Laser die bonding patch and detection fixing clamp
By designing solid crystal patches and detection fixtures compatible with optical communication and gas sensing lasers, the problem of different fixtures is solved in different patch surfaces, and the effect of efficient solid crystal and detection is achieved.
Patent Information
- Application Number
- CN202422326200.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-23
- Publication Date
- 2025-07-04
- Estimated Expiration
- 2034-09-23
AI Technical Summary
In the prior art, lasers in the optical communication industry and gas sensing industry need to use different fixtures to fix different patch surfaces in the solidification process, resulting in inefficiency, and different fixtures are required for detection and sampling, which cannot be efficiently compatible.
A laser solid crystal patch and detection fixture are designed, including a chassis and material strips. The material strips can be installed horizontally or vertically to meet the chip surface needs of different lasers, compatible with solid crystal patches of optical communication and gas sensing lasers, and can detect the position accuracy of the patch and chip thrust.
It realizes solid crystal patches that are compatible with different lasers under the same fixture, improves efficiency, and can simultaneously detect patch position accuracy and chip thrust, simplifying the operation process.
Smart Images
Figure CN223066625U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of expansion modules, and particularly relates to a laser die bonding, chip mounting and detection fixture. Background Art
[0002] At present, during the packaging production process of lasers for the optical communication industry and lasers for gas sensing, a die bonding process is required. In the die bonding process, the bonding surface of the product needs to be fixed horizontally upward, and then the chip can be mounted by a die bonder. During the die bonding and chip mounting process, it is necessary to randomly test the accuracy of the chip mounting position and the chip thrust to ensure the product quality, and fixtures are also required to fix the product during this process. Although the laser products for the optical communication industry and the laser products for gas sensing use the same socket, their corresponding bonding surfaces are different. The former needs to perform die bonding and chip mounting in the 7° inclined groove of the socket, while the latter needs to perform die bonding and chip mounting on the side surface of the fan-shaped column of the socket. The included angle between the two bonding surfaces is 97°.
[0003] In the prior art, general fixtures can only fix one surface horizontally upward or fix the angle horizontally upward within 90° by flipping. Therefore, two different fixtures are often required for die bonding and chip mounting; generally, different fixtures are also needed to detect the accuracy of the chip mounting position and the chip thrust during the die bonding process. How to effectively improve the efficiency of chip mounting and detection is one of the technical problems urgently to be solved in this field. Accordingly, the utility model provides a new type of laser die bonding, chip mounting and detection fixture. Summary of the Utility Model
[0004] Based on the above description, the utility model provides a laser die bonding, chip mounting and detection fixture, which can be compatible with the fixing of die bonding and chip mounting on different bonding surfaces of sockets of laser products for the optical communication industry and laser products for gas sensing, and can also be used for fixing the accuracy of the chip mounting position and the chip thrust during the die bonding and chip mounting process of the product.
[0005] The technical solution for the utility model to solve the above technical problems is as follows:
[0006] The utility model provides a laser die bonding, chip mounting and detection fixture, including: a chassis and a strip;
[0007] The chassis is provided with a first mounting position and a second mounting position, and both the first mounting position and the second mounting position are used for fixing the strip;
[0008] The strip is provided with a strip body, a baffle, a fixing manganese sheet and a strong magnetic part; the fixing manganese sheet is arranged at the top of the strip body and is used for installing the product socket; the strong magnetic part is arranged at the bottom of the strip body and is used for adsorbing and fixing the product socket; the baffle is arranged at the bottom of the strip body;
[0009] When the strip is disposed at the first installation position, the strip is in a horizontal state relative to the chassis, so that the side surface of the fan-shaped column of the product socket is horizontally upward for die bonding, chip mounting and inspection of the optical communication laser;
[0010] When the strip is disposed at the second installation position, the strip is in a vertical state relative to the chassis, so that the 7° inclined groove of the product socket is horizontally upward for die bonding, chip mounting and inspection of the gas sensing laser.
[0011] On the basis of the above technical solutions, the present utility model can be further improved as follows.
[0012] Further, a first hole is provided at the top of the strip body, and a second hole is provided on the fixed manganese piece;
[0013] The first hole and the second hole are correspondingly arranged, and the first hole and the second hole are adapted to the installation position of the product socket.
[0014] Further, both the first hole and the second hole are multiple.
[0015] Further, when the strip is disposed at the first installation position, the back surface of the fan-shaped column of the product socket abuts against the edge of the chassis, so that the horizontal plane of the fan-shaped column is upward.
[0016] Further, the second installation position is a strip-shaped groove, and the bottom of the strip-shaped groove is provided with a slope of 7°.
[0017] Further, when the strip is disposed at the second installation position, the 7° inclined groove surface of the product socket is horizontal.
[0018] Further, the chassis is provided with a stop portion, and the strip body is provided with a protruding portion;
[0019] When the strip is in a horizontal state at the first installation position, the stop portion abuts against the protruding portion.
[0020] Further, the fixture further includes a first fastener;
[0021] The first fastener is disposed at the top of the strip body for connecting and fastening the fixed manganese piece and the strip body.
[0022] Further, the fixture further includes a second fastener;
[0023] The second fastener is disposed at the bottom of the strip body for connecting and fastening the baffle and the strip body.
[0024] Furthermore, there are multiple first mounting positions and multiple second mounting positions.
[0025] Compared with the prior art, the technical solution of the present application has the following beneficial technical effects:
[0026] The laser die bonding, chip mounting and detection fixture provided by the present utility model is provided with a chassis and a strip; there are two mounting methods for the strip, correspondingly, the chassis is provided with a first mounting position and a second mounting position, and both the first mounting position and the second mounting position are used to fix the strip; the strip is provided with a strip body, a baffle, a fixing manganese sheet and a strong magnetic part; the fixing manganese sheet is arranged on the top of the strip body and is used for mounting the product socket; the strong magnetic part can be selectively arranged at the bottom or side of the strip body and is used for adsorbing and fixing the product socket; the baffle is arranged at the bottom of the strip body; when the strip is arranged at the first mounting position, the strip is in a horizontal state relative to the chassis, so that the side of the fan-shaped column of the product socket is horizontally upward for die bonding, chip mounting and inspection of optical communication lasers; when the strip is arranged at the second mounting position, the strip is in a vertical state relative to the chassis, so that the 7° inclined groove of the product socket is horizontally upward for die bonding, chip mounting and inspection of gas sensing lasers. This laser die bonding, chip mounting and detection fixture can be compatibly applied to the fixing of different die bonding and chip mounting surfaces of product sockets of lasers in the optical communication industry and lasers for gas sensing, and can also be used for fixing the position accuracy of chip mounting and the chip thrust during the die bonding and chip mounting process of the product. Description of the Drawings
[0027] Figure 1 Schematic diagram of the horizontal mounting structure of the laser die bonding, chip mounting and detection fixture provided by the embodiment of the present utility model;
[0028] Figure 2 Cross-sectional schematic diagram of the horizontal mounting structure of the laser die bonding, chip mounting and detection fixture provided by the embodiment of the present utility model; Figure 3 Schematic diagram of the vertical mounting structure of the laser die bonding, chip mounting and detection fixture provided by the embodiment of the present utility model;
[0029] Figure 4 Cross-sectional schematic diagram of the vertical mounting structure of the laser die bonding, chip mounting and detection fixture provided by the embodiment of the present utility model;
[0030] Figure 5 Schematic diagram of the structure of the chassis provided by the embodiment of the present utility model;
[0031] Figure 6 Schematic diagram of the structure of the strip provided by the embodiment of the present utility model (one);
[0032] Figure 7 Schematic diagram of the structure of the strip provided by the embodiment of the present utility model (two);
[0033] Figure 8 Structural schematic diagram of the product socket provided by the embodiment of the present utility model;
[0034] In the attached drawings, the list of components represented by each reference numeral is as follows:
[0035] 1. Chassis; 11. First installation position; 12. Second installation position; 13. Stopping portion;
[0036] 2. Strip; 21. Strip body; 211. Protruding portion; 22. Baffle; 23. Fixed manganese sheet; 24. Strong magnetic part;
[0037] 3. Product socket; 31. Sector column; 32. 7° inclined groove. Detailed implementation manners
[0038] In the description of the present utility model, it should be noted that unless otherwise clearly defined and limited, terms such as "provided with", "connected", etc. should be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and can also be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific situations.
[0039] In the description of the present utility model, it should be understood that the terms such as "upper", "lower", "left", "right", etc. indicating the orientation or position relationship are based on the orientation or position relationship shown in the attached drawings, and are only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, specific orientation structure and operation. Therefore, it should not be construed as a limitation to the present utility model.
[0040] The terms "first" and "second" etc. are only used for distinguishing descriptions and cannot be understood as indicating or implying relative importance. In the description of the present utility model, unless otherwise stated, the meaning of "a plurality of" is two or more.
[0041] In order to make the purpose, technical solutions and advantages of the present utility model clearer, the technical solutions in the present utility model will be clearly and completely described below in conjunction with the attached drawings in the present utility model. Obviously, the described embodiments are part of the embodiments of the present utility model, rather than all of the embodiments. Based on the embodiments in the present utility model, all other embodiments obtained by those of ordinary skill in the art without making creative efforts belong to the scope of protection of the present utility model.
[0042] The following combines the attached Figures 1 to 8The following embodiments are used to further describe the implementation manners of the present utility model in detail. The following embodiments are used to illustrate the present utility model, but cannot be used to limit the scope of the present utility model.
[0043] As Figure 1 、 Figure 2 、 Figure 3 and Figure 4 shown, the laser die bonding, chip mounting and detection fixture provided by the embodiment of the present utility model specifically includes a chassis 1 and a strip 2.
[0044] The chassis 1 is provided with a first mounting position 11 and a second mounting position 12, and both the first mounting position 11 and the second mounting position 12 are used to fix the strip 2. In a preferred example, in order to improve the chip mounting efficiency, as Figure 4 shown, both the first mounting position 11 and the second mounting position 12 are multiple.
[0045] The strip 2 is provided with a strip body 21, a baffle 22, a fixed manganese sheet 23 and a strong magnetic part 24; the fixed manganese sheet 23 is arranged at the top of the strip body 21 and is used to mount the product socket 3; the strong magnetic part 24 is arranged at the bottom of the strip body 21 and is used to adsorb and fix the product socket 3; the baffle 22 is arranged at the bottom of the strip body 21.
[0046] As Figure 8 shown, the product socket 3 includes a sector column 31 and a 7° inclined groove 32, which are respectively used for die bonding, chip mounting and inspection of an optical communication laser and a gas sensing laser.
[0047] When the strip 2 is arranged at the first mounting position 11, as Figure 1 and Figure 5 shown, the strip 2 is in a horizontal state relative to the chassis 1, so that the side surface (horizontal plane) of the sector column 31 of the product socket 3 is horizontally upwardly arranged for die bonding, chip mounting and inspection of an optical communication laser.
[0048] When the strip 2 is arranged at the second mounting position 12, as Figure 3 、 Figure 5 and Figure 6 shown, the strip 2 is in a vertical state relative to the chassis 1, so that the 7° inclined groove 32 of the product socket 3 is horizontally upwardly arranged for die bonding, chip mounting and inspection of a gas sensing laser.
[0049] Among them, in an optional embodiment, the top of the strip body 21 is provided with a first hole position, and the fixed manganese sheet 23 is provided with a second hole position; the first hole position and the second hole position are correspondingly arranged, and the first hole position and the second hole position are used to be adapted to the mounting position of the product socket 3.
[0050] Preferably, in order to further improve the chip mounting efficiency, both the first hole position and the second hole position are multiple, and the specific number of the hole positions is not limited and can be correspondingly set according to actual needs.
[0051] It should be noted that in the first case, as Figure 1 shown, when the laser for gas sensing is die-bonded and pasted, the strip 2 is located at the first mounting position 11, and the strip 2 is in a horizontal shape at the first mounting position 11.
[0052] As Figure 7 shown, the chassis 1 is provided with a stop portion 13. As Figure 5 shown, the strip body 21 is provided with a protrusion 211. As Figure 1 shown, the stop portion 13 and the protrusion 211 are arranged in abutment.
[0053] In actual operation, the corresponding operations are as follows:
[0054] 1. Place the product socket 3 on the corresponding hole positions of the strip 2. The strip body 21 and the fixed manganese sheet 23 are used to position the direction of the socket, and the socket is tightly attracted by the strong magnetic part 24.
[0055] 2. Horizontally place the strip 2 at the first mounting position 11 on the chassis 1. After the socket is fixed, the side of the socket sector column 31 faces horizontally upward. As Figure 2 shown, the edge of the chassis 1 just abuts against the back of the socket sector column 31 ( Figure 8 the arc surface of the sector column 31 in ), so that the sockets on the strip 2 are on the same horizontal plane, ensuring that the die-bonding and pasting can be carried out smoothly.
[0056] In the second case, as Figure 3 and Figure 4 shown, when the laser for the optical communication industry is die-bonded and pasted, in the case where the strip 2 is located at the second mounting position 12, as Figure 4 shown, the strong magnetic part 24 is arranged at the bottom of the strip body 21.
[0057] Among them, as Figure 7 shown, the second mounting position 12 is a strip-shaped groove, and the bottom of the strip-shaped groove is provided with a slope of 7°, so that when the strip 2 is placed in the strip-shaped groove, the 7° inclined groove 32 surface of the product socket 3 is horizontal.
[0058] In actual operation, the corresponding operations are as follows:
[0059] 1. Place the product socket 3 on the corresponding hole positions of the strip 2. The strip body 21 and the fixed manganese sheet 23 are used to position the direction of the socket, and the socket is tightly attracted by the strong magnetic part 24. Among them, the manganese sheet of the strip 2 is non-magnetic, which is convenient for the socket to be placed into the hole positions of the strip 2.
[0060] 2. Vertically place the strip 2 on the chassis 1. Since the vertical slot of the strip 2 on the chassis 1 is inclined at 7°, after the socket is fixed, the 7° inclined groove 32 of the socket faces horizontally upward and is on the same horizontal plane, so that the die-bonding and pasting can be carried out smoothly.
[0061] It should be noted that if the product bonding surfaces are not on the same plane, it will affect the bonding accuracy.
[0062] In addition, in the above two cases, when measuring the bonding position accuracy and chip thrust during the die bonding and chip bonding process, the strip 2 in the vertical or horizontal placement is removed, and the strip 2 with the socket fixed can be directly used for accuracy measurement and chip thrust detection without transferring the product to other fixed jigs for sampling measurement.
[0063] Furthermore, in an alternative embodiment, to ensure the firmness of the connection, as Figure 1 shown, the fixture further includes a first fastener and a second fastener.
[0064] Specifically, the first fastener is disposed at the top of the strip body for connecting and fastening the fixing manganese sheet 23 and the strip body, and the second fastener is disposed at the bottom of the strip body for connecting and fastening the baffle 22 and the strip body.
[0065] In summary, the die bonding, chip bonding and detection fixture for a laser proposed in the embodiment of the present invention can be compatibly applied to the fixing of different bonding surfaces of die bonding and chip bonding of the socket of lasers in the optical communication industry and lasers for gas sensing. When die bonding and chip bonding two types of lasers, only one set of fixtures is needed. At the same time, it can also be used for fixing the measurement of the bonding position accuracy and chip thrust during the die bonding and chip bonding process of the product, improving the efficiency of bonding and detection.
[0066] In the description of this specification, the description with reference to terms such as "specific examples" or "some examples" means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the embodiments of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example.
[0067] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit them. Although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements for some of the technical features. And these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.
Claims
1. A die bonding, chip mounting and detecting fixture for a laser, characterized in that Including: A chassis and a strip; The chassis is provided with a first mounting position and a second mounting position, and both the first mounting position and the second mounting position are used for fixing the strip; The strip is provided with a strip body, a baffle, a fixing manganese piece and a strong magnetic part; the fixing manganese piece is arranged at the top of the strip body and is used for installing a product socket; the strong magnetic part is arranged at the bottom of the strip body and is used for adsorbing and fixing the product socket; the baffle is arranged at the bottom of the strip body; When the strip is arranged at the first mounting position, the strip is in a horizontal state relative to the chassis, so that the side surface of the fan-shaped column of the product socket is horizontally upward for die bonding and inspection of an optical communication laser; When the strip is arranged at the second mounting position, the strip is in a vertical state relative to the chassis, so that the 7° inclined groove of the product socket is horizontally upward for die bonding and inspection of a gas sensing laser; 2. The laser die bonding, chip mounting and detection fixture according to claim 1, wherein A first hole is arranged at the top of the strip body, and a second hole is arranged on the fixing manganese piece; The first hole and the second hole are correspondingly arranged, and the first hole and the second hole are used for being adapted to the mounting position of the product socket; 3. The laser die bonding, chip mounting and detecting fixture according to claim 2, wherein, Both the first hole and the second hole are multiple; 4. The laser die bonding, chip mounting and detecting fixture according to claim 1, wherein, When the strip is arranged at the first mounting position, the back surface of the fan-shaped column of the product socket abuts against the edge of the chassis, so that the horizontal plane of the fan-shaped column is upward; 5. The laser die bonding, chip mounting and detection fixture according to claim 1, wherein The second mounting position is a strip-shaped groove, and the bottom of the strip-shaped groove is provided with a slope of 7°; 6. The laser die bonding, chip mounting and detection fixture according to claim 1, characterized in that When the strip is arranged at the second mounting position, the 7° inclined groove surface of the product socket is horizontal; 7. The laser die bonding, chip mounting and detecting fixture according to claim 1, wherein The chassis is provided with a stop portion, and the strip body is provided with a protruding portion; When the strip is in a horizontal state at the first mounting position, the stop portion abuts against the protruding portion; 8. The laser die bonding, chip mounting and detecting fixture according to claim 1, wherein, The fixture further includes a first fastener; The first fastener is arranged at the top of the strip body and is used for connecting and fastening the fixing manganese piece and the strip body; 9. The laser die bonding, chip mounting and detecting fixture according to claim 8, wherein The fixture further includes a second fastener; The second fastener is arranged at the bottom of the strip body and is used for connecting and fastening the baffle and the strip body; 10. The laser die bonding, chip mounting and detection fixture according to claim 1, wherein Both the first mounting position and the second mounting position are multiple.