Automatic suction mechanism for BGA communication products

Abstract

The utility model relates to the technical field of communication product processing auxiliary equipment, in particular to a BGA communication product automatic suction mechanism which comprises a cross rod, a moving device connecting rod and a suction nozzle. The moving device connecting rod is installed in the middle of the top of the cross-shaped rod, the cross-shaped rod is composed of four sets of supporting rods which are annularly and evenly distributed, the supporting rods and the moving device connecting rod are connected in a clamping mode, the ends, away from the moving device connecting rod, of the supporting rods are connected with telescopic pieces, and the ends of the telescopic pieces are connected with connecting bases. The bottom of the connecting base is connected with the suction rod through the buffer connecting piece, the suction nozzle is detachably installed at the bottom end of the suction rod, under the action of the buffer connecting piece, a buffer distance to a certain degree is provided for the suction nozzle, it is guaranteed that when the moving device controls the cross rod to drive the suction nozzle to make contact with the chip for adsorption, the instant adsorption impact force is reduced, and the protection capacity for the chip is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of communication product processing auxiliary equipment, in particular to an automatic suction mechanism for BGA communication products. Background Technique

[0002] The rapid development of the digital industry has greatly affected people's lives and promoted social progress. For example, emerging technologies such as cloud computing and virtualization are widely used, and entertainment methods such as short videos and VR (Virtual Reality) are popular on a large scale, and emerging technologies such as autonomous driving and artificial intelligence are gradually realized. The development of these emerging applications has put forward higher requirements for the computing power, bandwidth, and quality of the network. It is expected that the data center bandwidth needs to increase by more than 50% every year in the future. The development of emerging applications has also had a great impact on the distribution of network traffic. For example, cloud computing applications such as remote desktops and remote servers need to place computing, storage, and network resources in data centers and resource pools, making the data center network carry more and more horizontal traffic and requiring further improvement of network bandwidth.

[0003] At present, 100G data center networks are gradually popularized, and 400G data center networks have become an important direction for upgrading and are also the basis for the further development of data center networks to 800G or higher speeds. Higher processing speeds have higher requirements for heat dissipation and also have higher requirements for the quality of chips.

[0004] The functions of data communication switches are constantly improving, and the requirements for the data processing functions of data exchange chips are becoming more and more powerful, while the chip size and weight are getting larger. The higher the requirements for the processes of SMT surface mounting equipment and repair equipment, the greater the difficulty. High-end switches have become the mainstream for subsequent digital infrastructure applications. The SMT surface-mounted BGA has a large size and a varying number of solder ball pins, ranging from 5,000 to 10,000. During the production process, it is relatively easy to produce welding defects such as solder bridging, open soldering, and pillow defects. Moreover, there are many objective difficulties in the actual repair process. Therefore, in order to ensure the normal application of large-size BGAs and improve the repair process capabilities, the BGA rework station's convection heating equipment is used for repair. Convection heating is mainly used for components where the solder joints are under the device body or partially covered by the body, making it difficult to use continuous direct heating for repair. In practice, it can also be used for the installation and removal of surface-mounted components, BGA removal and installation, all of which are carried out through automatic nozzles. The BGA rework station selects the corresponding disassembly and assembly program and starts heating up. When the temperature rises to the melting point of the BGA solder balls, which is 217 degrees, and the peak temperature rises to about 245 degrees, one nozzle closely adheres to the BGA surface and sucks the BGA through vacuum. The BGA solder balls are lifted by the automatic descent of the nozzle. Since one nozzle sucks at the center position of the BGA and the middle of the large-size BGA is a silicon wafer, when the nozzle lifts it, air needs to be excluded, and when it presses down to contact the chip, stress will be generated, which may cause internal damage and lead to scrapping. The existing BGA repair is that the operator fixes the substrate on the fixture, the BGA rework station needs to replace the device for positioning, heats to remove the BGA, brushes the soldering paste, uses a soldering iron to heat the solder wick to remove the solder, cleans the pads, positions the stencil to brush the soldering paste, installs the BGA rework station to heat and weld. During this process, single-nozzle positioning for disassembly and assembly is difficult, the stability of single-nozzle positioning is insufficient, and the repair efficiency and quality are low. Therefore, in view of the above problems, this technical solution proposes an automatic suction mechanism for BGA communication products. Summary of the Invention

[0005] The purpose of the present utility model is to provide an automatic suction mechanism for BGA communication products to solve the problems raised in the above background technology.

[0006] To achieve the above object, the present utility model provides the following technical solution: An automatic suction mechanism for a BGA communication product, comprising a cross bar, a moving device connecting rod, and a suction nozzle; the moving device connecting rod is installed in the middle of the top of the cross bar, and the moving device connecting rod is connected to the moving device. The moving device drives the moving device connecting rod to transfer in ways such as lifting and rotating. The cross bar is composed of four groups of support rods evenly distributed in a ring. There is a snap connection between the support rod and the moving device connecting rod. One end of the support rod far from the moving device connecting rod is connected with a telescopic member, and the end of the telescopic member is connected with a connection base. The telescopic member is used to adjust the position of the connection base relative to the moving device connecting rod, so as to adjust and stably adsorb and position for the repair of chips of different shapes. The moving device connecting rod is snap-connected to the support rod, which is used to select and install an appropriate number of connection bases according to the mass when adsorbing chips of different masses, that is, while ensuring stable adsorption and positioning of the chips, reducing the number of support rods and the suction nozzles below them, thereby reducing the overall structural mass, and further reducing the power consumption of the moving device. The bottom of the connection base is connected with a suction rod through a buffer connecting member, and the bottom end of the suction rod is detachably installed with a suction nozzle. Under the action of the buffer connecting member, a certain degree of buffer distance is provided for the suction nozzle, ensuring that when the moving device controls the cross bar to drive the suction nozzle to contact and adsorb the chip, the instantaneous adsorption impact force is reduced, that is, the protection ability for the chip is increased.

[0007] Compared with the prior art, the beneficial effects of the present utility model are as follows: By detachably installing multiple groups of support rods with adjustable lengths on the outer wall of the moving device connecting rod, and then buffer-installing the suction nozzles at the bottom ends of the support rods, that is, using multiple groups of suction nozzles to facilitate the full and stable suction and transfer of the chips, and using the support rods with adjustable lengths to apply a balanced adsorption force to chips of different shapes and sizes for suction, and using the elastic connection between the suction nozzle and the connection base to reduce the impact force when the suction nozzle contacts and adsorbs the chip instantaneously, that is, increasing the safety during suction. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] Figure 1 It is an external three-dimensional structure schematic diagram of an automatic suction mechanism for a BGA communication product;

[0009] Figure 2 It is a top view structure schematic diagram of an automatic suction mechanism for a BGA communication product;

[0010] Figure 3 For Figure 2 the sectional view taken along A-A in

[0011] Figure 4 It is a front view internal structure schematic diagram of an automatic suction mechanism for a BGA communication product;

[0012] Wherein: suction rod 1, sleeve spring 2, cross rod 3, connecting base 4, nozzle rod 5, moving device connecting rod 7, connecting cylinder 8, nozzle 9, buffer rod 10, screw cylinder 11, screw rod 12, pin 13, card slot 14, spring positioning slot 21. Specific embodiments

[0013] It should be noted that, without conflict, the embodiments in the present utility model and the features in the embodiments can be combined with each other.

[0014] In the description of the present utility model, it should be understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus cannot be understood as a limitation to the present utility model. In addition, the terms "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the quantity of the indicated technical features. Thus, the features defined with "first", "second", etc. may explicitly or implicitly include one or more of such features. In the description of the present utility model, unless otherwise specified, the meaning of "a plurality" is two or more.

[0015] In the description of the present utility model, it should be noted that unless otherwise clearly specified and limited, the terms "installation", "connection", and "connection" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood through specific situations.

[0016] The present utility model will be described in detail below with reference to the drawings and in combination with the embodiments.

[0017] Please refer to Figures 1 - 4, An automatic suction mechanism for BGA communication products, comprising a cross bar 3, a moving device connecting rod 7, and a suction nozzle 9; the moving device connecting rod 7 is installed in the middle of the top of the cross bar 3, and the moving device connecting rod 7 is connected to the moving device. The moving device drives the moving device connecting rod 7 to transfer in ways such as lifting and rotating. The cross bar 3 is composed of four groups of support rods evenly distributed in a ring shape. There is a snap connection between the support rods and the moving device connecting rod 7. A telescopic member is connected to the end of the support rod away from the moving device connecting rod 7, and a connection base 4 is connected to the end of the telescopic member. The telescopic member is used to adjust the position of the connection base relative to the moving device connecting rod 7, so as to adjust the stable adsorption and positioning for the repair of chips with different shapes. The moving device connecting rod 7 is snap-connected to the support rod, which is used to select and install an appropriate number of connection bases 4 according to the mass of the chips when adsorbing chips with different masses. That is, while ensuring the stable adsorption and positioning of the chips, the number of support rods and the suction nozzles below them is reduced, thereby reducing the overall structure mass and further reducing the power consumption of the moving device. A suction rod is connected to the bottom of the connection base 4 through a buffer connecting member, and a suction nozzle 9 is detachably installed at the bottom of the suction rod. Under the action of the buffer connecting member, a certain degree of buffer distance is provided for the suction nozzle 9, ensuring that when the moving device controls the cross bar 3 to drive the suction nozzle 9 to contact and adsorb the chip, the instantaneous adsorption impact force is reduced, that is, the protection ability for the chip is increased.

[0018] In the embodiment of the present invention, Figure 1 The figure shows a schematic diagram when the telescopic member is not provided on the support rod and the support rod is fixedly connected to the side wall of the moving device connecting rod 7; secondly, all components in this suction mechanism are made of alloy materials and have the characteristic of being resistant to high temperature without deformation. The suction nozzle 9 is made of high-temperature resistant silicone material, which ensures that it can still perform stable suction and transfer when subjected to high temperature.

[0019] It should be noted that the moving device includes a lifting mechanism, a rotating mechanism, etc. The specific structure depends on the requirements of use and movement. Specifically, the selection types of the lifting mechanism and the rotating mechanism, as well as their specific installation and use, can all adopt existing conventional equipment, and no further description will be given here.

[0020] In an example of the present invention, a snap pin 13 is installed at one end of the support rod facing the moving device connecting rod 7, and a card slot 14 is opened on the side wall of the moving device connecting rod 7 corresponding to the snap pin 13. The snap pin 13 is snap-connected to the card slot 14, which is convenient for controlling the installation and removal of the support rod according to the use requirements.

[0021] Specifically, the telescopic member includes two mounting screws 12. The opposite ends of the two screws 12 are commonly connected by a screw barrel in a threaded manner. The mutually remote ends are respectively fixedly connected to the pin 13 and the connection base 4. When adjusting the length, manually rotate the screw barrel 11 to adjust the depth of the two ends of the screw placed inside the screw barrel, thereby adjusting the position of the connection base 4 relative to the connecting rod 7 of the moving device. By adjusting the positions of the four groups of connection bases 4, uniform distribution of suction and transfer can be achieved when facing different chips.

[0022] As a preferred embodiment of the present invention, the buffer connecting member includes a buffer rod 10 telescopically disposed between the connection base 4 and the suction rod 1. Telescopic holes are respectively formed in the connection base 4 and the suction rod 1 corresponding to the buffer rod 10 to provide space for the telescopic movement of the buffer 10. At the same time, spring positioning grooves 21 are formed in the connection base 4 and the suction rod 1 corresponding to the outside of the telescopic holes. A sleeve spring 2 is sleeved on the buffer rod 10 between the spring positioning grooves 21. That is, under the action of the sleeve spring 2, elastic force is provided for the up and down buffer movement of the buffer rod 10.

[0023] As a preferred embodiment of the present invention, a connection cylinder 8 is installed at the top of the suction nozzle 9. The suction nozzle rod 5 is installed at the top of the connection cylinder 8 in a plug-in manner. The top of the suction nozzle rod 5 is installed at the bottom of the suction rod 1. The plug-in connection between the suction nozzle rod 5 and the connection cylinder 8 facilitates the installation and disassembly of the suction nozzle 9, that is, it is beneficial to perform operations such as replacement and maintenance of the suction nozzle 9.

[0024] The working principle of the present utility model is as follows: At the idle position of the device, all the above-mentioned driving members, which refer to power elements, electrical components and the adapted power supply, are connected by wires. The electrical connection is completed in the order of the working sequence of each electrical component. The detailed connection means are well-known techniques in the art. The following mainly introduces the working principle and process, and will not describe the electrical control. When in use, the moving device is installed on the top of the connecting rod 7 of the moving device. Then, according to the shape and quality of the chip to be sucked and transferred, a suitable number of support rods are selected and installed on the side wall of the connecting rod 7 of the moving device through the connection method of the pin 13 and the card slot 14. Then, by rotating the screw barrel 11, the position of the connection base 4 relative to the connecting rod 7 of the moving device is adjusted to control the use position of the suction nozzle 9 installed at the bottom of the suction rod 1. Then, the moving device is used to control the suction nozzle 9 to contact and adsorb the suction nozzle to be sucked, and then its position is transferred.

[0025] The above has made a detailed description of the preferred embodiments of this patent. However, this patent is not limited to the above embodiments. Within the scope of knowledge possessed by those of ordinary skill in the art, various changes can be made without departing from the purpose of this patent.

Claims

1. An automatic suction mechanism for a BGA communication product, characterized in that It includes a cross bar (3), a moving device connecting rod (7), and a suction nozzle (9); the moving device connecting rod (7) is installed at the middle top of the cross bar (3), the moving device connecting rod (7) is connected to the moving device, the cross bar (3) is composed of four groups of support rods evenly distributed in a ring shape, the support rods are connected to the moving device connecting rod (7) in a snap connection manner, a telescopic member is connected to the end of the support rod far away from the moving device connecting rod (7), a connection base (4) is connected to the end of the telescopic member, a suction rod is connected to the bottom of the connection base (4) through a buffer connecting member, and a suction nozzle (9) is detachably installed at the bottom end of the suction rod.

2. The automatic suction mechanism for a BGA communication product according to claim 1, wherein, A latch (13) is installed at one end of the support rod facing the moving device connecting rod (7), a card slot (14) is formed on the side wall of the moving device connecting rod (7) corresponding to the latch (13), and the latch (13) is connected to the card slot (14) in a snap connection manner.

3. The automatic suction mechanism for a BGA communication product according to claim 2, wherein, The telescopic member includes two screw rods (12) installed, a screw barrel is commonly screwed to the opposite ends of the two screw rods (12), and the mutually remote ends are respectively fixedly connected to the latch (13) and the connection base (4).

4. The automatic suction mechanism for a BGA communication product according to claim 3, characterized in that The buffer connecting member includes a buffer rod (10) telescopically arranged between the connection base (4) and the suction rod (1), telescopic holes are respectively formed in the connection base (4) and the suction rod (1) corresponding to the buffer rod (10), spring positioning grooves (21) are formed on the connection base (4) and the suction rod (1) corresponding to the outside of the telescopic holes, and a sleeve spring (2) is sleeved on the buffer rod (10) between the spring positioning grooves (21).

5. The automatic suction mechanism for a BGA communication product according to claim 4, wherein, A connection cylinder (8) is installed at the top of the suction nozzle (9), a suction nozzle rod (5) is inserted and installed at the top of the connection cylinder (8), and the top of the suction nozzle rod (5) is installed at the bottom of the suction rod (1).

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