Heat dissipation device and terminal

Abstract

The embodiment of the utility model relates to the technical field of heat dissipation, and particularly discloses a heat dissipation device and a terminal.The heat dissipation device comprises a heat conduction assembly and a heat dissipation assembly, the heat conduction assembly comprises a plurality of heat conduction pipes and a plurality of heat storage pipes, each heat conduction pipe is provided with a first surface and a second surface, and the first surface and the second surface are oppositely arranged; the first surface is used for being attached to a processor, the heat storage pipe is fixed to the second surface, and the heat dissipation assembly is attached to the first surface. By means of the mode, the heat storage pipe is fixed to the heat conduction pipe, the heat storage performance of the heat conduction assembly is improved, part of heat generated by the processor during overclocking work is temporarily stored in the heat storage pipe while the heat conduction pipe conducts heat, the load of the heat conduction pipe is relieved, and the time of the processor in the overclocking work state can be prolonged.

Description

Technical Field

[0001] Embodiments of the present application relate to the technical field of heat dissipation, and in particular, to a heat dissipation device and a terminal. Background Art

[0002] In order to pursue performance, when a computer is in a cooling state, the processor of the computer enters an overclocking working state. When the processor is in the overclocking working state, a large amount of heat is generated. The heat is transferred to the heat dissipation component of the heat dissipation device through the traditional heat conduction tube of the heat dissipation device, and then the heat dissipation component dissipates the heat.

[0003] However, in the process of implementing the embodiments of the present application, the inventors found that: although the traditional heat pipe has good heat conduction performance, its specific heat capacity heat storage performance is poor, so that the traditional heat pipe can only transfer the heat generated by the processor during overclocking to the heat dissipation component in a short time, resulting in a short time for the processor to be in the overclocking working state. Utility Model Content

[0004] The main technical problem to be solved by the present application is to provide a heat dissipation device, which has a heat storage pipe fixed on the heat conduction pipe to improve the heat storage performance and can extend the overclocking working time of the processor.

[0005] To solve the above technical problem, a technical solution adopted by the present application is: to provide a heat dissipation device, including a heat conduction component and a heat dissipation component. The heat conduction component includes a plurality of heat conduction pipes and a plurality of heat storage pipes. The heat conduction pipe has a first surface and a second surface, and the first surface and the second surface are oppositely arranged. The first surface is used to fit against the processor, the heat storage pipe is fixed on the second surface, and the heat dissipation component fits against the first surface.

[0006] Optionally, the heat storage pipe includes a transfer layer and a heat storage layer. The transfer layer is fixed on the second surface, and the heat storage layer is arranged inside the transfer layer.

[0007] Optionally, the heat storage layer is made of paraffin wax, and the transfer layer is made of copper.

[0008] Optionally, the heat dissipation device further includes a bracket. The bracket is provided with an opening for the processor to be arranged, and a part of the heat conduction pipe is arranged at the opening.

[0009] Optionally, the bracket is provided with a receiving groove, the receiving groove communicates with the opening, and a part of the heat conduction pipe is received in the receiving groove.

[0010] Optionally, the number of both the heat conduction pipes and the heat storage pipes is three.

[0011] Optionally, the heat dissipation component includes a plurality of radiators, and the radiators are attached to the first surface of the heat conduction pipe.

[0012] Optionally, the radiator is provided with a plurality of heat dissipation channels.

[0013] Optionally, the heat dissipation assembly further includes a plurality of fans. The fans are provided with air outlets, the radiator is disposed at the air outlets, and the air outlets are communicated with the heat dissipation channels.

[0014] To solve the above technical problems, another technical solution adopted by this application is: to provide a terminal including the above heat dissipation device.

[0015] In the embodiment of this application, the heat dissipation device includes a heat conduction assembly and a heat dissipation assembly. The heat conduction assembly includes a plurality of heat conduction tubes and a plurality of heat storage tubes. The heat conduction tubes have a first surface and a second surface, and the first surface and the second surface are oppositely arranged. The first surface is used to be attached to the processor, the heat storage tubes are fixed to the second surface, and the heat dissipation assembly is attached to the first surface. By fixing the heat storage tubes on the heat conduction tubes, the heat storage performance of the heat conduction assembly is improved. While the heat conduction tubes conduct heat, part of the heat generated by the processor during overclocking operation is temporarily stored in the heat storage tubes, relieving the load of the heat conduction tubes and being able to extend the overclocking operation time of the processor. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions in the embodiments of this application, the following will briefly introduce the drawings required to be used in the embodiments of this application. Obviously, the following described drawings are only some embodiments of this application. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained according to the drawings.

[0017] Figure 1 is a schematic structural diagram of the heat dissipation device provided by this application;

[0018] Figure 2 is an exploded schematic structural diagram of the heat dissipation device and the processor provided by this application;

[0019] Figure 3 is a schematic structural diagram of the heat dissipation assembly of the heat dissipation device provided by this application.

[0020] Description of the reference numerals:

[0021] 100, heat dissipation device;

[0022] 1, heat conduction assembly; 11, heat conduction tube; 11a, first heat conduction tube; 11b, second heat conduction tube; 11c, third heat conduction tube; 12, heat storage tube; 12a, first heat storage tube; 12b, second heat storage tube; 12c, third heat storage tube;

[0023] 2. Heat dissipation component; 21. Heat sink; 21a. First heat sink; 21b. Second heat sink; 21c. Third heat sink; 21d. Fourth heat sink; 211. Heat dissipation channel; 22. Fan; 22a. First fan; 22b. Second fan; 221. Air outlet; 221a. Second air outlet; 221b. Second air outlet;

[0024] 3. Bracket; 31. Opening; 32. Receiving groove; 200. Processor;

[0025] 200a. First processor; 200b. Second processor. Detailed implementation manners

[0026] For the convenience of understanding this application, the following combines the accompanying drawings and specific embodiments to describe this application in more detail. It should be noted that when an element is expressed as "locked to" another element, it can be directly on the other element, or there can be one or more intermediate elements therebetween. When an element is expressed as "connected to" another element, it can be directly connected to the other element, or there can be one or more intermediate elements therebetween. The terms "vertical", "horizontal", "left", "right" and similar expressions used in this specification are only for the purpose of illustration.

[0027] Unless otherwise defined, all technical and scientific terms used in this specification have the same meaning as commonly understood by those skilled in the technical field to which this application belongs. The terms used in this specification in the description of this application are only for the purpose of describing specific embodiments and are not used to limit this application. The term "and / or" used in this specification includes any and all combinations of one or more of the related listed items.

[0028] An embodiment of this application provides a heat dissipation device 100. The heat dissipation device 100 is used to be fixed in a terminal to dissipate heat from the processor 200 of the terminal. It should be noted that the processor 200 can be a CPU (Central Processing Unit), and the processor 200 can also be a GPU (Graphics Processing Unit). Please refer to Figure 1 and Figure 2 , the heat dissipation device 100 includes a heat conduction component 1, a heat dissipation component 2 and a bracket 3. The heat conduction component 1 is used to fit onto the processor 200. The heat dissipation component 2 is in contact with the heat conduction component 1. Among them, the heat conduction component 1 is used to transfer the heat generated by the processor 200 during operation to the heat dissipation component 2, and the heat dissipation component 2 is used to dissipate the heat. The bracket 3 is provided for the heat conduction component 1 to be arranged.

[0029] For the above heat conduction component 1, please refer to Figure 2, the heat dissipation component 2 includes a plurality of heat conduction tubes 11 and a plurality of heat storage tubes 12. A part of the heat conduction tube 11 is disposed on the bracket 3. The heat conduction tube 11 has a first surface and a second surface, and the first surface and the second surface are oppositely arranged. The first surface is used to be attached to the processor 200, so that the heat generated when the processor 200 works is transferred to the heat conduction tube 11. The heat storage tube 12 is fixed to the second surface of the heat conduction tube 11. The heat storage tube 12 is used to temporarily store heat to improve the heat storage performance of the heat conduction component 1, so that the temperature rise rate of the processor 200 is reduced and the overclocking working duration of the processor 200 is extended. The heat temporarily stored in the heat storage tube 12 is also transferred to the heat conduction tube 11 and then to the heat dissipation component 2.

[0030] The heat storage tube 12 includes a transfer layer and a heat storage layer. The transfer layer is fixed to the second surface and is used to transfer heat. The heat storage layer is disposed within the transfer layer and is used to temporarily store heat.

[0031] In some embodiments, the transfer layer is made of copper, the heat storage layer is made of paraffin, and the specific heat capacity of paraffin is 2.9×1000 KJ / (KG·°C), so that the heat storage layer has the heat storage ability.

[0032] For the above heat dissipation component 2, please refer to Figure 3 , the heat dissipation component 2 includes a plurality of radiators 21 and a plurality of fans 22. The radiator 21 is attached to the first surface of the heat conduction tube 11. The radiator 21 is used to receive the heat transferred by the heat conduction tube 11 and dissipate the heat through heat exchange with the air flow. The fan 22 is disposed on one side of the radiator 21. The fan 22 is used to increase the flow rate of the air flow to improve the heat exchange efficiency between the air flow and the radiator 21, thereby improving the heat dissipation ability of the radiator 21.

[0033] The radiator 21 is provided with a plurality of heat dissipation channels 211. The heat dissipation channels 211 are used for the air flow to flow through to increase the contact area between the air flow and the radiator 21, thereby improving the heat dissipation ability of the radiator 21.

[0034] The fan 22 is provided with an air outlet 221. The air outlet 221 is provided for the radiator 21, and the heat dissipation channel 211 is communicated with the air outlet 221.

[0035] For the above bracket 3, please refer to Figure 3 , the bracket 3 is provided with an opening 31 and a receiving groove 32. The opening 31 is disposed at the bottom of the receiving groove 32. The opening 31 is communicated with the receiving groove 32. The opening 31 is used for the processor 200 to be disposed. The receiving groove 32 receives a part of the heat conduction tube 11, and a part of the heat conduction tube 11 is disposed at the opening 31 so that the first surface of the heat conduction tube 11 is attached to the processor 200.

[0036] In some embodiments, to enhance the heat dissipation capacity of the heat dissipation device 100, the number of heat conduction tubes 11 and the number of heat storage tubes 12 are both two. The two heat conduction tubes 11 are respectively a first heat conduction tube 11a and a second heat conduction tube 11b. The two heat storage tubes 12 are respectively a first heat storage tube 12a and a second heat storage tube 12b. One end of the first heat conduction tube 11a and one end of the second heat conduction tube 11b are both received in the receiving groove 32. The first heat storage tube 12a is fixed to the first surface of the first heat conduction tube 11a. The second heat storage tube 12b is fixed to the second surface of the second heat conduction tube 11b. The number of radiators 21 and the number of air outlets 221 are two. The two radiators 21 are respectively a first radiator 21a and a second radiator 21b. The two air outlets 221 are respectively a first air outlet 221a and a second air outlet 221b. The first radiator 21a is disposed at the first air outlet 221a, and the first radiator 21a is respectively in contact with the first surface of the other end of the first heat conduction tube 11a and the first surface of the other end of the second heat conduction tube 11b. The second radiator 21b is disposed at the second air outlet 221b, and the second radiator 21b is in contact with the first surface of the other end of the second heat conduction tube 11b.

[0037] In some embodiments, please refer to Figure 2 and Figure 3, in order to enable the heat dissipation device 100 to dissipate heat from two processors 200, the number of openings 31 is two. The two processors 200 are respectively a first processor 200a and a second processor 200b. The two openings 31 are respectively a first opening 31a and a second opening 31b. The first opening 31a is for the first processor 200a to be disposed, and the second opening 31b is for the second processor 200b to be disposed. The number of heat conducting tubes 11 and the number of heat storage tubes 12 are both three. The three heat conducting tubes 11 are respectively a first heat conducting tube 11a, a second heat conducting tube 11b, and a third heat conducting tube 11c. The three heat storage tubes 12 are respectively a first heat storage tube 12a, a second heat storage tube 12b, and a third heat storage tube 12c. The middle part of the first heat conducting tube 11a is received in the receiving groove 32, and the first surface of the middle part of the first heat conducting tube 11a is used to fit to the first processor 200a and the second processor 200b. One end of the second heat conducting tube 11b is received in the receiving groove 32, and the first surface of one end of the second heat conducting tube 11b fits to the first processor 200a. The other end of the third heat conducting tube 11c is received in the receiving groove 32, and the first surface of the other end of the third heat conducting tube 11c fits to the second processor 200b. The first heat storage tube 12a is fixed to the first surface of the first heat conducting tube 11a. The second heat storage tube 12b is fixed to the second surface of the second heat conducting tube 11b. The third heat storage tube 12c is fixed to the second surface of the third heat conducting tube 11c. The number of radiators 21 is four, and the number of fans 22 is two. The four radiators 21 are respectively a first radiator 21a, a second radiator 21b, a third radiator 21c, and a fourth radiator 21b. The two fans 22 are respectively a first fan 22a and a second fan 22b. The first radiator 21a is disposed at the first air outlet 221a of the first fan 22a, and the first radiator 21a respectively fits to the first surface of the other end of the first heat conducting tube 11a and the first surface of the other end of the second heat conducting tube 11b. The second radiator 21b is disposed at the second air outlet 221b of the first fan 22a, and the second radiator 21b fits to the first surface of the other end of the second heat conducting tube 11b. The third radiator 21c is disposed at the first air outlet 221a of the second fan 22b, and the third radiator 21c respectively fits to the first surface of one end of the first heat conducting tube 11a and the first surface of one end of the third heat conducting tube 11c. The fourth radiator 21b is disposed at the second air outlet 221b of the second fan 22b, and the fourth radiator 21b fits to the first surface of one end of the third heat conducting tube 11c.

[0038] In an embodiment of the present application, the heat dissipation device 100 includes a heat conduction component 1 and a heat dissipation component 2. The heat conduction component 1 includes a plurality of heat conduction tubes 11 and a plurality of heat storage tubes 12. The heat conduction tube 11 has a first surface and a second surface, and the first surface and the second surface are oppositely arranged. The first surface is used to be attached to the processor 200, the heat storage tube 12 is fixed to the second surface, and the heat dissipation component 2 is attached to the first surface. By fixing the heat storage tube 12 on the heat conduction tube 11, the heat storage performance of the heat conduction component 1 is improved. While the heat conduction tube 11 conducts heat, part of the heat generated by the processor 200 during overclocking operation is temporarily stored in the heat storage tube 12, alleviating the load of the heat conduction tube 11, and enabling the extension of the time for the processor 200 to be in the overclocking working state.

[0039] The present application also provides an embodiment of a terminal. The terminal includes the above-mentioned heat dissipation device 100. For the structure and function of the heat dissipation device 100, reference can be made to the above-mentioned embodiment, and details will not be repeated here. The terminal involved in the embodiment of the present application can be a desktop computer, a tablet computer, etc. The specific form of the above-mentioned terminal is not particularly limited in the embodiment of the present application.

[0040] It should be noted that the description and drawings of the present application give preferred embodiments of the present application. However, the present application can be implemented in many different forms and is not limited to the embodiments described in this specification. These embodiments do not serve as additional limitations to the content of the present application. The purpose of providing these embodiments is to make the understanding of the disclosed content of the present application more thorough and comprehensive. Moreover, the above technical features continue to be combined with each other to form various embodiments not listed above, all of which are regarded as within the scope described in the specification of the present application; further, for those of ordinary skill in the art, improvements or transformations can be made according to the above description, and all such improvements and transformations should fall within the protection scope of the appended claims of the present application.

Claims

1. A heat dissipation device, characterized in that, Comprising: A heat conduction component, including a plurality of heat conduction tubes and a plurality of heat storage tubes. The heat conduction tube has a first surface and a second surface, the first surface and the second surface are arranged opposite to each other, the first surface is used for fitting to the processor, and the heat storage tube is fixed to the second surface; A heat dissipation component, which is attached to the first surface.

2. The heat dissipation device according to claim 1, wherein The heat storage tube includes a transfer layer and a heat storage layer, the transfer layer is fixed to the second surface, and the heat storage layer is arranged inside the transfer layer.

3. The heat dissipation device according to claim 2, wherein The heat storage layer is made of paraffin, and the transfer layer is made of copper.

4. The heat dissipation device according to claim 1, wherein The heat dissipation device further includes a bracket, the bracket is provided with an opening for the processor to be arranged, and a part of the heat conduction tube is arranged at the opening.

5. The heat dissipation device according to claim 4, wherein The bracket is provided with a receiving groove, the receiving groove communicates with the opening, and a part of the heat conduction tube is received in the receiving groove.

6. The heat dissipation device according to claim 5, wherein The number of the heat conduction tubes and the heat storage tubes is three each.

7. The heat dissipation device according to any one of claims 1-6, wherein The heat dissipation component includes a plurality of radiators, and the radiators are attached to the first surface of the heat conduction tube.

8. The heat dissipation device according to claim 7, wherein The radiator is provided with a plurality of heat dissipation channels.

9. The heat dissipation device according to claim 8, wherein The heat dissipation component further includes a plurality of fans, the fans are provided with air outlets, the radiators are arranged at the air outlets, and the air outlets communicate with the heat dissipation channels.

10. A terminal, characterized in that, Including the heat dissipation device according to any one of claims 1-9.

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