lifting plate 22.

[0057] Specifically, Figure 1 As shown, one end of the handle 211 is connected to the test seat 10 through a hinge structure, so that it can rotate around a fixed point. The other end of the handle 211 is hinged to the first connecting rod 212 to form a flexible mechanical connection. The other end of the first connecting rod 212 is connected to the second connecting rod 213 through a hinge to ensure that the movement between the two can be transmitted to each other. The other end of the second connecting rod 213 is directly driven and connected to the lifting plate 22 to form a complete mechanical transmission chain. The handle 211 and the first connecting rod 212 constitute a typical two-link mechanism. The design of this two-link mechanism has the function of converting the form of motion, and can accurately convert the rotational motion of the handle 211 into linear motion.

[0058] When the handle 211 is operated, the handle 211 rotates around the hinge point of the test seat 10, and this rotational motion is transmitted to the second link 213 through the first link 212. Due to the hinged connection between the first link 212 and the second link 213, the rotational motion of the handle 211 is effectively converted into the linear motion of the second link 213. Finally, the second link 213 drives the lifting plate 22 to perform corresponding lifting actions, thereby clamping or releasing the packaging module. By adjusting the rotation amplitude of the handle 211, the moving distance of the lifting plate 22 can be flexibly controlled to adapt to packaging modules of different sizes and shapes.

[0059] In general, through the design of the connecting rod mechanism, the simple operation of the handle 211 is amplified and transmitted to the lifting plate 22, so that the lifting mechanism and the testing mechanism 30 can stably and controllably clamp the packaging module. This conversion mechanism can not only improve the operational flexibility of the driving assembly 21, but also increase the efficiency of the mechanical transmission, ensure the smoothness and precision of the action, and thus improve the reliability and usability of the entire packaging module testing device.

[0060] Optionally, the lifting mechanism further includes a reset member installed between the driving assembly 21 and the lifting plate 22 , and the reset member is used to provide a reset force so that the packaging module has a tendency to move in a direction away from the testing mechanism 30 .

[0061] Specifically, the reset member is installed between the driving assembly 21 and the lifting plate 22, and effective control of the lifting plate 22 is achieved through a reasonable mechanical layout. The reset member is usually fixed to the bottom or side of the lifting plate 22 and connected to the relevant part of the driving assembly 21. The design of this structural connection needs to ensure that the reset member does not affect the normal movement trajectory of the lifting plate 22 while applying the reset force. Therefore, the installation position and method of the reset member are usually precisely calculated and adjusted to ensure that it can provide a stable reset force without interfering with the normal operation of other components.

[0062] The reset member provides a stable elastic or mechanical force to ensure that the lifting plate 22 can automatically return to its initial position after the downward pressing action is completed. This reset force can be achieved by a spring, a cylinder or other elastic element. When the drive component 21 pushes the lifting plate 22 to move downward to clamp the packaging module, the reset member is in a compressed state and stores elastic potential energy. When the test is completed, the drive component 21 stops applying downward pressure, and the reset member releases its stored energy, quickly pushing the lifting plate 22 back to the initial position, thereby disengaging the packaging module from the testing mechanism 30. The effect of this force enables the packaging module to quickly detach from the test probe after the test is completed, avoiding signal interference or test errors that may be caused by long-term contact. At the same time, this design can also effectively prevent the displacement or shaking of the packaging module due to inertia or external force during the test process, thereby ensuring the accuracy of the test.

[0063] In summary, the reset element in the lifting mechanism is a key component, which ensures the position stability of the packaging module during the test and the rapid reset after the test is completed by providing a stable reset force.

[0064] Optionally, the packaging module testing device further includes a guide sleeve 60 mounted on the test socket 10 , and the guide sleeve 60 is sleeved on the outer circumference of the second connecting rod 213 .

[0065] Specifically, Figure 1 As shown, the second connecting rod 213 performs reciprocating linear motion under the action of the handle 211, and the presence of the guide sleeve 60 ensures that the trajectory of this motion remains on a predetermined straight line to avoid lateral deviation caused by external force or other factors. The guide sleeve 60 is firmly mounted on a suitable position of the test seat 10 by screws, welding or other fixing methods to ensure that it will not be displaced or loosened during mechanical movement. The solid structure of the test seat 10 can provide a stable support base for the guide sleeve 60, thereby further enhancing the guiding accuracy and the overall stability of the system. Through this structural design, the guide sleeve 60 plays a role of stable and precise guidance in the entire test process, which can avoid inaccurate testing or mechanical jamming problems caused by motion deviation.

[0066] Meanwhile, the inner diameter size of the guiding sleeve 60 should be precisely calculated and processed to form a tight fit with the outer diameter of the second connecting rod 213, ensuring that the second connecting rod 213 is neither affected by excessive frictional resistance nor generates excessive clearance resulting in wobbling during linear motion, thereby achieving precise control of the motion direction and ensuring that the second connecting rod 213 maintains smooth linear motion during the driving process.

[0067] In summary, the setting of the guiding sleeve 60 can not only improve the accuracy of motion but also effectively prevent mechanical wear and test errors caused by motion deviation, thereby enhancing the accuracy of the test.

[0068] Optionally, the encapsulation module testing device further includes a guiding rod 70 installed on the test seat 10. The lifting plate 22 is slidably connected to the test seat 10 via the guiding rod 70, and the driving assembly 21 drives the lifting plate 22 to move axially along the guiding rod 70.

[0069] Specifically, as Figure 1 shown, in order to ensure that the lifting plate 22 can achieve smooth and precise linear motion, a key component - the guiding rod 70 is introduced. The presence of the guiding rod 70 effectively controls and limits the motion trajectory of the lifting plate 22, ensuring that it can maintain stable linear motion in a specific direction.

[0070] The guiding rod 70 is firmly fixed to the corresponding position of the test seat 10 by means of screws, buckles or welding, etc., forming a stable and solid support system. The lifting plate 22 is connected to the guiding rod 70 through sliders, sleeves or other sliding components to form a sliding fit relationship, enabling the lifting plate 22 to freely move axially along the guiding rod 70, ensuring that the lifting plate 22 does not deviate from the predetermined trajectory during motion and avoiding motion deviation caused by lateral forces or other factors. In actual design, the material of the guiding rod 70 is usually selected as a high-strength, low-friction coefficient metal or composite material to ensure its good guiding performance during long-term use while reducing frictional wear. The design of the guiding rod 70 usually also needs to consider the tightness of the sliding connection with the lifting plate 22, ensuring both smooth sliding without obstruction and preventing excessive clearance from causing wobbling or deviation of the lifting plate 22.

[0071] During the testing process, the driving component 21 pushes or pulls the lifting plate 22 to make it perform precise linear motion along the axial direction of the guiding rod 70. The guiding rod 70 plays a crucial role in this process. It can not only provide physical constraints in the direction of motion but also ensure the smoothness and continuity of the motion through its sliding connection with the lifting plate 22. The force of the driving component 21 is transmitted to the encapsulation module through the lifting plate 22, while the guiding rod 70 ensures that this force transmission process will not be affected by motion deviation, thus guaranteeing a reliable electrical connection between the encapsulation module and the testing mechanism 30.

[0072] In summary, as an important structural component in the encapsulation module testing device, the guiding rod 70 ensures the stability and accuracy during the testing process through its precise guiding and supporting effects on the motion of the lifting plate 22.

[0073] The above are only the preferred embodiments of the present application and are not used to limit the present application. For those skilled in the art, various changes and modifications can be made to the present application. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included within the protection scope of the present application.

Claims

1. An encapsulation module testing device, characterized in that, The invention comprises a test seat (10), a lifting mechanism installed on the test seat (10), and a test mechanism (30) detachably installed on the test seat (10); a packaging module is placed between the lifting mechanism and the test mechanism (30); and the lifting mechanism cooperates with the test mechanism (30) to clamp the packaging module so that the packaging module is electrically connected to the test mechanism (30).

2. The encapsulation module testing device according to claim 1, wherein The testing mechanism (30) comprises a testing board (31) mounted on the testing seat (10) and a probe group (32) fixed to the testing board (31), wherein the probe group (32) contacts the pins of the packaging module.

3. The encapsulation module testing device according to claim 2, wherein The package module testing device further comprises at least two supporting legs (40) mounted on the test seat (10), and the test board (31) is mounted on the test seat (10) via the supporting legs (40).

4. The encapsulation module testing device according to claim 2 or 3, characterized in that The packaging module testing device further comprises a bracket (50) installed on a side of the testing board (31) close to the lifting mechanism, and the bracket (50) has a receiving groove for matching with the packaging module.

5. The encapsulation module testing device according to any one of claims 1-3, characterized in that The lifting mechanism comprises a driving component (21) installed on the test seat (10) and a lifting plate (22) drivingly connected to the driving component (21); the driving component (21) cooperates with the test mechanism (30) to clamp the packaging module via the lifting plate (22).

6. The encapsulation module testing device according to claim 5, characterized in that, The driving assembly (21) comprises a handle (211), a first connecting rod (212) and a second connecting rod (213); one end of the handle (211) is rotatably connected to the test seat (10); the other end of the handle (211) is rotatably connected to the first connecting rod (212); one end of the first connecting rod (212) facing away from the handle (211) is rotatably connected to the second connecting rod (213); and one end of the second connecting rod (213) facing away from the first connecting rod (212) is drivingly connected to the lifting plate (22).

7. The encapsulation module testing device according to claim 6, wherein The packaging module testing device further comprises a guide sleeve (60) mounted on the test seat (10), and the guide sleeve (60) is sleeved on the outer circumference of the second connecting rod (213).

8. The encapsulation module testing device according to claim 5, wherein The packaging module testing device also includes a guide rod (70) installed on the test seat (10), the lifting plate (22) is slidably connected to the test seat (10) via the guide rod (70), and the driving component (21) drives the lifting plate (22) to move axially along the guide rod (70).

9. The encapsulation module testing device according to claim 2 or 3, wherein The testing mechanism (30) further comprises a testing instrument, wherein the testing instrument is electrically connected to the probe set (32).

10. The encapsulation module testing device according to claim 5, characterized in that, The lifting mechanism further comprises a reset member installed between the driving assembly (21) and the lifting plate (22), the reset member being used to provide a reset force so that the packaging module has a tendency to move in a direction away from the testing mechanism (30).

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