Copper substrate for improving heat dissipation of lamp

Abstract

The utility model discloses a copper substrate for improving heat dissipation of a lamp, which relates to the field of copper substrate structures and comprises a copper bottom plate, a circuit layer is arranged on the surface of one side of the copper bottom plate, a heat dissipation unit is arranged on the surface of one side, far away from the circuit layer, of the copper bottom plate and comprises a plurality of copper heat conduction columns, and the copper heat conduction columns are arranged corresponding to the circuit layer. The multiple copper heat conduction columns and the copper bottom plate are integrally formed in a cold forging mode. According to the copper substrate for improving the heat dissipation of the lamp, a cold forging integrated forming mode is adopted, the basic functions of the copper substrate are reserved, and meanwhile the multiple copper heat conduction columns are punched, so that the heat dissipation structure of the copper substrate is optimized, the heat conduction and heat dissipation efficiency of the lamp in the using process is improved, stable operation of the lamp is ensured, and meanwhile the service life of the lamp is prolonged.

Description

Technical Field

[0001] The utility model relates to the field of copper substrate structures, and specifically relates to a copper substrate for improving the heat dissipation of lamps. Background Technique

[0002] Due to the advantages of high efficiency, energy saving, environmental protection, etc., LED lamps have been widely used in the lighting field. When the LED chip works, a large amount of heat will be generated, which is determined by the limitation of its electro-optical conversion efficiency. If this heat cannot be dissipated to the surrounding environment in a timely and effective manner, the temperature of the LED chip will rise sharply. The high-temperature environment will not only reduce the light efficiency of the LED chip, but also accelerate its aging process, thus significantly shortening the service life of the LED lamp.

[0003] Copper, due to its excellent thermal conductivity and processing performance, is made into a copper substrate and applied in LED lamps. The copper substrate can effectively conduct the heat generated by the LED chip to a wider heat dissipation surface, and then dissipate it through air convection or thermal radiation, etc., thereby improving the heat dissipation performance of the lamp. However, the traditional copper substrate has a certain improvement effect on the heat dissipation performance of the LED lamp, but the traditional copper substrate usually adopts a flat plate design, its heat dissipation area is limited by the physical size of the lamp, and the heat conduction path needs to cross the entire thickness of the substrate, increasing the thermal resistance, resulting in too high a temperature of the working lamp, affecting the luminous efficiency and service life, and it is difficult to meet the heat dissipation requirements of high-power LED lamps.

[0004] In view of this, this application is specifically proposed. Content of the Utility Model

[0005] The purpose of the utility model is to provide a copper substrate for improving the heat dissipation of lamps. This kind of copper substrate for improving the heat dissipation of lamps adopts a cold forging and one-piece forming method. While retaining the basic functions of the copper substrate, multiple copper heat conduction columns are punched out, so as to optimize the heat dissipation structure of the copper substrate, improve the heat conduction and heat dissipation efficiency during the use of the lamp, ensure the stable operation of the lamp, and at the same time extend the service life of the lamp.

[0006] The above optimization structure of the utility model is achieved through the following technical solution: A copper substrate for improving the heat dissipation of lamps, including a copper bottom plate, a circuit layer is provided on one side surface of the copper bottom plate, a heat dissipation unit is provided on the side surface of the copper bottom plate away from the circuit layer, the heat dissipation unit includes multiple copper heat conduction columns, the copper heat conduction columns are arranged corresponding to the circuit layer, and the multiple copper heat conduction columns are cold forged and integrally formed with the copper bottom plate.

[0007] In some embodiments, the thickness of the copper bottom plate is 1 mm, and the diameter of the copper heat conduction column is 0.7 mm.

[0008] In some embodiments, heat dissipation holes are provided on the side of the copper heat conduction column away from the copper bottom plate, and the heat dissipation holes are coaxially arranged with the copper heat conduction column.

[0009] In some embodiments, a plurality of heat conduction fins are provided on the copper heat conduction column, and the plurality of heat conduction fins are annularly distributed on the outer surface of the copper heat conduction column.

[0010] In some embodiments, the heat conduction fin is a spiral fin.

[0011] In some embodiments, the circuit layer includes a plurality of electrically connected large circuit connection areas and small circuit connection areas. Large chip pads are provided in the large circuit connection areas, small chip pads are provided in the small circuit connection areas, large chips are die-bonded to the large chip pads, and small chips are die-bonded to the small chip pads.

[0012] In some embodiments, external connection pads are symmetrically provided on the side of the copper bottom plate away from the copper heat conduction column, and the external connection pads are electrically connected to both the large circuit connection area and the small circuit connection area.

[0013] In some embodiments, the copper heat conduction columns are coaxially arranged with both the large chip pad and the small chip pad.

[0014] In summary, the present utility model has the following beneficial effects:

[0015] For this kind of copper substrate for improving the heat dissipation of a lamp, a plurality of copper heat conduction columns are provided on the copper bottom plate, and the heat on the copper bottom plate is dissipated through the copper heat conduction columns, increasing the heat dissipation area of the copper substrate, improving the heat conduction and heat dissipation efficiency during the use of the lamp, ensuring the stable operation of the lamp, and at the same time extending the service life of the lamp. At the same time, the cold forging and integral forming method is adopted to enhance the connection strength between the copper bottom plate and the copper heat conduction column, improve the heat dissipation effect of the copper heat conduction column on the copper bottom plate, simplify the forming process of the copper heat conduction column, and improve the production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 is an assembly structure diagram of the present utility model and a chip;

[0017] Figure 2 is a top view of the present utility model;

[0018] Figure 3 is a distribution schematic diagram of the circuit layer of the present utility model on the copper bottom plate;

[0019] Figure 4 is a structural cross-sectional view of the copper heat conduction column of the present utility model.

[0020] In the figure: 1. Copper bottom plate; 2. Circuit layer; 21. Large circuit connection area; 22. Small circuit connection area; 23. Large chip pad; 24. Small chip pad; 25. External connection pad; 3. Heat dissipation unit; 31. Copper heat conduction column; 32. Heat dissipation hole. Detailed implementation manners

[0021] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present utility model.

[0022] Refer to Figures 1-4 , a copper substrate for improving the heat dissipation of a lamp, including a copper bottom plate 1. The copper bottom plate 1 is the main part of the copper substrate, and high-purity and excellent heat-conducting purple copper material can be selected and made through processes such as cutting and stamping. One side surface of the copper bottom plate 1 is provided with a circuit layer 2. The circuit layer 2 includes a plurality of electrically connected large circuit connection areas 21 and small circuit connection areas 22. A large chip pad 23 is provided in the large circuit connection area 21, and a small chip pad 24 is provided in the small circuit connection area 22. A large chip is fixed on the large chip pad 23, and a small chip is fixed on the small chip pad 24. On the side of the copper bottom plate 1 away from the copper heat conduction column 31, external connection pads 25 are symmetrically provided. The external connection pads 25 are electrically connected to both the large circuit connection area 21 and the small circuit connection area 22, facilitating connection with an external circuit.

[0023] On the side surface of the copper bottom plate 1 away from the circuit layer 2, a heat dissipation unit 3 is provided. The heat dissipation unit 3 includes a plurality of copper heat conduction columns 31. The copper heat conduction columns 31 are arranged corresponding to the circuit layer 2. The plurality of copper heat conduction columns 31 and the copper bottom plate 1 can be integrally formed by cold forging. The integrally formed structure can ensure the heat transfer effect between the copper heat conduction columns 31 and the copper bottom plate 1, thereby improving the heat dissipation effect of the entire copper substrate.

[0024] In some embodiments, the thickness of the copper bottom plate 1 can be 1 mm to ensure sufficient strength and heat conduction performance, and the diameter of the copper heat conduction column 31 can be 0.7 mm to ensure sufficient strength and heat conduction performance.

[0025] In some embodiments, on the side of the copper heat conduction column 31 away from the copper bottom plate 1, heat dissipation holes 32 are provided. The heat dissipation holes 32 are coaxially arranged with the copper heat conduction columns 31, which can enhance the contact area between the copper heat conduction columns 31 and the air, thereby improving the heat dissipation effect.

[0026] In some embodiments, a plurality of heat conduction fins (not shown in the figure) are provided on the copper heat conduction column 31. The plurality of heat conduction fins are annularly distributed on the outer surface of the copper heat conduction column 31. The heat conduction fins are preferably spiral fins to enhance the heat dissipation effect.

[0027] In some embodiments, copper heat conducting columns 31 are coaxially arranged on both the large chip pad 23 and the small chip pad 24 to achieve efficient heat conduction.

[0028] In some embodiments, multiple copper heat conducting columns 31 are distributed in a matrix on the copper heat conducting columns 31. The copper heat conducting columns 31 distributed in the same row are connected by a transverse connecting rod (not shown in the figure), and the copper heat conducting columns 31 distributed in the same column are connected by a longitudinal connecting rod (not shown in the figure). Both the transverse connecting rod and the longitudinal connecting rod are arranged on the side of the copper heat conducting columns 31 away from the copper base plate 1. The transverse connecting rod, the longitudinal connecting rod and the copper heat conducting columns 31 can be integrally cold forged. Through the connection of the transverse connecting rod and the longitudinal connecting rod, the sides of the multiple copper heat conducting columns 31 away from the copper base plate 1 are connected into a whole, thereby improving the stability of the copper heat conducting columns 31. At the same time, the transverse connecting rod and the longitudinal connecting rod can further increase the heat dissipation area of the copper heat conducting columns 31, thereby improving the heat dissipation effect.

[0029] The specific manufacturing process is as follows:

[0030] Select a 3mm thick pure copper sheet. Coat an insulating layer on one side surface of the copper base plate 1 to protect the electrical insulation between the circuit layer and the copper base plate. Then, fabricate a circuit pattern on the insulating layer through processes such as photolithography and etching, including a large circuit connection area 21, a small circuit connection area 22, a large chip pad 23, a small chip pad 24, and an external connection pad 25. The large chip pad 23 and the small chip pad 24 need to be precisely designed according to the specifications and layout of the LED chips to ensure the accuracy and stability of die bonding. Set the positions of the copper columns to be stamped on the other side surface.

[0031] Using the cold forging forming process, 1mm of the overall thickness of the copper substrate is retained, and the remaining thickness is used for stamping the copper heat conducting columns 31. After the copper columns are stamped, apply a layer of solder or thermal conductive adhesive on the large chip pad 23 and the small chip pad 24, and respectively and precisely bond the large and small chips such as LED chips onto the large chip pad 23 and the small chip pad 24 through a die bonder. During the die bonding process, parameters such as die bonding pressure and temperature need to be controlled well to ensure close contact between the chip and the pad and good heat conduction. Complete the assembly of the copper substrate and the LED chips.

[0032] The specific working principle is as follows:

[0033] When the lamp works, the heat generated by heat generating components such as LED chips is first transferred to the copper heat conducting columns 31 through the thermal conductive adhesive or solder bonded to the chip pads. Since the copper heat conducting columns 31 and the copper base plate 1 are integrally cold forged, the heat can quickly be transferred along the copper heat conducting columns 31 to the copper base plate 1, and then dissipated into the air through the large area of the copper base plate 1. At the same time, the spiral heat conducting fins and heat dissipation holes 32 on the copper heat conducting columns 31 further increase the heat dissipation area and improve the heat dissipation efficiency.

[0034] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements for some of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A copper substrate for improving the heat dissipation of a lamp, comprising a copper bottom plate (1), characterized in that: One side surface of the copper base plate (1) is provided with a circuit layer (2), and the other side surface of the copper base plate (1) far from the circuit layer (2) is provided with a heat dissipation unit (3). The heat dissipation unit (3) includes a plurality of copper heat conducting columns (31). The copper heat conducting columns (31) are arranged corresponding to the circuit layer (2), and the plurality of copper heat conducting columns (31) and the copper base plate (1) are integrally formed by cold forging.

2. The copper substrate for improving the heat dissipation of a lamp according to claim 1, wherein: The thickness of the copper base plate (1) is 1 mm, and the diameter of the copper heat conducting column (31) is 0.7 mm.

3. A copper substrate for improving the heat dissipation of a lamp according to claim 1, characterized in that: One side of the copper heat conducting column (31) far from the copper base plate (1) is provided with a heat dissipation hole (32), and the heat dissipation hole (32) is coaxially arranged with the copper heat conducting column (31).

4. A copper substrate for improving the heat dissipation of a lamp according to claim 1, characterized in that: A plurality of heat conducting fins are arranged on the copper heat conducting column (31), and the plurality of heat conducting fins are annularly distributed on the outer surface of the copper heat conducting column (31).

5. The copper substrate for improving the heat dissipation of a lamp according to claim 4, wherein: The heat conducting fin is a spiral fin.

6. The copper substrate for improving the heat dissipation of a lamp according to claim 1, characterized in that: The circuit layer (2) includes a plurality of electrically connected large circuit connection areas (21) and small circuit connection areas (22). A large chip pad (23) is arranged in the large circuit connection area (21), a small chip pad (24) is arranged in the small circuit connection area (22), a large chip is die-bonded on the large chip pad (23), and a small chip is die-bonded on the small chip pad (24).

7. A copper substrate for improving the heat dissipation of a lamp according to claim 6, characterized in that: External connection pads (25) are symmetrically arranged on the side of the copper base plate (1) far from the copper heat conducting column (31), and the external connection pads (25) are electrically connected to both the large circuit connection area (21) and the small circuit connection area (22).

8. The copper substrate for improving the heat dissipation of a lamp according to claim 6, characterized in that: The copper heat conducting columns (31) are coaxially arranged with both the large chip pad (23) and the small chip pad (24).

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