Clamp adapter based on silicon substrate

Abstract

The utility model discloses a clamp adapter based on a silicon substrate, which is used for replacing an MEMS (Micro Electro Mechanical System) inertial sensor to be arranged in a testboard clamp of a test system to calibrate the test system, and comprises a ceramic tube shell which is arranged in the testboard clamp and is matched with the MEMS inertial sensor; the upper cover is arranged on the ceramic tube shell, and an accommodating inner cavity is formed between the upper cover and the ceramic tube shell; the silicon substrate is fixed in the accommodating inner cavity of the ceramic tube shell, and the silicon substrate is electrically connected with the ceramic tube shell; and the plurality of signal transmission parts are arranged on the silicon substrate and are electrically connected with the silicon substrate, and the plurality of signal transmission parts extend to the outside of the upper cover. The clamp adapter based on the silicon substrate provided by the utility model can improve the calibration precision and efficiency.

Description

Technical Field

[0001] The utility model belongs to the technical field of electronic component testing, and particularly relates to a fixture adapter based on a silicon substrate. Background Art

[0002] During the design, production and other stages of MEMS inertial sensors, a test system is required to calibrate and test the MEMS inertial sensors. The test system needs to be periodically calibrated to ensure the accuracy and effectiveness of the test results. In the prior art, MEMS inertial sensors are tested through a batch test bench. The test bench includes a power supply, peripheral configuration components such as resistors and capacitors, and a test fixture required for the operation of the MEMS inertial sensor. To perform non-destructive testing (without soldering) on the MEMS inertial sensor, the MEMS inertial sensor is placed in the test fixture, and the test fixture is electrically connected to the MEMS inertial sensor and the test bench, realizing the electrical connection between the MEMS inertial sensor and the test bench without soldering.

[0003] The MEMS inertial sensor test system includes a turntable, a centrifuge, a temperature chamber, a test bench, etc. When calibrating the MEMS inertial sensor test system, a fixture adapter is required to replace the MEMS inertial sensor in-situ for calibration to periodically measure the MEMS inertial sensor test system.

[0004] Chinese Patent CN220853621U discloses a fixture adapter for calibrating a MEMS inertial sensor test system, including a PCB board, a backing plate and an electrical connector. The signal connection between the fixture and the test system is realized through the PCB board. Among them, the dimensional tolerance of the PCB board is large, the overall structure is connected by bonding, the overall dimensional error is large, and problems such as unilateral warping are likely to occur when placed in the test fixture after assembly, affecting the electrical connection. Content of the Utility Model

[0005] Based on the above problems, the purpose of the utility model is to provide a fixture adapter based on a silicon substrate to improve the calibration accuracy.

[0006] To solve the problems in the prior art, the technical solution provided by the utility model is as follows:

[0007] A fixture adapter based on a silicon substrate, which is used to replace the MEMS inertial sensor and is placed in the test bench fixture of the test system to calibrate the test system, including:

[0008] A ceramic package, which is placed in the test bench fixture and is adapted to the MEMS inertial sensor;

[0009] An upper cover, which is arranged on the ceramic package and forms an accommodating inner cavity between it and the ceramic package;

[0010] A silicon substrate is fixed within the accommodating inner cavity of the ceramic package, and the silicon substrate is electrically connected to the ceramic package;

[0011] A plurality of signal transmission components are disposed on the silicon substrate and electrically connected to the silicon substrate, and the plurality of signal transmission components extend outside the upper cover.

[0012] Further, the ceramic package includes a ceramic housing, a plurality of first pads disposed circumferentially on the inner wall of the ceramic housing, and a plurality of second pads disposed circumferentially on the outer wall of the ceramic housing, and the plurality of second pads are electrically connected to the test bench fixture.

[0013] Further, a plurality of third pads and a plurality of fourth pads are provided at the upper end of the silicon substrate, each third pad is electrically connected to a corresponding fourth pad, the third pad is electrically connected to the first pad, and the signal transmission component is electrically connected to the fourth pad.

[0014] Further, the third pad is electrically connected to the first pad via a bonding wire.

[0015] Further, the signal transmission component is soldered to the fourth pad.

[0016] Further, the number of the third pads and the fourth pads is at least three.

[0017] Further, the signal transmission component is a wire.

[0018] Further, the silicon substrate is fixed within the ceramic package by an adhesive.

[0019] Further, the upper cover is fixed to the upper end of the ceramic package by soldering or bonding.

[0020] Further, the upper cover is provided with a through groove for the plurality of signal transmission components to extend out.

[0021] Compared with the prior art, the advantages of the present utility model are as follows:

[0022] Adopting the technical solution of the present utility model, through the cooperation of the ceramic package and the silicon substrate, the signal connection between the test fixture and the calibration device is realized. The ceramic package is adapted to the MEMS inertial sensor, so it can be adapted to the test fixture. Compared with the structure of electrically connecting with a PCB board, the adaptability is higher, and it is not easy to have problems of deformation affecting signal transmission. And the metrological calibration is carried out under the actual working state of the MEMS inertial sensor, including influencing factors such as high rotation speed, temperature, internal electromagnetic interference, communication transmission cables, etc., and the calibration is more accurate. Description of the Drawings

[0023] To more clearly illustrate the technical solutions of the embodiments of the present invention, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0024] Figure 1 It is one of the structural schematic diagrams of the fixture adapter based on a silicon substrate according to an embodiment of the present invention;

[0025] Figure 2 It is the second structural schematic diagram of the embodiment of the present invention;

[0026] Figure 3 It is Figure 2 the schematic cross-sectional view of A-A of

[0027] Figure 4 It is one of the structural schematic diagrams of the embodiment of the present invention with the upper cover removed;

[0028] Figure 5 It is the second structural schematic diagram of the embodiment of the present invention with the upper cover removed;

[0029] Wherein:

[0030] 1. Ceramic package; 1-1. Ceramic housing; 1-2. First pad; 1-3. Second pad;

[0031] 2. Upper cover; 2-1. Through slot;

[0032] 3. Silicon substrate; 3-1. Third pad; 3-2. Fourth pad;

[0033] 4. Signal transmission component;

[0034] 5. Bonding wire;

[0035] 6. Adhesive. Specific embodiments

[0036] The above solutions will be further described below in conjunction with specific embodiments. It should be understood that these embodiments are for illustrating the present invention and not for limiting the scope of the present invention. The implementation conditions adopted in the embodiments can be further adjusted according to the conditions of specific manufacturers, and the implementation conditions not specified are usually those in conventional experiments.

[0037] Referring to Figures 1 to 3 , which is the structural schematic diagram of the embodiment of the present invention, a fixture adapter based on a silicon substrate is provided, which is used to replace the MEMS inertial sensor and placed in the test bench fixture of the test system to calibrate the test system.

[0038] The fixture adapter includes a ceramic package 1, an upper cover 2 that mates with the ceramic package 1, a silicon substrate 3 disposed within the ceramic package 1, and a plurality of signal transmission components 4.

[0039] The ceramic package 1 is placed in a test bench fixture and adapted to a MEMS inertial sensor. That is, the ceramic package 1 uses the ceramic package of the MEMS inertial sensor and can cooperate with the test bench fixture to achieve signal transmission. Specifically, the ceramic package 1 includes a ceramic housing 1-1, a plurality of first pads 1-2 circumferentially disposed on the inner wall of the ceramic housing 1-1, and a plurality of second pads 1-3 circumferentially disposed on the outer wall of the ceramic housing 1-1. Among them, the plurality of second pads 1-3 are electrically connected to the pins on the test bench fixture.

[0040] The upper cover 2 uses an upper cover adapted to the MEMS inertial sensor. An accommodation cavity is formed between the upper cover 2 and the ceramic package 1. After the silicon substrate 3 and the plurality of signal transmission components 4 are installed, the upper cover 2 can be welded or bonded and fixed to the upper end of the ceramic package 1 to complete the encapsulation.

[0041] As Figure 4 and Figure 5 shown, the silicon substrate 3 is fixed within the accommodation cavity of the ceramic package 1, and the silicon substrate 3 is electrically connected to the ceramic package 1. The silicon substrate 3 is made of a conventional silicon wafer. The size of the silicon substrate 3 should meet the requirement that it can be placed inside the ceramic package 1. The height of the silicon substrate 3 should be lower than the first pads 1-2 inside the ceramic package 1. The silicon substrate 3 can be fixed in the ceramic package 1 by an adhesive 6. A plurality of third pads 3-1 are provided at the upper end of the silicon substrate 2, and each third pad 3-1 is electrically connected to the first pad 1-2 on the inner wall of the ceramic package 1. For example, the third pad 3-1 and the first pad 1-2 are connected by a bonding wire 5.

[0042] The plurality of signal transmission components 4 are disposed on the silicon substrate 3 and electrically connected to the silicon substrate 3. The plurality of signal transmission components 4 extend outside the upper cover 2 to signal-connect with a calibration device, so as to transmit the signal of the calibration device to the test bench fixture. Specifically, a plurality of fourth pads 3-2 are provided at the upper end of the silicon substrate 3, and the plurality of signal transmission components 4 are welded to the plurality of fourth pads 3-2. The number of the fourth pads 3-2 is the same as the number of the signal transmission components 4, and at least three are provided. During testing, it is set according to the test requirements. Each fourth pad 3-2 is electrically connected to the corresponding third pad 3-1. Among them, the signal transmission component 4 uses a wire.

[0043] To facilitate the installation of the plurality of signal transmission components 4, a through groove 2-1 for the plurality of signal transmission components 4 to extend out is provided on the upper cover 2.

[0044] The working principle of the present utility model is as follows:

[0045] During calibration, the calibration device generates a standard electrical signal, which is transmitted through the signal transmission component 4 to the fourth pad 3-2 on the silicon substrate 3. The fourth pad 3-2 transmits the signal to the third pad 3-1, and the third pad 3-1 transmits the signal through the bonding wire 5 to the first pad 1-2 of the ceramic package 1, and then through the second pad 1-3 to the test bench to complete the calibration of the test.

[0046] In summary, the test bench fixture has a higher adaptability to the test bench, which can improve the calibration accuracy and efficiency.

[0047] The above examples are only for explaining the technical concept and features of the present invention, and the purpose is to enable those who are familiar with this technology to understand the content of the present invention and implement it accordingly, and it cannot be used to limit the protection scope of the present invention. Any equivalent transformation or modification made according to the spirit of the present invention should be covered within the protection scope of the present invention.

Claims

1. A fixture adapter based on a silicon substrate, which is used to replace a MEMS inertial sensor and is placed in a test bench fixture of a test system to calibrate the test system, and is characterized in that Comprising: A ceramic package, which is placed in the test bench fixture and adapted to the MEMS inertial sensor; An upper cover, which is arranged on the ceramic package and forms a receiving inner cavity between it and the ceramic package; A silicon substrate, which is fixed in the receiving inner cavity of the ceramic package, and the silicon substrate is electrically connected to the ceramic package; A plurality of signal transmission components, which are arranged on the silicon substrate and electrically connected to the silicon substrate, and the plurality of signal transmission components extend outside the upper cover.

2. The jig adapter based on a silicon substrate according to claim 1, characterized in that: The ceramic package includes a ceramic housing, a plurality of first pads arranged circumferentially on the inner wall of the ceramic housing, and a plurality of second pads arranged circumferentially on the outer wall of the ceramic housing, and the plurality of second pads are electrically connected to the test bench fixture.

3. The jig adapter based on a silicon substrate according to claim 2, wherein: A plurality of third pads and a plurality of fourth pads are provided at the upper end of the silicon substrate, each third pad is electrically connected to the corresponding fourth pad, the third pad is electrically connected to the first pad, and the signal transmission component is electrically connected to the fourth pad.

4. The fixture adapter based on a silicon substrate according to claim 3, wherein: The third pad is electrically connected to the first pad through a bonding wire.

5. The fixture adapter based on a silicon substrate according to claim 3, wherein: The signal transmission component is soldered on the fourth pad.

6. The fixture adapter based on a silicon substrate according to claim 3, wherein: The number of the third pads and the fourth pads is at least three.

7. The fixture adapter based on a silicon substrate according to claim 1, wherein: The signal transmission component is a wire.

8. The fixture adapter based on a silicon substrate according to claim 1, wherein: The silicon substrate is fixed in the ceramic package through an adhesive.

9. The fixture adapter based on a silicon substrate according to claim 1, wherein: The upper cover is fixed to the upper end of the ceramic package by soldering or bonding.

10. The jig adapter based on a silicon substrate according to claim 9, characterized in that: A through slot for the plurality of signal transmission components to extend out is provided on the upper cover.

Images