Electronic device

CN223080330UActive Publication Date: 2025-07-08BEIJING XIAOMI MOBILE SOFTWARE CO LTD
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Patent Information

Application Number
CN202421523870.2
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-06-28
Publication Date
2025-07-08
Estimated Expiration
2034-06-28

AI Technical Summary

Technical Problem

The existing electronic equipment has limited cavity volume and small heat dissipation area, which leads to poor heat dissipation effect and affects performance.

Method used

The thermal conductor is heat-connected to the heat-homogenizing plate and is designed as a bent structure to cover the two surfaces of the functional components, increase the heat dissipation path and area, and at the same time, graphite or graphene materials are used to improve thermal conductivity.

Benefits of technology

It improves the heat dissipation efficiency of electronic devices, improves the heating problem on the screen side, enhances the space utilization rate, and efficiently dissipates heat to the battery cover side through multiple heat transfer paths to prevent damage to the screen components due to heat generation.

✦ Generated by Eureka AI based on patent content.

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    Figure CN223080330U_ABST
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Abstract

The utility model provides electronic equipment which comprises a vapor chamber and a heat conduction part, the heat conduction part is in thermal connection with the vapor chamber, the heat conduction part covers at least one part of a first surface of a functional assembly and covers at least one part of a second surface of the functional assembly in a bent mode, and the first surface and the second surface are oppositely arranged. Through the arrangement, the heat conduction piece is thermally connected with the vapor chamber, so that the heat of the vapor chamber can be transferred to the heat conduction piece; as the heat conduction piece is of the bent structure, the length of the heat conduction piece is increased, the heat dissipation path and the heat dissipation area of the electronic equipment are enlarged, and the heat dissipation effect of the electronic equipment is improved; meanwhile, the heat conduction piece covers the two opposite surfaces of the functional assembly, the space additionally occupied by the heat conduction piece is reduced, and the space utilization rate in the electronic equipment can be improved.
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