Host backboard, valve control device and valve control system

Abstract

The utility model belongs to the technical field of power distribution control, and provides a host backboard, a valve control device and a valve control system.According to the host backboard, the slot positions of a mainboard slot, a CPU board slot and a power panel slot which are large in heat productivity are separated through the slot positions of other slots, the slot position of the power panel slot is formed in the edge of the backboard, heat dissipation can be accelerated, and the heat dissipation efficiency is improved. The heat dissipation efficiency of the main board slot, the CPU board slot and the power board slot is improved, so that the CPU communication board, the main board and the power board which are connected in an inserted mode can work at higher power, and the problems that power is reduced and computing power and communication reliability are reduced due to poor heat dissipation are solved.

Description

Technical Field

[0001] This application belongs to the technical field of distribution control, and particularly relates to a host backplane, a valve control device, and a valve control system. Background Art

[0002] The high-voltage direct-connected energy storage valve control device is an important hub between DC control protection and energy storage valve sub-modules. More and more data needs to be processed in large quantities, which places higher requirements on the computing power and bandwidth of the chip. As a result, the power consumption of the device will inevitably increase. However, the current valve control device has low heat dissipation efficiency, resulting in insufficient computing power and affecting communication reliability. Therefore, how to improve the heat dissipation effect and ensure communication reliability is an urgent problem to be solved at present. Summary of the Utility Model

[0003] In view of the above problems, this application provides a host backplane, a valve control device, and a valve control system, aiming to solve the problems of low heat dissipation efficiency of the valve control device, resulting in insufficient computing power and affecting communication reliability.

[0004] In a first aspect, an embodiment of this application provides a host backplane, including a circuit base plate, on which a main board slot, two CPU board slots, multiple interface board slots, an input board slot, an output board slot, and two power board slots are provided:

[0005] The two CPU board slots are adjacently arranged on opposite sides of the main board slot, and the main board slot and the two CPU board slots are arranged between the two power board slots; the multiple interface board slots, the input board slot, and the output board slot are arranged between the two CPU board slots and the two power board slots.

[0006] In the technical solution of the embodiment of this application, by separating the slots of the main board slot, CPU board slots with relatively large heat generation from the slots of the power board slots through the slots of other slots, and also setting the slots of the power board slots at the edge of the backplane, it is beneficial to accelerate heat dissipation and improve the heat dissipation efficiency of the main board slot, CPU board slots, and power board slots, enabling the plugged-in CPU communication boards, main boards, and power boards to work at higher powers, thereby improving the problem of power reduction caused by poor heat dissipation and reducing computing power and communication reliability.

[0007] In some embodiments, the multiple interface board slots are located on one side of one of the CPU board slots facing away from the main board slot; the input board slot is located on one side of the other CPU board slot facing away from the main board slot; the output board slot is adjacently arranged to the input board slot.

[0008] In the technical solution of the embodiment of the present application, multiple interface board slots, input board slots, and input board slots are respectively arranged on both sides of the two CPU board slots facing away from the main board slot, facilitating the arrangement and management of the interface boards inserted into the interface board slots, as well as the arrangement and management of the input boards and output boards.

[0009] In some embodiments, the connectors on the two CPU board slots are connected to the connectors on the same interface board slot by equal-length signal transmission lines and equal-length signal reception lines.

[0010] In the technical solution of the embodiment of the present application, by setting the signal transceiver lines of the connectors of different CPU boards and the connectors of the same interface board to be equal in length, the communication between different CPU boards and the same interface board can be synchronized as much as possible for reception / delivery, maintaining consistent timing, meeting the requirement of as-synchronous communication as possible, and thus satisfying higher-speed communication. In addition, since there are signal transceiver lines between the connectors of different CPU boards and the connectors of the same interface board, effective communication can still be maintained when a single signal transceiver line fails, improving the reliability of the system.

[0011] In some embodiments, the two CPU board slots and the main board slot are both provided with connectors and optical communication modules, and the optical communication modules and the connectors are arranged at intervals.

[0012] In the technical solution of the embodiment of the present application, the arrangement of the optical communication modules and the connectors at intervals is beneficial to the heat dissipation of the optical communication modules and improves the communication efficiency.

[0013] In some embodiments, a power supply line is further included, and the two power supply board slots are respectively electrically connected to the main board slot, the two CPU board slots, the multiple interface board slots, the input board slot, and the output board slot through corresponding power supply lines.

[0014] In the technical solution of the embodiment of the present application, both of the two power supply boards can supply power to the devices inserted on the backplane. When single-way power supply is used, the two power supply boards can be used as backups for each other to improve the reliability of power supply; when dual-way power supply is used, the power of the devices can be increased, thereby improving the computing power and communication reliability.

[0015] In some embodiments, the slot width of the CPU board slot and the slot width of the main board slot are greater than the slot width of the interface board slot.

[0016] In the technical solution of the embodiment of the present application, on the backplane with a limited area, the slot widths of the CPU board slots and the main board slots with relatively large heat generation are set to be greater than the slot widths of other slots, increasing the heat dissipation efficiency of the slots of the CPU board slots and the main board slots, enabling the inserted CPU communication boards and main boards to work at higher powers, and improving the computing power and communication reliability.

[0017] In some embodiments, the slot width of the power board slot is greater than the slot width of the interface board slot.

[0018] In the technical solution of the embodiment of the present application, on a backplane with a limited area, the slot width of the power board slot with a relatively large heat generation is set to be greater than the slot widths of other slots, increasing the heat dissipation efficiency of the slot of the power board slot and improving the problem of power supply power drop caused by poor heat dissipation.

[0019] In some embodiments, the slot width of the power board slot is less than the slot width of the CPU board slot.

[0020] In the technical solution of the embodiment of the present application, on a backplane with a limited area and on the premise that the power board slot has been set at the edge of the backplane, in order to improve the heat dissipation efficiency of the plug-in devices in other slots, the slot width of the power board slot can be appropriately set to be less than the slot width of the CPU board slot, which is beneficial to the heat dissipation of the slot of the CPU board slot and other slots.

[0021] In some embodiments, the slot width of the CPU board slot is the same as the slot width of the main board slot; the slot widths of the input board slot and the output board slot are the same as the slot width of the interface board slot.

[0022] In the technical solution of the embodiment of the present application, the slot widths of the slots with similar heat generation are also set to be similar, which is beneficial to the layout of the backplane and the chassis, and is also beneficial to heat dissipation balance, and is also beneficial to arranging the communication traces of the same type of slots and other slots to be of equal length, facilitating synchronous communication.

[0023] In some embodiments, the two CPU board slots and the main board slot respectively include bus interfaces.

[0024] In the technical solution of the embodiment of the present application, an implementation manner of a high-speed communication interface is provided.

[0025] In some embodiments, the main board slot, the multiple interface board slots, the input board slot, and the output board slot respectively include low-voltage differential signal interfaces.

[0026] In the technical solution of the embodiment of the present application, an implementation manner of a high-speed communication interface is provided.

[0027] In a second aspect, an embodiment of the present application provides a valve control device, including the host backplane as described above, as well as a main board, two CPU communication boards, multiple interface boards, an input board, an output board, and a power supply board. The main board is plugged into the main board slot of the host backplane, the two CPU communication boards are respectively plugged into the two CPU board slots of the host backplane, the multiple interface boards are respectively plugged into the multiple interface board slots of the host backplane, the input board is plugged into the input board slot of the host backplane, the output board is plugged into the output board slot of the host backplane, and the two power supply boards are respectively plugged into the two power supply board slots of the host backplane.

[0028] In the technical solution of the embodiment of the present application, the valve control device uses other boards plugged into the above host backplane, which can obtain a higher heat dissipation efficiency. When high power operation is required, higher computing power and reliable communication performance can also be obtained.

[0029] In some embodiments, it further includes a first bus and a second bus, and the main board and the two CPU communication boards communicate serially through the first bus and the second bus respectively.

[0030] In the technical solution of the embodiment of the present application, an implementation manner of a high-speed communication interface is provided.

[0031] In some embodiments, it further includes a first low-voltage differential signal line, a second low-voltage differential signal line, and multiple third low-voltage differential signal lines;

[0032] The main board is connected to the input board through the first low-voltage differential signal line;

[0033] The main board is connected to the output board through the second low-voltage differential signal line;

[0034] The main board is respectively connected to the multiple interface boards through the multiple third low-voltage differential signal lines in a one-to-one correspondence.

[0035] In the technical solution of the embodiment of the present application, an implementation manner of a high-speed communication interface is provided.

[0036] In a third aspect, an embodiment of the present application provides a valve control system, including the valve control device as described above, and multiple expansion devices, and each expansion device is respectively communicatively connected to the two CPU communication boards of the valve control device.

[0037] In the technical solution of the embodiment of the present application, by using a valve control device with higher power, computing power, and communication capabilities, and multiple expansion devices can be expanded to achieve cross-communication data redundancy, improving the reliability of the valve control system.

[0038] In some embodiments, a centralized control device is further included, and the centralized control device is communicatively connected to the main board of the valve control device.

[0039] In the technical solution of the embodiment of the present application, by providing a centralized control device, it is convenient to centrally control the valve control system and improve work efficiency.

[0040] In some embodiments, a switch drive board is further included, and the switch drive board is connected to the input board and output board of the valve control device.

[0041] In the technical solution of the embodiment of the present application, by providing a switch drive board, it is convenient to control the switches of the valve control system and improve work efficiency.

[0042] In some embodiments, a collection board is further included, and the collection board is connected to one of the interface boards of the valve control device, and the collection board is used to collect current and / or voltage.

[0043] In the technical solution of the embodiment of the present application, by providing a collection board, it is convenient to centrally collect and manage the current and / or voltage parameters of the valve control system and improve work efficiency.

[0044] The above description is only an overview of the technical solution of the present application. In order to be able to understand the technical means of the present application more clearly, it can be implemented according to the content of the specification. And in order to make the above and other purposes, features and advantages of the present application more obvious and understandable, the specific embodiments of the present application are specifically described below. BRIEF DESCRIPTION OF THE DRAWINGS

[0045] By reading the detailed description of the preferred embodiments below, various other advantages and benefits will become clear to those of ordinary skill in the art. The drawings are only for the purpose of showing the preferred embodiments and are not considered to be a limitation of the present application. And in all the drawings, the same reference numerals are used to represent the same components. In the drawings:

[0046] Figure 1 The structural schematic diagram of the host backplane provided by an embodiment of the present application is shown;

[0047] Figure 2 The structural schematic diagram of the valve control device provided by an embodiment of the present application is shown;

[0048] Figure 3 The structural schematic diagram of the valve control system provided by an embodiment of the present application is shown. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0049] The embodiments of the technical solution of the present application will be described in detail below with reference to the drawings. The following embodiments are only used to illustrate the technical solution of the present application more clearly, so they are only examples and cannot be used to limit the protection scope of the present application.

[0050] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field to which this application belongs; the terms used herein are for the purpose of describing specific embodiments only and are not intended to limit this application; the terms "including" and "having" and any variations thereof in the specification and claims of this application and the above description of the drawings are intended to cover non-exclusive inclusion.

[0051] In the description of the embodiments of this application, technical terms such as "first" and "second" are only used to distinguish different objects and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity, specific order, or primary-secondary relationship of the indicated technical features. In the description of the embodiments of this application, the meaning of "a plurality of" is more than two, unless otherwise specifically defined.

[0052] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in connection with the embodiments can be included in at least one embodiment of this application. The phrase appears in various places in the specification and does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment mutually exclusive with other embodiments. Those skilled in the art will explicitly and implicitly understand that the embodiments described herein can be combined with other embodiments.

[0053] In the description of the embodiments of this application, the term "and / or" is merely a description of the association relationship of associated objects, indicating that three relationships can exist. For example, A and / or B can represent: A exists alone, A and B exist simultaneously, and B exists alone. In addition, the character " / " herein generally represents an "or" relationship between the associated objects before and after.

[0054] In the description of the embodiments of this application, the term "a plurality of" means more than two (including two). Similarly, "a plurality of groups" means more than two groups (including two groups), and "a plurality of pieces" means more than two pieces (including two pieces).

[0055] In the description of the embodiments of this application, unless otherwise clearly specified and limited, technical terms such as "installed", "connected", "coupled", "fixed", etc. should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can also be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the internal communication of two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the embodiments of this application can be understood according to specific circumstances.

[0056] The high-voltage direct-connected energy storage valve control device (hereinafter referred to as the valve control device) is an important hub between DC control protection and the energy storage valve sub-module. More and more data needs to be processed in large quantities, which places higher requirements on the computing power and bandwidth of the chip. Consequently, the power consumption of the device will inevitably increase, necessitating reliable power supply from a high-power power supply board. How to improve the heat dissipation effect and ensure communication reliability is an urgent problem to be solved in the existing technology.

[0057] In view of the deficiencies of the existing technology, a mainframe backplane for improving heat dissipation efficiency is provided.

[0058] According to some embodiments of the present application, with reference to Figure 1 , Figure 1 FIG. shows a schematic structural diagram of a mainframe backplane provided by an embodiment of the present application. For the sake of convenience of description, only the parts related to this embodiment are shown and are described in detail as follows:

[0059] The mainframe backplane 10 includes a circuit base plate 100. On the circuit base plate 100, there are provided a main board slot 110, two Central Processing Unit (CPU) board slots 120A and 120B, a plurality of interface (i.e., I / O port) board slots 130a to 130b, an input board slot 140, an output board slot 150, and two power supply board slots 160A and 160B.

[0060] The two CPU board slots are adjacently arranged on opposite sides of the main board slot; the main board slot and the two CPU board slots are arranged between the two power supply board slots; the plurality of interface board slots, the input board slot, and the output board slot are arranged between the two CPU board slots and the two power supply board slots.

[0061] The two CPU board slots 120A and 120B are adjacently arranged on opposite sides of the main board slot 110. The main board slot 110 and the two CPU board slots 120A and 120B are arranged between the two power supply board slots 160A and 160B; the plurality of interface board slots 130a to 130b, the input board slot 140, and the output board slot 150 are arranged between the two CPU board slots 120A and 120B and the two power supply board slots 160A and 160B.

[0062] Among them, the CPU boards inserted into the two CPU board slots 120A and 120B can also be referred to as CPU control boards or CPU communication boards, and the slots can also be referred to as interface panels or connector panels. Figure 1 In the example, the plurality of interface board slots 130a to 130d include an interface board slot 130a, an interface board slot 130b, an interface board slot 130c, and an interface board slot 130d.

[0063] In this embodiment, at least one of the interface board slots 130a, 130b, 130c, 130d, the input board slot 140, and the output board slot 150 is arranged between the CPU board slot 120A and the power supply board slot 160A, and the order is not limited, or at least one is arranged between the CPU board slot 120B and the power supply board slot 160B, and the order is not limited.

[0064] In the technical solution of the embodiment of the present application, by separating the slots of the main board slot 110, the CPU board slot, and the power supply board slots 160A and 160B with relatively large heat generation through the slots of other slots, and also setting the slots of the power supply board slots 160A and 160B at the edge of the backplane, it is beneficial to accelerate heat dissipation and improve the heat dissipation efficiency of the main board slot 110, the CPU board slot, and the power supply board slots 160A and 160B, so that the plugged-in CPU communication board, main board, and power supply board can all work at a higher power, thereby improving the problem of power reduction caused by poor heat dissipation and reducing computing power and communication reliability.

[0065] In some embodiments, the multiple interface board slots 130a to 130d are located on one side of one CPU board slot 120A facing away from the main board slot 110. The input board slot 140 is located on one side of the other CPU board slot 120B facing away from the main board slot 110; the input board slot 140 and the output board slot 150 are adjacent to each other.

[0066] In the technical solution of the embodiment of the present application, by arranging the multiple interface board slots 130a to 130d, the input board slot 140, and the input board slot 150 on both sides of the two CPU board slots 120A and 120B facing away from the main board slot 110 respectively, it is convenient for the layout and management of the interface boards plugged into the interface board slots 130a to 130d, and it is also convenient for the layout and management of the input board and the output board.

[0067] In some embodiments, the connectors 121 and 122 on the two CPU board slots 120A and 120B are connected to the connector 131 on the same interface board (such as 130d) slot by equal-length signal transmission lines and equal-length signal reception lines.

[0068] Among them, the equal-length signal transmission lines and equal-length signal reception lines are, for example, copper cladding arranged on the circuit board 100 or a cable connected to the circuit board 100.

[0069] In the technical solution of the embodiment of the present application, by setting the signal transceiver lines of the connectors of different CPU boards and the connectors of the same interface board to be of equal length, it is possible to make the communication between different CPU boards and the same interface board receive / send asynchronously as possible, maintain consistent timing, meet the requirement of asynchronously communicating as much as possible, and thus meet the need for higher-speed communication. In addition, since there are signal transceiver lines for the connectors of different CPU boards and the connectors of the same interface board, effective communication can still be maintained when a single signal transceiver line fails, improving the reliability of the system.

[0070] In some embodiments, two CPU board slots 120A and 120B are provided with connectors 121 and 122 and optical communication modules 123 and 124, and the main board slot 110 is provided with a connector 111 and an optical communication module 112. The optical communication modules 123, 124, 112 and the connectors 121, 122, 111 are arranged at intervals. This is beneficial to the heat dissipation of the optical communication modules 123, 124, 112 and improves the communication efficiency.

[0071] In some embodiments, the mainframe backplane 10 further includes a power supply line. The two power board slots 160A and 160B are respectively electrically connected to the main board slot 110, the two CPU board slots 120A and 120B, the multiple interface board slots 130a - 130d, the input board slot 140, and the output board slot 150 through corresponding power supply lines.

[0072] Among them, there are two groups of power supply lines, corresponding to the two power board slots 160A and 160B respectively, for outputting the power supplied by the two power board slots 160A and 160B to each slot respectively. Alternatively, the power supply line includes a power supply bus bar electrically connected to each slot, and the two power board slots 160A and 160B respectively output power to the power supply bus bar to supply power to each slot. The power supply line is, for example, a copper-clad trace on the circuit board 100.

[0073] In the technical solution of the embodiment of the present application, the power boards inserted into the two power board slots 160A and 160B can respectively supply power to the boards inserted on the mainframe backplane 10. When powered by a single path, the two power boards can be used as backups for each other, improving the reliability of power supply; when powered by a dual path, the power of the device can be increased, thereby improving the computing power and communication reliability.

[0074] In some embodiments, the slot width L1 of the CPU board slot 120A, the slot width L1 of the CPU board slot 120B, and the slot width L2 of the main board slot 110 are greater than the slot width L4 of the interface board slots 130a - 130d. Among them, the slot width can be understood as the outer shell or edge width of the interface or connector.

[0075] Among them, the slot widths L1 of the two CPU board slots 120A are similar or the same, and the slot width L1 of the CPU board slot 120B is similar or the same. The slot widths L4 of the interface board slots 130a to 130d are similar or the same.

[0076] In the technical solution of the embodiment of the present application, on the main board 10 with a limited area, the slot widths L1 of the CPU board slots 120A and 120B with relatively large heat generation and the slot width L2 of the main board slot 110 are set to be greater than the slot widths of other slots, increasing the heat dissipation efficiency of the slots of the CPU board slots 120A and 120B and the main board slot 110, so that the plugged-in CPU communication board and the main board can both work at a higher power, improving the computing power and communication reliability.

[0077] In some embodiments, the slot widths L4 of the power board slots 160A and 160B are greater than the slot widths L3 of the respective interface board slots 130a to 130d.

[0078] Among them, the slot widths L4 of the two power board slots 160A and 160B are similar or the same.

[0079] In the technical solution of the embodiment of the present application, on the main board 10 with a limited area, the slot widths of the power board slots 160A and 160B with relatively large heat generation are set to be greater than the slot widths of other slots, increasing the heat dissipation efficiency of the slots of the power board slots 160A and 160B, and improving the problem of power supply power drop caused by poor heat dissipation.

[0080] In some embodiments, the slot widths L4 of the power board slots 160A and 160B are less than the slot widths L1 of the CPU board slots 120A and 120B.

[0081] In the technical solution of the embodiment of the present application, on the main board with a limited area and on the premise that the power board slots 160A and 160B have been set at the edge of the main board, in order to improve the heat dissipation efficiency of the plugged-in devices of other slots, the slot width L4 of the power board slots 160A and 160B can be appropriately set to be less than the slot width L1 of the CPU board slots 120A and 120B, which is beneficial to the heat dissipation of the slots of the CPU board slots 120A and 120B and other slots.

[0082] In some embodiments, the slot width L1 of the CPU board slots 120A and 120B is the same as the slot width L2 of the main board slot 110; the slot width L5 of the input board slot 140 and the slot width L6 of the output board slot 150 are the same as the slot width L3 of the interface board slots 130a to 130d.

[0083] In the technical solution of the embodiment of the present application, the slot widths of slots with similar heat generation are also set to be similar, which is beneficial to the layout of the backplane and the chassis, and is also beneficial to heat dissipation balance, and is also beneficial to arranging the communication traces of the same type of slots and other slots to be of equal length, which is conducive to synchronous communication.

[0084] In some embodiments, the two CPU board slots 120A, 120B and the main board slot 110 respectively include bus interfaces. Among them, the bus interface is, for example, a Gigabit Transceiver (GT) interface, and the data transmission rate can reach 2 Gbps.

[0085] In some embodiments, the main board slot 110, the multiple interface board slots 130a to 130d, the input board slot 140 and the output board slot 150 respectively include Low-Voltage Differential Signaling (LVDS) interfaces, and the data transmission rate can reach 100 Mbps to 500 Mbps, and they have low power consumption and low bit error rate.

[0086] In an example, the host backplane 10 includes eleven slots, from left to the power board slot 160A (8TE), the interface board slot 130a (5TE), the interface board slot 130b (5TE), the interface board slot 130c (5TE), the interface board slot 130d (12TE), the CPU board slot 120A (12TE), the main board slot 110 (12TE), the CPU board slot 120B (12TE), the input board slot 140 (5TE), the output board slot 150 (5TE), the power board slot 160B (8TE), where 1TE is 5.08 mm. In this way, by optimizing the slot positions of the plug-ins on the host backplane 10 and the small panel width, the overall heat dissipation effect of the CPU board and the valve control device is improved.

[0087] According to some embodiments of the present application, referring to Figure 2 , Figure 2 FIG. shows a schematic structural diagram of a valve control device provided by an embodiment of the present application. For the convenience of description, only the parts related to this embodiment are shown and are described in detail as follows:

[0088] The valve control device includes the above-mentioned mainframe backplane 10, as well as a main board 210, two CPU communication boards 210A and 210B, multiple interface boards 230a - 230d, an input board 240, an output board 250, and two power supply boards 260A - 260B. The main board 210 is plugged into the main board slot 110 of the mainframe backplane 10. The two CPU communication boards 210A and 210B are respectively plugged into the two CPU board slots 120A and 120B of the mainframe backplane 10. The multiple interface boards 230a - 230d are respectively plugged into the multiple interface board slots 130a - 130d of the mainframe backplane 10. The input board 240 is plugged into the input board slot 140 of the mainframe backplane 10. The output board 250 is plugged into the output board slot 150 of the mainframe backplane 10. The two power supply boards 260A - 260B are respectively plugged into the two power supply board slots 160A and 160B of the mainframe backplane 10.

[0089] Among them, the input board 240 collects the opening and closing states of the circuit breaker switches of the energy storage valve sub-module. The output board 250 is used to control the opening and closing of the circuit breaker. The two power supply boards 260A - 260B are used to supply power to the valve control device, and can achieve online replacement in the case of any failure of the two power supply boards 260A - 260B, the two CPU communication boards 210A and 210B without powering off.

[0090] In the technical solution of the embodiment of the present application, the valve control device uses other boards plugged into the above-mentioned mainframe backplane 10, which can obtain a higher heat dissipation efficiency, and can also obtain higher computing power and reliable communication performance when high-power operation is required.

[0091] In some embodiments, the valve control device further includes a first bus and a second bus. The main board 210 communicates with the two CPU communication boards 210A and 210B through the first bus and the second bus respectively to achieve cross-communication control redundancy. The first bus and the second bus are, for example, Gigabit Transceivers (GT), and can reach a data transmission rate of 2 Gbps.

[0092] In some embodiments, the valve control device further includes a first Low-Voltage Differential Signaling (LVDS) line, a second low-voltage differential signaling line, and multiple third low-voltage differential signaling lines; the main board 210 is connected to the input board 240 through the first low-voltage differential signaling line; the main board 210 is connected to the output board 250 through the second low-voltage differential signaling line.

[0093] The main board 210 is respectively connected to the multiple interface boards 230a - 230d through multiple third low-voltage differential signaling lines in one-to-one correspondence, and can respectively reach a data transmission rate of 100 Mbps - 500 Mbps, and has low power consumption and low bit error rate.

[0094] In one example, through the above improvements, the valve control device can operate at 80 W (watts) to 120 W; the power of the CPU communication boards 210A and 210B is between 20 W and 30 W.

[0095] Under normal temperature (such as 25 °C), the maximum temperature of the CPU communication boards 210A and 210B is 75 °C, meeting the certification and test requirements. Before the improvement, in a high-temperature (such as 55 °C) aging test, the operating temperature of the CPU communication boards 210A and 210B was 105 °C; after the above improvement, the operating temperature of the CPU communication boards 210A and 210B can be reduced to below the junction temperature of 100 °C, meeting the certification and test requirements.

[0096] According to some embodiments of the present application, with reference to Figure 3 , Figure 3 FIG. shows a schematic structural diagram of a valve control system provided by an embodiment of the present application. For the convenience of description, only the parts related to this embodiment are shown and are described in detail as follows:

[0097] The valve control system includes the valve control device as described above and a plurality of expansion devices 310. Each expansion device 310 is respectively communicatively connected to the two CPU communication boards 210A and 210B of the valve control device.

[0098] Exemplarily, the expansion device 310 includes a CPU board - A and a CPU board - B. Figure 3 In the example, the two CPU communication boards 210A and 210B can respectively communicate with 4 expansion devices 310 through GT interconnection to achieve 2 Gbps communication and cross - communication data redundancy.

[0099] In the technical solution of the embodiment of the present application, by using a valve control device with higher power, computing power and communication ability, and multiple expansion devices 310 can be expanded to achieve cross - communication data redundancy, improving the reliability of the valve control system.

[0100] In some embodiments, the valve control system further includes a centralized control device 320, and the centralized control device 320 is communicatively connected to the main board 210 of the valve control device.

[0101] Among them, the centralized control device 320 is, for example, a control panel, which is convenient for the centralized control of the valve control system and improves work efficiency.

[0102] In some embodiments, the valve control system further includes a switch driving board 330, and the switch driving board 330 is connected to the input board 240 and the output board 250 of the valve control device.

[0103] The switch driving board 330 can be provided with various switch driving circuits, such as a transistor driving circuit, a relay driving circuit, etc.

[0104] In some embodiments, the valve control system further includes an acquisition board 340, which is connected to one of the interface boards 230a / 230b / 230c / 230d of the valve control device. The acquisition board 340 is configured to acquire current and / or voltage.

[0105] Exemplarily, the acquisition board 340 includes an electronic current and / or voltage transformer. One of the interface boards 230a / 230b / 230c / 230d communicates with the acquisition board 340 to acquire the secondary voltage value and current value of the electronic current and / or voltage transformer.

[0106] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them; although the present application has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements on some or all of the technical features; and these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application, and they should all be covered within the scope of the claims and the description of the present application. In particular, as long as there is no structural conflict, the technical features mentioned in each embodiment can be combined in any way. The present application is not limited to the specific embodiments disclosed in the text, but includes all technical solutions falling within the scope of the claims.

Claims

1. A host backplane, characterized in that, It includes a circuit base plate, on which a main board slot, two CPU board slots, multiple interface board slots, an input board slot, an output board slot and two power board slots are provided: The two CPU board slots are adjacently arranged on the opposite sides of the main board slot; the main board slot and the two CPU board slots are arranged between the two power board slots; the multiple interface board slots, the input board slot and the output board slot are arranged between the two CPU board slots and the two power board slots.

2. The main board of the host according to claim 1, characterized in that The multiple interface board slots are located on one side of one of the CPU board slots facing away from the main board slot; the input board slot is located on one side of the other CPU board slot facing away from the main board slot; the output board slot is adjacently arranged with the input board slot.

3. The main board as claimed in claim 1, wherein, Connectors on the two CPU board slots are connected to connectors on the same interface board slot with equal-length signal sending lines and equal-length signal receiving lines.

4. The host backplane according to claim 1, characterized in that The two CPU board slots and the main board slot are both provided with connectors and optical communication modules, and the optical communication modules and the connectors are arranged at intervals.

5. The host backplane according to claim 1, characterized in that, It further includes a power supply line, and the two power board slots are respectively electrically connected to the main board slot, the two CPU board slots, the multiple interface board slots, the input board slot and the output board slot through corresponding power supply lines.

6. The main board of the host according to any one of claims 1 to 5, characterized in that The slot width of the CPU board slot and the slot width of the main board slot are greater than the slot width of the interface board slot.

7. The main board according to any one of claims 1 to 5, characterized in that The slot width of the power board slot is greater than the slot width of the interface board slot.

8. The host backplane according to claim 7, characterized in that, The slot width of the power board slot is less than the slot width of the CPU board slot.

9. The host backplane according to claim 7, characterized in that, The slot width of the CPU board slot is the same as the slot width of the main board slot; the slot widths of the input board slot and the output board slot are the same as the slot width of the interface board slot.

10. A valve control device, characterized in that, It includes a host backplane according to any one of claims 1 to 9, as well as a main board, two CPU communication boards, multiple interface boards, an input board, an output board and two power boards. The main board is plugged into the main board slot of the host backplane, the two CPU communication boards are respectively plugged into the two CPU board slots of the host backplane, the multiple interface boards are respectively plugged into the multiple interface board slots of the host backplane, the input board is plugged into the input board slot of the host backplane, the output board is plugged into the output board slot of the host backplane, and the two power boards are respectively plugged into the two power board slots of the host backplane.

11. The valve control device according to claim 10, characterized in that, It further includes a first low-voltage differential signal line, a second low-voltage differential signal line and multiple third low-voltage differential signal lines; The main board and the input board are connected through the first low-voltage differential signal line; The main board and the output board are connected through the second low-voltage differential signal line; The main board and the multiple interface boards are respectively connected in one-to-one correspondence through the multiple third low-voltage differential signal lines.

12. A valve control system, characterized in that, It includes a valve control device according to claim 10 or 11, as well as multiple expansion devices, and each expansion device is respectively communicatively connected to the two CPU communication boards of the valve control device.

13. The valve control system according to claim 12, characterized in that, It further includes a centralized control device, and the centralized control device is communicatively connected to the main board of the valve control device.

14. The valve control system according to claim 12, characterized in that, It further includes a switch drive board, and the switch drive board is connected to the input board and the output board of the valve control device.

15. The valve control system according to claim 12, characterized in that, It further includes a collection board, and the collection board is connected to one of the interface boards of the valve control device, and the collection board is used for collecting current and / or voltage.

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