Testing equipment applied to civil aircraft general assembly site

Abstract

The utility model discloses test equipment applied to a civil aircraft general assembly site, which relates to the field of field equipment test and comprises a microcontroller, a wireless communication module, a power supply management module, a power supply battery and a plurality of interfaces of an RS485 interface, an RS232 interface, an RS422 interface, a CAN bus interface, a USB interface, an Ethernet interface and a GPIB interface. The microcontroller executes data transmission between the upper computer equipment and the assembly equipment through the wireless communication module and the test interface; according to the utility model, the diversified test interfaces improve the applicability between the test device and different assembly devices, realize the data transmission between each assembly device and the upper computer device on the general assembly site, ensure the remote test of the related functions of the assembly devices, improve the convenience of the function test of the assembly devices, and improve the test efficiency. And the accuracy of a test result is improved.

Description

Technical Field

[0001] The utility model relates to the field of on-site equipment testing, in particular to a testing device applied to the general assembly site of civil aircraft. Background Art

[0002] As a high-end manufacturing industry, there are often various assembly equipment at the general assembly site of civil aircraft. The functional testing of each assembly equipment has become an important guarantee for the safety of aircraft production.

[0003] Different types of assembly equipment often support different types of communication interfaces. At the same time, in order to ensure the functional safety of the assembly equipment, the equipment itself often does not allow the installation of networking functions. In the prior art, for the functional testing of the assembly equipment at the general assembly site of civil aircraft, it is often necessary for testers to carry a host computer device to the general assembly site and then connect the host computer device to the assembly equipment through different types of data cables to complete the functional testing of the assembly equipment.

[0004] However, the host computer device is often not convenient to carry, which greatly affects the convenience of functional testing. At the same time, the noisy environment at the general assembly site will have a negative impact on the stable operation of the host computer device and the testing concentration of testers, greatly affecting the accuracy of the test results. Summary of the Utility Model

[0005] The utility model provides a testing device applied to the general assembly site of civil aircraft to solve the problem that the assembly equipment at the general assembly site of civil aircraft cannot perform remote functional testing.

[0006] The utility model provides a testing device applied to the general assembly site of civil aircraft, including: a microcontroller, a wireless communication module, a power supply management module, a power supply battery, and a plurality of testing interfaces; the plurality of testing interfaces include multiple of RS485 interface, RS232 interface, RS422 interface, CAN bus interface, USB interface, Ethernet interface, and GPIB interface; different testing interfaces are connected to different assembly equipment;

[0007] The microcontroller is connected to the wireless communication module and the testing interface, and is used to execute data transmission between the host computer device and the assembly equipment through the wireless communication module and the testing interface;

[0008] The power supply management module is connected to the microcontroller and the power supply battery, and is used to supply power to the microcontroller through the power supply battery and manage the power supply state of the power supply battery.

[0009] The microcontroller includes an ESP32-C3 chip.

[0010] The RS422 interface is connected to the microcontroller through an SP3490EN-L / TR chip.

[0011] The RS485 interface is connected to the microcontroller through an SP3485 chip.

[0012] The RS232 interface is connected to the microcontroller through an SP3232EUCY-L / TR chip.

[0013] The CAN bus interface is connected to the microcontroller through a PCA82C251T / YM chip.

[0014] The Ethernet interface is connected to the microcontroller through a W5500 chip.

[0015] The power supply management module includes an AP2007 chip and a DW01A chip; the AP2007 chip is used to convert the power supply voltage of the power supply battery into the working voltage of the microcontroller; the DW01A chip is used to manage the power supply state of the power supply battery.

[0016] The test equipment applied to the civil aircraft final assembly site further includes a Type-C interface; the Type-C interface is connected to an external power supply; the power supply management module is specifically used to switch the power supply state of the microcontroller to be powered by the external power supply or the power supply battery through a PMOS transistor.

[0017] The power supply management module further includes a switching power supply unit; the switching power supply unit is connected to the Type-C interface; the power supply management module is specifically used to switch the power supply state of the microcontroller to be powered by the power supply battery when it detects that the external power supply is cut off through the switching power supply unit.

[0018] In the present utility model, the microcontroller is connected to different assembly devices at the civil aircraft final assembly site through test interfaces such as RS485 interface, RS232 interface, RS422 interface, CAN bus interface, USB interface, Ethernet interface and GPIB interface, and is communicatively connected to the upper computer device through a wireless communication module. With such diverse test interfaces, the applicability between the test equipment and different assembly devices is improved, data transmission between each assembly device at the final assembly site and the upper computer device is realized, remote testing of the relevant functions of the assembly devices is ensured. At the same time, the upper computer device does not need to be carried into the final assembly site, which improves the convenience of the functional testing of the assembly devices, avoids the noisy environment at the final assembly site from having a negative impact on the operation of the upper computer device and the test concentration of the test personnel, and improves the accuracy of the test results.

[0019] It should be understood that the content described in this part is not intended to identify the key or important features of the embodiments of the present utility model, nor is it used to limit the scope of the present utility model. Other features of the present utility model will become easily understood through the following description. Brief Description of the Drawings

[0020] In order to more clearly illustrate the technical solutions in the present utility model, the following will briefly introduce the drawings required for use in the description of the embodiments. Obviously, the drawings in the following description are only some embodiments of the present utility model. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0021] Figure 1 It is a structural diagram of a test device applied to the general assembly site of a civil aircraft according to Embodiment 1 of the present utility model;

[0022] Figure 2 It is a schematic diagram of the peripheral circuit of the SP3490EN-L / TR chip according to Embodiment 1 of the present utility model;

[0023] Figure 3 It is a schematic diagram of the peripheral circuit of the SP3485 chip according to Embodiment 1 of the present utility model;

[0024] Figure 4 It is a schematic diagram of the peripheral circuit of the SP3232EUCY-L / TR chip according to Embodiment 1 of the present utility model;

[0025] Figure 5 It is a schematic diagram of the peripheral circuit of the PCA82C251T / YM chip according to Embodiment 1 of the present utility model;

[0026] Figure 6 It is a structural diagram of another test device applied to the general assembly site of a civil aircraft according to Embodiment 2 of the present utility model;

[0027] Figure 7 It is a schematic structural diagram of the power supply management module according to Embodiment 2 of the present utility model;

[0028] Figure 8 It is a structural diagram of the housing of the test device applied to the general assembly site of a civil aircraft according to Embodiment 2 of the present utility model;

[0029] Figure 9 It is a structural diagram of the top cover of the test device applied to the general assembly site of a civil aircraft according to Embodiment 2 of the present utility model;

[0030] Figure 10 It is a top view structural diagram of the test device applied to the general assembly site of a civil aircraft according to Embodiment 2 of the present utility model;

[0031] Figure 11 It is a structural diagram of yet another test device applied to the general assembly site of a civil aircraft according to Embodiment 3 of the present utility model. Detailed implementation manners

[0032] In order to enable those skilled in the art of the present technology to better understand the solutions of the present utility model, the technical solutions in the present utility model will be clearly and completely described below in conjunction with the accompanying drawings in the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all of the embodiments. Based on the embodiments in the present utility model, all other embodiments obtained by those of ordinary skill in the art without making creative efforts shall fall within the protection scope of the present utility model.

[0033] It should be noted that the terms "first", "second", etc. in the description and claims of the present utility model and the above-mentioned accompanying drawings are used to distinguish similar objects, and do not necessarily need to be used to describe a specific order or sequence. It should be understood that such used data can be interchanged under appropriate circumstances so that the embodiments of the present utility model described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusion. For example, a process, method, system, product or device including a series of steps or units does not necessarily have to be limited to those steps or units clearly listed, but may include other steps or units not clearly listed or inherent to these processes, methods, products or devices.

[0034] Embodiment 1

[0035] Figure 1 The figure shows a structural diagram of a test device applied to the general assembly site of civil aircraft provided in Embodiment 1 of the present utility model. The test device includes a microcontroller 100, a wireless communication module 200, a power supply management module 300, a power supply battery 400, and a plurality of test interfaces; the plurality of test interfaces include a plurality of interfaces among an RS485 interface 501, an RS232 interface 502, an RS422 interface 503, a CAN bus interface 504, a USB interface 505, an Ethernet interface 506, and a GPIB interface 507; different test interfaces are connected to different assembly devices.

[0036] Specifically, according to the different communication interfaces supported by the assembly devices (such as oscilloscopes, multimeters, and various sensors, etc.) that do not have networking capabilities in the general assembly site of civil aircraft, different types of test interfaces can be configured for the current test device. For example, interfaces such as an RS485 interface 501, an RS232 interface 502, an RS422 interface 503, a CAN bus interface 504, a USB interface 505, an Ethernet interface 506, and a GPIB interface 507 can be configured to meet the functional test requirements between the host computer device and various assembly devices in the general assembly site of civil aircraft; among them, the assembly devices are the relevant devices participating in the civil aircraft general assembly process.

[0037] Among them, the RS485 interface 501, that is, the EIA-485 interface, adopts a two-wire system, half-duplex and point-to-point communication method, and has the characteristics of strong anti-noise interference, long transmission distance and multi-station ability; the RS232 interface 502, that is, the EIA-232 interface, adopts a three-wire system, full-duplex and point-to-multiple master-slave communication method, and has the characteristics of flexible baud rate selection and relatively long transmission distance; the RS422 interface 503, that is, the EIA-422 interface, adopts a five-wire system, full-duplex and point-to-multiple master-slave communication method, and has the characteristic of fast transmission speed; the CAN bus interface 504, that is, the Controller Area Network bus interface; the GPIB interface 507, that is, the General-Purpose Interface Bus (GPIB) interface.

[0038] The microcontroller 100 is connected to the wireless communication module 200 and the test interface, and is used to execute data transmission between the upper computer device and the assembly device through the wireless communication module 200 and the test interface. One end of the microcontroller 100 is connected to the wireless communication module 200, and the other end is respectively connected to each test interface. It is used to obtain the uplink transmission data sent by the corresponding assembly device through the test interface, and report the uplink transmission data to the upper computer device through the wireless communication module 200; at the same time, it is also used to obtain the downlink transmission data sent by the upper computer device through the wireless communication module 200, and send the downlink transmission data to the corresponding assembly device through the test interface, so as to complete the data transmission between the upper computer device and the assembly device.

[0039] The wireless communication module 200 may include one or more wireless communication units such as a Wi-Fi (Wireless Fidelity) communication unit, a Bluetooth communication unit, and an infrared communication unit. It is communicatively connected to the upper computer device through wireless communication, so that the assembly device without networking function in the civil aircraft final assembly site can realize data transmission with the upper computer device through the current test device to realize the remote function test of the on-site assembly device; in particular, the microcontroller 100 can also select the wireless communication unit with better signal strength as the transmission method of the current data to be transmitted according to the signal strength of different communication methods.

[0040] Optionally, in the present utility model, the microcontroller 100 includes an ESP32-C3 chip. This chip not only has the characteristics of low power consumption and high performance, but also supports multiple wireless communication methods such as Wi-Fi communication and Bluetooth communication, enabling the microcontroller 100 to select a matching wireless communication method according to different communication scenarios, that is, different communication methods supported by the host device, thereby enhancing the diversity of remote testing methods and the applicability of testing equipment; in addition, the ESP32-C3 chip supports external expansion of pseudo static random access memory (PSRAM), has good peripheral expansion functions, and thus greatly improves the expansion performance of the testing equipment, meeting the functional testing requirements of diversified assembly equipment.

[0041] Optionally, in the present utility model, the RS422 interface 503 is connected to the microcontroller 100 through an SP3490EN-L / TR chip. The SP3490EN-L / TR chip is specifically used to convert the transmission data received by the RS422 interface 503 into a serial port signal (i.e., "UART" signal) and uniformly collect it into the microcontroller 100 for the microcontroller 100 to uniformly manage all transmission signals; the peripheral circuit of the SP3490EN-L / TR chip is as Figure 2 shown; among them, the microcontroller 100 is connected to the "R#" port and "D" port of the SP3490EN-L / TR chip, and the RS422 interface 503 is connected to the "B" port and "Z" port of the SP3490EN-L / TR chip; the SP3490EN-L / TR chip not only supports high-speed multi-node data communication, but also can adapt to the complex general assembly site environment and has good transmission performance.

[0042] Optionally, in the present utility model, the RS485 interface 501 is connected to the microcontroller 100 through an SP3485 chip. The SP3485 chip is specifically used to convert the transmission data received by the RS485 interface 501 into a serial port signal and uniformly collect it into the microcontroller 100 for the microcontroller 100 to uniformly manage all transmission signals; the peripheral circuit of the SP3485 chip is as Figure 3 shown; among them, the microcontroller 100 is connected to the "RO" port and "DI" port of the SP3485 chip, and the RS485 interface 501 is connected to the "A" port and "B" port of the SP3485 chip; the SP3485 chip not only has the characteristics of low power consumption and high performance, but also has a small size, reducing the area occupied by the functional chip on the printed circuit board of the testing equipment.

[0043] Optionally, in the present utility model, the RS232 interface 502 is connected to the microcontroller 100 through an SP3232EUCY-L / TR chip. The SP3232EUCY-L / TR chip is specifically used to convert the transmission data received by the RS485 interface 501 into a serial port signal and uniformly collect it into the microcontroller 100, so as to facilitate the unified management of various transmission signals by the microcontroller 100; the peripheral circuit of the SP3232EUCY-L / TR chip is as Figure 4 shown; among them, the microcontroller 100 is connected to the "R1OUT" port and the "T1IN" port of the SP3232EUCY-L / TR chip, and the RS485 interface 501 is connected to the "T1OUT" port and the "R1IN" port of the SP3232EUCY-L / TR chip; the SP3232EUCY-L / TR chip also has the characteristics of low power consumption and high performance.

[0044] Optionally, in the present utility model, the CAN bus interface 504 is connected to the microcontroller 100 through a PCA82C251T / YM chip. The PCA82C251T / YM chip is specifically used to convert the transmission data received by the CAN bus interface 504 into a serial port signal and uniformly collect it into the microcontroller 100, so as to facilitate the unified management of various transmission signals by the microcontroller 100; the peripheral circuit of the PCA82C251T / YM chip is as Figure 5 shown; among them, the microcontroller 100 is connected to the "CANH" port and the "CANL" port of the PCA82C251T / YM chip, and the CAN bus interface 504 is connected to the "TXD" port and the "RXD" port of the PCA82C251T / YM chip; the PCA82C251T / YM chip also supports high-speed multi-node data communication and can adapt to the complex general assembly site environment, and also has good transmission performance.

[0045] Optionally, in the present utility model, the Ethernet interface 506 is connected to the microcontroller 100 through a W5500 chip. The W5500 chip is specifically used to convert the transmission data received by the Ethernet interface 506 into a serial port signal and uniformly collect it into the microcontroller 100, so as to facilitate the unified management of various transmission signals by the microcontroller 100; the W5500 chip supports full-duplex and half-duplex auto-negotiation communication and can operate normally in industrial-level high-temperature and low-temperature environments. For example, it can work normally in the range of -40 degrees to 85 degrees and has good voltage resistance, thereby improving the adaptability of the test equipment to harsh test environments. In addition, the USB interface 505 can be directly connected to the microcontroller 100 through a Type-A socket to reduce the expenditure on additional conversion circuits.

[0046] The power supply management module 300 is connected to the microcontroller 100 and the power supply battery 400, and is used to supply power to the microcontroller 100 through the power supply battery 400 and manage the power supply state of the power supply battery 400. Since the power supply voltage of the power supply battery 400 is often different from the operating voltage of the microcontroller 100. For example, the power supply voltage of the power supply battery 400 may be 3.7V, while the operating voltage of the microcontroller 100 is 5V. At this time, the power supply management module 300 needs to convert the power supply voltage of the power supply battery 400 into the operating voltage of the microcontroller 100 through a DC-to-DC converter to ensure the normal power supply of the microcontroller 100; the microcontroller 100 is also used to supply power to functional modules directly or indirectly connected to itself, such as the wireless communication module 200; at the same time, the power supply management module 300 is also used to manage the power of the power supply battery 400 to avoid overcharging or over-discharging of the power supply battery 400.

[0047] Optionally, in the present utility model, the power supply management module 300 includes an AP2007 chip and a DW01A chip; the AP2007 chip is used to convert the power supply voltage of the power supply battery 400 into the operating voltage of the microcontroller 100; the DW01A chip is used to manage the power supply state of the power supply battery 400. As a compact synchronous rectification boost converter, the AP2007 chip has the characteristics of high-efficiency boost, ensuring the timeliness of power supply for the microcontroller 100; the DW01A chip internally includes a high-precision voltage detection circuit and a delay circuit. By detecting the voltage and current of the power supply battery 400, overcharge protection, over-discharge protection, and over-current protection of the power supply battery 400 are realized, improving the power supply safety of the power supply battery 400.

[0048] In the present utility model, the microcontroller is connected to different assembly devices at the civil aircraft final assembly site through test interfaces such as RS485 interface, RS232 interface, RS422 interface, CAN bus interface, USB interface, Ethernet interface, and GPIB interface, and is communicatively connected to the upper computer device through the wireless communication module. In this way, through the diverse test interfaces it has, the applicability between the test device and different assembly devices is improved, data transmission between each assembly device at the final assembly site and the upper computer device is realized, remote testing of the relevant functions of the assembly devices is ensured. At the same time, the upper computer device does not need to be carried into the final assembly site, improving the convenience of functional testing of the assembly devices, avoiding the noisy environment at the final assembly site from having a negative impact on the operation of the upper computer device and the test concentration of the test personnel, and improving the accuracy of the test results.

[0049] Embodiment 2

[0050] Figure 6The figure shows the structure diagram of a testing device applied to the general assembly site of civil aircraft in the second embodiment of the present utility model. The testing device further includes a Type-C interface 600; the Type-C interface 600 is connected to an external power supply; the power supply management module 300 is specifically configured to switch the microcontroller 100 to be powered by the external power supply or the power supply battery 400 through a PMOS transistor.

[0051] Specifically, as Figure 7 shown, the power supply management module 300 switches the power supply mode through a PMOS (Positive channel Metal Oxide Semiconductor, MOS that transports current by the flow of holes) transistor; among them, the PMOS transistor may include an AO3401A chip; if the external power supply has power supply through the Type-C interface 600, the power supply management module 300 will increase the voltage of the VBUS terminal, thereby turning off the power supply of the power supply battery 400; if the external power supply does not have power supply through the Type-C interface 600, the PMOS transistor will be turned on, thereby powering the microcontroller 100 through the power supply battery 400. Thus, on the basis of enabling the testing device to have multiple charging methods, it is ensured that only one power supply powers the microcontroller 100 at the same time.

[0052] Figure 8 The figure shows the structure diagram of the housing of a testing device applied to the general assembly site of civil aircraft. According to the different structures of different testing interfaces, corresponding openings are provided on the housing so that the housing structure adapts to the external placement requirements of different testing interfaces; Figure 9 The figure shows the structure diagram of the top cover of a testing device applied to the general assembly site of civil aircraft. A plurality of screw holes are provided on the top cover. After the screws pass through the screw holes, the top cover can be fixed to the housing; Figure 10 The figure shows the top view structure diagram of a testing device applied to the general assembly site of civil aircraft. Only various testing interfaces are shown externally, while other functional modules, such as the microcontroller 100, the wireless communication module 200, the power supply management module 300, and the power supply battery 400, etc., are all encapsulated inside the housing.

[0053] Taking the oscilloscope, an assembly device at the civil aircraft final assembly site, as an example, after connecting the interface of the oscilloscope to the RS232 interface 502 of the current test device, the host device scans the WIFI network emitted by the wireless communication module 200 and connects to it. After the host device sends a "RUN" instruction to the current test device and the current test device forwards this instruction to the oscilloscope, the oscilloscope starts to collect signals and displays the current waveform status in real time; after the host device sends a "STOP" instruction to the current test device and the current test device forwards this instruction to the oscilloscope, the oscilloscope will immediately pause and store the current waveform information; after the host device sends a "PRINT" instruction to the current test device and the current test device forwards this instruction to the oscilloscope, the oscilloscope will store the waveform diagram in the USB storage device.

[0054] In the present utility model, the test device applied to the civil aircraft final assembly site includes a power supply battery and also includes a Type-C interface connected to an external power supply. The power supply management module switches the power supply mode of the microcontroller to external power supply or power supply battery power supply through a PMOS transistor, thereby expanding the power supply type of the current test device and ensuring that when a single power supply fails, the normal operation of the test device can be ensured through other power supply methods.

[0055] Embodiment 3

[0056] Figure 11 The figure shows the structure diagram of a test device applied to the civil aircraft final assembly site provided in Embodiment 3 of the present utility model. The power supply management module 300 of the test device applied to the civil aircraft final assembly site further includes a switching power supply unit 301; the switching power supply unit 301 is connected to the Type-C interface 600; the power supply management module 300 is specifically configured to switch to power supply by the power supply battery 400 when it detects that the external power supply is cut off through the switching power supply unit 301.

[0057] Specifically, a switch mode power supply (SMPS) itself is a high-frequency electric energy conversion device, and its function is to convert a certain level of voltage into the voltage or current required by the user through different forms of architectures. When the external power supply fails, the switching power supply unit will not immediately be in a power-off state and needs to go through a short period of continuous discharge. During this continuous discharge period, it continues to supply power to the microcontroller 100 through the power released by itself. At the same time, when the power supply management module 300 detects that the external power supply is cut off through the switching power supply unit 301, it switches the external power supply to power supply by the power supply battery 400.

[0058] Specifically, in the present utility model, since the Type-C interface 600 has converted the external power supply voltage (for example, 220V) into the operating voltage of the microcontroller 100 (for example, 5V), the switching power supply unit 301 here does not need to perform a voltage conversion operation and only needs to utilize its continuous discharge function after power-off. When the step-down function of the Type-C interface 600 fails, the input voltage entering the switching power supply unit at this time is the 220V voltage of the external power supply, and the switching power supply unit will convert it into the operating voltage of the microcontroller 100 at this time. In addition, according to the actual test requirements on the civil aircraft final assembly site, the switching power supply unit 301 can also be configured to be directly connected to the external power supply to replace the existing external power supply based on the Type-C interface 600 and change it to an external power supply based on the switching power supply unit 301.

[0059] In the present utility model, by configuring a switching power supply unit in the power supply management module, not only does the current test device have two power supply methods, namely external power supply and power supply battery, but also when a power failure occurs during the external power supply process, the power supply management module can not only perform the switching of the power supply method, that is, switch from external power supply to power supply battery, but also ensure continuous power supply during the switching process, avoid interruption of the test process due to power failure, and ensure the stable operation of the test process.

Claims

1. A test device applied to the general assembly site of civil aircraft, characterized in that Comprising: A microcontroller, a wireless communication module, a power supply management module, a power supply battery, and a plurality of test interfaces; the plurality of test interfaces include multiple ones among an RS485 interface, an RS232 interface, an RS422 interface, a CAN bus interface, a USB interface, an Ethernet interface, and a GPIB interface; different test interfaces are connected to different assembly devices; The microcontroller, connected to the wireless communication module and the test interfaces, is used to execute data transmission between the host device and the assembly device through the wireless communication module and the test interfaces; The power supply management module, connected to the microcontroller and the power supply battery, is used to supply power to the microcontroller through the power supply battery and manage the power supply state of the power supply battery.

2. The test equipment applied to the general assembly site of civil aircraft according to claim 1, characterized in that The microcontroller includes an ESP32-C3 chip.

3. The test equipment applied to the civil aircraft final assembly site according to claim 1, characterized in that The RS422 interface is connected to the microcontroller through an SP3490EN-L / TR chip.

4. The test equipment applied to the general assembly site of civil aircraft according to claim 1, characterized in that The RS485 interface is connected to the microcontroller through an SP3485 chip.

5. The test equipment applied to the general assembly site of civil aircraft according to claim 1, characterized in that, The RS232 interface is connected to the microcontroller through an SP3232EUCY-L / TR chip.

6. The test equipment applied to the general assembly site of civil aircraft according to claim 1, characterized in that The CAN bus interface is connected to the microcontroller through a PCA82C251T / YM chip.

7. The test equipment applied to the general assembly site of civil aircraft according to claim 1, characterized in that, The Ethernet interface is connected to the microcontroller through a W5500 chip.

8. The test equipment applied to the general assembly site of civil aircraft according to claim 1, wherein The power supply management module includes an AP2007 chip and a DW01A chip; The AP2007 chip is used to convert the power supply voltage of the power supply battery into the working voltage of the microcontroller; The DW01A chip is used to manage the power supply state of the power supply battery.

9. The test equipment applied to the general assembly site of civil aircraft according to claim 1, characterized in that, The test equipment applied to the civil aircraft final assembly site further includes a Type-C interface; the Type-C interface is connected to an external power supply; The power supply management module is specifically used to switch the power supply state of the microcontroller to be powered by the external power supply or the power supply battery through a PMOS transistor.

10. The test equipment applied to the general assembly site of civil aircraft according to claim 9, characterized in that, The power supply management module further includes a switching power supply unit; the switching power supply unit is connected to the Type-C interface; The power supply management module is specifically used to switch the power supply state of the microcontroller to be powered by the power supply battery when it detects that the external power supply is cut off through the switching power supply unit.

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