Welding device for PCB machining

Abstract

The utility model relates to the technical field of PCB (printed circuit board) processing, in particular to a welding device for PCB processing, which comprises a fixing component used for fixing a PCB provided with a through hole for inserting an electronic element; the moving mechanism is fixedly arranged relative to the fixing assembly; the plurality of welding heads are arranged on the moving mechanism and are arranged on the upper side of the PCB; the wire feeding mechanisms are arranged on the moving mechanism, correspond to the welding heads respectively and are used for conveying welding wires to the welding heads respectively, and the moving mechanism is used for driving the welding heads and the wire feeding mechanisms to move; the heating mechanism is connected with the welding heads and used for heating the welding heads; the liquid supply mechanism is connected with the welding heads and used for conveying welding auxiliary liquid to the welding heads. The utility model relates to a welding device for PCB (printed circuit board) processing, which aims to solve the problems of high automatic welding complexity and difficulty in daily use in the prior art.

Description

Technical Field

[0001] The utility model relates to the technical field of PCB board processing, and more specifically, to a welding device for PCB board processing. Background Art

[0002] PCB (Printed Circuit Board), the Chinese name is printed circuit board, also known as printed wiring board, is an important electronic component, a support for electronic components, and a carrier for electrical connection of electronic components. Since it is made by electronic printing technology, it is called a "printed" circuit board.

[0003] After the PCB board completes the multi-layer circuit engraving, it is necessary to attach electronic components at the through holes on it and fix them by welding. The automatic welding of electronic components in the prior art is mostly applied in the SMT (Surface Mounted Technology) workshop. Specifically, a squeegee and a template steel sheet with holes are used in cooperation to scrape solder paste at the hole positions on the PCB board. Then, the electronic components are inserted into the corresponding positions by a pick-and-place machine and fixed by laser heating. However, the above processing method has a high complexity and is not convenient for daily use. Summary of the Utility Model

[0004] The main purpose of the utility model is to propose a welding device for PCB board processing, aiming to solve the problems of high complexity and inconvenient daily use in automatic welding in the prior art.

[0005] In order to solve the above technical problems, a welding device for PCB board processing is proposed, including: a fixing component for fixing the PCB board, and the PCB board is provided with through holes for inserting electronic components;

[0006] A moving mechanism fixedly arranged relative to the fixing component;

[0007] A plurality of welding heads arranged on the moving mechanism and located above the PCB board;

[0008] A plurality of wire feeding mechanisms arranged on the moving mechanism, corresponding to each of the welding heads respectively, for feeding welding wires to each of the welding heads respectively, and the moving mechanism is used to drive each of the welding heads and each of the wire feeding mechanisms to move;

[0009] A heating mechanism connected to each of the welding heads for heating each of the welding heads;

[0010] A liquid supply mechanism connected to each of the welding heads respectively for supplying welding auxiliary liquid to each of the welding heads respectively.

[0011] In any of the above technical solutions, further, the moving mechanism includes:

[0012] The first sliding mechanism is vertically arranged on the fixed component;

[0013] The second sliding mechanism is horizontally arranged on the first sliding mechanism, and the first sliding mechanism is used to drive the second sliding mechanism to slide up and down;

[0014] The sliding member is horizontally slidably arranged on the second sliding mechanism, and the welding head and the wire feeding mechanism are arranged on the sliding member;

[0015] The telescopic mechanism is arranged on the second sliding mechanism and connected to the sliding member, and is used to drive the sliding member to slide along the first direction. The second sliding mechanism is used to drive the sliding member and the telescopic mechanism to slide along the second direction, and the first direction and the second direction are arranged intersecting or perpendicular to each other.

[0016] In any of the above technical solutions, further, the wire feeding mechanism includes:

[0017] The driving motor is arranged on the moving mechanism;

[0018] The first rotating shaft is rotatably arranged on the moving mechanism;

[0019] A plurality of first rotating wheels are fixedly arranged on the first rotating shaft and are correspondingly arranged for each welding head;

[0020] The second rotating shaft is rotatably arranged on the moving mechanism;

[0021] A plurality of second rotating wheels are fixedly arranged on the second rotating shaft and are correspondingly arranged for each first rotating wheel, and there is a distance between the second rotating wheels and the first rotating wheels;

[0022] The third rotating shaft is detachably arranged on the moving mechanism and is used for placing welding wire;

[0023] A plurality of guiding members are correspondingly arranged between each first rotating wheel and each welding head.

[0024] In any of the above technical solutions, further, the welding head is inclined and the welding head is arranged in a C shape.

[0025] In any of the above technical solutions, further, the fixed component includes:

[0026] The base;

[0027] Two conveyor belts are symmetrically arranged on the base and are both used for supporting the PCB board;

[0028] The conveying mechanism is arranged on the base and is connected to the two conveyor belts and is used to drive the conveyor belts to rotate;

[0029] Two cover parts, which are slidably and symmetrically arranged on the base and respectively corresponding to the two conveyer belts, with a gap provided between them and the conveyer belts.

[0030] In any of the above technical solutions, further, the fixing component further includes:

[0031] A support member, which is arranged on the base, corresponding to the two conveyer belts, hollow in the middle, and used for supporting the PCB board;

[0032] And / or, there are support ribs at the bottom.

[0033] In any of the above technical solutions, further, it further includes:

[0034] A lifting mechanism, which is arranged on the fixing component and under the PCB board;

[0035] A rotating mechanism, which is arranged on the lifting mechanism, and the lifting mechanism is used to drive the rotating mechanism to move up and down;

[0036] A first adsorption mechanism, which is arranged on the rotating mechanism, and the rotating mechanism is used to drive the first adsorption mechanism to rotate, and the first adsorption mechanism is used to adsorb electronic components;

[0037] A feeding mechanism, which is arranged on the fixing component, corresponding to the rotating mechanism, and used for conveying electronic components.

[0038] In any of the above technical solutions, further, it further includes:

[0039] A second adsorption mechanism, which is arranged on the feeding mechanism and used for adsorbing electronic components;

[0040] A proximity detection mechanism, which is arranged on the feeding mechanism and used for detecting electronic components.

[0041] In any of the above technical solutions, further, the feeding mechanism includes:

[0042] A linear vibrator, which is arranged on the fixing component;

[0043] A guiding track, which is arranged on the linear vibrator, corresponding to the rotating mechanism, and there is a stop at the end close to the rotating mechanism.

[0044] In any of the above technical solutions, further, the guiding track is provided with an inverted C-shaped groove, and there is a chamfer at the corner of the inverted C-shaped groove.

[0045] The beneficial effects are as follows:

[0046] 1. The soldering device for PCB board processing of the present utility model adjusts the soldering head and the wire feeding mechanism through the moving mechanism, facilitating the alignment of the soldering head with the through holes on the PCB board. Under the action of the heating mechanism, the soldering head is heated to a suitable working temperature. With the assistance of the liquid supply mechanism and the input of the wire feeding mechanism, the melted part of the welding wire uniformly flows into the through holes, enabling the electronic components to uniformly contact the through holes on the PCB board, ensuring the normal progress and quality of soldering, and facilitating use.

[0047] 2. The PCB board is fixedly supported and conveyed through the fixing component. The electronic components are automatically inserted onto the PCB board through the lifting mechanism, rotating mechanism, first adsorption mechanism, and feeding mechanism arranged on the lower side of the PCB board, accurately positioning the relative positions of the electronic components and the PCB board, ensuring the quality after soldering, facilitating manual soldering and automatic soldering. After soldering, the PCB board is output and input through the fixing component, facilitating the direct soldering of other subsequent PCBs, and facilitating the improvement of efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0048] In order to more clearly illustrate the technical solutions in the embodiments of the present utility model or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the following drawings are only some embodiments of the present utility model. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0049] Figure 1 is the three-dimensional structural schematic diagram of a soldering device for PCB board processing of the present utility model;

[0050] Figure 2 is the front view sectional structural schematic diagram of a soldering device for PCB board processing of the present utility model;

[0051] Figure 3 is Figure 2 the partial enlarged structural schematic diagram at A in

[0052] Figure 4 is the right view sectional structural schematic diagram of a soldering device for PCB board processing of the present utility model;

[0053] Figure 5 is Figure 4 the partial enlarged structural schematic diagram at B in

[0054] Figure 6 is the partial structural schematic diagram of a soldering device for PCB board processing of the present utility model.

[0055] The description of the reference numerals is as follows:

[0056] 1. Fixed component; 101. Base; 102. Conveyor belt; 103. Conveying mechanism; 104. Cover; 105. Support member;

[0057] 2. Lifting mechanism;

[0058] 3. Rotating mechanism;

[0059] 4. First adsorption mechanism;

[0060] 5. Loading mechanism; 501. Linear vibrator; 502. Guide rail; 503. Stopper;

[0061] 6. Moving mechanism; 601. First sliding mechanism; 602. Second sliding mechanism; 603. Sliding member; 604. Telescopic mechanism;

[0062] 7. Welding head;

[0063] 8. Wire feeding mechanism; 801. Driving motor; 802. First rotating shaft; 803. First rotating wheel; 804. Second rotating shaft; 805. Second rotating wheel; 806. Third rotating shaft; 807. Guide member;

[0064] 9. Liquid supply mechanism; 901. Liquid storage tank; 902. Connecting pipe; 903. Solenoid valve;

[0065] 10. Second adsorption mechanism;

[0066] 11. Proximity detection mechanism. Detailed implementation manners

[0067] Next, exemplary embodiments according to the present application will be described in detail with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments of the present application. It should be understood that the present application is not limited by the exemplary embodiments described herein. All other embodiments obtained by those of ordinary skill in the art based on the embodiments in the present invention without creative efforts shall fall within the scope of protection of the present invention.

[0068] It should be noted that, as shown in the present application and the claims, unless the context clearly indicates an exception, words such as "a", "an", "one" and / or "the" are not specifically singular, but may also include plural. Generally speaking, the terms "include" and "comprise" only indicate the inclusion of the steps and elements that have been clearly identified, and these steps and elements do not constitute an exclusive list. The method or device may also include other steps or elements.

[0069] If there are directional indications (such as up, down, left, right, front, back...) involved in the embodiments of the present utility model, then such directional indications are only used to explain the relative positional relationship, movement conditions, etc. between components in a specific posture (as shown in the attached drawings). If the specific posture changes, then the directional indications will also change accordingly.

[0070] In the present utility model, unless otherwise clearly defined and limited, terms such as "connection" and "fixation" should be understood in a broad sense. For example, "fixation" can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and can be the communication inside two components or the interaction relationship between two components, unless otherwise clearly limited. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0071] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the present utility model, then such descriptions of "first", "second", etc. are only for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the quantity of the indicated technical features. Thus, the features defined with "first" and "second" can explicitly or implicitly include at least one such feature. In addition, the meaning of "and / or" appearing throughout the text includes three parallel solutions. Taking "A and / or B" as an example, it includes solution A, solution B, or the solution where A and B are satisfied simultaneously. In addition, the technical solutions between various embodiments can be combined with each other, but it must be based on the fact that those of ordinary skill in the art can implement it. When the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such a combination of technical solutions does not exist and is not within the protection scope required by the present utility model.

[0072] The present utility model provides a soldering device for PCB board processing. mainly through the cooperation of a soldering head and a liquid supply mechanism, the solder melted on the side of the through hole of the PCB board corresponding to the soldering head automatically flows into the through hole to fix the pins of electronic components, which is convenient to use.

[0073] The following will detail a soldering device for PCB board processing of the present application through the following embodiments.

[0074] In this embodiment, as Figures 1 to 6 shown, the soldering device for PCB board processing includes:

[0075] A fixing component 1 for fixing the PCB board, and the PCB board is provided with through holes for inserting electronic components;

[0076] A moving mechanism 6 fixedly arranged relative to the fixing component 1;

[0077] A plurality of welding heads 7 are arranged on the moving mechanism 6 and on the upper side of the PCB board;

[0078] A plurality of wire feeding mechanisms 8 are arranged on the moving mechanism 6, corresponding to each welding head 7 respectively, and are used to convey welding wires to each welding head 7 respectively. The moving mechanism 6 is used to drive each welding head 7 and each wire feeding mechanism 8 to move;

[0079] A heating mechanism (not shown in the figure) is connected to each welding head 7 and is used to heat each welding head 7;

[0080] A liquid supply mechanism 9 is respectively connected to each welding head 7 and is used to convey welding auxiliary liquid to each welding head 7 respectively.

[0081] In this embodiment, it further includes:

[0082] A lifting mechanism 2 is arranged on the fixed component 1 and on the lower side of the PCB board;

[0083] A rotating mechanism 3 is arranged on the lifting mechanism 2, and the lifting mechanism 2 is used to drive the rotating mechanism 3 to move up and down;

[0084] A first adsorption mechanism 4 is arranged on the rotating mechanism 3. The rotating mechanism 3 is used to drive the first adsorption mechanism 4 to rotate, and the first adsorption mechanism 4 is used to adsorb electronic components;

[0085] A feeding mechanism 5 is arranged on the fixed component 1, corresponding to the rotating mechanism 3, and is used to convey electronic components.

[0086] In this technical solution, the fixed component 1 is horizontally arranged front and back, and the PCB board is slidably arranged on the fixed component 1 front and back, which is convenient for the fixed component 1 to be docked with other conveying lines and automatically convey the PCB boards before and after processing.

[0087] The lifting mechanism 2 is a vertically arranged cylinder fixed on the base 101 of the fixed component 1. The rotating mechanism 3 is a stepping motor. The first adsorption mechanism 4 includes a fixing plate and a plurality of air valves. The air valves are connected to a negative pressure machine through hoses. The first adsorption mechanism 4 is fixed on the rotating shaft of the rotating mechanism 3, and the rotating mechanism 3 is fixed on the telescopic shaft of the lifting mechanism 2. The feeding mechanism 5 is horizontally fixed on the base 101 front and back, and the feeding mechanism 5 can convey electronic components to the side where the rotating mechanism 3 is located.

[0088] During use, the feeding mechanism 5 conveys the electronic components to the designated position. Then, the lifting mechanism 2 drives the first adsorption mechanism 4 to adsorb the next pair of electronic components. After adsorption, the lifting mechanism 2 drives the first adsorption mechanism 4 to move up, and at the same time, the rotating mechanism 3 drives the first adsorption mechanism 4 to rotate 180 degrees. After rotation, the lifting mechanism 2 continues to drive the first adsorption mechanism 4 to move up to insert the electronic components into the through holes of the PCB board on the fixed component 1.

[0089] In the technical solution, an electronic component with six pins on one side and a total of twelve pins on both sides is described. There are corresponding twelve through holes on the PCB board. At the same time, both the soldering head 7 and the wire feeding mechanism 8 are correspondingly set to six. The liquid supply mechanism 9 can be set to one, and is respectively connected to the six soldering heads 7 through six pipelines. The liquid supply mechanism 9 can also be set to six, and is correspondingly set one by one with the soldering heads 7.

[0090] The soldering head 7 is an electric soldering iron, and the heating mechanism (not shown in the figure) is electric heating and is electrically connected to the soldering head 7. Turning on the heating mechanism can heat the soldering head 7 to the corresponding temperature, usually 320°C - 420°C. The welding wire is tin wire, and the welding auxiliary liquid is rosin liquid. The moving mechanism 6 is fixed on the upper side of the base 101 of the fixed component 1, and can drive the soldering head 7 and the wire feeding mechanism 8 to move up and down, left and right, and back and forth, which is convenient for the soldering head 7 to dock with the through holes on the PCB board and also convenient for the melted tin liquid to flow into the through holes.

[0091] The liquid supply mechanism 9 is arranged in six in the front and back. The liquid supply mechanism 9 includes a liquid storage tank 901, a connecting pipe 902, and a solenoid valve 903. The liquid storage tank 901 is a piston type pressure tank, and rosin liquid is stored in the liquid storage tank 901. The solenoid valve 903 is vertically fixed on the sliding block of the moving mechanism 6, and the soldering head 7 is obliquely fixed under the solenoid valve 903. When the solenoid valve is opened, the rosin liquid in the liquid storage tank 901 flows along the connecting pipe 902 and the soldering head 7 to the through holes of the PCB board.

[0092] In this embodiment, the fixed component 1 includes:

[0093] The base 101, the lifting mechanism 2 and the feeding mechanism 5 are arranged on the base 101;

[0094] Two conveyor belts 102 are symmetrically arranged on the base 101 and are both used to support the PCB board;

[0095] The conveying mechanism 103 is arranged on the base 101 and is connected to the two conveyor belts 102 for driving the conveyor belts 102 to rotate;

[0096] Two cover parts 104 are slidably and symmetrically arranged on the base 101, and are respectively arranged corresponding to the two conveyor belts 102, and there is a gap between them and the conveyor belts 102.

[0097] In this technical solution, the base 101 is arranged in a C-shaped frame, and the lifting mechanism 2 and the feeding mechanism 5 are fixed on the inner bottom surface of the base 101. The conveyor belt 102 is a belt, and the conveying mechanism 103 includes a driving motor 801, a driving wheel, a driven wheel and a tensioning wheel. The three wheels are connected by the conveyor belt 102. The driving motor 801 is connected to the driving wheel. The PCB boards are symmetrically arranged on the two conveyor belts 102 left and right. The cover 104 is L-shaped, symmetrically arranged left and right, and slidable up and down on both sides of the base 101. The top of the cover 104 is parallel to the upper part of the conveyor belt 102, both are horizontally arranged, and there is a gap between them. The PCB board is clamped in this gap.

[0098] In this embodiment, the fixing assembly 1 further includes:

[0099] A support member 105, arranged on the base 101, corresponding to the two conveyor belts 102, hollow in the middle, for supporting the PCB board;

[0100] And / or, there are support ribs (not shown in the figure) at the bottom.

[0101] In this technical solution, the support member 105 is fixed in the base 101 in a rectangular frame shape. There are step surfaces at the positions of the left and right sides of the support member 105 close to the conveyor belt 102, so that the top surface of the support member 105 is flush with the top surface of the conveyor belt 102, providing horizontal support for the PCB board. There are two vertically arranged support ribs (not shown in the figure) at the bottom inside the support frame to enhance the structural strength of the support member 105.

[0102] In some technical solutions, the support member 105 is provided with a notch for avoiding local structures on the PCB board.

[0103] In this embodiment, it further includes:

[0104] A second adsorption mechanism 10, arranged on the feeding mechanism 5, for adsorbing electronic components;

[0105] A proximity detection mechanism 11, arranged on the feeding mechanism 5, for detecting electronic components.

[0106] In this technical solution, the structure of the second adsorption mechanism 10 is the same as that of the first adsorption mechanism 4, and it is horizontally fixed at the front end of the guiding track 502 of the feeding mechanism 5 front and back. The proximity detection mechanism 11 is a proximity sensor. When the feeding mechanism 5 conveys the electronic components forward and approaches the proximity detection mechanism 11, the proximity detection mechanism 11 sends a control signal, the controller in the device controls the feeding mechanism 5 to close, and controls the second adsorption mechanism 10 to open, so that the electronic components are accurately fixed at the front end of the guiding track 502, facilitating the subsequent rotation mechanism 3 and the first adsorption mechanism 4 to accurately adsorb the electronic components.

[0107] In this embodiment, the feeding mechanism 5 includes:

[0108] A linear vibrator 501 is provided on the fixed component 1;

[0109] A guiding track 502 is provided on the linear vibrator 501, corresponding to the rotating mechanism 3, and a stop member 503 is provided at the end of the guiding track 502 close to the rotating mechanism 3.

[0110] In this technical solution, the linear vibrator 501 is fixedly provided on the base 101, the guiding track 502 is horizontally arranged before and after on the linear vibrator 501, and the stop member 503 is a baffle, which is vertically fixed at the front end of the guiding track 502. When in use, turning on the linear vibrator 501 can drive the electronic components to move forward along the guiding groove on the guiding track 502.

[0111] In some technical solutions, the guiding track 502 is provided with an inverted C-shaped groove, and a chamfer is provided at the corner of the inverted C-shaped groove.

[0112] In this embodiment, the moving mechanism 6 includes:

[0113] A first sliding mechanism 601 is vertically provided on the fixed component 1;

[0114] A second sliding mechanism 602 is horizontally provided on the first sliding mechanism 601, and the first sliding mechanism 601 is used to drive the second sliding mechanism 602 to slide up and down;

[0115] A sliding member 603 is horizontally slidably provided on the second sliding mechanism 602, and the welding head 7 and the wire feeding mechanism 8 are provided on the sliding member 603;

[0116] A telescopic mechanism 604 is provided on the second sliding mechanism 602, connected to the sliding member 603, and is used to drive the sliding member 603 to slide along the first direction. The second sliding mechanism 602 is used to drive the sliding member 603 and the telescopic mechanism 604 to slide along the second direction, and the first direction and the second direction are intersecting or perpendicular.

[0117] In this technical solution, both the first sliding mechanism 601 and the second sliding mechanism 602 are screw rod slider moving mechanisms 6 driven by motors. The first sliding mechanism 601 is vertically arranged, and the second sliding mechanism 602 is horizontally arranged left and right on the slider of the first sliding mechanism 601. The sliding member 603 is slidably arranged before and after through two guiding shafts under the slider of the second sliding mechanism 602. The telescopic mechanism 604 is a cylinder, horizontally fixed at the rear side of the slider of the second sliding mechanism 602, and the welding head 7 and the wire feeding mechanism 8 are fixed on the sliding member 603.

[0118] In this embodiment, the wire feeding mechanism 8 includes:

[0119] A driving motor 801 is provided on the moving mechanism 6;

[0120] The first rotating shaft 802 is rotatably arranged on the moving mechanism 6;

[0121] A plurality of first rotating wheels 803 are fixedly arranged on the first rotating shaft 802 and are correspondingly arranged for each welding head 7;

[0122] The second rotating shaft 804 is rotatably arranged on the moving mechanism 6;

[0123] A plurality of second rotating wheels 805 are fixedly arranged on the second rotating shaft 804 and are correspondingly arranged for each first rotating wheel 803, and there is a spacing between the second rotating wheels 805 and the first rotating wheels 803;

[0124] The third rotating shaft 806 is detachably arranged on the moving mechanism 6 and is used for placing welding wire;

[0125] A plurality of guiding members 807 are correspondingly arranged between each first rotating wheel 803 and each welding head 7.

[0126] In this technical solution, the first rotating shaft 802 and the second rotating shaft 804 are both rotatably arranged horizontally front and back on the sliding member 603. There are six first rotating wheels 803 and six second rotating wheels 805 correspondingly arranged. The third rotating shaft 806 is fixedly or rotatably arranged at the upper side position of the sliding member 603. Six wire spools are correspondingly arranged on the third rotating shaft 806. The open end of the wire spool passes between the first rotating wheel 803 and the second rotating wheel 805 and extends to the bottom end of the welding head 7 through the guiding member 807.

[0127] In some technical solutions, the third rotating shaft 806 is detachably arranged on the sliding member 603 through bolts, so as to facilitate the replacement of the wire spool.

[0128] In other technical solutions, the guiding member 807 is a hollow tubular structure, and the diameter of the end of the guiding member 807 close to the first rotating wheel 803 and the second rotating wheel 805 is larger, and the hollow part is also larger. The diameter of the end of the guiding member 807 close to the welding head 7 is smaller.

[0129] In still other technical solutions, the driving motor 801 is connected to the first rotating shaft 802 or the second rotating shaft 804. Further, two meshing gears are also arranged on the first rotating shaft 802 and the second rotating shaft 804, so that the driving motor 801 can synchronously drive the first rotating shaft 802 and the second rotating shaft 804 to move towards each other.

[0130] In other technical solutions, an arc-shaped groove is arranged in the middle of the first rotating wheel 803 and the second rotating wheel 805, increasing the contact area with the welding wire and improving the stability of conveying.

[0131] In this technical solution, the welding head 7 is inclined and the welding head 7 is arranged in a C shape.

[0132] The embodiments of the present disclosure have been described above. The above description is exemplary, not exhaustive, and is not limited to the disclosed embodiments. Many modifications and variations are obvious to those of ordinary skill in the art without departing from the scope and spirit of the described embodiments. The choice of terms used herein is intended to best explain the principles of the embodiments, practical applications, or improvements to technologies in the market, or to enable other ordinary skill in the art to understand the embodiments disclosed herein.

Claims

1. A soldering device for PCB board processing, characterized in that, Including: A fixing component (1) for fixing a PCB board, and the PCB board is provided with through holes for inserting electronic components; A moving mechanism (6) fixedly arranged relative to the fixing component (1); A plurality of welding heads (7) arranged on the moving mechanism (6) and on the upper side of the PCB board; A plurality of wire feeding mechanisms (8) arranged on the moving mechanism (6), respectively corresponding to each of the welding heads (7), for respectively feeding welding wires to each of the welding heads (7), and the moving mechanism (6) is used to drive each of the welding heads (7) and each of the wire feeding mechanisms (8) to move; A heating mechanism connected to each of the welding heads (7) for heating each of the welding heads (7); A liquid supply mechanism (9) respectively connected to each of the welding heads (7) for respectively supplying welding auxiliary liquid to each of the welding heads (7).

2. The soldering device for PCB board processing according to claim 1, wherein, The moving mechanism (6) includes: A first sliding mechanism (601) vertically arranged on the fixing component (1); A second sliding mechanism (602) horizontally arranged on the first sliding mechanism (601), and the first sliding mechanism (601) is used to drive the second sliding mechanism (602) to slide up and down; A sliding member (603) horizontally slidably arranged on the second sliding mechanism (602), and the welding heads (7) and the wire feeding mechanisms (8) are arranged on the sliding member (603); A telescopic mechanism (604) arranged on the second sliding mechanism (602) and connected to the sliding member (603) for driving the sliding member (603) to slide in a first direction, and the second sliding mechanism (602) is used to drive the sliding member (603) and the telescopic mechanism (604) to slide in a second direction, and the first direction and the second direction are intersecting or perpendicular.

3. The soldering device for PCB board processing according to claim 1, wherein, The wire feeding mechanism (8) includes: A driving motor (801) arranged on the moving mechanism (6); A first rotating shaft (802) rotatably arranged on the moving mechanism (6); A plurality of first rotating wheels (803) fixedly arranged on the first rotating shaft (802) and respectively corresponding to each of the welding heads (7); A second rotating shaft (804) rotatably arranged on the moving mechanism (6); A plurality of second rotating wheels (805) fixedly arranged on the second rotating shaft (804) and respectively corresponding to each of the first rotating wheels (803), with a spacing between the second rotating wheels (805) and the first rotating wheels (803); A third rotating shaft (806) detachably arranged on the moving mechanism (6) for placing welding wires; A plurality of guiding members (807) respectively arranged between each of the first rotating wheels (803) and each of the welding heads (7).

4. The soldering device for PCB board processing according to claim 1, wherein, The welding head (7) is inclined and the welding head (7) is arranged in a C shape.

5. The soldering device for PCB board processing according to claim 1, characterized in that, The fixing component (1) includes: A base (101); Two conveyor belts (102) symmetrically arranged on the base (101), both for supporting the PCB board; A conveying mechanism (103) arranged on the base (101) and connected to the two conveyor belts (102) for driving the conveyor belts (102) to rotate; Two cover members (104), which are slidably and symmetrically arranged on the base (101), respectively corresponding to two of the conveyor belts (102), and there is a gap between them and the conveyor belts (102).

6. The soldering device for PCB board processing according to claim 5, characterized in that, The fixing component (1) further includes: A support member (105), which is arranged on the base (101), corresponding to two of the conveyor belts (102), hollow in the middle, and is used to support the PCB board; And / or, there are support ribs at the bottom.

7. The soldering device for PCB board processing according to claim 1, wherein, It further includes: A lifting mechanism (2), which is arranged on the fixing component (1) and is arranged on the lower side of the PCB board; A rotating mechanism (3), which is arranged on the lifting mechanism (2), and the lifting mechanism (2) is used to drive the rotating mechanism (3) to move up and down; A first adsorption mechanism (4), which is arranged on the rotating mechanism (3), the rotating mechanism (3) is used to drive the first adsorption mechanism (4) to rotate, and the first adsorption mechanism (4) is used to adsorb electronic components; A feeding mechanism (5), which is arranged on the fixing component (1), corresponding to the rotating mechanism (3), and is used to convey electronic components.

8. The soldering device for PCB board processing according to claim 7, wherein It further includes: A second adsorption mechanism (10), which is arranged on the feeding mechanism (5) and is used to adsorb electronic components; A proximity detection mechanism (11), which is arranged on the feeding mechanism (5) and is used to detect electronic components.

9. The soldering device for PCB board processing according to claim 7, wherein, The feeding mechanism (5) includes: A linear vibrator (501), which is arranged on the fixing component (1); A guiding track (502), which is arranged on the linear vibrator (501), corresponding to the rotating mechanism (3), and there is a stop member (503) near the end of the rotating mechanism (3).

10. The soldering device for PCB board processing according to claim 9, characterized in that, The guiding track (502) is provided with an inverted C-shaped groove, and there is a chamfer at the corner of the inverted C-shaped groove.

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