Structure for rapidly evaluating adhesive force of adhesive
By introducing guides and telescopic rods into the adhesive evaluation structure, ensuring that the tension gauge pulls the second standard plate perpendicular to the substrate, the accuracy of the bonding force evaluation is solved, and the rapid and simple bonding force evaluation is achieved on-site.
Patent Information
- Application Number
- CN202421784579.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-26
- Publication Date
- 2025-07-08
- Estimated Expiration
- 2034-07-26
AI Technical Summary
In the prior art, when evaluating the adhesive force of the adhesive, it is difficult to ensure that the tensile force is perpendicular to the adhesive surface, resulting in large errors in the evaluation results.
A structure including a substrate, a first standard plate, a second standard plate, a tension gauge and a guide member is designed. The guide member ensures that the tension gauge pulls the second standard plate perpendicular to the substrate, and combines the telescopic rod and the auxiliary plate to achieve rapid on-site evaluation of the bonding force.
Accurate and fast on-site for adhesion assessment, simplifying operational procedures without external power supply, making it easy to carry and multi-batch evaluation.
Smart Images

Figure CN223078159U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of binder measurement and evaluation, and particularly relates to a structure for quickly evaluating the bonding force of a binder. Background Technique
[0002] A binder, also known as an adhesive or glue, is a non-metallic medium material that tightly connects one object to another. It has a wide range of applications in daily life, industry, building materials, metallurgy, agriculture and other fields. The bonding force is one of the core indicators for evaluating the performance of adhesives, directly affecting the bonding effect and overall quality of products. By evaluating the bonding force, it can be ensured that the adhesive can firmly bond the adherend during use and achieve the expected use effect.
[0003] During the production and distribution of binders, it is usually necessary to quickly evaluate the bonding force of binders to ensure production and work efficiency. At present, for the quick evaluation of the bonding force of binders, it is usually to prepare two test samples and apply the binder. One end of the two specimens is fixed, and a tensile force is applied to the other end. The bonding strength is evaluated by measuring the maximum value of the applied tensile force. Although this evaluation method is fast, during the application of the tensile force, it is difficult to ensure that the force is applied perpendicular to the bonding surface of the binder. When there is an angular deviation between the direction of the tensile force and the perpendicular direction of the bonding surface of the binder, it will cause a large error in the evaluation result of the bonding force of the binder. For this reason, this application proposes a structure for quickly evaluating the bonding force of binders. Content of the Utility Model
[0004] The purpose of the utility model is to provide a structure for quickly evaluating the bonding force of a binder, with a simple and reasonable overall structure, which can be used for the on-site quick evaluation of the bonding force of the binder, and is easy to operate and has strong practicability.
[0005] To achieve the above purpose, the utility model provides the following technical scheme:
[0006] A structure for quickly evaluating the bonding force of a binder includes a substrate, on which a first standard plate for applying the binder and a second standard plate for bonding with the binder are arranged, and the first standard plate is fixedly connected to the substrate; a tensiometer arranged above the substrate, which is used to pull the second standard plate away from the first standard plate and measure the tensile force, and a guiding member for guiding the tensiometer to pull perpendicular to the substrate is arranged on the substrate.
[0007] Preferably, the guiding member is a pair of guide rails vertically fixed on the upper surface of the substrate. The pair of guide rails are respectively located on both sides of the first standard plate and the second standard plate. Guide grooves are vertically opened on the guide rails, and guiding convex blocks slidably fitted with the guide grooves are arranged at the bottom end of the side wall of the tensiometer.
[0008] Preferably, a pull ring is provided on the upper surface of the second standard plate, a hook for hooking with the pull ring is provided at the measuring end of the tensiometer, and a handle is provided at the top of the tensiometer.
[0009] Preferably, the guiding bump is arranged in a long strip structure, and the long strip guiding bump is distributed along the length direction of the guide rail.
[0010] Preferably, a threaded through groove is formed in the base plate, the first standard plate is in threaded connection with the threaded through groove, a groove capable of accommodating the second standard plate to be embedded is formed in the upper end surface of the first standard plate, and a retaining ring abutted against the lower surface of the base plate is arranged at the bottom end of the first standard plate.
[0011] Preferably, an auxiliary plate is arranged below the base plate, and a pair of telescopic rods are arranged on the base plate, and the telescopic ends of the telescopic rods are connected with the auxiliary plate.
[0012] Preferably, the telescopic rod is composed of at least three sleeves sleeved with each other.
[0013] Compared with the prior art, the beneficial effects of the present utility model are as follows:
[0014] Through the arrangement of the first standard plate and the second standard plate, the binder is evenly applied in the groove on the first standard plate, the second standard plate is embedded in the groove and bonded with the binder, the tensiometer pulls the second standard plate away from the first standard plate, records the tension measured by the tensiometer when the second standard plate is separated from the first standard plate, and judges the magnitude of the tension and the predetermined bonding force of the binder, so as to be used for evaluating the bonding force of the binder. Since the whole uses the second standard plate to realize the measurement without an external power supply, it is suitable for the on-site rapid evaluation of the bonding force of the binder.
[0015] Through the arrangement of the guiding member, during the process of the tensiometer pulling the second standard plate away from the first standard plate for evaluation, the guiding bump on the tensiometer slides along the guiding groove on the guide rail, and can guide the tensiometer perpendicular to the base plate, so that the tensiometer pulls the second standard plate vertically away from the first standard plate, ensuring the effectiveness of the tensiometer in evaluating the bonding force of the binder.
[0016] Through the arrangement of the auxiliary plate and the telescopic rod, pull the auxiliary plate away from the base plate, utilize the connection between the telescopic rod and the base plate and the auxiliary plate. During the process of pulling the tensiometer away from the base plate, the auxiliary plate can be stepped on and abutted against the ground to assist in fixing the base plate, and the auxiliary plate can be pushed close to the base plate for folding, which is easy to carry.
[0017] Of course, it is not necessary for any product implementing the present utility model to simultaneously achieve all the above advantages. BRIEF DESCRIPTION OF THE DRAWINGS
[0018] Figure 1 is a schematic diagram of the overall structure of the present utility model;
[0019] Figure 2 Structural schematic diagram of the guiding member of the present utility model;
[0020] Figure 3 Structural schematic diagram of the substrate and the auxiliary plate of the present utility model;
[0021] Figure 4 Structural schematic diagram of the first standard plate and the second standard plate of the present utility model.
[0022] In the figure: 1. Substrate; 2. First standard plate; 3. Second standard plate; 4. Tensile meter; 5. Guiding member; 6. Auxiliary plate; 7. Telescopic rod; 8. Guide rail; 9. Guide groove; 10. Guiding bump; 11. Handle; 12. Threaded through groove; 13. Sleeve; 14. Pulling ring; 15. Retaining ring; 16. Groove. Specific embodiments
[0023] In the description of the present utility model, it should be understood that the orientation or positional relationship indicated by the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation to the present utility model. The following describes each embodiment of the present utility model in detail with reference to the drawings.
[0024] Embodiment
[0025] Please refer to Figures 1 to 4, the present utility model preferably provides a technical solution: a structure for quickly evaluating the bonding force of an adhesive, including a substrate 1, a first standard plate 2 for applying the adhesive and a second standard plate 3 for bonding with the adhesive are arranged on the substrate 1, and the first standard plate 2 is fixedly connected to the substrate 1; a tensiometer 4 is arranged above the substrate 1, which is used to pull the second standard plate 3 away from the first standard plate 2 and measure the tensile force. A guiding member 5 for guiding the tensiometer 4 to pull perpendicular to the substrate 1 is arranged on the substrate 1. In this structural manner, the adhesive is evenly applied on the first standard plate 2, the second standard plate 3 is bonded to the adhesive, the tensiometer 4 pulls the second standard plate 3 away from the first standard plate 2, and the tensile force measured by the tensiometer 4 when the second standard plate 3 is separated from the first standard plate 2 is recorded. By judging the magnitude of the tensile force and the predetermined bonding force of the adhesive, it can be used to evaluate the bonding force of the adhesive. Since the whole uses the second standard plate 3 for measurement without an external power supply, it is suitable for the on-site rapid evaluation of the bonding force of the adhesive. In addition, through the arrangement of the guiding member 5, during the evaluation process of the tensiometer 4 pulling the second standard plate 3 away from the first standard plate 2, the tensiometer 4 can be guided perpendicular to the substrate 1, so that the tensiometer 4 pulls the second standard plate 3 vertically away from the first standard plate 2, ensuring the effectiveness of the tensiometer 4 in evaluating the bonding force of the adhesive.
[0026] As a preferred implementation manner of this embodiment, the guiding member 5 is a pair of guide rails 8 vertically fixed on the upper surface of the substrate 1. The pair of guide rails 8 are respectively located on both sides of the first standard plate 2 and the second standard plate 3. A guide groove 9 is vertically opened on the guide rail 8. A guiding convex block 10 that is slidably fitted with the guide groove 9 is arranged at the bottom end of the side wall of the tensiometer 4. During the evaluation process of the tensiometer 4 pulling the second standard plate 3 away from the first standard plate 2, the guiding convex block 10 on the tensiometer 4 slides along the guide groove 9 on the guide rail 8, so that the tensiometer 4 can be guided perpendicular to the substrate 1. The guiding convex block 10 is set as a strip-shaped structure, and the strip-shaped guiding convex block 10 is distributed along the length direction of the guide rail 8, which can prevent the tensiometer 4 from rotating and swinging back and forth.
[0027] In this embodiment, a pull ring 14 is arranged on the upper surface of the second standard plate 3. The measuring end of the tensiometer 4 has a hook for hooking the pull ring 14. A handle 11 is arranged at the top end of the tensiometer 4. A threaded through groove 12 is opened on the substrate 1, and the first standard plate 2 is threadedly connected to the threaded through groove 12, which is convenient for replacing the first standard plate 2 and the second standard plate 3. Only by preparing the first standard plate 2 and the second standard plate 3 in batches, the bonding force of multiple batches of adhesives can be quickly evaluated. A groove 16 capable of accommodating the second standard plate 3 is opened on the upper end surface of the first standard plate 2, which is convenient for applying the adhesive. A retaining ring 15 that abuts against the lower surface of the substrate 1 is arranged at the bottom end of the first standard plate 2.
[0028] In a further embodiment, an auxiliary plate 6 is provided below the substrate 1, and a pair of telescopic rods 7 are provided on the substrate 1. The telescopic ends of the telescopic rods 7 are connected to the auxiliary plate 6. The telescopic rod 7 is composed of at least three sleeves 13 sleeved with each other. When the multiple sleeves 13 are extended, the auxiliary plate 6 can be stepped on and abutted against the ground to assist in fixing the substrate 1, which facilitates the evaluation and detection by pulling the tensiometer 4.
[0029] During use, during the production process or sales sampling inspection process of the adhesive, the adhesive is evenly applied in the groove 16 on the first standard plate 2, and the second standard plate 3 is embedded in the groove 16 and bonded to the adhesive. Then, the hook of the tensiometer 4 is hooked to the pull ring 14 on the second standard plate 3, and the handle 11 is held to pull the tensiometer 4 to pull the second standard plate 3 away from the first standard plate 2. Record the tension measured by the tensiometer 4 when the second standard plate 3 is separated from the first standard plate 2, and judge the magnitude of the tension and the predetermined bonding force of the adhesive, which can be used to evaluate the bonding force of the adhesive. Since the overall measurement is achieved by using the second standard plate 3 and no external power supply is required, it is suitable for the on-site rapid evaluation of the adhesive bonding force. In addition, the second standard plate 3 is hooked and connected to the tensiometer 4, and the first standard plate 2 is threadedly connected to the threaded through groove 12 on the substrate 1, which facilitates the replacement of the second standard plate 3 and the first standard plate 2. Only by preparing the first standard plate 2 and the second standard plate 3 in batches, the bonding forces of multiple batches of adhesives can be rapidly evaluated. Further, during the process of pulling the tensiometer 4 to pull the second standard plate 3 away from the first standard plate 2 for evaluation, the guiding convex block 10 on the tensiometer 4 slides along the guiding groove 9 on the guide rail 8, which can guide the tensiometer 4 perpendicular to the substrate 1, so that the tensiometer 4 pulls the second standard plate 3 vertically away from the first standard plate 2, ensuring the effectiveness of the evaluation of the adhesive bonding force by the tensiometer 4. Further, the auxiliary plate 6 is pulled away from the substrate 1. By using the connection between the substrate 1 and the auxiliary plate 6 by the telescopic rod 7, during the process of pulling the tensiometer 4 away from the substrate 1, the auxiliary plate 6 can be stepped on and abutted against the ground to assist in fixing the substrate 1. Pushing the auxiliary plate 6 close to the substrate 1 can be used for folding, which is easy to carry. The overall structure is simple and reasonable, which can be used for the on-site rapid evaluation of the adhesive bonding force, and the operation is simple and the practicability is strong.
[0030] In the present utility model, unless otherwise clearly specified and limited, the terms "installation", "connection", "connection", "fixation" and other terms should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two components or the interaction relationship between two components. Among them, there are various detachable installation methods. For example, it can be in a manner of cooperation between plugging and buckling, or in a manner of bolt connection, etc.
[0031] The above combination of embodiments and drawings clearly and completely describes the concept, specific structure and technical effects of the present utility model to fully understand the purpose, features and effects of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all embodiments. Based on the embodiments of the present utility model, other embodiments obtained by those skilled in the art without creative efforts fall within the protection scope of the present utility model. In addition, all the connection / linkage relationships mentioned in the text do not simply refer to the direct connection of components, but refer to the formation of a better connection structure by adding or reducing connection accessories according to specific implementation situations.
[0032] The specific description of the present utility model in the above embodiments is only used to further illustrate the present utility model and cannot be understood as a limitation on the protection scope of the present utility model. Non-essential improvements and adjustments made by technical engineers in the art to the present utility model based on the content of the above utility model all fall within the protection scope of the present utility model.
Claims
1. A structure for quickly evaluating the bonding force of an adhesive, characterized in that, Including: A substrate (1), on which a first reference plate (2) for applying an adhesive and a second reference plate (3) for bonding with the adhesive are provided. The first reference plate (2) is fixedly connected to the substrate (1). A tensiometer (4) arranged above the substrate (1), which is used to pull the second reference plate (3) away from the first reference plate (2) and measure the tensile force. A guide member (5) for vertically pulling the tensiometer (4) perpendicular to the substrate (1) is provided on the substrate (1).
2. The structure for quickly evaluating the bonding strength of an adhesive according to claim 1, wherein: The guide member (5) is a pair of guide rails (8) vertically fixed on the upper surface of the substrate (1). The pair of guide rails (8) are respectively located on both sides of the first reference plate (2) and the second reference plate (3). A guide groove (9) is vertically formed on the guide rail (8). A guide projection (10) slidably engaged with the guide groove (9) is provided at the bottom end of the side wall of the tensiometer (4).
3. The structure for quickly evaluating the bonding force of an adhesive according to claim 1, wherein: A pull ring (14) is provided on the upper surface of the second reference plate (3). The measuring end of the tensiometer (4) has a hook for hooking with the pull ring (14). A handle (11) is provided at the top end of the tensiometer (4).
4. A structure for quickly evaluating the bonding force of an adhesive according to claim 2, characterized in that: The guide projection (10) is arranged in a strip-shaped structure, and the strip-shaped guide projection (10) is distributed along the length direction of the guide rail (8).
5. A structure for quickly evaluating the bonding strength of an adhesive according to claim 1, characterized in that: A threaded through groove (12) is formed on the substrate (1). The first reference plate (2) is threadedly connected to the threaded through groove (12). A groove (16) capable of accommodating the second reference plate (3) to be embedded is formed on the upper end surface of the first reference plate (2). A retaining ring (15) abutted against the lower surface of the substrate (1) is provided at the bottom end of the first reference plate (2).
6. The structure for quickly evaluating the bonding force of an adhesive according to claim 1, characterized in that: An auxiliary plate (6) is arranged below the substrate (1). A pair of telescopic rods (7) are provided on the substrate (1). The telescopic ends of the telescopic rods (7) are connected to the auxiliary plate (6).
7. The structure for quickly evaluating the bonding force of an adhesive according to claim 6, characterized in that: The telescopic rod (7) is composed of at least three sleeves (13) sleeved with each other.