Graphics card circuit board of embedded capacitor
By burying the capacitor into the graphics card PCB board and connecting it with the GPU chip through hole, the problem of large space and unstable connection in the graphics card is solved, and the compact and efficient operation and stability of the graphics card are achieved.
Patent Information
- Application Number
- CN202421912761.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-08
- Publication Date
- 2025-07-04
- Estimated Expiration
- 2034-08-08
AI Technical Summary
Traditional capacitor integration technology occupies a large space in graphics cards, has unstable connections, is susceptible to heat, and cannot meet the requirements of high-density space and high-frequency operation stability.
Buried the capacitor into the graphics card PCB board, connected to the GPU chip through a through hole, and filled the gap with epoxy resin, providing a low impedance path and thermal conduction path to reduce electrical interference and noise.
It improves the space utilization rate of the graphics card PCB board, stabilizes the connection between the capacitor and the GPU chip, reduces power supply noise and voltage fluctuations, and improves the operating efficiency and reliability of the graphics card.
Smart Images
Figure CN223067264U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of graphics cards, in particular to a graphics card circuit board with embedded capacitors. Background Art
[0002] Currently, in the field of high-performance electronic devices, especially in the design of graphics cards, the electrical performance requirements for circuit boards are becoming increasingly strict. With the progress of technology, graphics cards are developing towards smaller size, higher speed, and higher frequency, which has led to a significant increase in the demand for passive components on circuit boards, especially capacitors. Capacitors play key roles such as filtering, decoupling, and energy storage in graphics cards, directly affecting the signal integrity and stability of the entire graphics card. Traditional capacitor integration technologies, such as surface mount technology (SMT), although capable of providing the required capacitance function, have problems of occupying a large amount of circuit board space and may also cause problems such as power supply, impedance, and signal.
[0003] A large number of capacitors are required in graphics cards. For example, in the GPU chip module, the capacitors for power supply often need multiple capacitors with different capacitance values and sizes. However, there are often other modules such as video memory around it, occupying a large amount of space. At the same time, as the functions of graphics cards become more and more abundant, the conventional surface mount method can no longer meet the increasingly dense and limited space. Surface mount capacitors are connected to the PCB through soldering points. When a large number of soldering operations are performed, poor soldering may occur, resulting in unstable connections, increasing the risk of power supply, and possibly leading to the failure risk of the GPU chip and even the entire graphics card. In addition, surface mount capacitors are usually placed near high-heat-generation areas such as MOS and inductors, and are easily affected by their heat, resulting in an increase in the operating temperature of the surface mount capacitors, thereby affecting the performance and lifespan of the capacitors. Summary of the Invention
[0004] In order to solve the above problems, the utility model provides a graphics card circuit board with embedded capacitors.
[0005] The utility model provides a graphics card circuit board with embedded capacitors, including a graphics card PCB board and a GPU chip. The GPU chip is attached to the top of the graphics card PCB board. A cavity is provided inside the graphics card PCB board, and a capacitor is installed in the cavity. A first through hole is provided inside the graphics card PCB board, and the first through hole communicates with the GPU chip and the cavity respectively. The capacitor is connected to the GPU chip through the first through hole.
[0006] As a further improvement of the utility model, the graphics card PCB board includes a core board layer arranged in the center, and a first copper foil layer, a semi-cured sheet layer, a second copper foil layer, and a solder mask layer are sequentially arranged on both sides of the core board layer in a mirror image manner.
[0007] As a further improvement of the present utility model, the cavity is arranged in the core board layer, and the depth of the cavity is less than the thickness of the core board layer.
[0008] As a further improvement of the present utility model, the capacitor is inversely installed in the cavity, the difference between the length of the cavity and the length of the capacitor is greater than or equal to 0.05 mm, and the height of the capacitor is less than the thickness of the core board layer.
[0009] As a further improvement of the present utility model, a gap is provided between the capacitor and the cavity, and the gap is filled with an epoxy resin material.
[0010] As a further improvement of the present utility model, a connecting member is provided at the bottom of the GPU chip. The connecting member includes a chip pad and solder balls. The solder balls are embedded in the solder mask layer. The bottom of the solder balls is connected to one end of the first through hole, and the chip pad is arranged on the top of the solder balls.
[0011] As a further improvement of the present utility model, at least two connecting members are provided.
[0012] As a further improvement of the present utility model, the capacitor is provided with a capacitor pad, and the capacitor pad is connected to the other end of the first through hole.
[0013] As a further improvement of the present utility model, the inner surface of the first through hole is copper-plated.
[0014] As a further improvement of the present utility model, it further includes a second through hole arranged inside the graphics card PCB board. The second through hole penetrates downward from the second copper foil layer to the second copper foil layer corresponding to its mirror image. The distance between the second through hole and the cavity is greater than 0.5 mm, and the inner surface of the second through hole is copper-plated.
[0015] The beneficial effects of the present utility model are as follows: In this solution, multiple capacitors are buried in the graphics card PCB board, significantly improving the available space of the graphics card PCB board, making the graphics card PCB board can be designed more compact and efficient; at the same time, effectively reducing the connection length between the capacitor and the GPU chip, especially providing a low-impedance path for the capacitor in the high-frequency working state of the GPU chip, smoothing the power supply voltage of the GPU chip while reducing the noise and voltage fluctuations on the power supply channel. In addition, it also reduces the electrical interference of other components in the graphics card PCB board to the capacitor, protects the core of the GPU chip from the influence of power fluctuations, and ensures its efficient and stable operation; at the same time, the materials wrapped around the buried capacitor provide an additional heat conduction path for the capacitor, improving the heat conduction and heat diffusion effects when the capacitor works. Description of the Drawings
[0016] Figure 1 is a cross-sectional view of the present utility model;
[0017] Figure 2 is an overall external view of the present utility model.
[0018] Reference numerals in the drawings: 1 - graphics card PCB board, 2 - GPU chip, 3 - capacitor, 4 - cavity, 5 - first through hole, 6 - gap, 7 - chip pad, 8 - solder ball, 9 - capacitor pad, 10 - second through hole, 11 - core board layer, 12 - first copper foil layer, 13 - prepreg layer, 14 - second copper foil layer, 15 - solder mask layer. Detailed implementation manners
[0019] In order to make the objectives, technical solutions and advantages of the present utility model clearer and more understandable, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be noted that the terms "front", "rear", "left", "right", "upper" and "lower" used in the following description refer to the directions in the drawings, and the terms "bottom surface" and "top surface", "inner" and "outer" refer to the directions towards or away from the geometric center of a specific component respectively.
[0020] As Figure 1-2 shown, the present utility model provides a graphics card circuit board with an embedded capacitor, which includes a graphics card PCB board 1 and a GPU chip 2. The GPU chip 2 is attached to the top of the graphics card PCB board 1. A cavity 4 is provided inside the graphics card PCB board 1. A capacitor 3 is installed in the cavity 4. A first through hole 5 is provided inside the graphics card PCB board 1. The first through hole 5 communicates with the GPU chip 2 and the cavity 4 respectively. The capacitor 3 is connected to the GPU chip 2 through the first through hole 5.
[0021] As an embodiment of the present utility model, the graphics card PCB board 1 includes a core board layer 11 disposed at the center. On both sides of the core board layer 11, a first copper foil layer 12, a prepreg layer 13, a second copper foil layer 14 and a solder mask layer 15 are sequentially arranged in a mirror image manner.
[0022] As another embodiment of the present utility model, the cavity 4 is provided in the core board layer 11, and the depth of the cavity 4 is less than the thickness of the core board layer 11.
[0023] As another embodiment of the present utility model, the capacitor 3 is installed upside down in the cavity 4. The difference between the length of the cavity 4 and the length of the capacitor 3 is greater than or equal to 0.05 mm, and the height of the capacitor 3 is less than the thickness of the core board layer 11.
[0024] As another embodiment of the present utility model, a gap 6 is provided between the capacitor 3 and the cavity 4, and the gap 6 is filled with an epoxy resin material.
[0025] As another embodiment of the present utility model, a connecting member is provided at the bottom of the GPU chip 2. The connecting member includes a chip pad 7 and solder balls 8. The solder balls 8 are embedded in the solder mask layer 15. The bottom of the solder balls 8 is connected to one end of the first through hole 5, and the chip pad 7 is disposed on the top of the solder balls 8.
[0026] As another embodiment of the present utility model, at least two of the connecting members are provided.
[0027] As another embodiment of the present utility model, the capacitor 3 is provided with a capacitor pad 9, and the capacitor pad 9 is connected to the other end of the first through hole 5.
[0028] As another embodiment of the present utility model, the inner surface of the first through hole 5 is copper-plated.
[0029] As another embodiment of the present utility model, it further includes a second through hole 10 provided inside the graphics card PCB board 1. The second through hole 10 penetrates downward from the second copper foil layer 14 to the second copper foil layer 14 corresponding to its mirror image. The distance between the second through hole 10 and the cavity 4 is greater than 0.5 mm, and the inner surface of the second through hole 10 is copper-plated.
[0030] The present utility model provides a graphics card circuit board with embedded capacitors. By embedding a plurality of the capacitors 3 into the graphics card PCB board 1, the graphics card PCB board 1 can be designed to be more compact and efficient.
[0031] The GPU chip 2 is surface-mounted and soldered to the graphics card PCB board 1 by surface mounting. In addition, the GPU chip 2 is further provided with a plurality of the chip pads 7, and at least two of the chip pads 7 are provided.
[0032] In addition, the capacitor 3 uses an ultra-thin solid capacitor package specifically for embedding. It is provided with a capacitor pad 9, and through the capacitor pad 9, the capacitor 3 is electrically connected to the graphics card PCB board 1. More specifically, a plurality of the solder balls 8 are further provided inside the graphics card PCB board 1, and the GPU chip 2 is electrically connected to the graphics card PCB board 1 by a corresponding connection mode between the chip pad 7 and the solder balls 8.
[0033] Such as Figure 2As shown in the figure, the graphics card PCB board 1 in the present utility model includes a core board layer 11. On both sides of the core board layer 11, a first copper foil layer 12, a prepreg layer 13, a second copper foil layer 14, and a solder mask layer 15 are sequentially arranged in a mirror image manner, and are extended and arranged on both sides with the core board layer 11 as the center. Preferably, the core board layer 11 uses an epoxy resin material with a high glass transition temperature, which can maintain mechanical and electrical properties at a higher temperature to provide better thermal stability.
[0034] A number of the cavities 4 are arranged in the core board layer 11. The shape and size of the cavities 4 are determined according to the position and size of the capacitors 3. Among them, the specific steps for manufacturing the cavities 4 are as follows: set the size specifications of the capacitors 3 during the PCB design stage, place them under the GPU chip 2, set relevant rules, mark an area in the core board layer 11 around the capacitors 3 in the PCB design software, and record it in the production file. During the production stage, use a laser to drill and hollow out the marked positions in the core board layer 11. Preferably, due to the tolerance and precision limitations of laser cutting during the manufacturing process, and to ensure that the capacitors 3 can be smoothly installed. The volume of the cavities 4 is designed to be larger than that of the capacitors 3. Specifically, the length of the cavities 4 is more than 0.05 mm longer than the side length of the capacitors 3.
[0035] Before the lamination of the graphics card PCB board 1, the capacitors 3 are installed into the cavities 4. Among them, the capacitors 3 are installed in an inverted manner, that is, the capacitor pads 9 are facing upward during installation.
[0036] There is a gap 6 in the cavity 4 below the capacitor 3. Among them, before installing the capacitor 3, a high-fluidity and low-viscosity epoxy resin material is filled in the gap 6, which helps to increase the mechanical stability of the capacitor 3 in the graphics card PCB board 1 and prevent the capacitor 3 from moving or falling off during transportation and use. When the graphics card PCB board 1 is laminated and pressed, it is preferably pressed in a vacuum environment. Using vacuum pressing can effectively fill the epoxy resin material filled in the gap 6, eliminate the air in the gap 6, and prevent bubbles from generating in other laminations. At the same time, it also ensures the precise contact and uniform distribution between the prepreg and other materials, reduces the resistance and inductance of the lamination, and improves the use effect of the capacitor 3.
[0037] After the graphics card PCB board 1 is laminated and pressed, several drill holes need to be made on the graphics card PCB board 1. The first through hole 5 is drilled by laser and then copper-plated. The drilling position starts from below the solder ball 8 and ends above the capacitor pad 9. The second through hole 10 is drilled by mechanical drilling and then copper-plated, and penetrates from the upper second copper foil layer 14 down to the corresponding mirrored lower second copper foil layer 14. Among them, in order to prevent the mechanical and performance impacts of the second through hole 10 on the buried capacitor, the drilling position of the second through hole 10 avoids the cavity 4 and the spacing is more than 0.5 mm. The second through hole 10 connects the first copper foil layer 12 and the second copper foil layer 14 by copper-plating the inner wall, so that the capacitor 3 is electrically connected to other conductive layers of the graphics card PCB board 1. At this time, through the second through hole 10, the power supply and ground signals of the capacitor 3 have a more complete transmission and return path. At the same time, heat diffusion is enhanced, effectively avoiding heat accumulation around the capacitor 3.
[0038] The capacitor 3 is connected to the GPU chip 2 through the capacitor pad 9, the first through hole 5, the first copper foil layer 12, the second copper foil layer 14, the solder ball 8, and the GPU chip 2 pad to achieve electrical connection.
[0039] Among them, the installation and connection method of the capacitor 3 enables the capacitor 3 to have the smallest connection and return path with the GPU chip 2, and the filtering range of the capacitor 3 is closer to the GPU chip 2. By this buried method, the placement efficiency of the surface space of the graphics card PCB board 1 is improved. At the same time, it helps to stabilize the power supply voltage, reduce voltage drop and noise, and improve the electrical performance of the circuit. That is, it ensures the stable operation of the GPU chip 2 and also improves the performance and reliability of the graphics card product.
[0040] The above content is a further detailed description of the present invention in combination with specific preferred embodiments. It cannot be determined that the specific implementation of the present invention is only limited to these descriptions. For those of ordinary skill in the technical field to which the present invention belongs, without departing from the concept of the present invention, several simple deductions or substitutions can still be made, and all should be regarded as belonging to the protection scope of the present invention.
Claims
1. An embedded capacitor graphics card circuit board, characterized in that, It includes a graphics card PCB board and a GPU chip. The GPU chip is attached to the top of the graphics card PCB board. There is a cavity inside the graphics card PCB board, and a capacitor is installed in the cavity. There is a first through-hole inside the graphics card PCB board, and the first through-hole communicates with the GPU chip and the cavity respectively. The capacitor is connected to the GPU chip through the first through-hole.
2. The embedded capacitor graphics card circuit board according to claim 1, characterized in that, The graphics card PCB board includes a core board layer arranged in the center, and a first copper foil layer, a semi-cured sheet layer, a second copper foil layer and a solder mask layer are sequentially arranged on both sides of the core board layer in a mirror image manner.
3. The graphics card circuit board with an embedded capacitor according to claim 2, characterized in that, The cavity is arranged in the core board layer, and the depth of the cavity is less than the thickness of the core board layer.
4. The graphics card circuit board with the embedded capacitor according to claim 2, characterized in that, The capacitor is installed upside down in the cavity. The difference between the length of the cavity and the length of the capacitor is greater than or equal to 0.05 mm, and the height of the capacitor is less than the thickness of the core board layer.
5. The embedded capacitor graphics card circuit board according to claim 1, characterized in that, There is a gap between the capacitor and the cavity, and the gap is filled with an epoxy resin material.
6. The embedded capacitor video card circuit board according to claim 2, wherein There is a connecting member at the bottom of the GPU chip. The connecting member includes a chip pad and solder balls. The solder balls are embedded in the solder mask layer. The bottom of the solder balls is connected to one end of the first through-hole, and the chip pad is arranged on the top of the solder balls.
7. The graphics card circuit board with the embedded capacitor according to claim 6, characterized in that, At least two connecting members are provided.
8. The embedded capacitor video card circuit board according to claim 1, characterized in that, The capacitor is provided with a capacitor pad, and the capacitor pad is connected to the other end of the first through-hole.
9. The embedded capacitor-based graphics card circuit board according to claim 1, wherein The inner surface of the first through-hole is copper-plated.
10. The embedded capacitor-based graphics card circuit board according to claim 2, wherein It further includes a second through-hole arranged inside the graphics card PCB board. The second through-hole penetrates downward from the second copper foil layer to the second copper foil layer corresponding to it in a mirror image. The distance between the second through-hole and the cavity is greater than 0.5 mm, and the inner surface of the second through-hole is copper-plated.