Anti-oxidation circuit board

Abstract

The utility model provides an anti-oxidation circuit board. The anti-oxidation circuit board comprises a substrate, a copper block and an insulating barrier. The substrate is provided with a mounting through hole. The copper block is mounted in the mounting through hole; the two ends of the copper block are arranged to be a first end and a second end respectively, and the first end is used for being externally connected with an electrical part. The insulating barrier is mounted at the second end to separate the second end from the external environment. According to the application, the insulating barrier can prevent the second end from contacting with the external environment so as to prevent the second end from being oxidized, and the external electrical part can prevent the first end from contacting with the external environment so as to prevent the first end from being oxidized, so that the oxidized area of the copper block is reduced, the conductivity of the copper block is protected, the reliability of the copper block is improved, and the service life of the copper block is prolonged. Therefore, the service life of the anti-oxidation circuit board is prolonged, and the replacement frequency and cost of the anti-oxidation circuit board are reduced. In addition, the copper block can be separated from the external environment by the insulating barrier, so that the copper block can be applied to scenes with high humidity or corrosive gas and the like, and the applicability of the anti-oxidation circuit board is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit boards, and particularly to an anti-oxidation circuit board. Background Art

[0002] At present, copper particles in a circuit board are embedded on the surface of a PCB board to play a role in heat dissipation and conduction. However, after the copper particles are embedded in the PCB board for a period of time, the copper particles will be oxidized and a layer of copper oxide will be generated on their surfaces, affecting the conductivity. Summary of the Utility Model

[0003] Based on this, in view of the problem that after the copper particles are embedded in the PCB board for a period of time, the copper particles will be oxidized and a layer of copper oxide will be generated on their surfaces, affecting the conductivity, it is necessary to provide an anti-oxidation circuit board.

[0004] Its technical solution is as follows:

[0005] On the one hand, an anti-oxidation circuit board is provided, including:

[0006] A substrate, the substrate is provided with mounting through holes;

[0007] A copper block, the copper block is installed in the mounting through hole; along the axis direction of the mounting through hole, the two ends of the copper block are respectively set as a first end and a second end, and the first end is used for connecting an external electrical component; and

[0008] An insulating barrier, the insulating barrier is installed at the second end to separate the second end from the external environment.

[0009] In the anti-oxidation circuit board in the above embodiment, during use, the insulating barrier can block the contact between the second end and the external environment to prevent the second end from being oxidized, and the externally connected electrical component can block the contact between the first end and the external environment to prevent the first end from being oxidized, so that the oxidized area of the copper block is reduced, the conductivity of the copper block is protected, the reliability and service life of the copper block are improved, thereby prolonging the service life of the anti-oxidation circuit board, reducing the replacement frequency and cost of the anti-oxidation circuit board. In addition, the insulating barrier can separate the copper block from the external environment, so that the copper block can be applied to scenarios such as high humidity or corrosive gases, improving the applicability of the anti-oxidation circuit board.

[0010] The technical solution is further described below:

[0011] In one of the embodiments, the insulating barrier covers one end of the mounting through hole close to the second end and is hermetically fitted with the second end.

[0012] In one of the embodiments, the anti-oxidation circuit board further includes a locking member, and the locking member is used to fix the insulating barrier on the substrate.

[0013] In one embodiment, one side of the substrate near the second end is set as the reverse side, the locking member is set as an adhesive layer, and the adhesive layer is located between the reverse side and the insulating barrier member and is arranged along the circumference of the mounting through-hole.

[0014] In one embodiment, the insulating barrier member has ductility, and the second end is in abutting fit with the insulating barrier member.

[0015] In one embodiment, one side of the substrate near the second end is set as the reverse side, and an installation groove communicating with the mounting through-hole is provided on the reverse side, and the insulating barrier member is embedded in the installation groove.

[0016] In one embodiment, the axis of the installation groove and the axis of the mounting through-hole are on the same straight line, and the inner diameter of the installation groove is larger than the inner diameter of the mounting through-hole.

[0017] In one embodiment, along the axis direction of the mounting through-hole, the projection area of the copper block is located within the projection area of the insulating barrier member.

[0018] In one embodiment, a convex portion is provided on the outer side wall of the copper block, and the convex portion is in frictional fit with the inner side wall of the mounting through-hole so that the copper block is fixed in the mounting through-hole and cooperates with the inner side wall of the mounting through-hole to form a heat dissipation channel.

[0019] In one embodiment, there is at least one convex portion, and each convex portion extends along the axis direction of the copper block and is arranged at intervals around the axis of the copper block. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The drawings constituting a part of this application are used to provide a further understanding of this application. The schematic embodiments of this application and their descriptions are used to explain this application and do not constitute an improper limitation to this application.

[0021] In order to more clearly illustrate the technical solutions in the embodiments of this application, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the following drawings are only some embodiments of this application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0022] Figure 1 It is a schematic structural diagram of an anti-oxidation circuit board in one embodiment.

[0023] Description of the reference numerals:

[0024] 10. Anti-oxidation circuit board; 100. Substrate; 110. Mounting through-hole; 120. Reverse side; 200. Copper block; 210. First end; 220. Second end; 300. Insulating barrier member. Detailed implementation manners

[0025] To make the above objects, features, and advantages of the present application more obvious and understandable, the following will describe the detailed implementation manners of the present application with reference to the accompanying drawings. Many specific details are set forth in the following description to fully understand the present application. However, the present application can be implemented in many other ways different from those described herein. Those skilled in the art can make similar improvements without departing from the connotation of the present application. Therefore, the present application is not limited by the specific embodiments disclosed below.

[0026] As Figure 1 shown, in one embodiment, an anti-oxidation circuit board 10 is provided, which includes a substrate 100, a copper block 200, and an insulating barrier member 300. Among them, the substrate 100 is provided with a mounting through-hole 110. The copper block 200 is installed in the mounting through-hole 110; along the axial direction of the mounting through-hole 110, the two ends of the copper block 200 are respectively set as a first end 210 and a second end 220, and the first end 210 is used to externally connect electrical components. The insulating barrier member 300 is installed at the second end 220 to separate the second end 220 from the external environment.

[0027] In the anti-oxidation circuit board 10 in the above embodiment, during use, the insulating barrier member 300 can block the second end 220 from contacting the external environment to prevent the second end 220 from oxidizing, and the externally connected electrical components can block the first end 210 from contacting the external environment to prevent the first end 210 from oxidizing, so that the oxidized area of the copper block 200 is reduced, the electrical conductivity of the copper block 200 is protected, the reliability and service life of the copper block 200 are improved, thereby prolonging the service life of the anti-oxidation circuit board 10 and reducing the replacement frequency and cost of the anti-oxidation circuit board 10. In addition, the insulating barrier member 300 can separate the copper block 200 from the external environment, enabling the copper block 200 to be applied to scenarios such as high humidity or corrosive gases, improving the applicability of the anti-oxidation circuit board 10.

[0028] Among them, the insulating barrier member 300 can separate the entire second end 220 from the external environment, or can separate a part of the second end 220 from the external environment.

[0029] Among them, the substrate 100 can be set as a PCB board. The number of mounting through-holes 110, the number of copper blocks 200, and the number of insulating barrier members 300 can all be flexibly adjusted according to actual usage needs. The copper block 200 can also be set as copper grains. The insulating barrier member 300 can be set as an insulating barrier sheet or an insulating barrier film. The material of the insulating barrier member 300 can be ceramic or polymer. In other embodiments, the area where the first end 210 is not externally connected to an electrical component can also be separated from the external environment through an insulating barrier structure.

[0030] Among them, the present application takes a circuit board with a copper block 200 installed as an example for illustration. In other embodiments, the copper block 200 with an insulating barrier member 300 installed can also be applied to other industrial products that require the installation of copper blocks.

[0031] Such as Figure 1 As shown, further, the insulating barrier member 300 covers one end of the mounting through-hole 110 close to the second end 220 and is hermetically attached to the second end 220. In this way, after the copper block 200 is pressed into the mounting through-hole 110, the insulating barrier member 300 is correspondingly covered on one side of the substrate 100, improving the convenience of assembling the anti-oxidation circuit board 10.

[0032] Among them, the insulating barrier member 300 can be installed on the substrate 100 by means of snap connection, press connection, adhesive bonding or other methods to cover one end of the mounting through-hole 110 close to the second end 220.

[0033] Optionally, the anti-oxidation circuit board 10 further includes a locking member for fixing the insulating barrier member 300 to the substrate 100. In this way, the locking member fixes the insulating barrier member 300 and the substrate 100 into one body, ensuring that the insulating barrier member 300 can be hermetically attached to the second end 220 and improving the reliability of the anti-oxidation circuit board 10.

[0034] Specifically in this embodiment, one side of the substrate 100 close to the second end 220 is set as the reverse side 120, the locking member is set as an adhesive layer, and the adhesive layer is located between the reverse side 120 and the insulating barrier member 300 and is arranged along the circumference of the mounting through-hole 110. The adhesive layer can be set in a ring shape. In this way, the fixing force between the insulating barrier member 300 and the substrate 100 is evenly distributed, ensuring that during the use of the anti-oxidation circuit board 10, the relative positions between the insulating barrier member 300 and the substrate 100 are kept fixed, and further ensuring that the insulating barrier member 300 can be hermetically attached to the second end 220 and improving the reliability of the anti-oxidation circuit board 10.

[0035] Optionally, the insulating barrier 300 is ductile, and the second end 220 is in contact with the insulating barrier 300. In this way, the copper block 200 can squeeze the insulating barrier 300, ensuring that the second end 220 and the insulating barrier 300 are sealed and fitted, thereby improving the reliability and assembly convenience of the anti-oxidation circuit board 10.

[0036] The second end 220 may be located in the mounting through hole 110, may be flush with the reverse side 120 of the substrate 100, or may extend out of the mounting through hole 110. Specifically, in this embodiment, the second end 220 extends out of the mounting through hole 110 and squeezes the sterilization barrier, so that the insulation barrier 300 is deformed to completely seal and fit with the second end 220.

[0037] The shape of the insulating barrier 300 can be flexibly adjusted according to the installation position of the second end 220 , and it is only necessary to ensure that the insulating barrier 300 can be sealed and fitted with the second end 220 to separate the second end 220 from the external environment.

[0038] In one embodiment, the side of the substrate 100 close to the second end 220 is set as the reverse side 120, and the reverse side 120 is provided with a mounting groove connected to the mounting through hole 110, and the insulating barrier 300 is embedded in the mounting groove. In this way, the insulating barrier 300 can be directly pressed into the mounting groove, which improves the convenience of assembling the anti-oxidation circuit board 10. In addition, the substrate 100 and the insulating barrier 300 are detachable, which is convenient for subsequent maintenance or replacement of the anti-oxidation circuit board 10.

[0039] In other embodiments, the adhesive layer is pre-coated on the inner wall of the mounting groove, so that when the insulating barrier 300 is inserted into the mounting groove, the adhesive layer can fix the insulating barrier 300 and the substrate 100 as a whole and seal the insulating barrier 300 with the inner wall of the mounting groove. In this way, the reliability of the anti-oxidation circuit board 10 is improved.

[0040] Optionally, the axis of the mounting groove and the axis of the mounting through hole 110 are located on the same straight line, and the inner diameter of the mounting groove is larger than the inner diameter of the mounting through hole 110. In this way, it is ensured that the insulating barrier 300 can be sealed with the second end 220 after being embedded in the mounting groove, so as to separate the second end 220 from the external environment, thereby improving the reliability of the anti-oxidation circuit board 10. In addition, the mounting groove can cooperate with the mounting through hole 110 to form a step shape, thereby improving the convenience of processing the anti-oxidation circuit board 10.

[0041] Specifically in this embodiment, the inner contour shape of the installation groove is matched with the outer contour shape of the insulation barrier 300 to ensure that the insulation barrier 300 can be embedded in the installation groove.

[0042] like Figure 1As shown, optionally, along the axial direction of the mounting through-hole 110, the projection area of the copper block 200 is located within the projection area of the insulating barrier 300. In this way, it is ensured that the insulating barrier 300 can separate the second end 220 from the external environment, improving the reliability of the oxidation-proof circuit board 10.

[0043] Wherein, the inner diameter of the mounting through-hole 110 matches the outer diameter of the copper block 200, and both can be flexibly adjusted according to actual usage requirements.

[0044] In one embodiment, a protrusion is provided on the outer sidewall of the copper block 200, and the protrusion is in frictional engagement with the inner sidewall of the mounting through-hole 110, so that the copper block 200 is fixed within the mounting through-hole 110 and cooperates with the inner sidewall of the mounting through-hole 110 to form a heat dissipation channel. In this way, both the copper block 200 and the substrate 100 can dissipate heat through the heat dissipation channel, improving the heat dissipation performance of the oxidation-proof circuit board 10.

[0045] Specifically in this embodiment, the protrusion is in transitional fit with the mounting through-hole 110.

[0046] Optionally, there is at least one protrusion, and each protrusion extends along the axial direction of the copper block 200 and is arranged at intervals around the axis of the copper block 200. In this way, a plurality of heat dissipation channels can be formed between the outer sidewall of the copper block 200 and the inner sidewall of the mounting through-hole 110, improving the heat dissipation performance of the oxidation-proof circuit board 10.

[0047] Among them, the number of protrusions can be flexibly adjusted according to actual usage requirements. Specifically in this embodiment, there are six protrusions, and the six protrusions are uniformly and spaced along the axial direction of the copper block 200 on the outer sidewall of the copper block 200.

[0048] In other embodiments, the insulating barrier 300 is provided with a communication hole for communicating the heat dissipation channel with the external environment.

[0049] Optionally, at least one heat dissipation hole is further provided on the substrate 100, and each heat dissipation hole is arranged in an array outside the mounting through-hole 110. In this way, the substrate 100 can also dissipate heat through the heat dissipation holes, improving the heat dissipation performance and reliability of the oxidation-proof circuit board 10.

[0050] In the description of the present application, it should be understood that if there are terms such as "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., the orientation or positional relationship indicated by these terms is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation on the present application.

[0051] In addition, if there are terms such as "first" and "second", these terms are only used for descriptive purposes and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include at least one of such features. In the description of the present application, if there is a term "plurality", the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise specifically and clearly defined.

[0052] In the present application, unless otherwise clearly specified and limited, if there are terms such as "mounted", "connected", "connected to", "fixed", etc., these terms should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or integrated; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the communication inside two elements or the interaction relationship between two elements, unless otherwise clearly limited. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific circumstances.

[0053] In the present application, unless otherwise clearly specified and limited, if there is a description such as a first feature being "on" or "under" a second feature, the meaning may be that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature being "above", "over" and "on top of" the second feature may mean that the first feature is directly above or obliquely above the second feature, or merely indicates that the first feature is at a higher horizontal level than the second feature. The first feature being "under", "beneath" and "underneath" the second feature may be that the first feature is directly below or obliquely below the second feature, or merely indicates that the first feature is at a lower horizontal level than the second feature.

[0054] It should be noted that if an element is referred to as "fixed to" or "disposed on" another element, it can be directly on the other element or there may also be an intermediate element. If an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intermediate element at the same time. If present, the terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in this application are only for the purpose of illustration and do not represent the only implementation.

[0055] It should also be understood that when interpreting the connection relationship or positional relationship of elements, although not explicitly described, the connection relationship and positional relationship are interpreted to include an error range, and this error range should be within the acceptable deviation range of a specific value determined by those skilled in the art. For example, "about", "approximately" or "substantially" can mean within one or more standard deviations, which is not limited here.

[0056] The technical features of the above embodiments can be combined arbitrarily. For the sake of brevity of description, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, it should be considered as within the scope described in this specification.

[0057] The above embodiments only express several implementation manners of this application, and their descriptions are relatively specific and detailed, but they should not be understood as a limitation to the scope of the patent application. It should be pointed out that for those of ordinary skill in the art, without departing from the concept of this application, several modifications and improvements can still be made, and these all belong to the protection scope of this application. Therefore, the protection scope of the patent of this application should be subject to the appended claims.

Claims

1. An anti-oxidation circuit board, characterized in that, Comprising: A substrate provided with mounting through-holes; A copper block mounted within the mounting through-hole; along the axial direction of the mounting through-hole, two ends of the copper block are respectively set as a first end and a second end, and the first end is used for externally connecting electrical components; and An insulating barrier member mounted on the second end to separate the second end from the external environment.

2. The antioxidant circuit board according to claim 1, wherein The insulating barrier member covers one end of the mounting through-hole close to the second end and is hermetically fitted with the second end.

3. The anti-oxidation circuit board according to claim 2, wherein, The anti-oxidation circuit board further includes a locking member for fixing the insulating barrier member to the substrate.

4. The antioxidant circuit board according to claim 3, wherein One side of the substrate close to the second end is set as the reverse side, and the locking member is set as an adhesive layer located between the reverse side and the insulating barrier member and arranged along the circumferential direction of the mounting through-hole.

5. The anti-oxidation circuit board according to claim 3, characterized in that, The insulating barrier member has ductility, and the second end is in abutting fit with the insulating barrier member.

6. The anti-oxidation circuit board according to claim 2, wherein, One side of the substrate close to the second end is set as the reverse side, and the reverse side is provided with a mounting groove communicating with the mounting through-hole, and the insulating barrier member is embedded in the mounting groove.

7. The antioxidant circuit board according to claim 6, wherein The axis of the mounting groove and the axis of the mounting through-hole are on the same straight line, and the inner diameter of the mounting groove is larger than the inner diameter of the mounting through-hole.

8. The antioxidant circuit board according to any one of claims 2 to 7, characterized in that, Along the axial direction of the mounting through-hole, the projection area of the copper block is located within the projection area of the insulating barrier member.

9. The anti-oxidation circuit board according to any one of claims 1 to 7, characterized in that, The outer side wall of the copper block is provided with a protruding portion, and the protruding portion is in frictional fit with the inner side wall of the mounting through-hole so that the copper block is fixed within the mounting through-hole and forms a heat dissipation channel in cooperation with the inner side wall of the mounting through-hole.

10. The anti-oxidation circuit board according to claim 9, wherein, The protruding portion is at least one, and each protruding portion extends along the axial direction of the copper block and is arranged at intervals around the axis of the copper block.

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