Semiconductor laser power supply processing cooling equipment

Abstract

The utility model discloses semiconductor laser power supply processing cooling equipment, which comprises a power supply structure, the power supply structure comprises a laser power supply, a mounting groove and an air guide fan, one end of the laser power supply is provided with the mounting groove, one side of the laser power supply is provided with the air guide fan, a cooling structure is mounted in the mounting groove, and the cooling structure is connected with a heat conduction structure. A transmission structure is connected into the cooling structure and connected with a liquid guide structure in a matched mode. The power supply structure has the advantages that the cooling structure is matched with other structures, active air inlet heat dissipation can be achieved, meanwhile, cooling liquid can be driven through driving force generated by the air guide fan blades, the cooling liquid can be effectively circulated, the cooling effect is improved, and the number of driving devices is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor laser power supplies, and more specifically, to a processing and cooling device for semiconductor laser power supplies. Background Art

[0002] A semiconductor laser power supply consists of a metal shell and a circuit part, and the circuit part consists of: a voltage stabilizing circuit, a laser power pulse control circuit, a pulse generating circuit, and a protection circuit. A digital semiconductor laser power supply takes a digital integrated circuit as the core and designs a power supply for a semiconductor laser that can achieve intelligent control.

[0003] For example, the utility model with the publication number CN220981666U proposes a cooling device for the production and processing of semiconductor laser power supplies, which realizes the adsorption of the coolant attached to the shell of the semiconductor laser power supply, thereby assisting in drying the shell of the semiconductor laser power supply.

[0004] The cooling devices generally used in the existing laser power supplies are fan air cooling and water cooling, but the generation methods of this kind of cooling do not have coordination, and the functions of the refrigeration equipment are single. Therefore, a power supply cooling device that can efficiently utilize the cooling mechanism is needed. Summary of the Utility Model

[0005] In view of the problems in the related art, the present utility model proposes a processing and cooling device for semiconductor laser power supplies to overcome the above-mentioned technical problems existing in the related art.

[0006] For this reason, the specific technical solutions adopted by the present utility model are as follows:

[0007] A processing and cooling device for semiconductor laser power supplies includes a power supply structure, and the power supply structure includes a laser power supply, a mounting groove, and a gas guiding fan. One end of the laser power supply is provided with a mounting groove, and one side of the laser power supply is provided with a gas guiding fan. A cooling structure is installed in the mounting groove, the cooling structure is connected with a heat conduction structure, a transmission structure is connected inside the cooling structure, and the transmission structure is matingly connected with a liquid guiding structure.

[0008] According to a processing and cooling device for semiconductor laser power supplies as claimed in the claims, the cooling structure includes a liquid guiding ring, a fixing plate, a liquid outlet pipe, a liquid inlet pipe, a docking port, an air inlet plate, and a magnetic permeable ring. The inner ring of the liquid guiding ring is connected with a magnetic permeable ring, a fixing plate is fixedly connected to the magnetic permeable ring, and the liquid guiding ring is communicated with a liquid inlet pipe.

[0009] According to a processing and cooling device for semiconductor laser power supplies as claimed in the claims, a liquid outlet pipe is provided on one side of the liquid inlet pipe, both the liquid outlet pipe and the liquid inlet pipe are connected with docking ports, an air inlet plate is provided inside the inner ring of the magnetic permeable ring, and the docking ports are docked with the heat conduction pipes of the heat conduction structure.

[0010] A semiconductor laser power supply processing and cooling device according to the claims, characterized in that the heat conduction structure includes a heat conduction tube and a heat conduction plate. The two ends of the heat conduction tube are respectively communicated with the butting ports of the liquid outlet tube and the liquid inlet tube. The heat conduction tube is fixedly connected with a heat conduction plate, and the heat conduction plate is installed on the surface of the casing of the laser power supply.

[0011] A semiconductor laser power supply processing and cooling device according to the claims, characterized in that the transmission structure includes a motor, a fan blade, a fixed block, and a first magnet. The driving end of the motor is connected with a fan blade, the end of the fan blade is connected with a fixed block, and a first magnet is fixedly installed on the fixed block. The motor is fixedly installed on the fixing plate.

[0012] A semiconductor laser power supply processing and cooling device according to the claims, characterized in that the liquid guiding structure includes a second magnet, a liquid guiding block, a guiding wheel, a through connection groove, and a connecting ring. One side of the liquid guiding block is fixedly connected with a second magnet, and the other side of the liquid guiding block is connected with a guiding wheel.

[0013] A semiconductor laser power supply processing and cooling device according to the claims, characterized in that a through connection groove is formed in the liquid guiding block, the through connection groove is fixedly connected with a connecting ring, and the liquid guiding block is installed in the annular empty groove between the liquid guiding ring and the magnetic permeable ring.

[0014] The beneficial effect of the present utility model is that the power supply structure of the present utility model can achieve active air intake and heat dissipation through the provided cooling structure in cooperation with other structures. At the same time, the driving force generated by the air guiding fan blade can be used to drive the coolant, so that the coolant can circulate effectively, improve the cooling effect, and reduce the number of cooling driving devices. Description of the Drawings

[0015] In order to more clearly illustrate the technical solutions in the embodiments of the present utility model or the prior art, the following will briefly introduce the drawings required to be used in the embodiments. Obviously, the drawings in the following description are only some embodiments of the present utility model. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0016] Figure 1 is a schematic diagram of the main structure of a semiconductor laser power supply processing and cooling device according to an embodiment of the present utility model;

[0017] Figure 2 is a schematic diagram of the power supply structure of a semiconductor laser power supply processing and cooling device according to an embodiment of the present utility model;

[0018] Figure 3 is a schematic diagram of the heat conduction structure of a semiconductor laser power supply processing and cooling device according to an embodiment of the present utility model;

[0019] Figure 4Schematic diagram of the cooling structure of a semiconductor laser power supply processing and cooling device according to an embodiment of the present utility model;

[0020] Figure 5 Schematic diagram of the magnetic permeable ring of a semiconductor laser power supply processing and cooling device according to an embodiment of the present utility model;

[0021] Figure 6 Schematic diagram of the transmission structure of a semiconductor laser power supply processing and cooling device according to an embodiment of the present utility model;

[0022] Figure 7 Schematic diagram of the liquid guiding structure of a semiconductor laser power supply processing and cooling device according to an embodiment of the present utility model;

[0023] In the figure:

[0024] 1. Power supply structure; 101. Laser power supply; 102. Installation groove; 103. Air guiding fan; 2. Cooling structure; 201. Liquid guiding ring; 202. Fixed plate; 203. Liquid outlet pipe; 204. Liquid inlet pipe; 205. Docking port; 206. Air inlet plate; 207. Magnetic permeable ring; 3. Heat conduction structure; 301. Heat conduction pipe; 302. Heat conduction plate; 4. Transmission structure; 401. Motor; 402. Fan blade; 403. Fixed block; 404. First magnetic block; 5. Liquid guiding structure; 501. Second magnetic block; 502. Liquid guiding block; 503. Guide wheel; 504. Through connection groove; 505. Connection ring. Detailed implementation manners

[0025] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all of the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present utility model.

[0026] According to an embodiment of the present utility model, a semiconductor laser power supply processing and cooling device is provided.

[0027] Embodiment 1;

[0028] As Figure 1-7As shown, according to the semiconductor laser power processing cooling equipment of the embodiment of the utility model, it includes a power structure 1, the power structure 1 includes a laser power supply 101, a mounting groove 102, and an air guide fan 103. The mounting groove 102 is provided at one end of the laser power supply 101, and the air guide fan 103 is provided on one side of the laser power supply 101. A cooling structure 2 is installed in the mounting groove 102, and the cooling structure 2 is connected to a heat conducting structure 3. The cooling structure 2 is connected to a transmission structure 4, and the transmission structure 4 is matched with a liquid guide structure 5. The laser power supply 101 of the power structure 1 is a carbon dioxide laser driving power supply, and the mounting groove 102 is used to connect the cooling structure 2. The air guide fan 103 discharges gas to cooperate with the motor 401 to drive the fan blades 402 to intake air to generate gas flow, so that the flow direction of the gas is constant, thereby improving the air cooling effect. The heat conducting structure 3 is used to absorb the heat on the casing, and the transmission structure 4 cooperates with the liquid guide structure 5 to drive the circulation of the coolant.

[0029] The cooling structure 2 includes a liquid guiding ring 201, a fixed plate 202, a liquid outlet pipe 203, a liquid inlet pipe 204, a docking port 205, an air inlet plate 206, and a magnetically permeable ring 207. The inner ring of the liquid guiding ring 201 is connected with the magnetically permeable ring 207, and the fixed plate 202 is fixedly connected to the magnetically permeable ring 207. The liquid guiding ring 201 is connected with the liquid inlet pipe 204. A liquid outlet pipe 203 is provided on one side of the liquid inlet pipe 204. Both the liquid outlet pipe 203 and the liquid inlet pipe 204 are connected with a docking port 205. The inner ring of the magnetically permeable ring 207 is provided with an air inlet plate 206. The docking port 205 is docked with the heat conducting pipe 301 of the heat conducting structure 3. The coolant is injected into the empty groove between the liquid guiding ring 201 and the magnetically permeable ring 207. The rotation effect of the liquid guiding structure 5 is driven by the transmission structure 4, so that the coolant can flow in the empty groove. The coolant is discharged through the liquid outlet pipe 203 and introduced through the liquid inlet pipe 204 to realize liquid circulation.

[0030] In actual use, a semiconductor refrigeration plate is also provided on the liquid inlet pipe 204, the cold end of which is located inside the liquid inlet pipe 204, and the hot end is located outside the liquid inlet pipe 204. This technology is a prior art, and therefore, it is not disclosed in this application. The semiconductor refrigeration plate is used to cool the circulating liquid to achieve the purpose of recycling the coolant.

[0031] The heat-conducting structure 3 includes a heat-conducting pipe 301 and a heat-conducting plate 302. The two ends of the heat-conducting pipe 301 are respectively connected to the liquid outlet pipe 203 and the docking port 205 of the liquid inlet pipe 204. The heat-conducting pipe 301 is fixedly connected to the heat-conducting plate 302. The heat-conducting plate 302 is installed on the surface of the casing of the laser power supply 101. During the circulation process of the coolant, it mainly flows in the heat-conducting pipe 301. The heat-conducting pipe 301 is a copper pipe, and the heat-conducting plate 302 is a heat-conducting metal. The heat on the surface of the power supply casing can be absorbed and transferred to the coolant, so that the casing can be quickly cooled down to improve the cooling effect.

[0032] The transmission structure 4 includes a motor 401, a fan blade 402, a fixing block 403, and a first magnet 404. The driving end of the motor 401 is connected to the fan blade 402. The end of the fan blade 402 is connected to the fixing block 403. The first magnet 404 is fixedly installed on the fixing block 403. The motor 401 is fixedly installed on the fixing plate 202. The liquid guiding structure 5 includes a second magnet 501, a liquid guiding block 502, a guiding wheel 503, a through connection groove 504, and a connecting ring 505. One side of the liquid guiding block 502 is fixedly connected to the second magnet 501. The other side of the liquid guiding block 502 is connected to the guiding wheel 503. A through connection groove 504 is formed on the liquid guiding block 502. The through connection groove 504 is fixedly connected to the connecting ring 505. The liquid guiding block 502 is installed in the annular empty groove between the liquid guiding ring 201 and the magnetic permeable ring 207. During the driving process of the fan blade 402, the first magnet 404 will be driven. The first magnet 404 is separated from the second magnet 501 through the magnetic permeable ring 207. The opposite magnetic poles of the first magnet 404 and the second magnet 501 are the same. Therefore, when the first magnet 404 is driven, the second magnet 501 can be driven through magnetic repulsion, so that the liquid guiding block 502 can rotate in the empty groove. The liquid guiding block 502 is provided with liquid guiding grooves, which can improve the liquid guiding effect and the circulation effect of the cooling liquid. The function of the guiding wheel 503 can convert the transmission of the liquid guiding block 502 in the empty groove into rolling friction, reducing the transmission loss.

[0033] In order to facilitate the understanding of the above technical solutions of the present invention, the working principle or operation method of the present invention in the actual process will be described in detail below.

[0034] The laser power supply 101 of the power supply structure 1 is a carbon dioxide laser drive power supply. The installation groove 102 is used to connect the cooling structure 2. The air guide fan 103 exports gas to cooperate with the motor 401 to drive the fan blade 402 to intake air to generate gas flow, making the flow direction of the gas certain and improving the air-cooling effect. The heat conduction structure 3 is used to absorb the heat on the machine shell. The transmission structure 4 cooperates with the liquid guide structure 5 to drive the circulation of the coolant. The coolant is injected into the empty groove between the liquid guide ring 201 and the magnetic penetration ring 207. Through the driving effect of the transmission structure 4 on the liquid guide structure 5, the coolant can be driven to flow in the empty groove. The coolant is exported through the liquid outlet pipe 203 and imported through the liquid inlet pipe 204 to realize liquid circulation. During the circulation process of the coolant, it mainly flows in the heat conduction pipe 301. The heat conduction pipe 301 is a copper pipe, and the heat conduction plate 302 is also a heat-conducting metal, which can absorb the heat on the surface of the power supply machine shell and conduct it to the coolant, enabling the machine shell to quickly cool down and improving the cooling effect. During the driving process of the fan blade 402, the first magnet 404 will be driven. The first magnet 404 is separated from the second magnet 501 through the magnetic penetration ring 207. The opposite magnetic poles of the first magnet 404 and the second magnet 501 are the same. Therefore, when the first magnet 404 is driven, the second magnet 501 can be driven through magnetic repulsion, enabling the liquid guide block 502 to rotate in the empty groove. The liquid guide block 502 is provided with liquid guide grooves, which can improve the liquid guide effect and the circulation effect of the coolant. The function of the guide wheel 503 can convert the transmission of the liquid guide block 502 in the empty groove into rolling friction, reducing the transmission loss.

[0035] The above are only the preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A semiconductor laser power supply processing and cooling device, characterized in that, It includes a power supply structure (1), and the power supply structure (1) includes a laser power supply (101), a mounting groove (102), and an air guide fan (103). One end of the laser power supply (101) is provided with a mounting groove (102), and one side of the laser power supply (101) is provided with an air guide fan (103). A cooling structure (2) is installed in the mounting groove (102). The cooling structure (2) is connected to a heat conduction structure (3). A transmission structure (4) is connected inside the cooling structure (2). The transmission structure (4) is matingly connected to a liquid guide structure (5).

2. The semiconductor laser power supply processing and cooling device according to claim 1, wherein, The cooling structure (2) includes a liquid guide ring (201), a fixing plate (202), a liquid outlet pipe (203), a liquid inlet pipe (204), a docking port (205), an air inlet plate (206), and a magnetic permeable ring (207). The inner ring of the liquid guide ring (201) is connected to the magnetic permeable ring (207). A fixing plate (202) is fixedly connected to the magnetic permeable ring (207). The liquid guide ring (201) is communicated with a liquid inlet pipe (204).

3. The semiconductor laser power supply processing and cooling device according to claim 2, characterized in that, A liquid outlet pipe (203) is provided on one side of the liquid inlet pipe (204). Both the liquid outlet pipe (203) and the liquid inlet pipe (204) are connected to a docking port (205). An air inlet plate (206) is provided inside the inner ring of the magnetic permeable ring (207). The docking port (205) is docked with a heat conduction pipe (301) of the heat conduction structure (3).

4. A semiconductor laser power supply processing and cooling device according to claim 3, wherein The heat conduction structure (3) includes a heat conduction pipe (301) and a heat conduction plate (302). The two ends of the heat conduction pipe (301) are respectively communicated with the docking ports (205) of the liquid outlet pipe (203) and the liquid inlet pipe (204). The heat conduction pipe (301) is fixedly connected to a heat conduction plate (302). The heat conduction plate (302) is installed on the surface of the casing of the laser power supply (101).

5. The semiconductor laser power supply processing and cooling device according to claim 4, characterized in that, The transmission structure (4) includes a motor (401), a fan blade (402), a fixing block (403), and a first magnetic block (404). The driving end of the motor (401) is connected to a fan blade (402). The end of the fan blade (402) is connected to a fixing block (403). A first magnetic block (404) is fixedly installed on the fixing block (403). The motor (401) is fixedly installed on the fixing plate (202).

6. The semiconductor laser power supply processing and cooling device according to claim 5, wherein The liquid guide structure (5) includes a second magnetic block (501), a liquid guide block (502), a guide wheel (503), a through connection groove (504), and a connection ring (505). A second magnetic block (501) is fixedly connected to one side of the liquid guide block (502). A guide wheel (503) is connected to the other side of the liquid guide block (502).

7. The semiconductor laser power supply processing and cooling device according to claim 6, wherein, A through connection groove (504) is formed on the liquid guide block (502). The through connection groove (504) is fixedly connected to a connection ring (505). The liquid guide block (502) is installed in the annular empty groove between the liquid guide ring (201) and the magnetic permeable ring (207).

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