Integrated circuit board testing device

Abstract

The utility model discloses an integrated circuit board testing device which comprises a case frame, the case frame is formed by assembling a plurality of steel plates with indentations, the top of the case frame is fixedly connected with an upper cover plate, and the bottom of the case frame is fixedly connected with a lower cover plate. The distance between the upper buckling plate and the lower buckling plate is adjusted through the two sets of telescopic pieces, the device is suitable for installation of integrated circuit board bodies of different specifications, the integrated circuit board bodies slide into the inserting grooves from the flaring parts and continue to slide inwards till the integrated circuit board bodies make contact with the abutting plates and then are protected by the buffering mechanisms, and after a plurality of integrated circuit board bodies are installed, the integrated circuit board bodies are prevented from falling off. The pressing plates are pressed on the side faces of the integrated circuit board bodies to complete installation of the integrated circuit board bodies, the first power line row sets and the second power line row sets corresponding to the integrated circuit board bodies are connected to the positive electrodes and the negative electrodes of the integrated circuit board bodies respectively, power-on synchronous testing is conducted, qualified products and defective products are screened out, the working efficiency is remarkably improved, and the production cost is reduced. And the detection stability is high.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit board testing, in particular to a testing device for integrated circuit boards. Background Art

[0002] An integrated circuit board, abbreviated as an IC board, is an indispensable core component in modern electronic devices. The integrated circuit board mainly consists of a substrate, components, wires, packaging materials, etc. The components include various electronic components and integrated circuit chips, etc., which are the key parts to realize the functions of the integrated circuit board.

[0003] Integrated circuit board testing is an important process to ensure the normal function and stable performance of integrated circuit boards. The purposes of testing include:

[0004] Detecting faults: Detecting and locating the fault points in the integrated circuit board through testing.

[0005] Optimizing design: Optimizing and improving the design of the integrated circuit board based on the test data.

[0006] Verifying functions: Ensuring that the integrated circuit board realizes various functions according to the design requirements.

[0007] Evaluating performance: Measuring and evaluating the performance indexes of the integrated circuit board, such as frequency, gain, distortion, etc.

[0008] Generally, electronic manufacturing enterprises use special equipment to comprehensively test integrated circuit boards. For example, the invention patent with the application number 202311058250.6 discloses a power-on testing device for integrated circuit boards, including a bottom plate. Supporting legs are installed at the lower end of the bottom plate, foot pads are installed at the lower ends of the supporting legs, a circuit board fixing mechanism is installed on the side of the bottom plate, support rods are installed at the upper corners of the bottom plate, a top frame is installed at the upper ends of the support rods, and a detection head position adjustment mechanism is installed inside the top frame; through the circuit board fixing mechanism, this mechanism can facilitate the fixing of circuit boards of different sizes, thus facilitating the power-on detection of the circuit board. In addition, by installing anti-slip protrusions and rubber gaskets on the side of the fixing plate, the circuit board can be prevented from being clamped and damaged; through the detection head position adjustment mechanism, this mechanism can facilitate the adjustment of the position of the detection head, thus facilitating the detection of different positions of the circuit board to improve the practicability of the device.

[0009] However, when the above solution is used, the installation process of the integrated circuit board is not convenient for positioning, resulting in low testing efficiency and unable to meet the actual work needs; if multiple integrated circuit boards are installed at the same time, the test circuit cannot be effectively arranged, resulting in mixed lines, easy misconnection and poor contact, thus leading to measurement errors.

[0010] Therefore, it is necessary to develop a test device that can perform orderly testing on multiple groups of integrated circuit boards, is convenient for positioning, and has a high degree of automation. Content of the Utility Model

[0011] The technical problem to be solved by the present utility model is directed to the deficiencies of the above-mentioned prior art, and provides a test device for integrated circuit boards. The distance between the upper clamping plate and the lower clamping plate is adjusted by two sets of telescopic members, which is suitable for the installation and use of integrated circuit board bodies of different specifications. The integrated circuit board body is slid into the insertion slot from the flared portion and continues to slide inward until it contacts the abutting plate and is protected by the buffer mechanism. After installing multiple integrated circuit board bodies, the pressing plate is used to press against the side of the integrated circuit board body to complete the installation of multiple groups of integrated circuit board bodies. The first power line row group and the second power line row group corresponding to multiple groups of integrated circuit board bodies are respectively connected to the positive and negative poles of the integrated circuit board body for power-on synchronous testing to screen out qualified products and defective products, so as to solve the problems raised in the background technology.

[0012] To solve the above technical problems, the technical solution adopted by the present utility model is:

[0013] A test device for integrated circuit boards includes a chassis frame, and the chassis frame is assembled by multiple steel plates with indentations. The top of the chassis frame is fixedly connected with an upper cover plate, and the bottom of the chassis frame is fixedly connected with a lower cover plate. An upper clamping plate and a lower clamping plate are installed inside the chassis frame. The upper clamping plate is located directly above the lower clamping plate, and corresponding insertion slots are respectively opened on the opposite sides of the upper clamping plate and the lower clamping plate. An integrated circuit board body is installed between the two opposite insertion slots.

[0014] A support plate is installed on the back of the chassis frame. An abutting plate parallel to the support plate is provided inside the chassis frame, and the support plate and the abutting plate are movably connected through a buffer mechanism. Clamping members are arranged at the top and bottom of the back of the chassis frame for binding test power lines. A pressing plate is slidably connected to the front of the chassis frame.

[0015] Preferably, the buffer mechanism includes at least two sliding rods. The ends of the sliding rods are fixed on the abutting plate. The sliding rods penetrate through the support plate and are slidably connected with through holes. Anti-detachment plates are threadedly connected to the ends of the sliding rods. Springs are sleeved on the outer sides of the sliding rods between the abutting plate and the support plate.

[0016] Preferably, the upper clamping plate and the lower clamping plate are slidably connected to the inner wall of the chassis frame. Telescopic members are installed on both the upper cover plate and the lower cover plate. The output ends of the two sets of telescopic members respectively drive the upper cover plate and the lower cover plate to adjust the distance between the upper cover plate and the lower cover plate.

[0017] Preferably, the telescopic member is set to be one of a cylinder, a hydraulic cylinder, and an electric push rod.

[0018] Preferably, the upper fastening plate and the lower fastening plate are distributed in parallel, and a plurality of insertion slots are distributed in parallel.

[0019] Preferably, a flared portion is provided at the front end of the insertion slot.

[0020] Preferably, a limiting sliding groove is provided on the corrugated steel plate, and the cross-sectional shape of the limiting sliding groove is set to a concave shape.

[0021] Preferably, clamping blocks are fixedly connected to both ends of one side of the pressing plate, and the clamping blocks are matched with the limiting sliding grooves. Threaded holes are formed on the surface of the pressing plate, and tightening bolts are threadedly connected in the threaded holes.

[0022] Preferably, the number of the wire clamping members is set to be multiple, and the multiple wire clamping members are respectively slidably connected in the limiting sliding grooves at the top end and the bottom end of the back of the chassis frame. The wire clamping members are made of elastic metal materials.

[0023] Preferably, both the upper fastening plate and the lower fastening plate are made of rubber materials, and reinforcing rib plates are integrally provided on the sides of the upper fastening plate and the lower fastening plate away from the insertion slots.

[0024] The utility model has the following beneficial effects:

[0025] 1. By adjusting the distance between the upper fastening plate and the lower fastening plate through two sets of telescopic members, it is applicable to the installation and use of integrated circuit board bodies of different specifications. Slide the integrated circuit board body into the insertion slot from the flared portion and continue to slide inward until it touches the abutting plate and is protected by the buffer mechanism. After installing multiple integrated circuit board bodies, use the pressing plate to press against the side of the integrated circuit board body to complete the installation of multiple groups of integrated circuit board bodies. Connect the first power line row group and the second power line row group corresponding to multiple groups of integrated circuit board bodies to the positive and negative poles of the integrated circuit board body respectively for power-on synchronous testing, and screen out qualified products and defective products. The working efficiency is significantly improved, and the detection stability is high;

[0026] 2. Firmly clamp the test power line through the wire clamping members, slide the multiple wire clamping members in the limiting sliding grooves, adjust them to the corresponding positions where the integrated circuit board bodies are installed, and comb the power line row groups, which is convenient for accurate docking and installation, improves the test efficiency, avoids test errors caused by messy lines, and can also avoid poor contact problems caused by line entanglement. Description of the Drawings

[0027] Figure 1 is a three-dimensional view of the integrated circuit board testing device provided by the utility model in the use state;

[0028] Figure 2 For the utility model Figure 1 The front view of the shown structure;

[0029] Figure 3 The top view of the structure of the present utility model Figure 1 is shown as follows;

[0030] Figure 4 The first perspective three-dimensional view of the structure of the integrated circuit board testing device provided by the present utility model;

[0031] Figure 5 The second perspective three-dimensional view of the structure of the integrated circuit board testing device provided by the present utility model;

[0032] Figure 6 The three-dimensional view of the mating structure of the upper fastening plate and the lower fastening plate of the present utility model.

[0033] Among them are:

[0034] Chassis frame - 1; upper cover plate - 2; lower cover plate - 3; upper fastening plate - 4; lower fastening plate - 5; insertion slot - 6; integrated circuit board body - 7; support plate - 8; abutting plate - 9; wire clamping member - 10; pressing plate - 11; sliding rod - 12; anti - detachment plate - 13; spring - 14; telescopic member - 15; flared portion - 16; limiting sliding groove - 17; clamping block - 18; threaded hole - 19; reinforcing rib plate - 20. Specific embodiments

[0035] The present utility model will be further described in detail below in conjunction with the accompanying drawings and specific preferred embodiments.

[0036] In the description of the present utility model, it should be understood that the orientation or positional relationship indicated by terms such as "left side", "right side", "upper part", "lower part", etc. is based on the orientation or positional relationship shown in the accompanying drawings. It is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. "First", "second", etc. do not represent the importance of the components, so it cannot be understood as a limitation to the present utility model. The specific dimensions adopted in this embodiment are only for illustrating the technical solution and do not limit the protection scope of the present utility model.

[0037] As Figures 1-6 shown, an integrated circuit board testing device includes a chassis frame 1, and the chassis frame 1 is assembled by multiple steel plates with indentations. An upper cover plate 2 is fixedly connected to the top of the chassis frame 1, a lower cover plate 3 is fixedly connected to the bottom of the chassis frame 1, and an upper fastening plate 4 and a lower fastening plate 5 are installed inside the chassis frame 1. The upper fastening plate 4 is located directly above the lower fastening plate 5, and insertion slots 6 distributed in one - to - one correspondence are provided on the opposite sides of the upper fastening plate 4 and the lower fastening plate 5. An integrated circuit board body 7 is installed between the two opposite insertion slots 6;

[0038] A support plate 8 is installed on the back of the chassis frame 1, and an abutting plate 9 parallel to the support plate 8 is arranged inside the chassis frame 1, and the support plate 8 and the abutting plate 9 are movably connected through a buffer mechanism;

[0039] As a preferred implementation manner of the buffer mechanism in the present utility model:

[0040] The buffer mechanism includes at least two sliding rods 12, the ends of the sliding rods 12 are fixed on the abutting plate 9, the sliding rods 12 penetrate through the support plate 8 and are slidably connected with the through holes, anti-detachment plates 13 are threadedly connected to the ends of the sliding rods 12, and springs 14 are sleeved on the outer sides of the sliding rods 12 and between the abutting plate 9 and the support plate 8;

[0041] Cable clamping members 10 are arranged at both the top and bottom of the back of the chassis frame 1 for binding test power cables, a pressing plate 11 is slidably connected to the front of the chassis frame 1, buffer sheets are arranged on the sides of the abutting plate 9 and the pressing plate 11, and the buffer sheets are made of rubber materials;

[0042] Insert a plurality of integrated circuit board bodies 7 into a plurality of corresponding insertion slots 6. After the integrated circuit board bodies 7 enter the insertion slots 6, slide them inward until they contact the abutting plate 9 and are protected by the buffer mechanism. After installing a plurality of integrated circuit board bodies 7, push the integrated circuit board bodies 7 inward, and then move the pressing plate 11 downward to press it against the side of the integrated circuit board bodies 7, thereby completing the installation of the integrated circuit board bodies 7.

[0043] Specifically, the upper fastening plate 4 and the lower fastening plate 5 are slidably connected to the inner wall of the chassis frame 1, which can ensure the stability of the movement of the upper fastening plate 4 and the lower fastening plate 5. Telescopic members 15 are installed on both the upper cover plate 2 and the lower cover plate 3, and the output ends of the two groups of telescopic members 15 drive the upper cover plate 2 and the lower cover plate 3 respectively, for adjusting the distance between the upper cover plate 2 and the lower cover plate 3, and can be applicable to integrated circuit board bodies 7 of different specifications.

[0044] Specifically, the telescopic member 15 is set to be one of a cylinder, a hydraulic cylinder and an electric push rod. When a cylinder or a hydraulic cylinder is selected as the telescopic adjustment structure, a pneumatic mechanism or a hydraulic mechanism is used as the power control.

[0045] Specifically, the upper fastening plate 4 and the lower fastening plate 5 are parallelly distributed, and a plurality of insertion slots 6 are parallelly distributed, which is convenient for the insertion and installation of the integrated circuit board bodies 7, can simultaneously install multiple groups of integrated circuit board bodies 7 for testing, and the overall structure is relatively stable after the installation of multiple groups of integrated circuit board bodies 7.

[0046] Specifically, a flared portion 16 is arranged at the front end of the insertion slot 6, which is convenient for the insertion of the integrated circuit board body 7.

[0047] Specifically, a limiting sliding groove 17 is arranged on the indented steel plate, and the cross-sectional shape of the limiting sliding groove 17 is set to be concave-shaped.

[0048] Specifically, at both ends of one side of the pressing plate 11, clamping blocks 18 are fixedly connected, and the clamping blocks 18 are matched with the limit sliding grooves 17. Threaded holes 19 are formed on the surface of the pressing plate 11, and a tightening bolt is threadedly connected in the threaded holes 19. When it is necessary to fix the position of the pressing plate 11, the tightening bolt is screwed into the threaded hole 19, and its end abuts against the steel plate with indentations, realizing the limitation of the pressing plate 11.

[0049] Specifically, the number of the wire clamping members 10 is set to be multiple, and the multiple wire clamping members 10 are respectively slidably connected in the limit sliding grooves 17 at the top and bottom of the back of the chassis frame 1. The wire clamping members 10 are made of elastic metal materials. The top of the wire clamping member 10 can firmly clamp the test power cord. The test power cord includes a first power cord row group connected to the positive electrode of the integrated circuit board body 7 and a second power cord row group connected to the negative electrode of the integrated circuit board body 7. The wire clamping member 10 is slid to adjust it to the corresponding position where the integrated circuit board body 7 is installed, so as to sort out the power cord row group, which is convenient for accurate butt joint installation, avoiding test errors caused by messy lines, and at the same time can avoid the problem of poor contact caused by line entanglement.

[0050] Specifically, both the upper clamping plate 4 and the lower clamping plate 5 are made of rubber materials, and reinforcing rib plates 20 are integrally arranged on the sides of the upper clamping plate 4 and the lower clamping plate 5 away from the insertion slot 6. The support strength and toughness of the upper clamping plate 4 and the lower clamping plate 5 are improved through the reinforcing rib plates 20. The rubber upper clamping plate 4 and the lower clamping plate 5 clamp the integrated circuit board body 7, having a buffering and anti-slip effect and preventing scratches on the surface of the integrated circuit board body 7.

[0051] When the utility model is in use, first move the pressing plate 11 to the top or bottom of the limit sliding groove 17. According to the specifications of the integrated circuit board body 7, adjust the two sets of telescopic members 15 so that their output ends push the upper clamping plate 4 and the lower clamping plate 5, so that the distance between the corresponding insertion slots 6 meets the use of the integrated circuit board body 7. Slide the integrated circuit board body 7 into the insertion slot 6 through the flared portion 16 and continue to slide inward until it contacts the abutting plate 9 and is protected by the buffer mechanism. After installing multiple integrated circuit board bodies 7, push the integrated circuit board body 7 inward, and then move the pressing plate 11 downward to press it against the side of the integrated circuit board body 7, thus completing the installation of the integrated circuit board body 7; during the test, connect the first power cord row group and the second power cord row group corresponding to multiple groups of integrated circuit board bodies 7 to the positive and negative electrodes of the integrated circuit board body 7 respectively and conduct a power-on test. After the test, screen out the qualified products and defective products, and remove the integrated circuit board body 7 for collection.

[0052] The embodiments of the present utility model have been described in detail above in conjunction with the accompanying drawings, but the present utility model is not limited to the described embodiments. For those skilled in the art, without departing from the principle and spirit of the present utility model, various changes, modifications, substitutions, and variations made to these embodiments still fall within the protection scope of the present utility model.

Claims

1. An integrated circuit board testing device, comprising a chassis frame (1), and the chassis frame (1) is assembled by a plurality of steel plates with indentations, characterized in that: A top cover plate (2) is fixedly connected to the top of the chassis frame (1). A bottom cover plate (3) is fixedly connected to the bottom of the chassis frame (1). An upper fastening plate (4) and a lower fastening plate (5) are installed inside the chassis frame (1). The upper fastening plate (4) is directly above the lower fastening plate (5). Plug-in slots (6) are provided in a one-to-one correspondence on the opposite sides of the upper fastening plate (4) and the lower fastening plate (5). An integrated circuit board body (7) is installed between two opposite plug-in slots (6). A support plate (8) is installed on the back of the chassis frame (1). An abutting plate (9) parallel to the support plate (8) is provided inside the chassis frame (1). The support plate (8) and the abutting plate (9) are movably connected through a buffer mechanism. Clamping members (10) are provided at the top and bottom of the back of the chassis frame (1) for binding test power cords. A pressing plate (11) is slidably connected to the front of the chassis frame (1).

2. An integrated circuit board testing device according to claim 1, characterized in that: The buffer mechanism includes at least two sliding rods (12). The ends of the sliding rods (12) are fixed to the abutting plate (9). The sliding rods (12) penetrate through the support plate (8) and are slidably connected to through holes. An anti-disengagement plate (13) is threadedly connected to the end of the sliding rod (12). A spring (14) is sleeved outside the sliding rod (12) between the abutting plate (9) and the support plate (8).

3. An integrated circuit board testing device according to claim 1, characterized in that: The upper fastening plate (4) and the lower fastening plate (5) are slidably connected to the inner wall of the chassis frame (1). Telescopic members (15) are installed on both the upper cover plate (2) and the lower cover plate (3). The output ends of the two groups of telescopic members (15) drive the upper cover plate (2) and the lower cover plate (3) respectively to adjust the distance between the upper cover plate (2) and the lower cover plate (3).

4. An integrated circuit board testing device according to claim 3, characterized in that: The telescopic member (15) is one of a cylinder, a hydraulic cylinder, and an electric push rod.

5. An integrated circuit board testing device according to claim 1, characterized in that: The upper fastening plate (4) and the lower fastening plate (5) are parallelly distributed, and multiple plug-in slots (6) are parallelly distributed.

6. The integrated circuit board testing device according to claim 1, characterized in that: A flared portion (16) is provided at the front end of the plug-in slot (6).

7. An integrated circuit board testing device according to claim 1, characterized in that: A limiting sliding groove (17) is provided on the corrugated steel plate, and the cross-sectional shape of the limiting sliding groove (17) is concave.

8. An integrated circuit board testing device according to claim 7, characterized in that: Two ends of one side of the pressing plate (11) are fixedly connected with clamping blocks (18), and the clamping blocks (18) are matched with the limiting sliding groove (17). Threaded holes (19) are provided on the surface of the pressing plate (11), and fastening bolts are threadedly connected in the threaded holes (19).

9. An integrated circuit board testing device according to claim 1, wherein: The number of the clamping members (10) is multiple, and the multiple clamping members (10) are respectively slidably connected in the limiting sliding grooves (17) at the top and bottom of the back of the chassis frame (1). The clamping members (10) are made of elastic metal materials.

10. A test device for an integrated circuit board according to claim 1, characterized in that: Both the upper fastening plate (4) and the lower fastening plate (5) are made of rubber materials. Reinforcing rib plates (20) are integrally provided on the sides of the upper fastening plate (4) and the lower fastening plate (5) away from the plug-in slots (6).

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