Heat dissipation structure, shell assembly and electronic equipment

Abstract

The utility model provides a heat dissipation structure, a shell assembly and electronic equipment, and belongs to the technical field of heat dissipation. The heat dissipation structure comprises a heat dissipation layer and a heat transmission window. The heat dissipation layer is provided with a heat absorption surface and a heat release surface, and the heat absorption surface is used for absorbing heat; the orthographic projection of the heat transmission window on the plane where the heat release surface is located at least partially coincides with the heat release surface. The heat dissipation structure can solve the problems that the heat dissipation channel of the electronic equipment is blocked and the heat dissipation difficulty is large.

Description

[0001] This application claims the priority of a Chinese patent application with the application number 202322084918.6 and the application title "Heat Dissipation Structure, Housing Assembly and Electronic Device" filed on August 3, 2023, the entire content of which is incorporated herein by reference. Technical Field

[0002] The utility model relates to the technical field of heat dissipation, and particularly relates to a heat dissipation structure, a housing assembly and an electronic device. Background Art

[0003] With the popularization of 5G and the development of mobile games, the power consumption of electronic devices such as mobile phones continues to increase. However, the housing material of electronic devices is usually a polymer material, which has problems such as poor heat conduction ability and large thermal resistance, resulting in the heat of electronic devices being unable to be dissipated normally, thus causing problems such as overheating, lag, and power consumption.

[0004] Among them, the heat in the motherboard area is quickly conducted to the middle frame through a heat dissipation component (such as a vapor chamber or a loop heat pipe, etc.), and then the heat is evenly dissipated through graphite heat conduction. For the screen side, due to the existence of an ultra-thin vapor chamber and graphite in the middle frame, good temperature uniformity can be achieved; however, for the back cover side, due to the existence of structures such as cameras, antennas, NFC (Near Field Communication) structures, and charging coils, it is difficult to stack enough heat dissipation materials (such as graphite and vapor chambers), the heat dissipation path is easily blocked, and the heat dissipation difficulty is relatively large, becoming a bottleneck area for the heat dissipation of electronic devices. Summary of the Utility Model

[0005] The utility model provides a heat dissipation structure, a housing assembly and an electronic device, which can solve the problems of blocked heat dissipation path and large heat dissipation difficulty of electronic devices.

[0006] The technical solution is as follows:

[0007] On the one hand, a heat dissipation structure is provided, and the heat dissipation structure includes: a heat dissipation layer and a heat transmission window;

[0008] The heat dissipation layer is provided with an endothermic surface and an exothermic surface, and the endothermic surface is used for absorbing heat;

[0009] The heat transmission window is located on the side where the exothermic surface is located, and the orthographic projection of the heat transmission window on the plane where the exothermic surface is located and the exothermic surface at least partially coincide.

[0010] In some embodiments, the heat transmission window and the exothermic surface are arranged at intervals, and the radiant heat emitted by the exothermic surface is transmitted outward through the heat transmission window.

[0011] In some embodiments, a heat conduction connecting piece is provided on the endothermic surface;

[0012] The heat-conducting connecting member includes one or more of the following: an adhesive layer, a heat-conducting gasket, and a heat-conducting gel layer.

[0013] In some embodiments, the heat dissipation layer includes one or more of the following: a graphite film, a graphene film, a vapor chamber, and a heat pipe fitting.

[0014] In some embodiments, the heat dissipation structure further includes a heat radiation layer, the heat radiation layer is located on the heat release surface, and the heat radiation layer covers at least a part of the surface of the heat release surface;

[0015] The positive projection of the heat transmission window on the plane where the heat radiation layer is located coincides with at least a part of the heat radiation layer.

[0016] In some embodiments, the heat radiation layer includes one or more of the following: a lipid film layer, a polymer film layer, a carbon powder coating, a graphene powder coating, and a black paint coating.

[0017] In some embodiments, the radiation transmittance of the heat transmission window in the infrared band range is greater than or equal to 70%;

[0018] and / or,

[0019] The radiation emissivity of the heat radiation layer in the infrared band range is greater than or equal to 0.9.

[0020] In some embodiments, the area of the heat release surface covered by the heat radiation layer is greater than or equal to 80% of the total area of the heat release surface;

[0021] and / or,

[0022] The area of the positive projection of the heat transmission window on the plane where the heat radiation layer is located that coincides with the heat radiation layer is greater than or equal to 80% of the total area of the heat radiation layer.

[0023] On the other hand, a housing assembly is provided, and the housing assembly includes: the heat dissipation structure described in the present invention and a housing;

[0024] The heat dissipation layer is located inside the housing, and the heat transmission window is located on the housing.

[0025] On the other hand, an electronic device is provided, and the electronic device includes: at least one heat source device, a housing, and the heat dissipation structure described in the present invention;

[0026] The at least one heat source device is located inside the housing, the heat dissipation layer is located on a side of the at least one heat source device facing the housing, and the heat transmission window is located on the housing.

[0027] In some embodiments, the electronic device further comprises a mainboard, a heat dissipation bracket and a battery compartment, and the heat dissipation structure comprises a heat radiation layer;

[0028] The at least one heat source device is located on the main board;

[0029] At least a portion of the heat dissipation bracket is located on the heat dissipation surface, at least a portion of the heat dissipation bracket extends to the battery compartment, and the heat radiation layer is located on a side of the heat dissipation bracket away from the heat dissipation surface.

[0030] In some embodiments, the electronic device also includes a screen and a temperature vapor chamber, the screen is located on the surface of the shell, the temperature vapor chamber is located on the non-display side of the screen, the heat absorbing end of the temperature vapor chamber is close to the at least one heat source device, and the heat releasing end of the temperature vapor chamber extends in a direction parallel to the non-display surface of the screen.

[0031] In some embodiments, the at least one heat source device is located on at least one of the two side surfaces of the mainboard, and the heat dissipation layer and the temperature vapor chamber are respectively located on both sides of the mainboard.

[0032] In some embodiments, the portion of the housing opposite to the screen is formed as a back cover, and the heat transmission window is located on the back cover;

[0033] The back cover is also provided with a camera window, and the camera window does not overlap with the heat transmission window.

[0034] The beneficial effects brought by the technical solution provided by the utility model include at least:

[0035] The heat dissipation structure of the utility model comprises a heat dissipation layer and a heat transmission window, wherein the position of the heat transmission window corresponds to the position of the heat release surface, the heat dissipation layer absorbs the heat of the heat source device by the heat absorption surface, and then radiates outwards through the heat release surface, and the radiated heat is dissipated outwards through the heat transmission window, so that it can be dissipated from the inside of the electronic device to the outside, thereby solving the problem that the heat dissipation channel of the electronic device is blocked and the heat dissipation is difficult. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0037] Figure 1 It is a structural schematic diagram of the heat dissipation structure provided by an embodiment of the utility model;

[0038] Figure 2It is a schematic structural diagram of an electronic device provided by an embodiment of the present utility model;

[0039] Figure 3 It is a schematic structural diagram of an electronic device provided by another embodiment of the present utility model;

[0040] Figure 4 It is a schematic structural diagram of a rear cover provided by an embodiment of the present utility model.

[0041] The reference numerals in the figure are respectively represented as:

[0042] 10, heat source device; 20, housing; 201, rear cover; 2011, camera window; 30, main board; 301, shielding cover; 40, heat dissipation bracket; 50, battery compartment; 60, screen; 70, heat pipe.

[0043] 1, heat dissipation layer; 11, heat absorption surface; 12, heat release surface;

[0044] 2, heat transmission window;

[0045] 3, heat conduction connecting piece;

[0046] 4, heat radiation layer. Specific embodiments

[0047] Here, the exemplary embodiments will be described in detail, and the examples are shown in the drawings. When the following description refers to the drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present utility model. On the contrary, they are merely examples of devices and methods consistent with some aspects of the present utility model as detailed in the appended claims.

[0048] In the description of the present utility model, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate the orientation or positional relationship based on the Figure 1 orientation or positional relationship shown, and are only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation of the present utility model.

[0049] Unless otherwise defined, all technical terms used in the embodiments of the present utility model have the same meaning as commonly understood by those of ordinary skill in the art.

[0050] At present, electronic devices such as mobile phones mainly adopt a three-section structural design, including a main board area, a battery compartment, and a small board area. The heat in the main board area is quickly conducted to the middle frame through a heat pipe, and then evenly distributed throughout the mobile phone through graphite heat dissipation, thereby improving the overall heat dissipation capacity of the mobile phone. For the screen side, due to the presence of an ultra-thin VC and graphite in the middle frame, good temperature uniformity can be achieved; however, for the mobile phone back cover, due to the presence of cameras, antennas, NFC (Near Field Communication), and charging coils, there are strict requirements for the transceiver of radio frequency and wireless signals, and it is difficult to stack too many heat dissipation materials such as graphite and heat pipes. The heat dissipation path is easily blocked, thus becoming a bottleneck area for mobile phone heat dissipation.

[0051] To make the objectives, technical solutions, and advantages of the present disclosure clearer, the embodiments of the present disclosure will be further described in detail below with reference to the accompanying drawings.

[0052] On the one hand, as shown in Figure 1 This embodiment provides a heat dissipation structure, which includes a heat dissipation layer 1 and a heat transmission window 2; the heat dissipation layer 1 is provided with a heat absorption surface 11 and a heat release surface 12, and the heat absorption surface 11 is used to absorb heat.

[0053] The heat transmission window 2 is located on the side where the heat release surface 12 is located, and the orthographic projection of the heat transmission window 2 on the plane where the heat release surface 12 is located and the heat release surface 12 at least partially coincide.

[0054] It should be noted that the heat transmission window 2 is used to radiate the heat absorbed by the heat dissipation layer. The heat transmission window 2 can be provided on the appearance part of the electronic device. Taking the electronic device as a mobile phone as an example, the appearance part can be a middle frame, a battery cover, a screen, etc. For example: The heat transmission window 2 can be provided at at least one position of the battery cover to achieve radiative heat dissipation. The battery cover includes: a housing and a decorative part. The heat transmission window 2 can be provided on the housing and the decorative part to respectively achieve heat dissipation of the CPU or camera module, etc. Or, in order to improve the heat dissipation effect, the heat transmission window 2 can be provided in the display area or non-display area of the screen. Or, the heat transmission window 2 can also be provided at the border of the middle frame to achieve heat dissipation of the functional module. It should be emphasized that the embodiments of the present disclosure do not specifically limit the setting position and shape of the heat transmission window 2, and it can be provided at at least one position of the following appearance parts: middle frame, battery cover, screen, etc.

[0055] The heat dissipation structure of this embodiment includes a heat dissipation layer 1 and a heat transmission window 2, where the position of the heat transmission window 2 corresponds to the position of the heat release surface 12. The heat dissipation layer 1 uses the heat absorption surface 11 to absorb the heat of the heat source device 10, and then radiates it outward through the heat release surface 12. The radiated heat is dissipated outward through the heat transmission window 2, so that it can be dissipated from the inside of the electronic device to the outside, solving the problem of blocked heat dissipation channels and difficult heat dissipation on the back cover 201 side of the electronic device.

[0056] In some possible implementation manners, the heat absorption surface 11 is used to absorb the heat of the heat source device 10, and the heat absorption surface 11 is located within the thermal influence space of the heat source device 10. Optionally, the orthographic projection of the heat source device 10 on the plane where the heat absorption surface 11 is located and the heat absorption surface 11 at least partially coincide.

[0057] The heat transmission window 2 of this embodiment is optionally made of an infrared transmission material, which is a material that can transmit infrared radiation and can radiate and dissipate the heat of the heat release surface 12 by using infrared radiation. The infrared transmission material can be a crystal material such as high-purity silicon, high-purity silicon germanium, zinc selenide, zinc sulfide, sapphire, calcium fluoride, etc., or a glass material such as silicate glass, aluminate glass, gallate glass or chalcogenide glass, or an infrared high-transmittance plastic material, or diamond and diamond-like films.

[0058] Combined with Figure 1 As shown in the figure, in some embodiments, the heat transmission window 2 and the heat release surface 12 are arranged at intervals, and the radiant heat emitted by the heat release surface 12 is transmitted outward through the heat transmission window 2.

[0059] The heat transmission window 2 and the heat release surface 12 are arranged at intervals, and the heat of the heat release surface 12 is transferred outward in the form of radiant energy and then transmitted outward through the heat transmission window 2.

[0060] Combined with Figure 1 As shown in the figure, in some embodiments, a heat conduction connecting member 3 is provided on the heat absorption surface 11; the heat conduction connecting member 3 includes one or more of the following: an adhesive layer, a heat conduction gasket, and a heat conduction gel layer.

[0061] By using the heat conduction connecting member 3 of the heat absorption surface 11, the heat absorption surface 11 and the heat source device 10 can be stably and reliably conductively connected, so that the heat of the heat source device 10 can be transferred to the heat absorption surface 11.

[0062] In some embodiments, the heat dissipation layer 1 includes one or more of the following: a graphite film, a graphene film, a heat pipe plate 70, and a heat pipe fitting.

[0063] The heat dissipation layer 1 has high heat conduction performance and can be made of high heat conduction materials such as graphite, graphene, heat pipes or heat pipe plates 70 in terms of structure, and can quickly absorb the heat of the heat source device 10 by using the heat absorption surface 11 and dissipate it outward from the heat release surface 12.

[0064] Combined with Figure 1 As shown in the figure, in some embodiments, the heat dissipation structure further includes a heat radiation layer 4, the heat radiation layer 4 is located on the heat release surface 12, and the heat radiation layer 4 covers at least a part of the surface of the heat release surface 12; the orthographic projection of the heat transmission window 2 on the plane where the heat radiation layer 4 is located and the heat radiation layer 4 at least partially coincide.

[0065] The heat radiation layer 4 is used to enhance the heat radiation efficiency of the heat release surface 12, with an emissivity requirement of more than 0.9, which can promote the heat of the heat release surface 12 to radiate outward in the form of heat radiation, and then dissipate it outward through the heat transmission window 2.

[0066] Combined with Figure 1 As shown, in some embodiments, the heat radiation layer 4 includes one or more of the following: a lipid film layer, a polymer film layer, a toner coating, a graphene powder coating, and a black paint coating.

[0067] Using the above-mentioned heat radiation layer 4 can improve the heat radiation efficiency of the heat release surface 12, enabling the heat of the heat release surface 12 to radiate outward as much as possible, and then dissipate it outward through the heat transmission window 2.

[0068] In some embodiments, the radiation transmittance of the heat transmission window 2 in the infrared wavelength range (greater than 760 NM) is greater than or equal to 70%; where, during the process of the incident light flux from the illuminated surface or the medium incident surface to the other side leaving, the ratio of the radiant energy that is projected and transmitted through the object to the total radiant energy projected onto the object is called the transmittance of the object.

[0069] Exemplarily, the radiation transmittance of the heat transmission window 2 in the infrared wavelength range is, for example, 70%, 80%, 90%, 95%, etc.

[0070] In some embodiments, the radiation emissivity of the heat radiation layer 4 in the infrared wavelength range (greater than 760 NM) is greater than or equal to 0.9. Among them, the radiation emissivity, or emissivity for short, is a measure of the ability of an object's surface to release energy in the form of radiation relative to its strength. The emissivity of an object is equal to the ratio of the energy radiated by the object at a certain temperature to the energy radiated by a blackbody at the same temperature. The emissivity of a blackbody is equal to 1, and the emissivity of other objects is between 0 and 1. The closer the radiation emissivity of the heat radiation layer 4 is to 1, the more energy the heat radiation layer 4 radiates outward.

[0071] Exemplarily, the radiation emissivity of the heat radiation layer 4 in the infrared wavelength range is, for example, 0.9, 0.91, 0.92, 0.93, 0.94, 0.95, etc.

[0072] In some embodiments, the area of the heat release surface 12 covered by the heat radiation layer 4 is greater than or equal to 80% of the total area of the heat release surface 12. Thus, the area of the heat release surface 12 covered by the heat radiation layer 4 is relatively large, which can ensure that most of the heat of the heat release surface 12 radiates outward in the form of radiant energy, thereby improving the heat dissipation ability of the heat dissipation structure.

[0073] Exemplarily, the ratio of the area of the heat release surface 12 covered by the heat radiation layer 4 to the total area of the heat release surface 12 is, for example, 80%, 85%, 90%, 95%, 100%.

[0074] In some embodiments, the area where the orthographic projection of the heat transmission window 2 on the plane where the heat radiation layer 4 is located coincides with the heat radiation layer 4 is greater than or equal to 80% of the total area of the heat radiation layer 4. This ensures that most of the heat radiation layer 4 is aligned with the position of the heat transmission window 2, and can ensure that most of the heat radiated by the heat radiation layer 4 can smoothly radiate outward through the heat transmission window 2, thereby improving the heat dissipation capacity of the heat dissipation structure.

[0075] Exemplarily, the proportion of the area where the orthographic projection of the heat transmission window 2 on the plane where the heat radiation layer 4 is located coincides with the heat radiation layer 4 is, for example, 80%, 85%, 90%, 95%, 100%.

[0076] On the other hand, in combination with Figure 2 、 3 As shown, this embodiment provides a housing assembly, which includes: a housing 20, and the heat dissipation structure of the present utility model; a heat dissipation layer 1 is located inside the housing 20, and a heat transmission window 2 is located on the housing 20.

[0077] The housing assembly of this embodiment adopts the heat dissipation structure of the present utility model and has all the technical effects of the present utility model.

[0078] On the other hand, in combination with Figure 2 、 3 As shown, this embodiment provides an electronic device, which includes: at least one heat source device 10, a housing 20, and the heat dissipation structure of the present utility model; at least one heat source device 10 is located inside the housing 20, a heat dissipation layer 1 is located on the side of at least one heat source device 10 facing the housing 20, and a heat transmission window 2 is located on the housing 20.

[0079] The electronic device of this embodiment adopts the heat dissipation structure of the present utility model and has all the technical effects of the present utility model.

[0080] Among them, the number of heat source devices 10 is, for example, one, two, three, etc. The position of the heat source device 10 corresponds to the heat absorption surface 11 of the heat dissipation layer 1, and the heat absorption surface 11 can absorb the heat of the heat source device 10, thereby realizing heat dissipation and temperature reduction of the heat source device 10.

[0081] Exemplarily, the heat source device 10 includes but is not limited to a chip module, a camera module, etc. A heat conduction silicone and other materials are filled between the heat source device 10 and the heat absorption surface 11 as a heat conduction connection layer.

[0082] In combination with Figure 3As shown, in some embodiments, the electronic device also includes a mainboard 30, a heat dissipation bracket 40 and a battery compartment 50, and the heat dissipation structure includes a heat radiation layer 4; at least one heat source device 10 is located on the mainboard 30; at least part of the heat dissipation bracket 40 is located on the heat dissipation surface 12, at least part of the heat dissipation bracket 40 extends to the battery compartment 50, and the heat radiation layer 4 is located on the side of the heat dissipation bracket 40 away from the heat dissipation surface 12.

[0083] In the electronic device of this embodiment, the heat source device 10 on the mainboard 30 utilizes the heat dissipation structure of the utility model and combines with the heat dissipation bracket 40 to perform composite heat dissipation, wherein the heat dissipation bracket 40 absorbs heat from the heat absorbing surface 11, a part of the heat is radiated outward through the heat radiation layer 4, and the other part is directly and evenly transferred to the battery compartment 50 through heat dissipation, so as to evenly distribute the heat in the entire electronic device and avoid heat accumulation in the mainboard 30 area.

[0084] In some possible implementations, the positions of the thermal transmission window 2 and the heat dissipation bracket 40 correspond, and the orthographic projection of the thermal transmission window 2 on the plane where the heat dissipation surface 12 is located at least partially overlaps with the heat dissipation surface 12, so that the heat of the heat dissipation bracket 40 can be dissipated outward through the thermal transmission window 2 in the form of radiation energy.

[0085] Furthermore, a black film or graphite layer is provided on the side of the heat dissipation bracket 40 facing the thermal transmission window 2, and the black film or graphite layer can promote uniform distribution of heat along the heat dissipation bracket 40. The heat radiation layer 4 is located on the surface of the black film or graphite layer, and dissipates the heat in the black film or graphite layer outward in the form of radiation energy.

[0086] Combination Figure 2 , 3 As shown, in some embodiments, the electronic device also includes a screen 60 and a temperature homogenizer 70, the screen 60 is located on the surface of the shell 20, the temperature homogenizer 70 is located on the non-display side of the screen 60, the heat absorbing end of the temperature homogenizer 70 is close to at least one heat source device 10, and the heat releasing end of the temperature homogenizer 70 extends in a direction parallel to the non-display surface of the screen 60.

[0087] The electronic device of this embodiment uses a temperature homogenizing plate 70 on the screen 60 side to absorb the heat of the heat source device 10 and extends in a direction parallel to the screen 60 to evenly distribute the heat in the entire electronic device to avoid heat accumulation at the mainboard 30.

[0088] Combination Figure 2 , 3 As shown, in some embodiments, at least one heat source device 10 is located on at least one of the two sides of the mainboard 30, and the heat dissipation layer 1 and the temperature averaging plate 70 are respectively located on both sides of the mainboard 30. By arranging the temperature averaging layer and the temperature averaging plate 70 on both sides of the mainboard 30, the heat source device 10 on the mainboard 30 can be cooled from both sides thereof.

[0089] Reference Figure 2 On the side of the main board 30 facing the screen 60, a shielding cover 301 is further provided. The shielding cover 301 covers the heat source device 10 to achieve electromagnetic shielding of the heat source device 10. The inner side of the shielding cover 301 is thermally connected to the heat source device 10, and the outer side of the shielding cover 301 is thermally connected to the heat absorption end of the heat pipe 70. The thermal connection method is, for example, filling with thermal conductive silicone.

[0090] Combined Figure 2 、 3 As shown in the figure, in some embodiments, the part of the housing 20 opposite to the screen 60 is formed as a rear cover 201, and the heat transmission window 2 is located on the rear cover 201; the rear cover 201 is further provided with a camera window 2011, and the camera window 2011 does not coincide with the heat transmission window 2. By arranging the heat transmission window 2 on the rear cover 201, the heat on the rear cover 201 side can be dissipated outward through the rear cover 201 in the form of radiant energy, which can solve the problem that the heat dissipation path on the rear cover 201 side of the electronic device is blocked and the heat dissipation is difficult.

[0091] Verified, taking the smartphone usage scenario as an example, the temperature of the main board area is generally 40 - 50 degrees. At this temperature, the proportion of radiant heat dissipation is as high as 40 - 50%. Using the heat dissipation structure of the present invention, the heat in this part can be efficiently dissipated through the heat transmission window 2, and the temperature of the back of the mobile phone can be reduced by at least 2 degrees.

[0092] In some possible implementation manners, the electronic device can be any one of various types of computer system devices that are mobile or portable and have heat dissipation requirements. Specifically, the electronic device can be a mobile phone or a smart phone (for example, a phone based on iPhone TM, a phone based on Android TM), a portable game device (for example, Nintendo DS TM, PlayStation Portable TM, Gameboy Advance TM, iPhone TM), a laptop computer, a PDA, a portable Internet device, a music player, and a data storage device, other handheld devices, and such as headsets, etc. The electronic device can also be other wearable devices that need to be charged (for example, a head-mounted device (HMD) such as an electronic bracelet, an electronic necklace, an electronic device, or a smart watch).

[0093] The electronic device can also be any one of a plurality of electronic devices, which include but are not limited to cellular phones, smart phones, other wireless communication devices, personal digital assistants, audio players, other media players, music recorders, video recorders, other media recorders, radios, medical devices, vehicle transportation instruments, calculators, programmable remote controls, pagers, laptop computers, desktop computers, printers, netbook computers, personal digital assistants (PDAs), portable multimedia players (PMPs), Moving Picture Experts Group (MPEG-1 or MPEG-2) Audio Layer 3 (MP3) players, portable medical devices, digital cameras, and combinations thereof, etc.

[0094] In some cases, the electronic device can perform multiple functions (e.g., playing music, displaying videos, storing pictures, and receiving and sending phone calls). If needed, the electronic device can be a device such as a cellular phone, a media player, other handheld devices, a wristwatch device, a pendant device, a headset device, or other compact and portable devices.

[0095] It should be noted that, as used herein, "a number of", "at least one" means one or more, "a plurality of", "at least two" means two or more. "And / or" describes the association relationship of associated objects and indicates that three relationships can exist. For example, A and / or B can represent: A exists alone, A and B exist simultaneously, and B exists alone. The character " / " generally means that the associated objects before and after are in an "or" relationship.

[0096] In the description of the present disclosure, unless otherwise clearly specified and limited, the terms "installed", "connected", "coupled" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection; it can be directly connected, or indirectly connected through an intermediate medium, and it can be the communication inside two components or the interaction relationship between two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present disclosure can be understood according to specific situations.

[0097] In addition, the terms "first", "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the quantity of the indicated technical features. Thus, the features defined with "first", "second" can explicitly or implicitly include one or more features. In the description of the present disclosure, the meaning of "a plurality of" is two or more, unless otherwise clearly specifically defined.

[0098] In the description of this specification, the description referring to the terms "certain embodiments", "one embodiment", "some embodiments", "schematic embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials, or characteristics described in connection with the embodiments or examples are included in at least one embodiment or example of the present disclosure.

[0099] The above are only examples of the present disclosure and are not intended to limit the present disclosure. Any modifications, equivalent replacements, improvements, etc. made within the principles of the present disclosure shall be included within the protection scope of the present disclosure.

Claims

1. A heat dissipation structure, characterized in that, The heat dissipation structure includes: a heat dissipation layer (1) and a heat transmission window (2); The heat dissipation layer (1) is provided with a heat absorption surface (11) and a heat release surface (12), and the heat absorption surface (11) is used for absorbing heat; The heat transmission window (2) is located on the side where the heat release surface (12) is located, and the orthographic projection of the heat transmission window (2) on the plane where the heat release surface (12) is located and the heat release surface (12) at least partially coincide.

2. The heat dissipation structure according to claim 1, wherein, The heat transmission window (2) is arranged at an interval from the heat release surface (12), and the radiant heat emitted by the heat release surface (12) is transmitted outward through the heat transmission window (2).

3. The heat dissipation structure according to claim 1, wherein A heat conduction connecting member (3) is provided on the heat absorption surface (11); The heat conduction connecting member (3) includes one or more of the following: an adhesive layer, a heat conduction gasket, and a heat conduction gel layer.

4. The heat dissipation structure according to claim 1, wherein The heat dissipation layer (1) includes one or more of the following: a graphite film, a graphene film, a heat pipe, and a heat pipe fitting.

5. The heat dissipation structure according to claim 1, wherein, The heat dissipation structure further includes a heat radiation layer (4), the heat radiation layer (4) is located on the heat release surface (12), and the heat radiation layer (4) covers at least a part of the surface of the heat release surface (12); The orthographic projection of the heat transmission window (2) on the plane where the heat radiation layer (4) is located and the heat radiation layer (4) at least partially coincide.

6. The heat dissipation structure according to claim 5, wherein, The heat radiation layer (4) includes one or more of the following: a lipid film layer, a polymer film layer, a carbon powder coating, a graphene powder coating, and a black paint coating.

7. The heat dissipation structure according to claim 5, characterized in that, The radiation transmittance of the heat transmission window (2) in the infrared band range is greater than or equal to 70%; and / or, The radiation emissivity of the heat radiation layer (4) in the infrared band range is greater than or equal to 0.

9.

8. The heat dissipation structure according to claim 5, characterized in that, The area of the heat release surface (12) covered by the heat radiation layer (4) is greater than or equal to 80% of the total area of the heat release surface (12); and / or, The area where the orthographic projection of the heat transmission window (2) on the plane where the heat radiation layer (4) is located and the heat radiation layer (4) coincide is greater than or equal to 80% of the total area of the heat radiation layer (4).

9. A housing assembly, characterized in that, The housing assembly includes: a housing (20), and the heat dissipation structure according to any one of claims 1-8; The heat dissipation layer (1) is located inside the housing (20), and the heat transmission window (2) is located on the housing (20).

10. An electronic device, characterized in that, The electronic device includes: at least one heat source device (10), a housing (20), and the heat dissipation structure according to any one of claims 1 to 8; The at least one heat source device (10) is located inside the housing (20), the heat dissipation layer (1) is located on the side of the at least one heat source device (10) facing the housing (20), and the heat transmission window (2) is located on the housing (20).

11. The electronic device according to claim 10, wherein The electronic device further includes a main board (30), a heat dissipation bracket (40), and a battery compartment (50), and the heat dissipation structure includes a heat radiation layer (4); The at least one heat source device (10) is located on the main board (30); At least a part of the heat dissipation bracket (40) is located on the heat release surface (12), at least a part of the heat dissipation bracket (40) extends into the battery compartment (50), and the heat radiation layer (4) is located on a side of the heat dissipation bracket (40) facing away from the heat release surface (12).

12. The electronic device according to claim 11, wherein The electronic device further includes a screen (60) and a heat pipe (70). The screen (60) is located on the surface of the housing (20). The heat pipe (70) is located on a non-display side of the screen (60). A heat absorption end of the heat pipe (70) is close to the at least one heat source device (10), and a heat release end of the heat pipe (70) extends in a direction parallel to the non-display surface of the screen (60).

13. The electronic device according to claim 12, wherein The at least one heat source device (10) is located on at least one of two sides of the main board (30), and the heat dissipation layer (1) and the heat pipe (70) are respectively located on two sides of the main board (30).

14. The electronic device according to claim 12, wherein A part of the housing (20) opposite to the screen (60) is formed as a rear cover (201), and the heat transmission window (2) is located on the rear cover (201); The rear cover (201) is further provided with a camera window (2011), and the camera window (2011) does not coincide with the heat transmission window (2).

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