High-phase-consistency microwave 25-path power divider
By using polytetrafluoroethylene material and metal box-enclosed circuit board design, combined with λ/4 and λ/2 transmission lines and resistors, the problems of large size, large loss and poor phase consistency of microwave power dividers are solved, and a microwave power divider design with high phase consistency and low loss is achieved.
Patent Information
- Application Number
- CN202422347433.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-26
- Publication Date
- 2025-07-04
- Estimated Expiration
- 2034-09-26
AI Technical Summary
The existing microwave power dividers have problems such as large size, large loss, and poor amplitude and phase consistency of each channel.
The circuit board is made of polytetrafluoroethylene material with a small dielectric loss angle, and transmission lines and vias are electroplated on the outer wall of the circuit board. Combined with λ/4 transmission lines, λ/2 transmission lines and resistors, the circuit board is embedded with a ground layer and is closed with a metal box to form a high-phase consistency microwave 25-way power divider.
It reduces signal energy loss, improves signal transmission stability and phase consistency, has the characteristics of small structure and excellent performance, and is suitable for a variety of environments.
Smart Images
Figure CN223066442U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the technical field of power splitter preparation, and particularly relates to a 25-way microwave power splitter with high phase consistency. Background Art
[0002] A power splitter is an important electronic component, mainly used to divide the energy of an input signal into two or more output signals with equal or unequal energy, or conversely, to combine the energy of multiple signals into one output, in which case it can be called a combiner. The following is a detailed introduction to the power splitter: The power splitter usually consists of a group of couplers, delay lines and other components. Among them, the coupler plays the role of distributing the input signal to multiple output ports, while the delay line is used to adjust the phase difference between the output ports to ensure the accuracy and stability of signal distribution. According to different structural forms, the power splitter can be divided into microstrip power splitter, waveguide power splitter, coaxial power splitter, etc.
[0003] A power divider is a device that divides the energy of an input signal into two or more output signals, or conversely, combines the energy of multiple signals into one output, in which case it can also be called a combiner. Microwave power splitters are power distribution and power synthesis devices that are widely used in the microwave radio frequency field at present. In order to obtain higher synthesis efficiency, the amplitude and phase consistency of each path of the power divider and synthesizer must be very good, and it is required to have low loss and a compact structure. At present, the multi-stage unequal division method is adopted, but this method has a large volume, large loss, poor amplitude consistency of each path, and poor phase consistency. Summary of the Utility Model
[0004] The purpose of the utility model is to provide a 25-way microwave power splitter with high phase consistency, aiming to solve the problems raised in the background art.
[0005] A 25-way microwave power splitter with high phase consistency includes
[0006] A circuit board;
[0007] A plurality of vias are formed on the outer wall of the circuit board, and transmission lines, λ / 4 transmission lines and λ / 2 transmission lines are electroplated on the outer wall of the circuit board. One end of the transmission line is electrically connected to one end of five λ / 4 transmission lines. One end of each λ / 4 transmission line far from the transmission line is electrically connected to one side of the via, and the other side of the via is electrically connected to the λ / 2 transmission line. A resistor is fixedly arranged on the outer wall of the circuit board, and one of the λ / 2 transmission lines is electrically connected to the remaining λ / 2 transmission lines through the resistor.
[0008] Furthermore, a conduction layer is electroplated on the inner wall of the via.
[0009] Furthermore, a grounding layer is embedded at the center of the inner wall of the circuit board.
[0010] Furthermore, the circuit board is made of polytetrafluoroethylene.
[0011] Furthermore, a plug is fixedly arranged on the outer wall of the circuit board.
[0012] Furthermore, a metal box body is sleeved on the outer wall of the circuit board.
[0013] Compared with the prior art, the beneficial effects of the present utility model are as follows:
[0014] Since the circuit board 1 is made of polytetrafluoroethylene material with a smaller dielectric loss angle, it can reduce the energy loss of the transmitted signal. The circuit board is enclosed by a metal box body, which can better shield external radiation. It has the advantages of simple processing, no need for debugging, small size, and excellent performance, and is also applicable to any one-way power divider. BRIEF DESCRIPTION OF THE DRAWINGS
[0015] The drawings are used to provide a further understanding of the present utility model and constitute a part of the specification. Together with the embodiments of the present utility model, they are used to explain the present utility model, but do not constitute a limitation to the present utility model. In the drawings:
[0016] Figure 1 is the front view of the present utility model;
[0017] Figure 2 is the enlarged schematic view of A of the present utility model;
[0018] Figure 3 is the cross-sectional view of the via of the present utility model.
[0019] In the figure: 1, circuit board; 2, transmission line; 3, λ / 4 transmission line, 4; via, 5; λ / 2 transmission line; 6, resistor; 7, grounding layer; 8, plug; 401 conduction layer. DETAILED DESCRIPTION OF THE EMBODIMENTS
[0020] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present utility model.
[0021] In the description of the present utility model, it should be noted that the orientation or positional relationship indicated by the terms "upper", "lower", "inner", "outer", "top / bottom end", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation to the present utility model. In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance.
[0022] In the description of the present utility model, it should be noted that unless otherwise clearly specified and defined, the terms "installation", "provided with", "sheathed / connected", "connection", etc. shall be understood in a broad sense. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.
[0023] Please refer to Figures 1-3 , the technical solution provided by this embodiment is as follows:
[0024] A 25-way microwave power divider with high phase consistency, including
[0025] a circuit board 1;
[0026] A plurality of vias 4 are provided on the outer wall of the circuit board 1. A transmission line 2, a λ / 4 transmission line 3 and a λ / 2 transmission line 5 are electroplated on the outer wall of the circuit board 1. One end of the transmission line 2 is electrically connected to one end of five λ / 4 transmission lines 3. One end of each λ / 4 transmission line 3 away from the transmission line 2 is electrically connected to one side of the via 4, and the other side of the via 4 is electrically connected to the λ / 2 transmission line 5. A resistor 6 is fixedly provided on the outer wall of the circuit board 1. One of the λ / 2 transmission lines 5 is electrically connected to the remaining λ / 2 transmission lines 5 through the resistor 6.
[0027] In a specific embodiment of the present utility model, the circuit board 1 is made of polytetrafluoroethylene material with a small dielectric loss angle, which can reduce the energy loss of the transmitted signal. The circuit board is enclosed by a metal box body, which can better shield external radiation. It has the advantages of simple processing, no need for debugging, small structure, and excellent performance. It is also applicable to any one-way power divider. The transmission line 2 is connected to multiple groups of λ / 4 transmission lines 3 and outputs through the transmission line 2. Through holes 4 are provided on the λ / 4 transmission lines 3. The λ / 4 transmission lines 3 are connected to the λ / 2 transmission lines 5 through the through holes 4. The λ / 2 transmission lines 5 are all connected through the resistors 6. A grounding layer is provided in the middle layer of the circuit board. The present invention also has the advantages of simple processing, no need for debugging, small structure, and excellent performance. It is a device that divides the energy of one input signal into multiple output signal energies, and can also combine multiple input signal energies into one output signal energy in reverse.
[0028] Specifically, a conduction layer 401 is electroplated on the inner wall of the through hole 4.
[0029] In a specific embodiment of the present utility model, the coating material inside the through holes of the circuit board is mainly copper. In the manufacturing of multi-layer PCBs (Printed Circuit Boards), the through-hole structure is crucial because it connects traces, pads, and polygons on different layers of the PCB. Whether the through hole is a through-hole (connecting the outer layer and passing through the entire circuit board), a blind hole (connecting the outer layer to the inner layer), or a buried hole (connecting the inner layer but not the outer layer), copper plating is required inside the through hole to form a reliable electrical connection.
[0030] Specifically, a grounding layer 7 is embedded at the center of the inner wall of the circuit board 1.
[0031] In the specific embodiments of the present utility model, the benefits of embedding a grounding layer 7 at the center of the inner wall of the circuit board 1 are mainly reflected in the following aspects: Voltage return: Most components on the circuit board are connected to the power network. The grounding layer provides a low-impedance voltage return path for these components, which helps to stabilize the voltage and prevent the impact of voltage fluctuations on the circuit performance. Signal return: For high-speed signal transmission, a clear signal return path is crucial. The grounding layer can ensure a stable reference level for the signal during transmission, reduce crosstalk and reflection between signals, thereby improving signal integrity. Noise reduction: As the signal speed increases, the switching states of digital circuits change frequently, easily generating noise pulses. The grounding layer has a large conductive area and low impedance, which can effectively absorb and disperse these noise pulses and reduce their interference with other parts of the circuit. Electromagnetic shielding: The grounding layer can also act as an electromagnetic shielding layer to prevent external electromagnetic radiation from interfering with the circuit board, and at the same time reduce the radiation leakage of internal signals on the circuit board to the outside. Heat conduction: The grounding layer is usually made of metal (such as copper) and has good heat conduction performance. When some components on the circuit board generate heat, the grounding layer can help quickly conduct the heat to other parts of the circuit board or external heat dissipation devices, thereby maintaining the overall temperature stability of the circuit board. Enhanced structural strength: The grounding layer is located at the center of the inner wall of the circuit board, which can enhance the overall structural strength of the circuit board and make it more durable. Circuit protection: The grounding layer can also serve as a protective barrier for the internal circuit of the circuit board to prevent damage to the internal circuit caused by external impact and vibration.
[0032] Specifically, the material of the circuit board 1 is polytetrafluoroethylene.
[0033] In the specific embodiments of the present utility model, the selection of polytetrafluoroethylene (PTFE) as the material of the circuit board 1 has many significant benefits, which are mainly reflected in the following aspects:
[0034] Stable operating temperature: PTFE circuit boards can operate stably for a long time at temperatures up to 260°C to 280°C without melting, deforming or degrading. This high-temperature tolerance makes it very suitable for electronic devices used in extremely high-temperature environments, such as circuit boards for aircraft and spacecraft, rocket engine control systems, etc. Corrosion resistance: PTFE is an inert substance and shows extremely strong resistance to most chemicals, including acids, alkalis, oxidants and reductants. Therefore, PTFE circuit boards can work for a long time in various harsh chemical environments without being corroded, thus ensuring the reliability and stability of the circuit. High electrical insulation strength: PTFE has extremely high electrical insulation strength and can resist the breakdown of high voltages, ensuring the safety of the circuit. Low dielectric constant and dielectric loss: Its dielectric constant is low and the dielectric loss is small, which helps to maintain the clarity and stability of the signal and is suitable for fields such as high-precision instrument equipment and precision measurement equipment. Water non-absorbency: PTFE circuit boards are a water-non-absorbent material, which can effectively prevent the infiltration of moisture and water, protect the components and circuits in the circuit board from being eroded by the humid environment, and thus extend the service life of the circuit board. High toughness and flexibility: PTFE maintains its toughness even at low temperatures and is not easily damaged. At the same time, it has a certain degree of flexibility, which is convenient for processing and installation. Aging resistance and weather resistance: It has excellent aging resistance and chemical stability, can resist the erosion of various environmental factors, and extends the service life of the circuit board. Non-flammability and low smoke generation: PTFE is not easily combustible and generates less smoke when burning, improving the safety of the circuit board in emergencies such as fires.
[0035] Specifically, a plug 8 is fixedly arranged on the outer wall of the circuit board 1.
[0036] In a specific embodiment of the present invention, the plug can facilitate stable external electrical connection.
[0037] Specifically, a metal box body is sleeved on the outer wall of the circuit board 1.
[0038] In a specific embodiment of the present invention, the circuit board is enclosed by a metal box body, which can better shield external radiation.
[0039] Working principle:
[0040] The circuit board 1 is made of polytetrafluoroethylene material with a small dielectric loss angle, which can reduce the energy loss of the transmitted signal. The circuit board is enclosed in a metal box, which can better shield external radiation. It has the advantages of simple processing, no debugging required, small size, and excellent performance. It is also applicable to any one-way power divider. The transmission line 2 is connected to multiple groups of λ / 4 transmission lines 3 and outputs through the transmission line 2. Through holes 4 are provided on the λ / 4 transmission lines 3, and the λ / 4 transmission lines 3 are connected to the λ / 2 transmission line 5 through the through holes 4. The λ / 2 transmission line 5 is all connected through the resistor 6. A grounding layer is provided in the middle layer of the circuit board. The present invention also has the advantages of simple processing, no debugging required, small size, and excellent performance. It is a device that divides the energy of one input signal into multiple signal energies for output, or conversely, synthesizes multiple signal energies into one output.
[0041] Finally, it should be noted that the above are only the preferred embodiments of the present utility model and are not used to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, for those skilled in the art, they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements for some of the technical features. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present utility model shall be included within the protection scope of the present utility model.
Claims
1. A 25-way microwave power divider with high phase consistency, characterized in that, including, a circuit board (1); a plurality of vias (4) are formed in the outer wall of the circuit board (1), a transmission line (2), a λ / 4 transmission line (3) and a λ / 2 transmission line (5) are electroplated on the outer wall of the circuit board (1), one end of the transmission line (2) is electrically connected to one end of five λ / 4 transmission lines (3), one end of each λ / 4 transmission line (3) far from the transmission line (2) is electrically connected to one side of the via (4), the other side of the via (4) is electrically connected to the λ / 2 transmission line (5), a resistor (6) is fixedly arranged on the outer wall of the circuit board (1), and one of the λ / 2 transmission lines (5) is electrically connected to the remaining λ / 2 transmission lines (5) through the resistor (6).
2. The high-phase-consistency microwave 25-way power divider according to claim 1, wherein A conduction layer (401) is electroplated on the inner wall of the via (4).
3. A high-phase-consistency microwave 25-way power divider according to claim 2, characterized in that, A ground layer (7) is embedded at the center of the inner wall of the circuit board (1).
4. The high-phase-consistency microwave 25-way power divider according to claim 3, wherein The circuit board (1) is made of polytetrafluoroethylene.
5. The high-phase-consistency microwave 25-way power divider according to claim 4, wherein A plug (8) is fixedly arranged on the outer wall of the circuit board (1).
6. The high-phase-consistency microwave 25-way power divider according to claim 5, characterized in that A metal box body is sleeved on the outer wall of the circuit board (1).