Circuit board assembly aging measurement system
Through integrated matrix test boards and relay matrix boards, multi-channel parallel testing is realized, solving the problem of large size and high cost of aging test equipment in existing circuit board components, and achieving low-cost, miniaturization and automation testing effects.
Patent Information
- Application Number
- CN202422041685.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-22
- Publication Date
- 2025-07-04
- Estimated Expiration
- 2034-08-22
AI Technical Summary
The aging test equipment for existing circuit board components has a huge hardware, large size, high cost, and complex operation, making it difficult to meet the testing needs of low-cost, miniaturization and automation.
Matrix test board and relay matrix board are adopted, and communication modules, MCUs, test channel interfaces, etc. are integrated to realize multi-channel parallel testing, combining bus design and security protection circuits, reducing hardware costs and improving testing efficiency.
It realizes miniaturized and low-cost automated testing, improves testing efficiency and safety, facilitates maintenance, and simplifies operational processes.
Smart Images

Figure CN223065449U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of circuit board testing, in particular to an aging measurement system for a circuit board assembly. Background Art
[0002] At present, most of the tests of intelligent test terminals for PCBA (Printed Circuit Board Assembly) are functional tests and aging tests. When conducting aging tests, electrical (voltage, current, resistance, keys, components, circuits, etc.) related tests need to be carried out on the PCBA to determine whether the PCBA to be tested is normal.
[0003] Currently, such tests in the market are all sets of equipment and instruments, with a large number of hardware components and a large number of hardware channels, resulting in a large volume. Moreover, the test process is complex, the instrument price is expensive, and the large hardware system makes it not easy for operators to operate, and it is impossible to quickly maintain when problems occur in the test machine.
[0004] The hardware system required for multi-channel aging tests is huge and not integrated. The equipment used has a large volume and high cost. Coupled with the corresponding increase in labor costs, it is increasingly unable to meet the demand for low-cost and small-volume automated measurement equipment. Summary of the Utility Model
[0005] The purpose of the utility model is to provide an aging measurement system for a circuit board assembly to solve the problems raised in the above background art.
[0006] To achieve the above purpose, the utility model provides the following technical solution: An aging measurement system for a circuit board assembly, including a matrix test board. The matrix test board is electrically connected with a power module, and a communication module, an MCU, a test channel interface, and a measuring instrument interface module are welded on the matrix test board. The power module supplies power to the MCU and the matrix test board, and can provide various sizes of circuits for the matrix test board to ensure the stable operation of the matrix test board.
[0007] Signal transfer pins. The signal transfer pins are electrically connected with a signal channel switching board, a display screen switching board, and a power supply switching board. The signal channel switching board, the display screen switching board, and the power supply switching board are electrically connected with a relay matrix board. The relay matrix board is electrically connected with the matrix test board. Using the relay matrix board can connect multiple test points at one time to achieve multi-channel parallel testing, thereby significantly improving the test efficiency and saving test time.
[0008] Further, a decoding module, a driving module, and a relay matrix module are sequentially soldered on the matrix test board card, and the decoding module, the driving module, and the relay matrix module are located between the MCU and the test channel interface, and the measuring instrument interface module is electrically connected to the relay matrix module.
[0009] Further, the power module includes a power conversion IC and a voltage regulator. The model of the power conversion IC is L7805, and the model of the voltage regulator is AMS1117-3.3. The driving module includes a driving module IC, and the model of the driving module IC is ULN2803. The test channel interface includes a relay matrix and a 34-pin header interface, and the model of the MCU is 74HCT244D.
[0010] Compared with the prior art, the beneficial effects of the present utility model are as follows:
[0011] (1) The communication module, the measuring instrument interface module, the MCU, the decoding module, the driving module, the relay matrix module, and the test channel interface are all integrated on the matrix test board card, with high integration, greatly reducing the space occupied by the test system, having low cost, and meeting the requirements of miniaturization and automated testing.
[0012] (2) The 4-channel parallel test system has a streamlined design, which can further reduce the manufacturing cost of the test fixture. The power supply part has a safety protection circuit design, which can greatly improve safety and prevent operators from being electrocuted and injured.
[0013] (3) The hardware cost of 64 channels is reduced to the lowest, and combined with the matrix test board card, it can flexibly complete the function test and aging test of each channel. The simple channel design also facilitates subsequent maintenance work;
[0014] (4) The entire circuit uses a bus design, which is convenient to check, facilitating engineers to debug and verify. The general upper computer software and the industrial computer issue commands to control the system operation, with a visual operation interface, facilitating operators to operate. Description of the Drawings
[0015] Figure 1 It is the principle block diagram of the matrix test board card of the present utility model;
[0016] Figure 2 It is the circuit block diagram of the matrix test board card of the present utility model;
[0017] Figure 3 It is the test flow block diagram of the present utility model;
[0018] Figure 4 It is the circuit diagram of the matrix test board card of the present utility model;
[0019] Figure 5 This is the circuit diagram of the decoding module of the present utility model;
[0020] Figure 6 This is the circuit diagram of the driving module of the present utility model.
[0021] In the figure: 100, matrix test board; 1, power supply module; 2, communication module; 3, measuring instrument interface module; 4, MCU; 5, decoding module; 6, driving module; 7, relay matrix module; 8, test channel interface; 9, power conversion IC; 10, voltage regulator; 11, driving module IC; 12, UART to USB module; 13, relay matrix; 14, 34pin horn interface; 15, signal transfer pin; 16, signal channel switching board; 17, display screen switching board; 18, power supply switching board; 19, relay matrix board. Detailed implementation manners
[0022] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without creative efforts shall fall within the protection scope of the present utility model.
[0023] Embodiment:
[0024] Please refer to Figure 1-6 , the present utility model provides a technical solution: a circuit board assembly aging measurement system, including a matrix test board 100, and the matrix test board 100 serves as the matrix board of the measurement PCBA fixture;
[0025] The matrix test board 100 is electrically connected to a power supply module 1, and the matrix test board 100 is welded with a communication module 2, an MCU 4, a test channel interface 8, and a measuring instrument interface module 3. The power supply module 1 supplies power to the MCU 4 and the matrix test board 100;
[0026] The power supply module 1 is a DC power supply, inputting a 12V power supply DC to DC, and converting it into multiple voltages such as 5V and 3.3V through low-dropout linear voltage regulation to supply power to the matrix test board 100;
[0027] A signal transfer pin 15, the signal transfer pin 15 is electrically connected to a signal channel switching board 16, a display screen switching board 17, and a power supply switching board 18. The signal channel switching board 16, the display screen switching board 17, and the power supply switching board 18 are electrically connected to a relay matrix board 19, and the relay matrix board 19 is electrically connected to the matrix test board 100.;
[0028] The signal transfer pin 15 is connected to the UUT (Unit Under Test). The main function of the signal channel switching board 16 is to switch the signal channels between the circuit board and the UUT under different test stages or test requirements. Through the signal channel switching board 16, the circuit path to be tested can be flexibly selected to achieve multi-functional and multi-channel testing of the circuit board;
[0029] The display switching board 17 is used to connect and switch different displays or display devices so as to display information such as the working state and test data of the circuit board in real time during the test process;
[0030] The power supply switching board 18 is used to control different power supplies required by the circuit board during the test process. It can switch different power supply voltages, currents and other parameters according to the test requirements to ensure that the UUT is tested under suitable power supply conditions.
[0031] In this embodiment, as Figure 1 shown, the matrix test board 100 is sequentially welded with a decoding module 5, a driving module 6, and a relay matrix module 7. The decoding module 5, the driving module 6, and the relay matrix module 7 are located between the MCU 4 and the test channel interface 8, and the measuring instrument interface module 3 is electrically connected to the relay matrix module 7;
[0032] The main function of the decoding module 5 is to decode the instructions or signals sent by the MCU 4 and convert them into a signal format that the driving module 6 and the relay matrix module 7 can understand; in the aging test, the decoding module 5 can ensure that the instructions of the MCU 4 are accurately transmitted to the subsequent modules, thereby controlling the operation of the test system;
[0033] The main function of the driving module 6 is to receive the signal output by the decoding module 5 and amplify or convert it into a signal that can drive the relay matrix module 7 to work;
[0034] The advantage of the relay matrix module 7 lies in its flexibility and scalability. By increasing or decreasing the number of relays, the number and layout of test channels can be easily adjusted to meet the test requirements of UUTs of different scales and complexities.
[0035] In this embodiment, the power supply module 1 includes a power conversion IC 9 and a voltage regulator 10. The model of the power conversion IC 9 is L7805, and the model of the voltage regulator 10 is AMS1117-3.3.
[0036] In this embodiment, the driving module 6 includes a driving module IC 11, and the model of the driving module IC 11 is ULN2803.
[0037] In this embodiment, as Figure 2As shown, the communication module 2 includes a UART to USB module 12. The main function of the UART to USB module 12 is to convert the UART interface into a USB interface for data exchange through the USB interface.
[0038] In this embodiment, as Figure 2 shown, the test channel interface 8 includes a relay matrix 13 and a 34-pin header interface 14.
[0039] In this embodiment, the model of the MCU 4 is 74HCT244D.
[0040] Specifically, during use, place the Rack (test rack) required for testing in the incubator. The incubator is used to simulate various temperature environments that the UUT may encounter to accelerate the aging process. Place the UUT to be tested on the Tray (tray). Put the Tray into the designated position of the Rack and ensure that the upper cover plate is pressed in place so that the bottom probes are in full contact with the test points of the UUT. These probes are used to establish electrical connections for testing.
[0041] The IPC (industrial computer) establishes a connection with the matrix test board 100 in the cabinet through serial communication and sends test commands. After receiving the command, the matrix test board 100 analyzes which Slot (slot or position) the UUT is on. The matrix test board 100 turns on the power bus, signal bus, and communication bus at this position through the relay. The activation of these buses enables the UUT to receive the necessary power, signals, and establish communication with the test system.
[0042] The upper computer (i.e., the test software on the IPC) enters the test process and starts to execute the preset test sequence. During the test process, the incubator starts to perform high and low temperature changes to simulate the operating conditions of the UUT at different temperatures. Measuring instruments such as multimeters read various parameters of the UUT (such as voltage, current, resistance, etc.) in real time and compare the read values with the parameter standards designed for the UUT. This step is used to evaluate whether the performance of the UUT meets the requirements.
[0043] Although the embodiments of the present invention have been shown and described, for those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principles and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.
Claims
1. A circuit board assembly aging measurement system, characterized in that, Including: A matrix test board card (100), on which a power module (1) is electrically connected. The matrix test board card (100) is welded with a communication module (2), an MCU (4), a test channel interface (8), and a measuring instrument interface module (3). The power module (1) supplies power to the MCU (4) and the matrix test board card (100). Signal transfer pins (15), which are electrically connected to a signal channel switching board card (16), a display screen switching board card (17), and a power supply switching board card (18). The signal channel switching board card (16), the display screen switching board card (17), and the power supply switching board card (18) are electrically connected to a relay matrix board card (19), and the relay matrix board card (19) is electrically connected to the matrix test board card (100).
2. The aging measurement system for a circuit board assembly according to claim 1, characterized in that: The matrix test board card (100) is also welded with a decoding module (5), a driving module (6), and a relay matrix module (7) in sequence. The decoding module (5), the driving module (6), and the relay matrix module (7) are located between the MCU (4) and the test channel interface (8). The measuring instrument interface module (3) is electrically connected to the relay matrix module (7).
3. The aging measurement system for a circuit board assembly according to claim 1, wherein: The power module (1) includes a power conversion IC (9) and a voltage regulator (10). The model of the power conversion IC (9) is L7805, and the model of the voltage regulator (10) is AMS1117-3.
3.
4. A circuit board component aging measurement system according to claim 2, characterized in that: The driving module (6) includes a driving module IC (11), and the model of the driving module IC (11) is ULN2803.
5. The aging measurement system for a circuit board assembly according to claim 1, characterized in that: The communication module (2) includes a UART to USB module (12).
6. The aging measurement system for a circuit board assembly according to claim 1, wherein: The test channel interface (8) includes a relay matrix (13) and a 34-pin horn interface (14).
7. The aging measurement system for a circuit board assembly according to claim 1, wherein: The model of the MCU (4) is 74HCT244D.