Heat conduction plate body, heat conduction plate and heat dissipation device of heat conduction plate
By setting a targeted heat exchange fin structure in the steam cavity of the thermally conductive plate body, the problem of untimely heat dissipation of heat source zones and high-power zones in the prior art is solved, and the efficient and stable heat dissipation effect of the thermally conductive plate bodies and heat dissipation devices is achieved.
Patent Information
- Application Number
- CN202421437286.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-06-21
- Publication Date
- 2025-07-08
- Estimated Expiration
- 2034-06-21
AI Technical Summary
Existing heat dissipation devices cannot effectively dissipate heat in time and effectively in electronic products for heat source or high-power zones, resulting in the problem of excessive temperature.
The heat exchange fin structure is arranged in the steam cavity of the thermally conductive plate body, especially for the heat source area and the high-power area. The heat is transmitted to the heat exchange fin structure through the thermally conductive plate body, and then it is quickly transmitted to the working fluid in the steam cavity from the fin structure, and the local heat dissipation efficiency is improved in combination with the refrigerant heat dissipation method.
While achieving low cost and low weight, the local heat dissipation efficiency of the thermal conductor plate and heat dissipation device is improved, ensuring rapid heat dissipation in the heat source area and high power area, and reducing temperature.
Smart Images
Figure CN223080328U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of heat dissipation, in particular to a heat conducting plate body, a heat conducting plate and a heat dissipation device thereof. Background Art
[0002] With the development of technology, the efficiency of electronic components in electronic products has been significantly improved. However, with the significant improvement in the efficiency of electronic components, the speed at which electronic components generate heat during operation is also increasing. Therefore, the requirements for the heat dissipation performance of electronic products are also getting higher and higher.
[0003] In the prior art, the heat dissipation device dissipates heat from electronic products by conducting the heat generated by electronic components through a heat conducting plate, and the heat conducting plate then conducts the heat to heat dissipation fins for heat dissipation.
[0004] When the existing heat dissipation device dissipates heat from an electronic product, the heat dissipation efficiency of the heat conducting plate of the heat dissipation device for the heat dissipation area in contact with it is the same. However, the heat generation efficiency of the heat dissipation area of an electronic product is usually not consistent. Some areas have a higher heat generation efficiency, especially the heat source area or high-power area, while some areas have a relatively lower heat generation efficiency. If the heat dissipation efficiency of the heat dissipation device is configured according to the heat generation efficiency of the heat source area or high-power area, the weight of the heat dissipation device will be greatly increased, and the cost of the heat dissipation device will also increase significantly. If the heat dissipation efficiency of the heat dissipation device is configured according to the heat generation efficiency of the area with relatively low heat generation efficiency, although the weight of the heat dissipation device will not increase and the cost is relatively low, the heat source area and high-power area cannot be cooled in time and effectively, resulting in too high a temperature in the heat source area or high-power area. Summary of the Utility Model
[0005] Aiming at the deficiencies of the prior art, the utility model provides a heat conducting plate body, a heat conducting plate and a heat dissipation device thereof. By arranging a heat exchange fin structure on the heat conducting plate body, while ensuring low cost and low weight, the local heat dissipation efficiency of the heat conducting plate body is improved, and further the heat dissipation efficiency of the heat conducting plate and the heat dissipation efficiency of the heat dissipation device are improved.
[0006] The purpose of the utility model is achieved by the following technical solutions:
[0007] A heat conducting plate body, one side of the heat conducting plate body is concave to form a steam cavity; a heat exchange fin structure is arranged in the steam cavity; the heat exchange fin structure corresponds to the heat source area and / or high-power area.
[0008] The utility model also provides a heat conducting plate, including the heat conducting plate body and a cover body covering the heat conducting plate body; the cover body covers the side of the heat conducting plate body where the steam cavity is opened.
[0009] The present utility model also provides a heat dissipation device, including the heat conduction plate; the heat dissipation device further includes at least one heat dissipation fin;
[0010] The cover body is provided with at least one through groove, and the through groove communicates with the steam chamber; the heat dissipation fin passes through the through groove of the cover body and extends into the steam chamber;
[0011] The heat dissipation fin is provided with at least one plugging convex rib, and the plugging convex rib corresponds to the through groove; the plugging convex rib passes through its corresponding through groove and extends into the steam chamber; at least one communication port is provided on the plugging convex rib; when the heat dissipation fin is plugged into the heat conduction plate, the communication port extends into the steam chamber.
[0012] The heat conduction plate body, heat conduction plate and heat dissipation device disclosed by the present utility model, by arranging a heat exchange fin structure on the heat conduction plate body, ensure low cost and low weight while improving the local heat dissipation efficiency of the heat conduction plate body, thereby improving the heat dissipation efficiency of the heat conduction plate and the heat dissipation efficiency of the heat dissipation device. Description of the Drawings
[0013] In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings required to be used in the embodiments will be briefly introduced below.
[0014] Figure 1 Structural schematic diagram (one) of the heat conduction plate body of Embodiment 1 of the present utility model;
[0015] Figure 2 Structural schematic diagram (two) of the heat conduction plate body of Embodiment 1 of the present utility model;
[0016] Figure 3 For Figure 2 Partial enlarged view of the heat conduction plate body shown;
[0017] Figure 4 Exploded view of the heat conduction plate of Embodiment 1 of the present utility model;
[0018] Figure 5 For Figure 4 Partial enlarged view of the cover body shown;
[0019] Figure 6 Structural schematic diagram (one) of the heat dissipation device shown in Embodiment 1 of the present utility model;
[0020] Figure 7 Structural schematic diagram (two) of the heat dissipation device shown in Embodiment 1 of the present utility model;
[0021] Figure 8 For Figure 6 Structural schematic diagram of the heat dissipation fin shown;
[0022] Figure 9 is Figure 8 a partially enlarged view of the heat dissipation fin shown;
[0023] Figure 10 is Figure 6 a partially enlarged view of the fixing bar shown;
[0024] Figure 11 a schematic structural view of the heat conduction plate body of Embodiment 2 of the present utility model;
[0025] Figure 12 is Figure 11 a schematic structural view of the shovel tooth fin unit shown;
[0026] Figure 13 a schematic structural view of the heat conduction plate body of Embodiment 3 of the present utility model;
[0027] Figure 14 is Figure 13 a partially enlarged view of the heat conduction plate body shown;
[0028] Figure 15 is Figure 13 a schematic view (I) of the splicing state of the offset fin unit shown;
[0029] Figure 16 is Figure 15 a partially enlarged view of the offset fin unit shown;
[0030] Figure 17 is Figure 13 a schematic view (II) of the splicing state of the offset fin unit shown;
[0031] Figure 18 is Figure 17 a partially enlarged view of the offset fin unit shown. Detailed implementation manners
[0032] To facilitate the understanding of the present utility model, the present utility model will be described more comprehensively below with reference to the relevant drawings. Those skilled in this technology can easily understand other advantages and effects of the present utility model from the content disclosed in this specification. It should be noted that the structures, proportions, sizes, etc. shown in the drawings of this specification are only used to cooperate with the content disclosed in the specification for those skilled in this technology to understand and read, and are not used to limit the limiting conditions for the implementation of the present utility model. Therefore, they do not have a substantial technical meaning. Any modification of the structure, change of the proportional relationship, or adjustment of the size, without affecting the effects that the present utility model can produce and the purposes that can be achieved, should still fall within the scope covered by the technical content disclosed in the present utility model. At the same time, the terms such as "upper", "lower", "left", "right", and "middle" cited in this specification are only for the convenience of clear narration and are not used to limit the scope for the implementation of the present utility model. The change or adjustment of their relative relationships should also be regarded as the scope within which the present utility model can be implemented without substantial change in the technical content.
[0033] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the technical field to which the present utility model belongs. The terms used in the specification of the present utility model herein are only for the purpose of describing specific embodiments and are not intended to limit the present utility model. The term "and / or" used herein includes any and all combinations of one or more of the related listed items.
[0034] Embodiment 1
[0035] As Figure 1 and Figure 2 shown, the present utility model discloses a heat-conducting plate body 10, and a steam cavity 100 is recessed on one side of the heat-conducting plate body 10. A heat exchange fin structure is arranged in the steam cavity 100; the heat exchange fin structure corresponds to the heat source area and / or the high-power area. The heat exchange efficiency of the area where the heat exchange fin structure is arranged in the steam cavity 100 is significantly improved. When dissipating heat from the product, the heat exchange fin structure corresponds to the heat source area and / or the high-power area of the product, ensuring that the heat generated in the heat source area and / or the high-power area is conducted to the heat exchange fin structure through the heat-conducting plate body 10, and the heat exchange fin structure quickly conducts the heat of the heat-conducting plate body 10 to the working fluid in the steam cavity 100, thereby realizing rapid heat exchange.
[0036] As Figure 3As shown, in this embodiment, the heat exchange fin structure is at least one set of columnar fin units 200. The columnar fin units 200 are machined in the steam chamber. It should be noted that the shape of the columnar fin units 200 can be a square column or a circular column. Of course, the shape of the columnar fin units 200 is not limited to the above two shapes and can also be any other shape. In this embodiment, the number of columnar fin units 200 is multiple, and the multiple columnar fin units 200 are distributed in a matrix. The columnar fin units 200 are copper columns, aluminum columns or copper-aluminum bimetal columns.
[0037] When dissipating heat from the product, the heat conducting plate body 10 contacts the heat generating area of the product to dissipate heat from the heat generating area. The position of the heat conducting plate body 10 where the columnar fin units are provided corresponds to the heat source area or the high power area of the product. The heat conducting plate body 10 absorbs the heat generated in the heat source area or the high power area, and the heat conducting plate body 10 quickly conducts the heat to the columnar fin units 200. The columnar fin units 200 then quickly conduct the heat to the working fluid in the steam chamber 100, thereby improving the local heat exchange efficiency of the heat conducting plate body 10.
[0038] As Figure 4 shown, the present utility model discloses a heat conducting plate 1, which includes a heat conducting plate body 10 and a cover body 20 covering the heat conducting plate body 10. The cover body 20 covers one side of the heat conducting plate body 10 where the steam chamber 100 is opened.
[0039] As Figure 3 shown, in this embodiment, at least one fin locking groove 310 is provided on the side wall of the steam chamber 100. As Figure 4 and Figure 5 shown, the cover body 20 is provided with at least one through groove 600, and the through groove 600 communicates with the steam chamber 100.
[0040] As Figure 6 and Figure 7 shown, the present utility model also discloses a heat dissipation device 2, which includes a heat conducting plate 1 and at least one heat dissipation fin 30. The heat dissipation fin 30 passes through the through groove 600 and extends into the steam chamber 100.
[0041] As Figure 8 and Figure 9 shown, in this embodiment, at least one insertion convex rib 301 is provided on the heat dissipation fin 30, and the insertion convex rib 301 corresponds to the through groove 600; the insertion convex rib 600 communicates with the steam chamber 100 after passing through its corresponding through groove 600. Specifically, at least one insertion convex rib 301 of each heat dissipation fin 30 extends into the steam chamber 100 after passing through its corresponding through groove 600; at least one communication port 302 is provided on the insertion convex rib 301. When the heat dissipation fin 30 is inserted into the heat conducting plate 1, the communication port 302 extends into the steam chamber 100. In this embodiment, two insertion convex ribs 301 are correspondingly provided for each heat dissipation fin 30.
[0042] As Figure 9 shown, in this embodiment, the insertion rib 301 is provided with at least one connecting portion 303. The connecting portion 303 protrudes along the vertical direction of the insertion rib 301, and the connecting port 302 is opened in the connecting portion 303. Correspondingly, as Figure 5 shown, the through groove 600 is recessed toward both side edges along the vertical direction of its extension to form an avoidance groove 610; the avoidance groove 610 corresponds to the connecting portion 303. When the insertion rib 301 is inserted into the through groove 600, the connecting portion 303 is aligned with the avoidance groove 610 and passes through the avoidance groove 610. After the connecting portion 303 passes through the avoidance groove 610, the heat dissipation fins 30 are communicated with the steam chamber 100 through the connecting port 302.
[0043] As Figure 3 and Figure 9 shown, in this embodiment, after the insertion rib 301 is inserted into the steam chamber 100, the fin locking groove 310 of the steam chamber 100 locks and limits the end of the insertion rib 301. By locking and limiting the insertion rib 301, the heat dissipation fins 30 are locked and limited, thereby improving the connection stability between the heat dissipation fins 30 and the pressurized heat conducting plate 1 and preventing the heat dissipation fins 30 from falling off.
[0044] As Figure 3 shown, in this embodiment, a plurality of conduction support columns 700 are arranged in the steam chamber 100; one end of the conduction support column 700 is connected to the bottom of the steam chamber 100, and the other end is in contact with the cover body 20. Preferably, the conduction support columns 700 are evenly distributed in the steam chamber 100. As a preferred implementation manner, the conduction support column 700 is a circular column. Of course, the conduction support column 700 can also be designed in other shapes. On the one hand, the conduction support column 700 provides support for the cover body 20 to prevent the cover body 20 from deforming under the pressure of the heat dissipation fins 30; on the other hand, the conduction support column 700 conducts the heat absorbed by the heat conducting plate body 10 to the cover body 20, and the cover body 20 conducts the heat to the heat dissipation fins 30 for heat dissipation. The heat dissipation device 2 of the present invention simultaneously adopts a refrigerant heat dissipation method and a conduction heat dissipation method, so that the heat dissipation efficiency is greatly improved and the heat dissipation effect is stable.
[0045] As Figure 6 , Figure 8 and Figure 10As shown, in this embodiment, the heat dissipation device 2 further includes at least one fixing strip 40; the fixing strip 40 is provided with at least two first card slots 401, and the heat dissipation fins 30 are further provided with at least two second card slots 304, and the first card slots 401 and the second card slots 304 correspond to each other. The fixing strip 40 fixes the heat dissipation fins 30, so that the heat dissipation fins 30 maintain a stable state and are not prone to loosening, falling off, etc. As a preferred embodiment, the number of fixing strips 40 is three, and the three fixing strips 40 are fixed to at least two surfaces of the heat dissipation fins 30, and the fixing effect on the heat dissipation fins 30 is better.
[0046] As Figure 6 and Figure 7 shown, in this embodiment, the heat dissipation device 2 further includes a fin protection member 50. The fin protection member 50 is a mesh structure, and the fin protection member 50 is connected to the side of the heat dissipation fins 30 away from the pressurized heat conduction plate 1. The fin protection member 50 protects the heat dissipation fins 30 and does not affect the heat dissipation effect of the heat dissipation fins 30 at the same time.
[0047] Embodiment 2
[0048] As Figure 11 and Figure 12 shown, the present utility model discloses a heat conduction plate body 10A. One side of the heat conduction plate body 10A is concavely formed with a steam cavity 100A. A heat exchange fin structure is arranged in the steam cavity 100A.
[0049] In this embodiment, the heat exchange fin structure is at least one set of shovel tooth fin units 200A. The shovel tooth fin units 200A are brazed in the steam cavity. In this embodiment, multiple sets of shovel tooth fin units 200A are sequentially spliced along the transverse direction of the steam cavity 100A.
[0050] The shovel tooth fin unit 200A includes a connecting plate 2001 and at least one heat exchange fin 2002; the connecting plate 2001 is connected to the bottom of the steam cavity 100, and the heat exchange fin 2002 is arranged on the side of the connecting plate 2001 away from the steam cavity 100A. As a preferred embodiment, the number of heat exchange fins 2002 is multiple, and the multiple heat exchange fins 2002 are arranged in parallel at equal intervals on the connecting plate 2001. In this embodiment, the connecting plate 2001 is a copper plate, an aluminum plate or a copper-aluminum bimetal plate; the heat exchange fin 2002 is a copper sheet, an aluminum sheet or a copper-aluminum bimetal sheet.
[0051] When dissipating heat from the product, the heat conducting plate body 10A contacts the heat generating area of the product to dissipate heat from the heat generating area. The shoveled fin unit 200A provided on the heat conducting plate body 10A corresponds to the heat source area or high power area of the product. The heat conducting plate body 10 absorbs the heat generated in the heat source area or high power area, and the heat conducting plate body 10A quickly conducts the heat to the shoveled fin unit 200A, and the shoveled fin unit 200A then quickly conducts the heat to the working fluid in the vapor chamber 100A, thereby improving the local heat exchange efficiency of the heat conducting plate body 10A.
[0052] The other structures of the heat conducting plate body 10A in this embodiment are the same as those of the heat conducting plate body 10 in Embodiment 1, and will not be described in detail here.
[0053] This embodiment also discloses a heat conducting plate. The heat conducting plate in this embodiment includes a heat conducting plate body 10A. Compared with the structure of the heat conducting plate 1 in Embodiment 1, the structure of the heat conducting plate in this embodiment is different in the above-mentioned structure of the heat conducting plate body 10A, and the other structures are the same.
[0054] This embodiment also discloses a heat dissipation device. The heat dissipation device in this embodiment includes a heat conducting plate, and the heat conducting plate includes a heat conducting plate body 10A. Compared with the structure of the heat dissipation structure 2 in Embodiment 1, the structure of the heat dissipation device in this embodiment is different in the above-mentioned structure of the heat conducting plate body 10A, and the other structures are the same.
[0055] Embodiment 3
[0056] As Figure 13 and Figure 14 shown, in this embodiment, the heat exchange fin structure is at least one set of staggered fin units 200B. The staggered fin units 200B are brazed in the vapor chamber. In this embodiment, multiple sets of staggered fin units 200B are sequentially spliced along the transverse direction of the vapor chamber 100B.
[0057] As Figures 15 - 18 shown, in this embodiment, the staggered fin unit 200B includes a heat exchange plate 2003, and the heat exchange plate 2003 is connected to the bottom of the vapor chamber 100B; the heat exchange plate 2003 has a plurality of heat exchange grooves 2004; the heat exchange plate 2003 has at least one heat exchange groove 2004 distributed along the transverse direction, and at least two or more heat exchange grooves 2004 distributed along the longitudinal direction, and the heat exchange grooves 2004 distributed longitudinally are sequentially staggered. In this embodiment, the heat exchange plate 2003 has a plurality of heat exchange grooves 2004 distributed along the transverse direction, and the plurality of heat exchange grooves 2004 distributed along the transverse direction are arranged at equal intervals.
[0058] As Figure 15 and Figure 16As shown, in this embodiment, the heat exchange groove 2004 is a square groove. Of course, in other embodiments, the heat exchange groove 2004 can also be of other shapes. In this embodiment, the heat exchange groove 2004 is recessed inward from the heat exchange plate in a direction away from the steam chamber.
[0059] When dissipating heat from the product, the heat conducting plate body 10B contacts the heat generating area of the product to dissipate heat from the heat generating area. The misaligned fin unit 200B provided on the heat conducting plate body 10B corresponds to the heat source area or high-power area of the product. The heat conducting plate body 10B absorbs the heat generated in the heat source area or high-power area, and the heat conducting plate body 10B quickly conducts the heat to the misaligned fin unit 200B, and the misaligned fin unit 200B then quickly conducts the heat to the working fluid in the steam chamber 100B, thereby improving the local heat exchange efficiency of the heat conducting plate body 10B.
[0060] The other structures of the heat conducting plate body 10B in this embodiment are the same as those of the heat conducting plate body 10 in Embodiment 1, and will not be elaborated here.
[0061] This embodiment also discloses a heat conducting plate. The heat conducting plate in this embodiment includes a heat conducting plate body 10B. Compared with the structure of the heat conducting plate 1 in Embodiment 1, the difference of the heat conducting plate in this embodiment lies in the structure of the above-mentioned heat conducting plate body 10B, and the other structures are the same.
[0062] This embodiment also discloses a heat dissipation device. The heat dissipation device in this embodiment includes a heat conducting plate, and the heat conducting plate includes a heat conducting plate body 10B. Compared with the structure of the heat dissipation structure 2 in Embodiment 1, the difference of the heat dissipation device in this embodiment lies in the structure of the above-mentioned heat conducting plate body 10B, and the other structures are the same.
[0063] The above-described embodiments merely represent several implementation manners of the present invention, and the description thereof is relatively specific and detailed, but should not be construed as a limitation on the scope of the utility model patent. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present invention, several modifications and improvements can still be made, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the utility model patent shall be subject to the appended claims.
Claims
1. A heat-conducting plate body, characterized in that, One side of the heat-conducting plate body is recessed to form a steam cavity; a heat exchange fin structure is arranged in the steam cavity; the heat exchange fin structure corresponds to a heat source area and / or a high-power area; The heat exchange fin structure is at least one set of shovel-tooth fin units; The shovel-tooth fin unit includes a connecting plate and at least one heat exchange fin; the connecting plate is connected to the bottom of the steam cavity, and the heat exchange fin is arranged on the side of the connecting plate away from the steam cavity.
2. The heat conducting plate body according to claim 1, characterized in that, The heat exchange fin structure is at least one set of columnar fin units.
3. The heat-conducting plate body according to claim 2, wherein, The columnar fin units are machined in the steam cavity.
4. The heat-conducting plate body according to claim 1, wherein, The shovel-tooth fin units are brazed in the steam cavity.
5. The heat-conducting plate body according to claim 1, wherein The heat exchange fin structure is at least one set of staggered fin units.
6. The heat-conducting plate body according to claim 5, wherein The staggered fin units are brazed in the steam cavity.
7. The heat-conducting plate body according to claim 5, wherein, The staggered fin unit includes a heat exchange plate, and the heat exchange plate is connected to the bottom of the steam cavity; the heat exchange plate has a plurality of heat exchange grooves; at least one of the heat exchange grooves is distributed horizontally on the heat exchange plate, and at least two or more of the heat exchange grooves are distributed vertically on the heat exchange plate, and the two or more heat exchange grooves distributed vertically are sequentially staggered.
8. The heat-conducting plate body according to claim 7, characterized in that The heat exchange grooves are square grooves.
9. The heat-conducting plate body according to claim 7, wherein The heat exchange grooves are recessed from the heat exchange plate in a direction away from the steam cavity.
10. Heat conducting plate, characterized in that, It includes the heat-conducting plate body according to any one of claims 1-9 and a cover body covering the heat-conducting plate body; the cover body covers the side of the heat-conducting plate body where the steam cavity is opened.
11. Heat dissipation device, characterized in that, It includes the heat-conducting plate according to claim 10; the heat dissipation device further includes at least one heat dissipation fin; The cover body is provided with at least one through groove, and the through groove is communicated with the steam cavity; The heat dissipation fin passes through the through groove and extends into the steam cavity; The heat dissipation fin is provided with at least one insertion convex rib, and the insertion convex rib corresponds to the through groove; the insertion convex rib passes through the corresponding through groove and extends into the steam cavity; at least one communication port is opened on the insertion convex rib; when the heat dissipation fin is inserted into the heat-conducting plate, the communication port extends into the steam cavity.
12. The heat dissipation device according to claim 11, wherein, The insertion convex rib is provided with at least one communication part, and the communication part protrudes in a direction perpendicular to the insertion convex rib, and the communication port is opened on the communication part; the through groove is recessed toward both sides in a direction perpendicular to its extension to form an avoidance groove; the avoidance groove corresponds to the communication part.
13. The heat dissipation device according to claim 11, wherein It further includes a fin protection part, the fin protection part is a mesh structure, and the fin protection piece is connected to the side of the heat dissipation fin away from the heat-conducting plate.