Novel SOP6 integrated packaging differential pressure sensor module

Abstract

The utility model relates to a novel SOP6 integrated packaging differential pressure sensor module. The utility model relates to a gas sensor, which comprises a PCB (printed circuit board), a cover plate fixed at the top of the PCB, a shell fixed at the top of the cover plate, a cavity arranged between the shell and the cover plate, a first gas inlet unit arranged above the cavity, a second gas inlet unit arranged below the cavity, and a first chip and a second chip which are connected in the shell and are electrically connected, and the first chip isolates the first air inlet unit from the cavity. The first chip and the second chip are uniformly packaged in the pressure sensor, the packaging integration level is high, the calibration compatibility is strong, sensor calibration is directly carried out, calibration tools of various modules do not need to be customized according to a PCB, the cost is low, the efficiency is high, a peripheral circuit is simple, the size of the PCB is reduced to half of that of a common module, the structural design of a customer is more compact, and the compatibility is higher.

Description

Technical Field

[0001] The utility model belongs to the technical field of chip packaging, and particularly relates to a novel SOP6 integrated packaging differential pressure sensor module. Background Art

[0002] As Figure 1 、 2 shown, the existing SOP6 packaged pressure sensor is a single-chip package, only having a pressure chip and no signal conditioning ASIC chip, and can only output mv signals without temperature compensation and calibration. For products with temperature compensation and calibration requirements, an additional signal conditioning ASIC chip has to be added on the PCB. Constrained by the size of the PCB board, a module calibration tooling must be customized, resulting in high costs and low efficiency.

[0003] Moreover, the air inlet of the existing SOP6 packaged pressure sensor is the nozzle of the SOP6 package, and the hole leading to the atmosphere at the other end is on the side of the lid. Usually, this kind of package can only be used for gauge pressure sensors and cannot be used for differential pressure sensors, with poor versatility. Also, when encapsulating semi-finished products with glue, it is necessary to prevent the side air holes from being blocked by the dispensed glue, and the process is relatively complex. Summary of the Utility Model

[0004] The utility model provides a novel SOP6 integrated packaging differential pressure sensor module, which solves the defects of the existing packaged pressure sensor with poor versatility. For products with temperature compensation and calibration requirements, an additional signal conditioning ASIC chip has to be added on the PCB, which will increase the size of the PCB board and is prone to blocked holes during glue dispensing for semi-finished products.

[0005] To achieve the above object, the technical solution adopted by the utility model is: a novel SOP6 integrated packaging differential pressure sensor module, which includes:

[0006] A PCB board, a cover plate fixed on the top of the PCB board, a housing fixed on the top of the cover plate, a cavity arranged between the housing and the cover plate, a first air inlet unit arranged above the cavity, a second air inlet unit arranged below the cavity, and a first chip and a second chip connected and electrically connected in the housing;

[0007] The first chip isolates the first air inlet unit from the cavity.

[0008] Optimally, the first air inlet unit includes a nozzle integrally connected to the top of the housing, a guiding part arranged on the top of the nozzle with a gradually decreasing diameter, a first outer air hole opened on the top of the nozzle, and a first inner air hole opened at the bottom of the nozzle and connected to the first outer air hole. The first chip is used to isolate the first inner air hole from the cavity.

[0009] Preferably, the second air intake unit includes a via hole penetrating through the PCB board and a second air hole penetrating through the cover plate, and the second air hole communicates the cavity and the via hole.

[0010] Preferably, it further includes a groove formed at the bottom of the housing, a lead connecting the first chip and the second chip, and a potting glue potted outside the PCB board and the housing, and the cover plate is clamped in the groove.

[0011] Preferably, the diameter of the first outer air hole is larger than that of the first inner air hole.

[0012] Preferably, the diameter of the via hole is larger than that of the second air hole.

[0013] Preferably, the lead is a gold wire, an aluminum wire or a copper wire.

[0014] Preferably, the first chip is a pressure chip and the second chip is an ASIC chip.

[0015] Due to the application of the above technical solutions, the utility model has the following advantages compared with the prior art:

[0016] In the utility model, a novel SOP6 integrated package differential pressure sensor module integrates the first chip and the second chip in the pressure sensor. The packaging integration degree is high, the calibration compatibility is strong, and the sensor calibration can be directly carried out without customizing calibration tooling for various modules according to the PCB, with low cost and high efficiency. Moreover, the peripheral circuit is simple, the PCB size is reduced to half of that of a common module, the customer's structural design is more compact, and the compatibility is stronger;

[0017] By arranging the via hole on the PCB board and the second air hole on the cover plate, it can be used as a gauge pressure sensor or a differential pressure sensor, with stronger versatility; and because both the via hole and the second air hole are on the back of the PCB board, the holes are not easily blocked during dispensing and potting, and the process is simpler. Description of the Drawings

[0018] Figure 1 is the front view of the existing sensor module;

[0019] Figure 2 is the top view of the existing sensor module;

[0020] Figure 3 is the cross-sectional view of the utility model;

[0021] Figure 4 is the top view of the utility model;

[0022] Description of the Reference Numerals:

[0023] 1. PCB board; 2. housing; 3. slot; 4. cover plate; 5. cavity; 6. air nozzle; 7. guiding part; 8. first external air hole; 9. first internal air hole; 10. first chip; 11. second chip; 12. lead wire; 13. via hole; 14. second air hole; 15. potting glue. Detailed implementation manner

[0024] The following further describes the present utility model in combination with the embodiments shown in the drawings.

[0025] As Figure 3 、 4 shown, it is a structural schematic diagram of a novel SOP6 integrated package differential pressure sensor module of the present utility model. The module includes a PCB board 1, a housing 2, a slot 3, a cover plate 4, a cavity 5, a first air inlet unit, a second air inlet unit, a first chip 10, a second chip 11, a lead wire 12, and a potting glue 15.

[0026] The cover plate 4 is fixed on the top of the PCB board 1, and the housing 2 is fixed on the top of the cover plate 4. A cavity 5 is formed between the housing 2 and the cover plate 4 for encapsulating the first chip 10 and the second chip 11. The connection manner between the cover plate 4 and the housing 2 can be interference fit, screw connection, bonding, etc. In this embodiment, the two are connected together by bonding.

[0027] A slot 3 is opened at the bottom of the housing 2, and the two are connected by an interference fit. The cover plate 4 is embedded in the slot 3 of the housing 2, and then the two are bonded together with epoxy glue.

[0028] The first air inlet unit is arranged above the cavity 5. The external first pressure P1 passes through the first air inlet unit to the first chip 10 in the cavity 5. The first air inlet unit includes an air nozzle 6, a guiding part 7, a first external air hole 8, and a first internal air hole 9. The air nozzle 6 is integrally connected to the top of the housing 2 and is vertically arranged. The guiding part 7 is arranged on the top of the air nozzle 6 and gradually tapers in diameter from bottom to top, which is convenient for connecting with external pipelines.

[0029] The first external air hole 8 is vertically opened at the top of the air nozzle 6, and the first internal air hole 9 is vertically opened at the bottom of the air nozzle 6 and is connected to the first external air hole 8. External gas (i.e., pressure P1) passes through the first external air hole 8 and the first internal air hole 9 to the first chip 10 in the cavity 5, and the first chip 10 senses the pressure on the first pressure side.

[0030] The diameter of the first external air hole 8 is larger than that of the first internal air hole 9, and the pressure sensed by the first chip 10 on the first pressure side is more concentrated, thereby improving the accuracy of the detection result.

[0031] The second air intake unit is arranged below the cavity 5. The second air intake unit includes a via hole 13 and a second air hole 14. The via hole 13 penetrates through the PCB board 1, and the second air hole 14 penetrates through the cover plate 4 and communicates the cavity 5 and the via hole 13. The atmosphere or pressure P2 enters the cavity 5 through the via hole 13 and the second air hole 14. Connecting to the atmosphere can be used as a gauge pressure sensor. When used as a gauge pressure sensor, connecting to the atmosphere is mainly to ensure that the pressure inside the sensor is consistent with the external environment, so as to avoid affecting the normal operation of the sensor due to excessive difference between the internal pressure and the external pressure. Connecting to the pressure P2 can be used as a differential pressure sensor.

[0032] The diameter of the via hole 13 is larger than that of the second air hole 14, ensuring that the pressure on the second pressure side sensed by the side of the first chip 10 is more concentrated, thereby improving the accuracy of the detection result.

[0033] The first chip 10 is fixedly connected to the top inside the housing 2 and is used to isolate the first inner air hole 9 and the cavity 5. The second chip 11 is fixedly connected to the top inside the housing 2 and is connected to the first chip 10 through a lead 12. The cavity 5 is filled with silica gel, which plays a protective role for the covered first chip 10 and second chip 11, and at the same time can effectively sense the change of the external pressure, forming a micro-deformation acting on the first chip 10.

[0034] The lead 12 can be selected from existing gold wires, aluminum wires or copper wires to realize the signal transmission between the first chip 10 and the second chip 11. To further improve the reliability, corrosion resistance and conductivity of the signal transmission, the lead 12 can preferably be a gold wire.

[0035] The first chip 10 is a pressure chip, i.e., a MEMS chip, and the second chip 11 is an ASIC chip. The first chip 10 and the second chip 11 are connected through a lead 12. The potting glue 15 is potted on the outside of the PCB board 1 and the housing 2 to protect the housing 2 and at the same time prevent the housing 2 from shifting in position on the PCB board 1.

[0036] When used as a gauge pressure sensor, the first pressure P1 is introduced through the first outer air hole 8, and the atmosphere is introduced through the via hole 13, ensuring that the pressure inside the sensor is consistent with the external environment, so as to avoid affecting the normal operation of the sensor due to excessive difference between the internal pressure and the external pressure.

[0037] When used as a differential pressure sensor, the first pressure P1 is introduced through the first external air hole 8, and the second pressure P2 is introduced through the via hole 13. One side of the first chip 10 close to the first internal air hole 9 serves as the first pressure-sensing side to sense the pressure change, and converts the pressure change into a deformation quantity and transmits it to the first chip 10; the bottom of the first chip 10 serves as the second pressure-sensing side. External gas enters the cavity 5 through the via hole 13 and the second air hole 14. The first chip 10 converts the differential pressure deformation quantity caused by the pressure difference between the two sides of the first pressure-sensing side and the second pressure-sensing side into an analog signal and transmits it to the second chip 11. The second chip 11 converts the received analog signal into a digital pressure signal, and performs signal amplification and calibration and other processes, and performs temperature compensation on the digital pressure signal according to the pre-stored temperature coefficient to achieve the temperature linear compensation function. The obtained compensated pressure signal is transmitted to external devices.

[0038] The first chip 10 and the second chip 11 are encapsulated in the pressure sensor together. The packaging integration degree is high, the calibration compatibility is strong, and the sensor calibration can be directly carried out without customizing calibration tooling for various modules according to the PCB. The cost is low, the efficiency is high, and the peripheral circuit is simple. The size of the PCB board 1 is reduced to half of that of a common module, and the customer's structural design is more compact and the compatibility is stronger.

[0039] The via hole 13 is arranged on the PCB board 1, and the second air hole 14 is arranged on the cover plate 4. It can be used as a gauge pressure sensor or a differential pressure sensor, and the versatility is stronger; moreover, because both the via hole 13 and the second air hole 14 are on the back of the PCB board 1, the holes are not easily blocked during dispensing and potting, and the process is simpler.

[0040] The above embodiments are only for illustrating the technical concept and features of the present invention, and their purpose is to enable those who are familiar with this technology to understand the content of the present invention and implement it accordingly, and cannot be used to limit the protection scope of the present invention. All equivalent changes or modifications made according to the spirit and essence of the present invention should be covered within the protection scope of the present invention.

Claims

1. A novel SOP6 integrated package differential pressure sensor module, characterized in that, It includes: a PCB board (1), a cover plate (4) fixed on the top of the PCB board (1), a housing (2) fixed on the top of the cover plate (4), a cavity (5) provided between the housing (2) and the cover plate (4), a first air intake unit provided above the cavity (5), a second air intake unit provided below the cavity (5), and a first chip (10) and a second chip (11) which are connected in the housing (2) and electrically connected; The first chip (10) isolates the first air intake unit and the cavity (5).

2. The novel SOP6 integrated package differential pressure sensor module according to claim 1, characterized in that: The first air intake unit includes a nozzle (6) integrally connected to the top of the housing (2), a guiding part (7) provided on the top of the nozzle (6) with a gradually decreasing diameter, a first outer air hole (8) opened on the top of the nozzle (6), and a first inner air hole (9) opened at the bottom of the nozzle (6) and connected to the first outer air hole (8), and the first chip (10) is used to isolate the first inner air hole (9) and the cavity (5).

3. A novel SOP6 integrated package differential pressure sensor module according to claim 1, characterized in that: The second air intake unit includes a via hole (13) penetrating the PCB board (1) and a second air hole (14) penetrating the cover plate (4), and the second air hole (14) communicates the cavity (5) and the via hole (13).

4. A novel SOP6 integrated package differential pressure sensor module according to claim 1, characterized in that: It further includes a slot (3) opened at the bottom of the housing (2), a lead (12) connecting the first chip (10) and the second chip (11), and a potting glue (15) potted on the outer sides of the PCB board (1) and the housing (2), and the cover plate (4) is clamped in the slot (3).

5. A novel SOP6 integrated package differential pressure sensor module according to claim 2, characterized in that: The diameter of the first outer air hole (8) is larger than the diameter of the first inner air hole (9).

6. A novel SOP6 integrated package differential pressure sensor module according to claim 3, characterized in that: The diameter of the via hole (13) is larger than the diameter of the second air hole (14).

7. A novel SOP6 integrated package differential pressure sensor module according to claim 4, characterized in that: The lead (12) is a gold wire, an aluminum wire or a copper wire.

8. A novel SOP6 integrated package differential pressure sensor module according to claim 1, characterized in that: The first chip (10) is a pressure chip, and the second chip (11) is an ASIC chip.

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