Electrodeposition device for water cooling circulation

Abstract

The utility model discloses an electrodeposition device with water cooling circulation. The electrodeposition device comprises an integrated tank body, an upper fixing cover, a lower fixing base and a fixing screw rod, the integrated tank body is provided with an inner tank for containing deposition liquid and an outer tank for containing cooling liquid, the inner tank is provided with a tank body upper opening and a tank body lower opening, and the anode wire penetrates into the deposition liquid from the tank body upper opening; an upper fixing cover is arranged at the upper end of the integrated tank body, a lower fixing base is arranged at the lower end of the integrated tank body, a deposition source sheet is arranged between a tank body lower opening of the integrated tank body and the lower fixing base, and the deposition source sheet is in contact with deposition liquid; the integrated groove body is clamped and fixed between the upper fixing cover and the lower fixing base through a fixing screw rod. According to the electrodeposition tank, the inner tank for containing deposition liquid and the outer tank for containing cooling liquid are integrated, so that the structure of the electrodeposition tank is simplified, and the production efficiency is improved; and the integrated tank body is clamped and fixed through the fixing screw rod, so that the overall sealing performance is better, and the probability that circulating water is polluted by radionuclides is greatly reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of electrodeposition, and particularly relates to an electrodeposition device with water cooling circulation. Background Technique

[0002] The α meter calibration source is prepared with α radioactive nuclides. In order to ensure that the energy of α particles is basically not attenuated in the source and reduce self-absorption, the active layer must be very thin. The domestic α meter calibration sources mainly include 241Am, 238Pu, 244Cm, etc. According to the classification of GB18871-2002, most of the α nuclides belong to the extremely toxic group. After the α nuclides enter the human body, the tissues will be continuously irradiated. The parts where radiation induces cell death, mutation and malignant mutation are in the cell nucleus, and deoxyribonucleic acid is the main target. Ionization and excitation mainly damage cells by acting on DNA molecules, leading to various health hazards until the radioactive nuclide decays completely or is completely excreted from the body.

[0003] Parker, Kitov and others developed a new method for preparing radiation sources and targets for nuclear physics experiments in weakly polar organic solvents in the 1960s. It uses organic solvents such as isopropanol and electroplating solutions of inorganic acids containing trace radioactive substances for electroplating to prepare sources. Electroplating is carried out under high DC voltage and low current density, and the radioactive nuclide is deposited on the cathode in the form of hydroxide or other compounds. The above method is called molecular electroplating and is widely used in the preparation of α meter calibration sources. Molecular electroplating is carried out at a high voltage (500 - 1000V), and the electroplating solution is generally above 60 - 70°C. For solvents with lower boiling points, the boiling phenomenon is serious, the solution volatilizes quickly, and even combustion occurs. Moreover, radioactive nuclides will be carried during the process of a large amount of solvent volatilization, resulting in an increase in the concentration of radioactive aerosols in the laboratory.

[0004] East China Normal University has filed a patent application for an invention named "An Experimental Device and Experimental Method for Preparing α Radioactive Sources by Electro - deposition and Auto - deposition", with the application number 201910692601.6. This experimental device consists of a Teflon outer cylinder and a Teflon inner cylinder with a jacket - equipped deposition tank arranged on a stainless - steel base. A sieve plate is provided inside the Teflon inner cylinder; a water inlet pipe and a water outlet pipe are provided on the Teflon outer cylinder; the water inlet pipe and the water outlet pipe are connected to the jacket between the Teflon outer cylinder and the Teflon inner cylinder. This experimental device realizes the electro - deposition of α - radioactive nuclides in the powered - on mode or the Po auto - deposition in the powered - off mode. This experimental device has the following disadvantages: (1) Low cooling efficiency: The electro - deposition solution is in the Teflon inner cylinder, and the coolant is in the Teflon outer cylinder. The heat - conducting layer between the two is Teflon, which is a fluoropolymer with a relatively low thermal conductivity; (2) Complex structure: The electro - deposition solution is in the Teflon inner cylinder, and the coolant is in the Teflon outer cylinder. A jacket is required to connect the two, which results in low production efficiency and there is a risk of polluting the circulating water due to poor sealing of the jacket; (3) The Teflon inner cylinder is thread - connected to the stainless - steel base, and the connection method of this experimental device is complex and the operation efficiency is low. Utility Model Content

[0005] Aiming at the deficiencies existing in the prior art, the present utility model provides an electro - deposition device with water - cooling circulation, which has the characteristics of simple cooling structure, high cooling efficiency, low pollution risk, high working efficiency, etc.

[0006] The present utility model discloses an electro - deposition device with water - cooling circulation for preparing α radioactive sources, including: an integrated tank body, an upper fixing cover, a lower fixing base, and fixing screws;

[0007] The integrated tank body has an inner tank for containing the deposition solution and an outer tank for containing the coolant. The upper and lower ends of the inner tank have an upper tank opening and a lower tank opening. The anode wire extends from the upper tank opening into the deposition solution, and the anode wire is connected to the positive pole of the power supply;

[0008] The upper end of the integrated tank body is provided with an upper fixing cover, and the lower end is provided with a lower fixing base. A deposition source sheet is arranged between the lower tank opening of the integrated tank body and the lower fixing base. The deposition source sheet is in contact with the deposition solution, and the deposition source sheet is connected to the negative pole of the power supply;

[0009] The upper fixing cover and the lower fixing base clamp and fix the integrated tank body through the fixing screws.

[0010] As a further improvement of the utility model, a rubber gasket is provided between the lower opening of the integrated tank body and the lower fixing base. A central hole for the deposition liquid to contact the deposition source wafer is provided in the middle of the rubber gasket; under the clamping action of the fixing screw, the lower fixing base, the deposition source wafer, the rubber gasket, the integrated tank body and the upper fixing cover are in close contact with each other.

[0011] As a further improvement of the utility model, the outer tank of the integrated tank body is a closed annular cavity structure provided on the outer wall of the inner tank. At least one water inlet and at least one water outlet are provided on the outer tank, and the water inlet is located below the water outlet.

[0012] As a further improvement of the utility model, two symmetrically distributed water inlets and two water outlets are provided on the outer tank, and the water inlet is directly below the corresponding water outlet.

[0013] As a further improvement of the utility model, the upper fixing cover is composed of an inner ring and an outer ring which are coaxially arranged and fixed. A through hole and a first fixing groove which are communicated with each other are provided from top to bottom at the center of the inner ring. The aperture of the through hole is smaller than the groove diameter of the first fixing groove. The through hole is used for the anode wire to penetrate into the deposition liquid; the first fixing groove is matched with the upper opening of the tank body for fixing the upper opening of the tank body.

[0014] As a further improvement of the utility model, the lower fixing base is composed of an upper base and a lower base which are arranged up and down and fixed. A second fixing groove is provided at the center of the upper base. The second fixing groove is used for fixing the lower opening of the tank body or the lower opening of the tank body and the rubber gasket; a receiving groove for receiving the deposition source wafer is provided at the top of the center of the lower base. The groove diameter of the second fixing groove is smaller than the groove diameter of the receiving groove.

[0015] As a further improvement of the utility model, the material of the integrated tank body is glass, the material of the inner ring of the upper fixing cover and the upper base of the lower fixing base is polytetrafluoroethylene, and the material of the outer ring of the upper fixing cover and the lower base of the lower fixing base is aluminum; the inner ring and the outer ring of the upper fixing cover are adhesively fixed.

[0016] As a further improvement of the utility model, the fixing screw includes a threaded inner rod and an outer sleeve. A plurality of non-threaded first fixing holes are annularly and evenly distributed on the outer ring, and a plurality of non-threaded second fixing holes A are annularly and evenly distributed on the upper base. A plurality of threaded second fixing holes B are evenly distributed on the lower base corresponding to the second fixing holes A. The outer sleeve is placed between the upper fixing cover and the lower fixing base. The lower end of the inner rod is fixed in the second fixing hole, and the upper end of the inner rod passes through the first fixing hole and is tightened and fixed by a butterfly screw.

[0017] As a further improvement of the present utility model, the number of the first fixing holes and the second fixing holes is 3 each; the distance from each first fixing hole or second fixing hole to the edge is equal, and the angle between every two first fixing holes or second fixing holes is 120 degrees.

[0018] As a further improvement of the present utility model, the anode wire is made of platinum, shaped like a coil of incense, placed in the inner groove and parallel to the deposition source sheet.

[0019] Compared with the prior art, the beneficial effects of the present utility model are as follows:

[0020] The present utility model combines the inner groove for containing the deposition liquid and the outer groove for containing the cooling liquid into one, simplifies the structure of the electroplating tank, and improves the production efficiency;

[0021] The present utility model clamps and fixes the integrated tank body between the lower fixing base and the upper fixing cover through the fixing screw, and the overall sealing performance is better, greatly reducing the probability of the circulating water being polluted by radionuclides;

[0022] The inner groove of the present utility model for containing the electroplating liquid and the outer groove for containing the cooling liquid (water) are of a glass integrated structure, and the water inlet and the water outlet are symmetrically distributed on both sides, with high heat conduction efficiency. Description of the Drawings

[0023] Figure 1 It is a schematic structural diagram of the electroplating device with water cooling circulation disclosed by the present utility model;

[0024] Figure 2 is Figure 1 a schematic structural diagram of the integrated tank body in;

[0025] Figure 3 is Figure 1 a schematic structural diagram of the upper fixing cover in;

[0026] Figure 4 is Figure 1 a schematic structural diagram of the lower fixing base in;

[0027] Figure 5 is Figure 1 a schematic structural diagram of the fixing screw in;

[0028] Figure 6 is Figure 1 a schematic structural diagram of the rubber gasket in;

[0029] Figure 7 is Figure 1 a schematic structural diagram of the deposition source sheet in.

[0030] Symbol Explanation:

[0031] 1. Integrated tank body; 11. Upper opening of the tank body; 12. Lower opening of the tank body; 13. Inner tank; 14. Outer tank; 15. First water inlet; 16. First water outlet; 17. Second water inlet; 18. Second water outlet;

[0032] 2. Upper fixing cover; 21. Inner ring; 22. Outer ring; 23. First fixing hole; 24. First fixing groove; 25. Through hole;

[0033] 3. Lower fixing base; 31. Accommodating groove; 32. Second fixing groove; 33. Upper base; 34. Lower base; 35. Second fixing hole;

[0034] 4. Fixing screw; 41. Inner rod; 42. Outer sleeve; 43. Butterfly screw;

[0035] 5. Rubber gasket; 51. Central hole;

[0036] 6. Deposition source sheet. Detailed implementation mode

[0037] To make the objectives, technical solutions and advantages of the embodiments of the present utility model clearer, the technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are some but not all of the embodiments of the present utility model. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without creative efforts shall fall within the scope of protection of the present utility model.

[0038] The following further describes the present utility model in detail with reference to the accompanying drawings:

[0039] As Figure 1 shown, the present utility model provides an electro-deposition device with water cooling circulation for preparing an α radiation source, including: an integrated tank body 1, an upper fixing cover 2, a lower fixing base 3, a fixing screw 4, a rubber gasket 5, a deposition source sheet 6 and an anode wire (not shown in the figure); wherein,

[0040] Further referring to Figure 2, the integrated tank body 1 of the present utility model has an inner tank 13 for containing deposition liquid and an outer tank 14 for containing cooling liquid (cooling water). The inner tank 13 is a cylindrical structure with openings at both the upper and lower ends. The upper and lower ends of the inner tank 13 have a tank upper opening 11 and a tank lower opening 12. The anode wire is used to extend from the tank upper opening 13 into the deposition liquid contained in the inner tank 13. The outer tank 14 is a closed annular cavity structure provided on the outer wall of the inner tank 13. At least one water inlet and at least one water outlet are provided on the outer tank 14, and the water inlet is located below the water outlet; preferably, two symmetrically distributed water inlets and two water outlets are provided on the outer tank 14, namely a first water inlet 15, a second water inlet 17, a first water outlet 16, and a second water outlet 18. The first water inlet 15 is directly below the first water outlet 16, and the second water inlet 17 is directly below the second water outlet 18. Further, the material of the integrated tank body 1 of the present utility model is glass, and the inner tank 13 and the outer tank 14 are integrally formed. Based on this, the integrated tank body 1 of the present utility model has high heat conduction efficiency.

[0041] The upper fixing cover 2 of the present utility model is arranged at the upper end of the integrated tank body 1; further reference Figure 3 , the upper fixing cover 2 of the present utility model is composed of an inner ring 21 and an outer ring 22 which are coaxially arranged and fixed. Preferably, the material of the inner ring 21 is polytetrafluoroethylene, and the material of the outer ring 22 is aluminum. The inner ring 21 and the outer ring 22 are fixed by glue sticking; further, to increase the sticking surface of the inner ring 21 and the outer ring 22, the outer wall of the inner ring 21 is in a trapezoidal structure with a smaller upper part and a larger lower part, and the outer ring 22 is provided with a trapezoidal hole with a smaller upper part and a larger lower part that matches the inner ring 21, as Figure 3 shown. A through hole 25 and a first fixing groove 24 that are connected and communicated are provided at the center of the inner ring 21 from top to bottom. The through hole 25 and the first fixing groove 24 are coaxially arranged; the diameter of the through hole 25 is smaller than the groove diameter of the first fixing groove 24. The through hole 25 is used for the anode wire to extend into the deposition liquid; the first fixing groove 24 cooperates with the tank upper opening 11 to fix the tank upper opening 11. The upper fixing cover 2 is circular as a whole. Three first fixing holes 23 are distributed on the edge of the outer ring 22 of the upper fixing cover 2. The first fixing holes 23 have no threads, and the diameter of the first fixing holes 23 is equal to the diameter of the inner rod 31 of the fixing screw 4. The distance from each first fixing hole 23 to the edge of the upper fixing cover is equal, and the angle between every two first fixing holes 23 is 120 degrees.

[0042] Further reference Figure 6 、 7, the lower fixing base 3 of the present utility model is arranged at the lower end of the integrated tank body 1. A rubber gasket 5 and a deposition source sheet 6 are successively arranged from top to bottom between the lower opening 12 of the tank body of the integrated tank body 1 and the lower fixing base 3. A central hole 51 for the deposition liquid to contact the deposition source sheet 6 is arranged in the middle of the rubber gasket 5. The rubber gasket 5 is below the integrated tank body 1, and the rubber gasket 5 is in close contact with the lower opening 12 of the tank body of the integrated tank body 1 to prevent the electroplating liquid from leaking. Further reference Figure 4 , the lower fixing base 3 of the present utility model is composed of an upper base 33 and a lower base 34 which are arranged up and down and fixed to each other. Preferably, the material of the upper base 33 is polytetrafluoroethylene, and the material of the lower base 34 is aluminum; the upper base 33 and the lower base 34 are separated and not fixed, so that the deposition source sheet 6 can be placed in the accommodation groove 31. A second fixing groove 32 is arranged at the center of the upper base 33, and the second fixing groove 32 is used to fix the lower opening 12 of the tank body and the rubber gasket 5. A accommodation groove 31 for accommodating the deposition source sheet 6 is arranged at the top of the center of the lower base 34. The accommodation groove 31 and the second fixing groove 32 are coaxially arranged and communicated, and the groove diameter of the second fixing groove 32 is smaller than the groove diameter of the accommodation groove 31. The outer diameters of the upper base 33 and the lower base 34 are the same and are both circular. Three corresponding second fixing holes 35 are arranged at the edges of the upper base 33 and the lower base 34. The second fixing hole A of the upper base 33 has no thread, and the second fixing hole B of the lower base 34 has a thread. The second fixing hole A and the second fixing hole B together form the second fixing hole 35; the diameter of the second fixing hole 35 is equal to the diameter of the inner rod 41 of the fixing screw 4; the distance from each second fixing hole to the edge of the lower fixing base 3 is equal, and the angle between every two second fixing holes is 120 degrees.

[0043] The upper fixing cover 2 and the lower fixing base 3 of the present utility model clamp and fix the integrated tank body 1 through the fixing screw 4. Under the clamping action of the fixing screw 4, the lower fixing base 3, the deposition source sheet 6, the rubber gasket 5, the integrated tank body 1 and the upper fixing cover 2 are in close contact; further reference Figure 5 , the fixing screw 4 includes a threaded inner rod 41 and an outer sleeve 42. The outer sleeve 42 is placed between the upper fixing cover 2 and the lower fixing base 3. The lower end of the inner rod 41 passes through the second fixing hole A and is fixed in the second fixing hole B. The upper end of the inner rod 41 passes through the first fixing hole 23 and is tightened and fixed by a butterfly screw 43.

[0044] The anode wire of the present utility model is connected to the positive pole of the power supply, and the deposition source sheet 6 is connected to the negative pole of the power supply; the power supply is preferably a DC regulated power supply. The material of the anode wire is platinum, and its shape is spiral like an incense coil. It is placed in the inner groove 13 and parallel to the deposition source sheet 6.

[0045] The usage method of the present utility model is as follows:

[0046] The deposition source sheet 6, the rubber gasket 5 and the integrated tank body 1 are respectively placed into the lower fixing base 3, and after the upper fixing cover 2 passes through the fixing screw 4, it is fastened with the wing screw 43; after connecting the anode and the cathode, the electro-deposition reaction starts.

[0047] The advantages of the present utility model are as follows:

[0048] The present utility model combines the inner tank for containing the deposition liquid and the outer tank for containing the cooling liquid into one, simplifies the structure of the electro-deposition tank, and improves the production efficiency; the present utility model clamps and fixes the integrated tank body between the lower fixing base and the upper fixing cover through the fixing screw, and the overall sealing performance is better, greatly reducing the probability of the circulating water being polluted by radionuclides; the inner tank for containing the electro-deposition liquid and the outer tank for containing the cooling liquid (water) of the present utility model are of a glass integrated structure, and the water inlets and outlets are symmetrically distributed on both sides, with high heat conduction efficiency.

[0049] The above are only the preferred embodiments of the present utility model and are not used to limit the present utility model. For those skilled in the art, various changes and modifications can be made to the present utility model. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present utility model shall be included within the protection scope of the present utility model.

Claims

1. An electroplating device with a water cooling cycle for preparing an α radiation source; characterized in that, Including: An integrated tank body, an upper fixing cover, a lower fixing base and fixing screws; The integrated tank body has an inner tank for containing a deposition liquid and an outer tank for containing a coolant. The upper and lower ends of the inner tank have an upper tank opening and a lower tank opening. The anode wire extends from the upper tank opening into the deposition liquid, and the anode wire is connected to the positive electrode of the power supply; An upper fixing cover is provided at the upper end of the integrated tank body, and a lower fixing base is provided at the lower end. A deposition source wafer is provided between the lower tank opening of the integrated tank body and the lower fixing base. The deposition source wafer is in contact with the deposition liquid, and the deposition source wafer is connected to the negative electrode of the power supply; The upper fixing cover and the lower fixing base clamp and fix the integrated tank body through the fixing screws.

2. The electrodeposition device with a water cooling cycle as described in claim 1, wherein, A rubber gasket is provided between the lower tank opening of the integrated tank body and the lower fixing base. A central hole for the deposition liquid to contact the deposition source wafer is provided in the middle of the rubber gasket; under the clamping action of the fixing screws, the lower fixing base, the deposition source wafer, the rubber gasket, the integrated tank body and the upper fixing cover are in close contact.

3. The electroplating device with water cooling cycle according to claim 1, characterized in that, The outer tank of the integrated tank body is a closed annular cavity structure provided on the outer wall of the inner tank. At least one water inlet and at least one water outlet are provided on the outer tank, and the water inlet is located below the water outlet.

4. The electroplating device with water cooling cycle according to claim 3, characterized in that, Two symmetrically distributed water inlets and two water outlets are provided on the outer tank, and the water inlet is directly below the corresponding water outlet.

5. The electrodeposition device with a water cooling cycle according to claim 1 or 2, characterized in that The upper fixing cover is composed of an inner ring and an outer ring which are coaxially arranged and fixed. A through hole and a first fixing groove communicating with each other are provided from top to bottom at the center of the inner ring. The diameter of the through hole is smaller than the diameter of the first fixing groove. The through hole is used for the anode wire to extend into the deposition liquid; the first fixing groove cooperates with the upper tank opening to fix the upper tank opening.

6. The electrodeposition apparatus with a water cooling cycle according to claim 5, characterized in that The lower fixing base is composed of an upper layer base and a lower layer base which are arranged up and down and fixed. A second fixing groove is provided at the center of the upper layer base. The second fixing groove is used for fixing the lower tank opening or the lower tank opening and the rubber gasket; a receiving groove for receiving the deposition source wafer is provided at the top of the center of the lower layer base. The diameter of the second fixing groove is smaller than the diameter of the receiving groove.

7. The electrodeposition apparatus with a water cooling cycle according to claim 6, characterized in that, The material of the integrated tank body is glass, the material of the inner ring of the upper fixing cover and the upper layer base of the lower fixing base is polytetrafluoroethylene, and the material of the outer ring of the upper fixing cover and the lower layer base of the lower fixing base is aluminum; the inner ring and the outer ring of the upper fixing cover are adhesively fixed.

8. The electroplating device with a water cooling cycle according to claim 6, characterized in that, The fixing screw includes a threaded inner rod and an outer sleeve. A plurality of non-threaded first fixing holes are annularly and evenly distributed on the outer ring, a plurality of non-threaded second fixing holes A are annularly and evenly distributed on the upper layer base, and a plurality of threaded second fixing holes B are evenly distributed corresponding to the second fixing holes A on the lower layer base. The outer sleeve is placed between the upper fixing cover and the lower fixing base. The lower end of the inner rod is fixed in the second fixing hole, and the upper end of the inner rod passes through the first fixing hole and is tightened and fixed by a wing screw.

9. The electroplating device with water cooling cycle according to claim 8, characterized in that, The number of the first fixing holes and the second fixing holes is 3 each; the distance from each first fixing hole or second fixing hole to the edge is equal, and the angle between every two first fixing holes or second fixing holes is 120 degrees.

10. The electroplating apparatus with a water cooling cycle according to claim 1, characterized in that, The material of the anode wire is platinum, and its shape is spiral incense-like. It is placed in the inner groove and parallel to the deposition source wafer.

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