Controller device and electric vehicle
By setting a heat dissipation plate in the controller to bond with the power element, heat is transferred to the shell and aluminum substrate, the problem of poor heat dissipation in the prior art is solved, and a more efficient heat dissipation effect is achieved, and the power element damage is avoided.
Patent Information
- Application Number
- CN202422180802.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-05
- Publication Date
- 2025-07-08
- Estimated Expiration
- 2034-09-05
AI Technical Summary
When the power components generate a large amount of heat, the aluminum-based circuit board cannot transfer heat in time, resulting in a continuous increase in temperature and the risk of burning out the power components.
A heat dissipation plate is arranged on the surface of the power element and fixed it with the aluminum substrate and the shell. The heat dissipation plate is transferred to the shell and the aluminum substrate through the heat dissipation plate, increasing the heat dissipation area to improve the heat dissipation efficiency.
It effectively improves the heat dissipation efficiency of power components and avoids the risk of component damage caused by excessive temperature.
Smart Images
Figure CN223080287U_ABST
Abstract
Description
Technical Field
[0001] The embodiments of the present application relate to the technical field of controllers, and in particular, to a controller device and an electric vehicle. Background Art
[0002] In the field of electric vehicles, the three major components usually refer to the battery, the electric control unit, and the motor. The electric control unit is respectively connected to the battery and the motor to realize the control of the motor. The electric control unit includes a controller, and an aluminum-based circuit board and power components are arranged inside the controller. At present, in the existing controller structure, after the power components are surface-mounted on the aluminum-based circuit board, heat is conducted through the aluminum-based circuit board to the outer shell, so as to conduct the heat of the power components to the outside.
[0003] However, during the implementation of the embodiments of the present application, the inventor found that when the heat generated by the power components is relatively large, the aluminum-based circuit board cannot transfer the heat to the outer shell in time, resulting in the continuous rise of the temperature of the power components, and there is a risk of burning out the power components. Summary of the Utility Model
[0004] The main technical problem to be solved by the embodiments of the present application is to provide a controller device and an electric vehicle, which can effectively improve the heat dissipation efficiency of the power components and avoid the over-high temperature of the power components.
[0005] To solve the above technical problem, a technical solution adopted by the embodiments of the present application is: to provide a controller device, including an outer shell, an aluminum substrate, power components, a control board, a heat dissipation board, and fixing components. The outer shell is provided with a receiving cavity; the aluminum substrate is arranged in the receiving cavity; the power components are arranged on the aluminum substrate and are electrically connected to the aluminum substrate; the control board is spaced above the aluminum substrate and is electrically connected to the aluminum substrate; the heat dissipation board is arranged between the control board and the power components, and the heat dissipation board is attached to the power components; the fixing components are respectively connected to the heat dissipation board and the outer shell to fix the heat dissipation board and the aluminum substrate to the outer shell.
[0006] In some embodiments, the controller device further includes a first conductive component and an insulating component. The first conductive component is electrically connected to the aluminum substrate and the control board; the heat dissipation board is provided with a first through hole, the insulating component is arranged in the first through hole and is connected to the heat dissipation board, the insulating component is provided with a second through hole, and the first conductive component passes through the first through hole and the second through hole and then extends out of the outer shell, and the fixing component is connected to the insulating component.
[0007] In some embodiments, the heat dissipation board is provided with a first step around the first through hole. The insulating component includes a central portion and an edge portion. The central portion is located in the first through hole, and the edge portion is stacked and connected with the first step in a first direction. The first step is located between the edge portion and the aluminum substrate, and the first direction is the thickness direction of the heat dissipation board.
[0008] In some embodiments, along the first direction, the edge portion corresponds to at least a part of the power components.
[0009] In some embodiments, a second through hole is provided in the central portion. The first conductive component includes a first conductive column and a first base, and the first base is connected to the end of the first conductive column. The insulating member further includes an extension portion connected to the central portion. The first base is provided with a third through hole, the aluminum substrate is provided with a fourth through hole, the extension portion is located in the third through hole and the fourth through hole, and a fixing member is disposed through the extension portion and connected to the housing.
[0010] In some embodiments, along a first direction, the heat dissipation plate has opposite first and second surfaces. The first surface is disposed in contact with the power element, and the second surface faces away from the power element. The insulating member is flush with the second surface of the heat dissipation plate, or the insulating member is lower than the second surface of the heat dissipation plate.
[0011] In some embodiments, the second surface of the heat dissipation plate is provided with a first fin portion for increasing the heat dissipation area of the second surface.
[0012] In some embodiments, the controller device further includes a thermally conductive silica gel sheet, and the thermally conductive silica gel sheet is respectively disposed in contact with the power element and the heat dissipation plate.
[0013] In some embodiments, the housing includes a first housing and a second housing. The first housing and the second housing enclose a receiving cavity, and a thermally conductive silicone grease is provided between the first housing and the aluminum substrate.
[0014] To solve the above technical problems, another technical solution adopted in the embodiments of the present application is: to provide an electric vehicle including a controller device.
[0015] The beneficial effects of the embodiments of the present application are as follows: The controller device in the embodiments of the present application includes a housing, an aluminum substrate, a power element, a control board, a heat dissipation plate, and a fixing member. The housing is provided with a receiving cavity; the aluminum substrate is disposed in the receiving cavity; the power element is disposed on the aluminum substrate and electrically connected to the aluminum substrate; the control board is spaced above the aluminum substrate and electrically connected to the aluminum substrate; the heat dissipation plate is disposed between the control board and the power element, and the heat dissipation plate is disposed in contact with the power element; the fixing member is respectively connected to the heat dissipation plate and the housing to fix the heat dissipation plate and the aluminum substrate to the housing. In the controller device of the embodiments of the present application, by providing a heat dissipation plate on the surface of the power element and disposing the heat dissipation plate in contact with the power element, part of the heat generated by the power element during operation can be transferred to the housing through the aluminum substrate, and another part of the heat is transferred to the heat dissipation plate. Compared with the heat dissipation surface of the power element, the heat dissipation surface of the heat dissipation plate is larger, which can effectively improve the heat dissipation efficiency of the power element and avoid the risk of damage to the power element due to too high temperature of the power element. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] To more clearly illustrate the technical solutions in the specific embodiments of the present application, the following will briefly introduce the drawings required for use in the description of the specific embodiments. In all the drawings, similar elements or parts are generally identified by similar reference numerals. In the drawings, the elements or parts do not necessarily draw according to the actual scale.
[0017] Figure 1 is a schematic diagram of the controller device in the embodiment of the present application;
[0018] Figure 2 is the sectional view of the controller device in the embodiment of the present application along Figure 1 A-A in;
[0019] Figure 3 is an exploded view of the controller device in the embodiment of the present application;
[0020] Figure 4 is an exploded view of the partial structure of the controller device in the embodiment of the present application;
[0021] Figure 5 is the enlarged view of the partial B of the controller device in the embodiment of the present application in Figure 2 ; Specific Embodiments
[0022] To facilitate the understanding of the present application, the following will describe the present application in more detail in conjunction with the drawings and specific embodiments. It should be noted that when an element is expressed as "fixed to" another element, it can be directly on the other element, or there can be one or more intermediate elements therebetween. When an element is expressed as "connected to" another element, it can be directly connected to the other element, or there can be one or more intermediate elements therebetween. The terms "upper", "lower", "inner", "outer", "vertical", "horizontal", etc. used in this specification indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be construed as a limitation to the present application. In addition, the terms "first", "second", etc. are only used for descriptive purposes and cannot be construed as indicating or implying relative importance.
[0023] Unless otherwise defined, all the technical and scientific terms used in this specification have the same meaning as those commonly understood by those skilled in the technical field to which the present application belongs. The terms used in the specification of the present application are only for the purpose of describing specific embodiments and are not used to limit the present application. The term "and / or" used in this specification includes any and all combinations of one or more of the related listed items.
[0024] In addition, the technical features involved in different embodiments of the present application described below can be combined with each other as long as they do not conflict with each other.
[0025] Please refer to Figures 1 to 3 , in the controller device 100 according to the embodiment of the present application, it includes a housing 10, an aluminum substrate 20, a power element 30, a control board 40, a heat dissipation board 50 and a fixing member 60. The housing 10 is provided with a receiving cavity 13, and the aluminum substrate 20, the power element 30, the control board 40, the heat dissipation board 50 and the fixing member 60 are arranged in the receiving cavity 13. The power element 30 is arranged on the aluminum substrate 20 by welding or soldering and forms an electrical connection with the aluminum substrate 20. The control board 40 is arranged at an interval above the aluminum substrate 20 and forms an electrical connection with the aluminum substrate 20, wherein the power element 30 is located between the control board 40 and the aluminum substrate 20. The heat dissipation board 50 is arranged between the control board 40 and the power element 30, and the heat dissipation board 50 is attached to the power element 30. The fixing member 60 is respectively connected to the heat dissipation board 50 and the housing 10, so as to fix the heat dissipation board 50 and the aluminum substrate 20 inside the housing 10. In the controller device 100 according to the embodiment of the present application, by arranging the heat dissipation board 50 on the surface of the power element 30 and attaching the heat dissipation board 50 to the power element 30, part of the heat generated by the power element 30 during operation can be transferred to the housing 10 through the aluminum substrate 20, and another part of the heat is transferred to the heat dissipation board 50. Compared with the heat dissipation surface of the power element 30, the heat dissipation surface of the heat dissipation board 50 is larger, which can effectively improve the heat dissipation efficiency of the power element 30 and avoid the risk of damaging the power element 30 due to the over-high temperature of the power element 30. It can be understood that the power element 30 may include electronic components such as power tubes, transistors, and MOS tubes.
[0026] In some embodiments, please refer to Figure 1 , Figure 3 and Figure 4, the controller device 100 further includes a first conductive component 71 and a second conductive component 72. The first conductive component 71 and the second conductive component 72 are both electrically connected and disposed on the aluminum substrate 20. The first conductive component 71 includes a first conductive post 711 and a first base 712. The first base 712 is connected to one end of the first conductive post 711, and the first conductive post 711 is electrically connected to the aluminum substrate 20 through the first base 712. The number of the first conductive posts 711 and the first bases 712 is three respectively, and each first conductive post 711 is correspondingly disposed with a first base 712. The three first conductive posts 711 are used to connect with the external three-phase AC cable, so as to realize electrical connection with the motor. The second conductive component 72 includes a second conductive post 721 and a second base 722. The second base 722 is connected to one end of the second conductive post 721, and the second conductive post 721 is electrically connected to the aluminum substrate 20 through the second base 722. The number of the second conductive posts 721 and the second bases 722 is two respectively, and each second conductive post 721 is correspondingly disposed with a second base 722. The polarities of the two second conductive posts 721 are opposite, and both are used to connect with the external power cable, so as to realize electrical connection with the power supply. The control board 40 is provided with a through hole. The first conductive post 711 and the second conductive post 721 both pass through the through hole and extend out of the housing 10.
[0027] In some embodiments, please refer to Figure 4 and Figure 5 , the heat dissipation plate 50 is provided with a plurality of through first through holes 51 along the first direction X, where the first direction X is the thickness direction of the heat dissipation plate 50. The controller device 100 further includes an insulating member 80. The insulating member 80 is disposed in the first through hole 51 and connected to the heat dissipation plate 50. The insulating member 80 is provided with a second through hole 811. The first conductive post 711 in the first conductive component 71 passes through the first through hole 51 and the second through hole 811 and then extends out of the housing 10. The fixing member 60 is respectively connected to the insulating member 80 and the housing 10, so as to fix the heat dissipation plate 50 and the aluminum substrate 20 inside the housing 10. By providing the first through hole 51 on the heat dissipation plate 50 and the second through hole 811 on the insulating member 80, both the first through hole 51 and the second through hole 811 are used to avoid the first conductive post 711, so that the heat dissipation plate 50 and the insulating member 80 can be disposed between the control board 40 and the power board components, and the fixing member 60 can connect the insulating member 80 and the housing 10 in the first direction X to realize the fixation of the heat dissipation plate 50 relative to the housing 10.
[0028] In some embodiments, please refer to Figure 4 and Figure 5, the heat dissipation plate 50 is provided with a first step 52 around the first through hole 51. The insulating member 80 includes a central portion 81 and an edge portion 82. The edge portion 82 is disposed around the central portion 81, and at least a part of the central portion 81 is located within the first through hole 51. In the first direction X, at least a part of the edge portion 82 is stacked and connected with the first step 52, and the first step 52 is located between the edge portion 82 and the aluminum substrate 20. Through the above structure, when the fixing member 60 is respectively connected to the insulating member 80 and the housing 10, the edge portion 82 can press the first step 52 in the first direction X, so that the insulating member 80 presses the heat dissipation plate 50 in the first direction X to realize the fixing of the heat dissipation plate 50.
[0029] In some embodiments, please refer to Figure 5 , along the first direction X, the edge portion 82 is correspondingly arranged with at least a part of the power element 30, so that the edge portion 82 can press the heat dissipation plate 50 against the heat dissipation surface of the power element 30, further improving the heat conduction efficiency between the power element 30 and the heat dissipation plate 50.
[0030] In some embodiments, please refer to Figure 4 and Figure 5 , the central portion 81 of the insulating member 80 is provided with a second through hole 811, and the first conductive post 711 is disposed through the second through hole 811. The insulating member 80 further includes an extension portion 83, the extension portion 83 is connected to the central portion 81, the first base 712 is provided with a third through hole 7121, the aluminum substrate 20 is provided with a fourth through hole 21, the extension portion 83 is located within the third through hole 7121 and the fourth through hole 21, and the fixing member 60 is disposed through the extension portion 83 and connected to the housing 10. By providing the extension portion 83 and being located within the third through hole 7121 and the fourth through hole 21, when the fixing member 60 can fix the heat dissipation plate 50 relative to the housing 10, the fixing member 60 can be prevented from being in electrical contact with the first base 712 and the aluminum substrate 20. In addition, through the above structure, during the assembly process, the fixing member 60 can pass through the insulating member 80, the first base 712, and the aluminum substrate 20 at one time and then be connected to the housing 10. Under the crimping action of the insulating member 80, the first conductive assembly 71 and the heat dissipation plate 50 can be simultaneously crimped and fixed, without additional assembly steps and without increasing the assembly man-hours.
[0031] In some embodiments, please refer to Figure 4 and Figure 5, along the first direction X, the heat dissipation plate 50 has opposite first and second surfaces 53 and 54, where the first surface 53 is arranged in contact with the power board element, and the second surface 54 faces away from the power element 30. By providing a first step 52 around the first through hole 51 on the heat dissipation plate 50, on the one hand, the first step 52 can be stacked with the edge portion 82 of the insulating member 80 in the first direction X, and the edge portion 82 presses and fixes the heat dissipation plate 50. On the other hand, the first step 52 can accommodate the edge portion 82, so that the insulating member 80 is flush with the second surface 54 of the heat dissipation plate 50 in the first direction X, or the insulating member 80 is lower than the second surface 54 of the heat dissipation plate 50. This can reduce the assembly thickness of the control board 40, the heat dissipation plate 50, and the aluminum substrate 20 in the first direction X, thereby reducing the thickness of the controller device 100 in the first direction X. It should be noted that in other embodiments, the insulating member 80 can protrude slightly from the second surface 54 of the heat dissipation plate 50 in the first direction X.
[0032] In some embodiments, the heat dissipation plate 50 can be a heat dissipation aluminum plate, which can make full use of the high thermal conductivity performance of aluminum to quickly transfer heat. Further, the heat dissipation plate 50 can be a solid plate body, so that the heat dissipation plate 50 has a large heat capacity to absorb more heat, thereby coping with the situation where the power element 30 generates high power heat in a short time; or, the heat dissipation plate 50 can be made into a structure with several fins, which can utilize the good thermal conductivity and large heat dissipation area of aluminum metal, thereby increasing the rated power of the power element 30 under rated conditions; or the heat dissipation plate 50 can be a solid aluminum plate, and a first fin portion is provided on the second surface 54 of the heat dissipation plate 50, and the first fin portion is used to increase the heat dissipation area of the second surface 54 and further improve the heat dissipation efficiency of the heat dissipation plate 50.
[0033] In some embodiments, please refer to Figure 3 and Figure 5 , the controller device 100 further includes a thermal conductive silicone sheet 91, and the thermal conductive silicone sheet 91 is respectively arranged in contact with the power element 30 and the first surface 53 of the heat dissipation plate 50. By providing the thermal conductive silicone sheet 91 between the first surface 53 of the power element 30 and the heat dissipation plate 50, the problem of the error in the assembly process accuracy can be effectively overcome, resulting in that some power elements 30 cannot be directly arranged in contact with the first surface 53 of the heat dissipation plate 50, affecting the heat transfer between the power element 30 and the heat dissipation plate 50. In some embodiments, along the first direction X, the thickness of the thermal conductive silicone sheet 91 is 0.3 mm to 3 mm.
[0034] In some embodiments, please refer to Figure 3 and Figure 5, the housing 10 includes a first housing 11 and a second housing 12, and the first housing 11 and the second housing 12 jointly enclose a receiving cavity 13. The aluminum substrate 20 is connected to the first housing 11. Among them, the first housing 11 is preferably a metal housing, such as an aluminum housing, so that the first housing 11 has good heat conduction and heat dissipation performance and can transfer the heat of the aluminum substrate 20 to the outside quickly. The second housing 12 can be a metal housing or a plastic housing. In a further embodiment, a thermal grease 92 is provided between the first housing 11 and the aluminum substrate 20, and the thermal grease 92 can fill the gap between the first housing 11 and the aluminum substrate 20, which can further improve the heat conduction performance between the aluminum substrate 20 and the first housing 11. It can be understood that in some other embodiments, a second fin portion 111 can be provided on the outer surface of the first housing 10, and the heat dissipation area of the first housing 11 can be further increased through the second fin portion 111 to accelerate the heat dissipation efficiency.
[0035] The present application further provides an embodiment of an electric vehicle. The electric vehicle includes the above-mentioned controller device 100. For the specific structure and function of the controller device 100, reference can be made to the above embodiments, which will not be elaborated here.
[0036] The controller device 100 in the embodiment of the present application includes a housing 10, an aluminum substrate 20, a power element 30, a control board 40, a heat dissipation board 50, and a fixing member 60. The housing 10 is provided with a receiving cavity 13; the aluminum substrate 20 is disposed in the receiving cavity 13; the power element 30 is disposed on the aluminum substrate 20 and is electrically connected to the aluminum substrate 20; the control board 40 is spaced above the aluminum substrate 20 and is electrically connected to the aluminum substrate 20; the heat dissipation board 50 is disposed between the control board 40 and the power element 30, and the heat dissipation board 50 is disposed in contact with the power element 30; the fixing member 60 is respectively connected to the heat dissipation board 50 and the housing 10 to fix the heat dissipation board 50 and the aluminum substrate 20 to the housing 10. In the embodiment of the present application, the controller device 100 provides a heat dissipation board 50 on the surface of the power element 30, and the heat dissipation board 50 is disposed in contact with the power element 30, so that part of the heat generated by the power element 30 during operation can be transferred to the housing 10 through the aluminum substrate 20, and another part of the heat is transferred to the heat dissipation board 50. Compared with the heat dissipation surface of the power element 30, the heat dissipation surface of the heat dissipation board 50 is larger, which can effectively improve the heat dissipation efficiency of the power element 30 and avoid the risk of damaging the power element 30 due to the over-high temperature of the power element 30.
[0037] The above are only the embodiments of the present application, and do not limit the patent scope of the present application accordingly. Any equivalent structure or equivalent process transformation made by using the content of the specification and drawings of the present application, or directly or indirectly applied in other related technical fields, shall be equally included in the patent protection scope of the present application.
Claims
1. A controller device, characterized in that, Comprising: A housing having a receiving cavity; An aluminum substrate disposed in the receiving cavity; A power element disposed on the aluminum substrate and electrically connected to the aluminum substrate; A control board spaced above the aluminum substrate and electrically connected to the aluminum substrate; A heat dissipation plate disposed between the control board and the power element, the heat dissipation plate being in close contact with the power element; A fixing member respectively connecting the heat dissipation plate and the housing to fix the heat dissipation plate and the aluminum substrate to the housing.
2. The controller device according to claim 1, wherein The controller device further includes a first conductive component and an insulating member, the first conductive component being electrically connected to the aluminum substrate and the control board; The heat dissipation plate is provided with a first through hole, the insulating member is disposed in the first through hole and connected to the heat dissipation plate, the insulating member is provided with a second through hole, the first conductive component passes through the first through hole and the second through hole and then extends out of the housing, and the fixing member is connected to the insulating member.
3. The controller device according to claim 2, wherein The heat dissipation plate is provided with a first step around the first through hole, the insulating member includes a central portion and an edge portion, the central portion is located in the first through hole, the edge portion is stacked and connected to the first step in a first direction, the first step is located between the edge portion and the aluminum substrate, and the first direction is the thickness direction of the heat dissipation plate.
4. The controller device according to claim 3, wherein Along the first direction, at least a part of the edge portion is correspondingly disposed with the power element.
5. The controller device according to claim 3, wherein The central portion is provided with the second through hole, the first conductive component includes a first conductive column and a first base, and the first base is connected to the end of the first conductive column; The insulating member further includes an extension portion connected to the central portion, the first base is provided with a third through hole, the aluminum substrate is provided with a fourth through hole, the extension portion is located in the third through hole and the fourth through hole, and the fixing member is inserted through the extension portion and connected to the housing.
6. The controller device according to claim 3, wherein Along the first direction, the heat dissipation plate has opposite first and second surfaces, the first surface is in close contact with the power element, and the second surface faces away from the power element; The insulating member is flush with the second surface of the heat dissipation plate, or the insulating member is lower than the second surface of the heat dissipation plate.
7. The controller device according to claim 6, wherein The second surface of the heat dissipation plate is provided with a first fin portion for increasing the heat dissipation area of the second surface.
8. The controller device according to claim 1, wherein The controller device further includes a thermal conductive silicone sheet, the thermal conductive silicone sheet being respectively in close contact with the power element and the heat dissipation plate.
9. The controller device according to claim 1, wherein The housing includes a first housing and a second housing. The first housing and the second housing enclose the receiving cavity, and a thermal grease is provided between the first housing and the aluminum substrate.
10. An electric vehicle, characterized in that, It includes the controller device according to any one of claims 1-9.