Two-phase fluid heat dissipation element and product thereof
Through the design of two-phase fluid heat dissipation components, the cooling fluid state transition and drainage structure are used to solve the problem of volume increase and noise of the heat dissipation structure of electronic products, and the temperature stability and miniaturization design are achieved, cost reduction and modular applications are supported.
Patent Information
- Application Number
- CN202421503421.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Priority Date
- 2023-06-29
- Filing Date
- 2024-06-28
- Publication Date
- 2025-07-08
- Estimated Expiration
- 2034-06-28
AI Technical Summary
The increase in the heat dissipation structure of existing electronic products leads to an increase in volume and noise, making it difficult to take into account both efficient heat dissipation and miniaturization design.
Using two-phase fluid heat dissipation elements, the cooling fluid is used to convert liquid and gas states under ambient temperature changes, and efficient thermal energy management is achieved through vacuum or negative pressure environment and drainage structure, combining capillary guide plates and gas-liquid unidirectional filtration membrane to ensure temperature stability.
It realizes stable maintenance of electronic products temperature, avoids overheating or supercooling to damage internal components, reduces product volume and reduces costs, and supports modular design and replaceability.
Smart Images
Figure CN223080329U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to a heat dissipation element, in particular to a two-phase fluid heat dissipation element and its products. Background Art
[0002] With the progress of technology, electronic products are widely used in human life. To meet the needs of convenient use, these electronic products are gradually designed to have multiple functions. Since these electronic products often generate heat due to energy consumption during operation, most of these electronic products are equipped with a heat dissipation component such as a fan, a fan motor, and heat dissipation holes to help cool down, ensuring that these electronic products will not be damaged due to excessive temperature, or even have their service life reduced.
[0003] However, with the improvement of heat dissipation effect, the number of such heat dissipation structures will inevitably increase, restricting the design requirements for miniaturization of these electronic products. In addition, the fan and the fan motor in such heat dissipation structures not only easily generate noise during operation, but the fan motor also generates heat during operation. In view of this, developing a heat dissipation element that helps with heat dissipation, avoids temperature generation, and also helps to reduce the overall volume of these electronic products is an urgent development goal in the related field. Summary of the Utility Model
[0004] To develop a heat dissipation element that helps with heat dissipation, avoids temperature generation, and also helps to reduce the overall volume of these electronic products, the utility model provides a two-phase fluid heat dissipation element, including a housing. A sealed flow channel space is formed inside the housing, and at least a part of the flow channel space is filled with a cooling fluid. The housing transfers an ambient temperature to the flow channel space, causing the cooling fluid to convert between a liquid state and a gas state according to the ambient temperature.
[0005] As a further improvement of the utility model, when the entire cooling fluid is in the liquid state, the flow channel space is a vacuum environment or a negative pressure environment.
[0006] As a further improvement of the utility model, the flow channel space includes a gas storage space and a liquid storage space. When the two-phase fluid heat dissipation element is in use, a horizontal position of the gas storage space is higher than that of the liquid storage space.
[0007] As a further improvement of the utility model, between the housing and the corresponding liquid storage space, a drainage structure protrudes into the gas storage space.
[0008] As a further improvement of the utility model, the drainage structure includes an inclined surface.
[0009] As a further improvement of the utility model, the drainage structure includes a capillary guiding sheet. The capillary guiding sheet has a capillary structure, and at least a part of it is in contact with the cooling fluid in a liquid state.
[0010] To develop a heat dissipation element that helps with heat dissipation, avoids temperature generation, and also helps reduce the overall volume of the electronic product, the present utility model also provides an article, including a housing for being assembled on at least a part of the surface of an electronic product. A sealed flow channel space is formed inside the housing, and at least a part of the flow channel space is filled with a cooling fluid. The housing transfers an ambient temperature to the flow channel space, so that the cooling fluid converts between a liquid state and a gas state according to the ambient temperature.
[0011] As a further improvement of the present utility model, when the cooling fluid is in the liquid state as a whole, the flow channel space is a vacuum environment or a negative pressure environment.
[0012] As a further improvement of the present utility model, the flow channel space includes a gas storage space and a liquid storage space. When the two-phase fluid heat dissipation element is in use, a horizontal position of the gas storage space is higher than that of the liquid storage space.
[0013] As a further improvement of the present utility model, between the housing and the corresponding liquid storage space, a drainage structure protrudes into the gas storage space.
[0014] As a further improvement of the present utility model, the drainage structure includes a capillary guiding sheet, the capillary guiding sheet has a capillary structure, and at least a part of it is in contact with the cooling fluid in a liquid state.
[0015] Compared with the prior art, the beneficial effects of the present utility model are as follows:
[0016] When the two-phase fluid heat dissipation element provided by the present utility model is in use, when the ambient temperature rises, the cooling fluid can absorb the heat energy provided by the ambient temperature and then convert into the gas state to maintain the ambient temperature and prevent the ambient temperature from rising excessively; when the ambient temperature drops, the cooling fluid can release heat energy and convert into the liquid state to maintain the ambient temperature. In this way, when the two-phase fluid heat dissipation element is applied to an electronic product such as a mobile phone, a computer, household appliances, or even a precision instrument, it can assist in maintaining the ambient temperature of the electronic product within a stable range, preventing damage to each component inside the electronic product or abnormal circuits caused by too low or too high a temperature, and maintaining the operating quality of the electronic product.
[0017] The two-phase fluid heat dissipation element provided by the present utility model has a simple structure and is easy to manufacture. In addition to helping to save costs, compared with a heat dissipation component commonly used in the electronic product on the market, which often requires the use of complex parts such as a fan and a motor, the two-phase fluid heat dissipation element can greatly reduce the overall volume of the electronic product while maintaining the heat dissipation effect, achieving the purpose of product miniaturization.
[0018] The two-phase fluid heat dissipation element provided by the present utility model can be widely applied in various fields and can also be combined with the electronic product through a detachable design. In this way, the electronic product can reduce or omit the originally built-in heat dissipation components according to requirements. The two-phase fluid heat dissipation element can also achieve the effect of being replaceable, which is helpful for modular design and cost savings. Brief Description of the Drawings
[0019] Figure 1 Exploded view of the first embodiment provided by the present utility model;
[0020] Figure 2 Partial enlarged cross-sectional view of the first embodiment provided by the present utility model;
[0021] Figure 3 Stereoscopic perspective view of the second embodiment provided by the present utility model;
[0022] Figure 4 Stereoscopic exploded view of the third embodiment provided by the present utility model.
[0023] Symbol Description:
[0024] 10 Two-phase fluid heat dissipation element
[0025] 11 Outer shell
[0026] 12 Flow channel space
[0027] 121 Gas storage space
[0028] 122 Liquid storage space
[0029] 123 Drainage structure
[0030] 1231 Inclined surface
[0031] 1232 Rib
[0032] 1233 Capillary guide sheet
[0033] 1234 Fixing hole
[0034] 124 Gas-liquid one-way filter film
[0035] 13 Cooling fluid
[0036] 20 Electronic product
[0037] 20A Computer memory card
[0038] 21 Mobile phone case
[0039] 211 Inner side Detailed Description of the Preferred Embodiments
[0040] To make the objectives, technical solutions, and advantages of the embodiments of the present utility model clearer, the following will clearly and completely describe the technical solutions in the embodiments of the present utility model with reference to the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are some, rather than all, of the embodiments of the present utility model. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without creative efforts fall within the scope of protection of the present utility model.
[0041] The following further describes the present utility model in detail with reference to the accompanying drawings:
[0042] Please refer to Figure 1 and Figure 2 , which is a preferred embodiment of the two-phase fluid heat dissipation element 10 provided by the present utility model, including a housing 11. The housing 11 is made of a heat-conducting material. A flow channel space 12 is formed inside the housing 11. The flow channel space 12 is a closed space and at least a part of the flow channel space 12 is filled with a cooling fluid 13. The housing 11 can transfer an ambient temperature to the flow channel space 12, so that the cooling fluid 13 undergoes a conversion between a liquid state and a gas state according to the ambient temperature.
[0043] Among them, the heat-conducting material can be a plastic or a metal with high heat-conducting characteristics. Among them, the heat-conducting material can be copper, aluminum, or a composite thereof.
[0044] Among them, as the ambient temperature increases, the proportion of the cooling fluid 13 in the gas state is greater.
[0045] Among them, before or after the flow channel space 12 is filled with the cooling fluid 13, a vacuum pumping process is performed to form a vacuum environment or a negative pressure environment. That is to say, when the cooling fluid 13 is in the liquid state as a whole, the flow channel space 12 is the vacuum environment or the negative pressure environment.
[0046] Among them, when the cooling fluid 13 is in the liquid state as a whole, a liquid volume is smaller than a space volume of the flow channel space 12.
[0047] Furthermore, the cooling fluid 13 can be a liquid with high volatility. Preferably, the cooling fluid 13 can be water, alcohols, alkanes, or fluorinated liquids.
[0048] When the two-phase fluid heat dissipation element 10 provided by the present utility model is in use, when the ambient temperature rises, the cooling fluid 13 can absorb the thermal energy provided by the ambient temperature and then convert it into the gas state to maintain the ambient temperature and prevent the ambient temperature from rising excessively; when the ambient temperature drops, the cooling fluid 13 can release thermal energy and convert it into the liquid state to maintain the ambient temperature. In this way, when the two-phase fluid heat dissipation element 10 is applied to an electronic product 20 such as a mobile phone, a computer, a household appliance or even a precision instrument, it can assist the ambient temperature of the electronic product 20 to be maintained within a stable range, avoiding damage to the components inside the electronic product 20 or abnormal circuits caused by too low or too high temperatures, and maintaining the operating quality of the electronic product 20.
[0049] Preferably, the heat-conducting material is a non-metallic material, so that when the two-phase fluid heat dissipation element 10 is combined with an electronic product 20 with a communication function, signal shielding can be avoided, and the characteristic of light weight can be achieved.
[0050] Furthermore, the flow channel space 12 includes a gas storage space 121 and a liquid storage space 122. The gas storage space 121 is used to accommodate the cooling fluid 13 in the gas state; the liquid storage space 122 is used to accommodate the cooling fluid 13 in the liquid state, and when the two-phase fluid heat dissipation element 10 is in use, a horizontal position of the gas storage space 121 is higher than that of the liquid storage space 122. In this way, it can help isolate the cooling fluid 13 in the liquid state and the cooling fluid 13 in the gas state in the flow channel space 12, preventing the cooling fluid 13 in the gas state from staying in the cooling fluid 13 in the liquid state in the form of small bubbles, which will instead affect the transfer of the ambient temperature.
[0051] Among them, between the housing 11 and the corresponding liquid storage space 122, a drainage structure 123 protrudes into the gas storage space 121, so that the cooling fluid 13 converted from the gas state to the liquid state can condense on the surface of the drainage structure 123 in the gas storage space 121 and be guided to the liquid storage space 122 through the drainage structure 123.
[0052] Among them, the shape of the drainage structure 123 is not limited, and it can be a cylindrical rib, a long-strip-shaped protruding rod, or a protruding block of any structure.
[0053] Furthermore, the drainage structure 123 is a long-strip-shaped protruding rod, and its two ends respectively extend in the direction from the gas storage space 121 to the liquid storage space 122.
[0054] Furthermore, please refer to Figure 3 , the drainage structure 123 is a protruding block, and an inclined surface 1231 is included in the side surface of the protruding block connected to the housing 11.
[0055] Further, please refer to Figure 4 . The drainage structure 123 includes at least one columnar rib 1232 and a capillary guide sheet 1233. The capillary guide sheet 1233 is provided with a fixing hole 1234 through which the rib 1232 can pass, so that in addition to having a drainage function, the rib 1232 can also fix the capillary guide sheet 1233. The capillary guide sheet 1233 has a capillary structure, so that the capillary guide sheet can evenly distribute the cooling fluid 13 through capillary action.
[0056] Wherein, at least a part of the capillary guide sheet 1233 is in contact with the liquid cooling fluid 13, and / or another part of the capillary guide sheet 1233 is in contact with the gaseous cooling fluid 13.
[0057] Wherein, the capillary guide sheet 1233 is distributed within the flow channel space 12. Or the capillary guide sheet 1233 is only arranged corresponding to the area of the electronic product 20 that provides a heat source, which helps the diversion and distribution of the gaseous cooling fluid 13.
[0058] Wherein, a gas-liquid one-way filtering film 124 may be included between the gas storage space 121 and the liquid storage space 122. The gas-liquid one-way filtering film 124 can make the cooling fluid 13 in the gas state and the cooling fluid 13 in the liquid state move in a single direction towards the gas storage space 121 and the liquid storage space 122 respectively, effectively isolating the cooling fluid 13 in the gas state and the liquid state.
[0059] The two-phase fluid heat dissipation element 10 provided by the present utility model has a simple structure and is easy to manufacture. In addition to helping to save costs, compared with a heat dissipation component commonly used in the electronic product 20 on the market, which often requires the use of complex parts such as fans and motors, the two-phase fluid heat dissipation element 10 can greatly reduce the overall volume of the electronic product 20 while maintaining the heat dissipation effect, achieving the purpose of product miniaturization.
[0060] The two-phase fluid heat dissipation element 10 provided by the present utility model can be widely applied. In addition to being directly combined with the electronic product 20, it can also be combined with the electronic product 20 through a detachable design. In this way, the electronic product 20 can reduce or omit the original built-in heat dissipation component according to needs, and the two-phase fluid heat dissipation element 10 can also achieve the effect of being replaceable, which helps the modular design and the effect of cost saving.
[0061] In one embodiment, the two-phase fluid heat dissipation element 10 is disposed on an inner side surface 211 of a mobile phone protective case 21. When the mobile phone protective case 21 faces the electronic product 20 (mobile phone) with the inner side surface 211, the two-phase fluid heat dissipation element 10 can be in direct contact with the electronic product 20, thereby achieving the heat dissipation effect.
[0062] Wherein, the outer shell 11 of the two-phase fluid heat dissipation element 10 can also be at least a part of the inner side surface 211 of the mobile phone protective case 21, and the present invention is not limited thereto.
[0063] Please refer to Figure 3 , in one embodiment, the two-phase fluid heat dissipation element 10 is combined with a computer memory card 20A. The two-phase fluid heat dissipation element 10 is located on one side surface of the computer memory card 20A and directly contacts the internal environment of the computer memory card 20A through the outer shell 11. It should be noted that when the computer memory card 20A is assembled into a computer mainframe, the horizontal position of the gas storage space 121 in the flow channel space 12 is higher than the upper part of the liquid storage space 122. The structural relationship between the gas storage space 121 and the liquid storage space 122 helps to maintain the conversion efficiency of the cooling fluid 13 and the temperature sensitivity of the two-phase fluid heat dissipation element 10 to the ambient temperature.
[0064] The above are only the preferred embodiments of the present invention and are not used to limit the present invention. For those skilled in the art, the present invention can have various changes and modifications. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.
Claims
1. A two-phase fluid heat dissipation element, characterized in that, It includes a housing, and a sealed flow channel space is formed inside the housing. At least a part of the flow channel space is filled with a cooling fluid, and the housing transfers an ambient temperature to the flow channel space, so that the cooling fluid undergoes a conversion between a liquid state and a gas state according to the ambient temperature.
2. The two-phase fluid heat dissipation element provided in claim 1, characterized in that, When the cooling fluid is in the liquid state as a whole, the flow channel space is a vacuum environment or a negative pressure environment.
3. The two-phase fluid heat dissipation element provided in claim 1, characterized in that, The flow channel space includes a gas storage space and a liquid storage space. When the two-phase fluid heat dissipation element is in use, a horizontal position of the gas storage space is higher than that of the liquid storage space.
4. The two-phase fluid heat dissipation element provided in claim 3, characterized in that, Between the housing and the corresponding liquid storage space, a drainage structure protrudes into the gas storage space.
5. The two-phase fluid heat dissipation element provided in claim 4, characterized in that, The drainage structure includes an inclined surface.
6. The two-phase fluid heat dissipation element provided in claim 4, characterized in that, The drainage structure includes a capillary guiding sheet, the capillary guiding sheet has a capillary structure, and at least a part of it is in contact with the cooling fluid in a liquid state.
7. A heat dissipation product, characterized in that, It includes a housing, which is used to be assembled on at least a part of the surface of an electronic product. A sealed flow channel space is formed inside the housing. At least a part of the flow channel space is filled with a cooling fluid, and the housing transfers an ambient temperature to the flow channel space, so that the cooling fluid undergoes a conversion between a liquid state and a gas state according to the ambient temperature.
8. The heat dissipation product provided as claimed in claim 7, characterized in that, When the cooling fluid is in the liquid state as a whole, the flow channel space is a vacuum environment or a negative pressure environment.
9. The heat dissipation product provided as claimed in claim 8, characterized in that, The flow channel space includes a gas storage space and a liquid storage space. When the two-phase fluid heat dissipation element is in use, a horizontal position of the gas storage space is higher than that of the liquid storage space.
10. The heat dissipation product provided as in claim 9, characterized in that, Between the housing and the corresponding liquid storage space, a drainage structure protrudes into the gas storage space.
11. The heat dissipation product provided as claimed in claim 10, wherein, The drainage structure includes a capillary guiding sheet, the capillary guiding sheet has a capillary structure, and at least a part of it is in contact with the cooling fluid in a liquid state.