Conductive adhesive and electronic equipment

Abstract

The embodiment of the utility model relates to the technical field of conductive adhesives, and particularly discloses a conductive adhesive and electronic equipment, comprising an insulating bonding layer comprising a first surface and a second surface which are oppositely arranged; and the plurality of conductive probes are embedded in the insulating bonding layer, one end of each conductive probe extends out of the first surface, the other end of each conductive probe extends out of the second surface, and the plurality of conductive probes are arranged at intervals. Through the above mode, the embodiment of the utility model can change the conductive mode that the original conductive adhesive adopts conductive particles or conductive wires, and the original conductive adhesive is replaced by the conductive probe with higher structural strength, so that the overall structural strength of the conductive adhesive is improved, the conductive adhesive is not easily influenced by external force, and the performance is more stable.

Description

Technical Field

[0001] Embodiments of the present utility model relate to the technical field of conductive adhesives, and particularly to a conductive adhesive and an electronic device. Background Art

[0002] A conductive adhesive is an adhesive that has a certain electrical conductivity after curing or drying. It is used to connect a variety of conductive materials together to form an electrical path between the connected conductive materials. According to the conductive direction, it is divided into isotropic conductive adhesives (ICAs) and anisotropic conductive adhesives (ACAs). As a connection medium that conducts electricity in one direction, anisotropic conductive adhesives are applied to the field of packaging of electronic components and the connection of micro-pitch components.

[0003] In the process of implementing the present utility model, the inventor of the present utility model found that: at present, existing anisotropic conductive adhesives use conductive particles or metal wires as conductors for conducting electricity. However, due to the limited structural strength of the conductive particles or conductive wires themselves, the structural strength of the anisotropic conductive adhesive of the conductive adhesive is relatively low, and the uniformity of the distribution of the internal conductive particles and conductive wires will change significantly under the action of external forces during use, thereby affecting the contact resistance value of the anisotropic conductive adhesive. Summary of the Utility Model

[0004] The main technical problem to be solved by the embodiments of the present utility model is to provide a conductive adhesive and an electronic device that are not prone to large deformations when subjected to external forces.

[0005] To solve the above technical problem, a technical solution adopted by the present utility model is: to provide a conductive adhesive including: an insulating adhesive layer including a first surface and a second surface arranged opposite to each other; a plurality of conductive probes embedded in the insulating adhesive layer, one end of the conductive probe extending out of the first surface, the other end of the conductive probe extending out of the second surface, and the plurality of conductive probes being arranged at intervals.

[0006] Optionally, a first limiting groove is provided on the side wall of the part of the conductive probe embedded in the insulating adhesive layer; a first limiting portion extends from the insulating adhesive layer, and the first limiting portion is inserted into the first limiting groove.

[0007] Optionally, a second limiting groove is further provided on the side wall of the part of the conductive probe embedded in the insulating adhesive layer, and the first limiting groove and the second limiting groove are arranged in a cross shape; a second limiting portion extends from the insulating adhesive layer, the second limiting portion and the first limiting portion are arranged in a cross shape, and the second limiting portion is inserted into the second limiting groove.

[0008] Optionally, a third limiting portion extends from a side wall of a portion of the conductive probe embedded in the insulating adhesive layer. The third limiting portion extends in a direction parallel to the first surface, and the third limiting portion is inserted into the insulating adhesive layer.

[0009] Optionally, a first spherical conductive portion is provided at one end of the conductive probe extending out of the first surface, and second spherical conductive portions are provided at the other ends of the conductive probe extending out of the second surface.

[0010] Optionally, the plurality of conductive probes are arranged in an array.

[0011] Optionally, the distance between any two adjacent conductive probes is greater than or equal to 30 μm.

[0012] Optionally, the length of one end of the conductive probe extending out of the first surface is less than or equal to 10 μm.

[0013] Optionally, the length of the other end of the conductive probe extending out of the second surface is less than or equal to 10 μm.

[0014] Optionally, the insulating adhesive layer is insulating silicone.

[0015] Optionally, the resistance of the insulating adhesive layer is greater than or equal to 100 MΩ.

[0016] Optionally, the length of the conductive probe is greater than or equal to 0.3 mm.

[0017] To solve the above technical problems, another technical solution adopted by the present utility model is: to provide an electronic device including the above conductive adhesive.

[0018] The beneficial effects of the embodiments of the present utility model are: different from the prior art, the embodiments of the present utility model provide a conductive adhesive including an insulating adhesive layer having a first surface and a second surface disposed opposite to each other; a plurality of conductive probes embedded in the insulating adhesive layer, one end of the conductive probe extending out of the first surface, and the other end of the conductive probe extending out of the second surface, and the plurality of conductive probes are spaced apart. With the above structure, in the embodiments of the present utility model, the inherent structural strength of the conductive probes can be utilized to improve the overall structural strength of the conductive adhesive, thereby ensuring that the contact resistance value of the conductive adhesive has a smaller change range compared to the contact resistance values of existing metal wire type conductive adhesives or conductive particle type conductive adhesives, and the performance is more stable. Description of the Drawings

[0019] To more clearly illustrate the technical solutions of the embodiments of the present utility model, the following will briefly introduce the drawings required for use in the embodiments of the present utility model. Obviously, the following described drawings are only some embodiments of the present utility model. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on the drawings.

[0020] Figure 1 It is a schematic structural diagram of a conductive adhesive provided by an embodiment of the present utility model;

[0021] Figure 2 It is a schematic cross-sectional structural diagram of a conductive adhesive provided by an embodiment of the present utility model;

[0022] Figure 3 It is a schematic structural diagram of another conductive adhesive provided by an embodiment of the present utility model;

[0023] Figure 4 It is a schematic cross-sectional structural diagram of another conductive adhesive provided by an embodiment of the present utility model;

[0024] Figure 5 is Figure 4 a partial enlarged view of part A in;

[0025] Figure 6 It is a schematic structural diagram of a conductive probe provided by an embodiment of the present utility model;

[0026] Figure 7 It is a schematic structural diagram of another conductive probe provided by an embodiment of the present utility model;

[0027] Figure 8 It is a schematic cross-sectional structural diagram of yet another conductive adhesive provided by an embodiment of the present utility model;

[0028] Figure 9 It is a schematic structural diagram of a conductive probe with different types of conductive parts provided by an embodiment of the present utility model. Detailed implementation manners

[0029] To facilitate the understanding of the present utility model, the following will further illustrate the present utility model in more detail in conjunction with the drawings and specific embodiments. It should be noted that when an element is described as "fixed to" another element, it can be directly on the other element, or there can be one or more intermediate elements therebetween. When an element is described as "connected" to another element, it can be directly connected to the other element, or there can be one or more intermediate elements therebetween. The terms "vertical", "horizontal", "left", "right" and similar expressions used in this specification are only for the purpose of illustration.

[0030] Unless otherwise defined, all technical and scientific terms used in this specification have the same meaning as commonly understood by those skilled in the technical field to which this utility model belongs. The terms used in this specification in the description of the utility model are only for the purpose of describing specific embodiments and are not intended to limit the utility model. The term "and / or" used in this specification includes any and all combinations of one or more of the related listed items.

[0031] In practical applications, conductive adhesives can be classified according to the conductive direction. According to the conductive direction, they are divided into isotropic conductive adhesives (ICAs) and anisotropic conductive adhesives (ACAs). In the actual application scenarios of conductive adhesives, the anisotropic conductive adhesives are used more frequently, especially in the field of electronic component packaging: anisotropic conductive adhesives are widely used in the field of electronic component packaging, such as COG, TCP / COF, COB, and FPC, etc., as well as in scenarios such as touch screen wiring conduction and high-precision wire harness conduction. And in the field of micro-pitch component connection: it is especially suitable for scenarios with ultra-fine pitch, diverse component types, and high packaging difficulty, such as LED die bonding packaging, FPC flexible products, camera modules, liquid crystal display modules, liquid crystal driver modules, etc.

[0032] Existing anisotropic conductive adhesives usually use conductive particles or conductive wires for conduction. The working principle of anisotropic conductive adhesives is as follows: when using conductive particles, when the anisotropic conductive adhesive is subjected to a suitable external pressure, along the direction of the applied pressure, the conductive particles come into contact with each other to form a conduction circuit, so that the anisotropic conductive adhesive conducts electricity unidirectionally along the direction of the applied pressure; when using conductive wires, the circuit is conducted through metal wires. For the above-mentioned anisotropic conductive adhesives using conductive particles or conductive wires, when the anisotropic conductive adhesive is subjected to a suitable external pressure, due to the low structural strength of the conductive wires or conductive particles themselves, they are easily deformed under pressure, and the uniformity of the distribution of the conductive wires or conductive particles inside the anisotropic conductive adhesive changes, which in turn affects the contact resistance value during the use of the anisotropic conductive adhesive. Moreover, the deformation direction and displacement degree of the conductive wires or conductive particles during their deformation under pressure are uncontrollable, which easily leads to the damage of the conductive adhesive, resulting in the failure of the conductive adhesive.

[0033] The conductive adhesive of this utility model uses conductive probes with higher structural strength and optimizes the connection structure between the conductive probes and the insulating adhesive layer, so that the overall structural strength of the conductive adhesive is greatly increased, and the stability of the contact resistance value of the conductive adhesive is also ensured.

[0034] Please refer to Figure 1, The conductive adhesive 1000 includes an insulating adhesive layer 2 and a plurality of conductive probes 1. Among them, the insulating adhesive layer 2 includes a first surface 21 and a second surface 22 arranged opposite to each other; a plurality of conductive probes 1 are embedded in the insulating adhesive layer 2, one end of the conductive probe 1 extends out of the first surface 21, the other end of the conductive probe 1 extends out of the second surface 22, and the plurality of conductive probes 1 are arranged at intervals.

[0035] Specifically, a plurality of conductive probes 1 are buried according to the required preset layout to make it suitable for the required working environment. For example, if the conductive contacts of the external device to be connected are distributed in a rectangular array, then a plurality of conductive probes 1 are buried according to the rectangular array distribution; if the conductive contacts of the external device to be connected are in a circular array, then a plurality of conductive probes 1 are buried according to the circular array distribution. It should be noted that considering the actual application scenario, the conductive contacts of external devices generally adopt a general design, that is, the adjacent spacing of multiple conductive contacts is the same. Therefore, the conductive adhesive 1000 of the present invention can be distributed according to the spacing of the general design, that is, a plurality of conductive probes 1 of the present invention are arranged in an array to improve the applicability of the conductive adhesive 1000. And because the insulating adhesive layer 2 of the conductive adhesive 1000 is cuttable, the conductive adhesive 1000 has the characteristic of being cuttable, so that the conductive adhesive 1000 can meet the conductive connection requirements of different-shaped external devices, further improving the applicability of the conductive adhesive 1000. For example, when the connection part required by the external device to be connected is circular, the conductive adhesive 1000 is cut into a circular shape to make it fit the required connection part; when the connection part required by the external device to be connected is rectangular, it is cut according to the actual length and width of the rectangle to make it fit the rectangle of the required connection part, which can further save the cost of separately customizing conductive adhesives 1000 of different shapes and reduce the use cost of the conductive adhesive 1000.

[0036] In some embodiments, please refer to Figure 2 and Figure 3 , a first limiting groove 11 is provided on the side wall of the part of the conductive probe 1 buried in the insulating adhesive layer 2; correspondingly, a first limiting portion 23 extends from the insulating adhesive layer 2, and the first limiting portion 23 is inserted into the first limiting groove 11. Through the cooperation of the first limiting portion 23 and the first limiting groove 11, the connection stability between the insulating adhesive layer 2 and the conductive probe 1 is ensured. Specifically, the cooperation of the first limiting portion 23 and the first limiting groove 11 enables the conductive adhesive 1000, when subjected to external pressure, even if the insulating adhesive layer 2 undergoes a certain degree of deformation, the conductive probe 1 will not undergo relative displacement with respect to the insulating adhesive layer 2.

[0037] Further, please refer to Figure 3 、 Figure 4 and Figure 5, a second limiting groove 12 is further provided on the side wall of the part of the conductive probe 1 embedded in the insulating adhesive layer 2. The first limiting groove 11 and the second limiting groove 12 are arranged in a cross shape; the insulating adhesive layer 2 extends with a second limiting part 24. The second limiting part 24 and the first limiting part 23 are arranged in a cross shape, and the second limiting part 24 is inserted into the second limiting groove 12. It can be understood that the second limiting groove 12 and the second limiting part 24 also ensure the connection stability between the insulating adhesive layer 2 and the conductive probe 1. Moreover, the first limiting groove 11 and the second limiting groove 12 arranged in a cross shape enable the conductive probe 1 and the insulating adhesive layer 2 to be stably connected to the insulating adhesive layer 2 when subjected to external pressures in different directions and will not have relative displacements in different directions.

[0038] It can be understood that the angle at which the first limiting groove 11 and the second limiting groove 12 are arranged in a cross shape is diverse with respect to the extending direction of the conductive probe 1. Please refer to Figure 6 together. For example, the direction of the first limiting groove 11 is parallel to the extending direction of the conductive probe 1, the second limiting groove 12 is perpendicular to the direction of the first limiting groove 11. Correspondingly, the first limiting part 23 corresponds to the first limiting groove 11, and the second limiting part 24 corresponds to the second limiting groove 12; or refer to Figure 7 together. The first limiting groove 11 forms a 45° angle with the extending direction of the conductive probe 1, and the second limiting part 24 forms a 135° angle with the extending direction of the conductive probe 1. Correspondingly, the first limiting part 23 corresponds to the first limiting groove 11, and the second limiting part 24 corresponds to the second limiting groove 12.

[0039] It can be understood that the deflection angles of the first limiting groove 11 and the second limiting groove 12 are diverse and are not limited to the above angles only. Moreover, the widths and depths of the first limiting groove 11 and the second limiting groove 12 need to be set according to actual requirements. Correspondingly, the protrusions of the first limiting part 23 and the second limiting part 24 are also set according to actual requirements and the matching degree of the first limiting groove 11 and the second limiting groove 12. Refer to Figure 4 and Figure 5 and Figure 6 for example only, and do not specify the widths and depths of the grooves.

[0040] In some other embodiments, please refer to Figure 8, on the side wall of the part of the conductive probe 1 embedded in the insulating adhesive layer 2, a third limiting portion 13 extends. The third limiting portion 13 extends in a direction parallel to the first surface 21, and the third limiting portion 13 is inserted into the insulating adhesive layer 2. When an external pressure is applied to the conductive probe 1 in a direction perpendicular to the first plane 21, the third limiting portion 13 inserted into the insulating adhesive layer 2 forms a limit on the conductive probe 1 in a direction perpendicular to the first plane 21, thereby ensuring the connection strength between the conductive probe 1 and the insulating adhesive layer 2, and preventing the conductive probe 1 from detaching from the insulating adhesive layer 2 or causing an unexpected relative displacement between the conductive probe 1 and the insulating adhesive layer 2 due to external force.

[0041] In order to increase the contact area between the conductive probe 1 and the device to be connected, it can be understood that spherical, conical and other shapes are adopted to achieve this. In some embodiments, please refer to Figure 9 , at one end of the conductive probe 1 extending out of the first surface 21, a first spherical conductive portion 14 is provided, and at the other end of the conductive probe 1 extending out of the second surface 22, a second spherical conductive portion 15 is provided. Compared with the connection method directly using a flat cross-section for contact, according to the area formula of a circular plane: S1 = π * r^2, and the area formula of a sphere: S2 = 4 * πr^2, the contact area of the first spherical conductive portion 14 and the second spherical conductive portion 15 is significantly larger than the cross-sectional area of the flat cross-section, thereby improving the connection stability between the conductive probe 1 and the external device to be connected, and increasing the maximum current value that can be carried.

[0042] In some embodiments, please refer to Figure 9 , at one end of the conductive probe 1 extending out of the first surface 21, a first conical conductive portion 16 is provided, and at the other end of the conductive probe 1 extending out of the second surface 22, a second conical conductive portion 17 is provided, or a combination method is adopted in which at one end of the conductive probe 1 extending out of the first surface 21, a conical conductive portion 17 is provided, and at the other end of the conductive probe 1 extending out of the second surface 22, a spherical conductive portion is provided, which can also increase the contact area between the conductive probe 1 and the external device to be connected, and improve the connection stability between the conductive probe 1 and the external device to be connected.

[0043] It should be noted that in order to ensure the good performance of the conductive adhesive 1000, it is necessary to restrict the relevant parameters of the conductive adhesive 1000. The relevant parameters here include, but are not limited to: the spacing between adjacent conductive probes 1, the length of one end of the conductive probe 1 extending out of the first surface 21, the length of the other end of the conductive probe 1 extending out of the second surface 22, the length of the conductive probe 1, the resistance of the insulating adhesive layer 2, and the material of the insulating adhesive layer 2.

[0044] Specifically, the distance between any two adjacent conductive probes 1 of the conductive adhesive 1000 is greater than or equal to 30 μm. The specific value can be set according to the actual usage scenario to meet the requirements in different usage scenarios. In this embodiment, preferably, the distance between any two adjacent conductive probes 1 is 30 μm.

[0045] The length of one end of the conductive probe 1 extending out of the first surface 21 is less than or equal to 10 μm, and / or the length of the other end of the conductive probe 1 extending out of the second surface 22 is less than or equal to 10 μm. The extending length of the conductive probe 1 should meet the above range to avoid the risk of insufficient bonding ability of the insulating bonding layer 2 to the external device and unreliable bonding or detachment when the conductive adhesive 1000 bonds the external device due to too long an extending length.

[0046] The length of the conductive probe 1 is greater than or equal to 0.3 mm. By the length of the conductive probe 1, the thickness of the actual finished product of the conductive adhesive 1000 is limited. Conductive adhesives 1000 with different thicknesses are suitable for different usage scenarios. The thickness of the conductive adhesive 1000 required for specific usage scenarios will not be exemplified one by one in this embodiment.

[0047] The resistance of the insulating bonding layer 2 is greater than or equal to 100 MΩ to ensure that insulation can be maintained between any two adjacent conductive probes 1 and conduction does not occur, avoiding damage to the anisotropic conductive characteristics of the conductive adhesive 1000.

[0048] For the above-mentioned insulating bonding layer 2, the selectable materials include but are not limited to: insulating silicone, insulating resin, etc. Among them, insulating resin refers to epoxy resin, polyimide resin, polyurethane resin, acrylic resin, etc. In this embodiment, the insulating bonding layer 2 is preferably insulating silicone.

[0049] In the embodiment of the present invention, the conductive adhesive 1000 includes an insulating bonding layer 2 and a plurality of conductive probes 1. Among them, the insulating bonding layer 2 includes a first surface 21 and a second surface 22 arranged opposite to each other; a plurality of conductive probes 1 are embedded in the insulating bonding layer 2. One end of the conductive probe 1 extends out of the first surface 21, and the other end of the conductive probe 1 extends out of the second surface 22. The plurality of conductive probes 1 are arranged at intervals, and the overall structural strength of the conductive adhesive 1000 is improved by relying on the inherent structural strength of the conductive probes 1 themselves, so that the structural strength of the conductive adhesive 1000 using the conductive probes 1 is significantly enhanced compared with the existing conductive adhesives 1000 using conductive particles or conductive wires.

[0050] The present invention also provides an embodiment of an electronic device. The electronic device includes the above-mentioned conductive adhesive 1000. For the structure and function of the conductive adhesive 1000, reference can be made to the above embodiment, and details will not be repeated here.

[0051] It should be noted that the description and drawings of the present utility model have given preferred embodiments of the present utility model. However, the present utility model can be implemented in many different forms and is not limited to the embodiments described in this specification. These embodiments do not serve as additional limitations to the content of the present utility model. The purpose of providing these embodiments is to make the understanding of the disclosed content of the present utility model more thorough and comprehensive. Moreover, the above technical features continue to be combined with each other to form various embodiments not listed above, which are all regarded as within the scope described in the description of the present utility model; further, for those of ordinary skill in the art, improvements or transformations can be made according to the above description, and all such improvements and transformations should fall within the protection scope of the appended claims of the present utility model.

Claims

1. A conductive adhesive, characterized in that, Comprising: An insulating adhesive layer, including a first surface and a second surface arranged oppositely; A plurality of conductive probes, embedded in the insulating adhesive layer, one end of the conductive probe extending out of the first surface, the other end of the conductive probe extending out of the second surface, and the plurality of conductive probes being arranged at intervals.

2. The conductive adhesive according to claim 1, wherein A first limiting groove is provided on the side wall of the part of the conductive probe embedded in the insulating adhesive layer; A first limiting portion extends from the insulating adhesive layer, and the first limiting portion is inserted into the first limiting groove.

3. The conductive adhesive according to claim 2, wherein A second limiting groove is further provided on the side wall of the part of the conductive probe embedded in the insulating adhesive layer, and the first limiting groove and the second limiting groove are arranged in a cross shape; A second limiting portion extends from the insulating adhesive layer, the second limiting portion and the first limiting portion are arranged in a cross shape, and the second limiting portion is inserted into the second limiting groove.

4. The conductive adhesive according to claim 1, wherein A third limiting portion extends from the side wall of the part of the conductive probe embedded in the insulating adhesive layer, the third limiting portion extends along a direction parallel to the first surface, and the third limiting portion is inserted into the insulating adhesive layer.

5. The conductive adhesive according to claim 1, wherein A first spherical conductive portion is provided at one end of the conductive probe extending out of the first surface, and a second spherical conductive portion is provided at the other end of the conductive probe extending out of the second surface.

6. The conductive adhesive according to any one of claims 1-5, wherein The plurality of conductive probes are arranged in an array.

7. The conductive adhesive according to any one of claims 1-5, wherein The distance between any two adjacent conductive probes is greater than or equal to 30 μm.

8. The conductive adhesive according to any one of claims 1-5, wherein The length of one end of the conductive probe extending out of the first surface is less than or equal to 10 μm, and / or the length of the other end of the conductive probe extending out of the second surface is less than or equal to 10 μm.

9. The conductive adhesive according to any one of claims 1-5, wherein The insulating adhesive layer is insulating silica gel; and / or The resistance of the insulating adhesive layer is greater than or equal to 100 MΩ; and / or The length of the conductive probe is greater than or equal to 0.3 mm.

10. An electronic device, characterized in that, Comprising the conductive adhesive according to any one of claims 1-9.

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