Multifunctional heat dissipation shielding device
Through the combined structure of the heat dissipation fan, heat conduction discharge pipe and shielding heat conduction parts, the problem of low heat dissipation efficiency of the electromagnetic shield cover is solved, efficient heat dissipation and electromagnetic shielding are achieved, reducing the temperature of the back cover of the equipment, and improving the quality of wireless communications.
Patent Information
- Application Number
- CN202421560263.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-02
- Publication Date
- 2025-07-08
- Estimated Expiration
- 2034-07-02
AI Technical Summary
The existing electromagnetic shield has poor heat dissipation efficiency, which leads to the problem of hot back cover of the equipment.
The combined structure of a heat dissipation fan, a heat conduction discharge pipe and a shielding heat is adopted. The heat dissipation fan is used to blow heat dissipate through the heat dissipation fan. The heat conduction discharge pipe circulates the flow medium for heat transfer, and the multiple connection paths of the heat conduction sheet and the electromagnetic shielding sheet are efficiently dissipated to avoid heat transfer to the back cover of the equipment.
It realizes efficient heat dissipation, avoids the back cover of the equipment from getting hot, improves the heat dissipation efficiency of electromagnetic shielding, reduces radio frequency noise leakage, and improves wireless communication quality.
Smart Images
Figure CN223080331U_ABST
Abstract
Description
Technical Field
[0001] The present disclosure relates to the technical field of electromagnetic shielding covers, and in particular to a multifunctional heat dissipation shielding device. Background Art
[0002] Dual in-line memory modules (DIMMs) in notebook computers on the market often use electromagnetic shielding covers to reduce the influence of radio frequency noise and its electromagnetic interference. The material of the electromagnetic shielding cover generally uses stainless steel, and the structure is roughly a rectangular lid.
[0003] In the prior art, most electromagnetic shielding covers adopt two setting methods. One is to use the bracket clip structure designed on the motherboard to clip the electromagnetic shielding cover onto the motherboard to cover the memory module therein; the other method is to directly integrally form an electromagnetic shielding cover on the notebook computer rear cover structure, with the other end abutting against the motherboard to cover the memory module therein. However, both of these methods have certain drawbacks: First, the electromagnetic shielding cover will absorb the heat dissipated by the memory module during actual use and cause its own temperature to rise. Even if there are heat dissipation through holes in itself, the temperature will still rise relatively high. Especially when it is integrally set with the notebook computer rear cover, it will also cause the problem of the rear cover getting hot; Second, it is impossible to achieve zero-gap installation between the electromagnetic shielding cover and the circuit board, which will cause partial radio frequency noise leakage and affect the quality of wireless communication.
[0004] Therefore, there is an urgent need for an electromagnetic shielding cover device with a new structure on the market to solve the problems of poor heat dissipation efficiency of the electromagnetic shielding cover in the prior art and the problem of the device rear cover getting hot. Summary of the Utility Model
[0005] The embodiments of the present disclosure provide a multifunctional heat dissipation shielding device to solve the problems of poor heat dissipation efficiency of the electromagnetic shielding cover in the prior art and the problem of the device rear cover getting hot.
[0006] The multifunctional heat dissipation shielding device provided by the embodiments of the present disclosure includes a heat dissipation fan, a heat conduction row pipe, and a shielding heat conduction member;
[0007] The heat dissipation fan has a blown heat dissipation part;
[0008] One end of the heat conduction row pipe is connected to the blown heat dissipation part;
[0009] The shielding heat conduction member includes a heat conduction sheet and an electromagnetic shielding sheet connected to the heat conduction sheet;
[0010] Wherein, the other end of the heat conduction row pipe is connected to the heat conduction sheet;
[0011] The heat conduction medium in the heat conduction row pipe can circulate between the blown heat dissipation part and the heat conduction sheet.
[0012] In one implementable embodiment, the heat dissipation fan further includes a metal fan housing;
[0013] One side of the electromagnetic shielding sheet is fixedly connected to the metal fan housing, and the other side is fixedly connected to the heat conducting sheet.
[0014] In one implementable embodiment, a retaining wall flange is further formed by bending one side of the electromagnetic shielding sheet facing away from the heat conducting sheet, and a hollowed-out groove for clamping a conductive foam is provided.
[0015] In one implementable embodiment, a filling gap for pasting a conductive foam is further formed between the retaining wall flange and the side portion of the electromagnetic shielding sheet.
[0016] In one implementable embodiment, an uneven structure portion for coating or pasting a heat conducting interface material is further provided in the sheet body of the electromagnetic shielding sheet.
[0017] In one implementable embodiment, the electromagnetic shielding sheet includes a first shielding portion for electromagnetic shielding of the memory module and a second shielding portion for electromagnetic shielding of the solid state drive.
[0018] In one implementable embodiment, a connecting portion for installation and fixation is further provided in the electromagnetic shielding sheet;
[0019] The electromagnetic shielding sheet can be fixedly connected to the main board through the connecting portion.
[0020] In one implementable embodiment, one side of the heat conducting sheet is welded or integrally connected to the electromagnetic shielding sheet;
[0021] And one side plate surface of the heat conducting sheet further has an abutting portion for abutting against the device cover plate.
[0022] In one implementable embodiment, the heat conducting sheet further has an installation portion for installation and fixation;
[0023] The heat conducting sheet can be fixedly connected to the main board through the installation portion.
[0024] In one implementable embodiment, the blown heat dissipation portion includes a plurality of heat dissipation fins arranged at intervals;
[0025] And a plurality of the heat dissipation fins are located on the side of the heat conducting row pipe facing away from the heat dissipation fan.
[0026] The technical solution provided by the embodiments of the present disclosure has the following advantages compared with the prior art:
[0027] When the multi-functional heat dissipation and shielding device provided by the embodiment of the present disclosure is in use, the shielding and heat-conducting member therein is correspondingly covered on the memory module in the main board, and the control heat dissipation fan rotates correspondingly to blow and dissipate heat from the heat-receiving heat dissipation part. The electromagnetic shielding sheet in the shielding and heat-conducting member can perform electromagnetic shielding on the memory module and reduce radio frequency noise. The heat-conducting sheet can transfer the heat absorbed by the shielding and heat-conducting member, and further transfer it to the heat-receiving heat dissipation part through the heat-conducting row pipe. In this way, the heat in the shielding and heat-conducting member can finally be blown and dissipated into the ambient air by the heat dissipation fan. Without opening heat dissipation pores in the shielding and heat-conducting member, efficient heat dissipation of the shielding and heat-conducting member can be achieved, and the heat in the electromagnetic shielding sheet can be effectively prevented from being transferred to the device rear cover. Therefore, the multi-functional heat dissipation and shielding device has the beneficial effects of high heat dissipation efficiency and effectively solving the problem of the device rear cover getting hot.
[0028] It should be understood that the content described in this part is not intended to identify the key or important features of the embodiments of the present disclosure, nor is it used to limit the scope of the present disclosure. Other features of the present disclosure will become easily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS
[0029] By referring to the drawings and reading the detailed description below, the above and other objects, features, and advantages of the exemplary embodiments of the present disclosure will become easily understood. In the drawings, several embodiments of the present disclosure are shown in an exemplary rather than restrictive manner, where:
[0030] In the drawings, the same or corresponding reference numerals represent the same or corresponding parts.
[0031] Figure 1 The top view of the multi-functional heat dissipation and shielding device provided by the embodiment of the present disclosure is shown;
[0032] Figure 2 The bottom view of the multi-functional heat dissipation and shielding device provided by the embodiment of the present disclosure is shown.
[0033] Description of the reference numerals in the drawings: 1. Heat dissipation fan; 11. Heat-receiving heat dissipation part; 12. Metal fan housing; 2. Heat-conducting row pipe; 3. Shielding and heat-conducting member; 31. Heat-conducting sheet; 311. Contact part; 312. Mounting part; 32. Electromagnetic shielding sheet; 321. Retaining wall fold; 321a. Filling gap; 322. Hollowed-out groove; 323. Concavo-convex structure part; 324. Connecting part. DETAILED DESCRIPTION OF THE EMBODIMENTS
[0034] To make the objectives, features, and advantages of the present disclosure more apparent and understandable, the following will clearly and completely describe the technical solutions in the embodiments of the present disclosure with reference to the accompanying drawings in the embodiments of the present disclosure. Obviously, the described embodiments are only a part of the embodiments of the present disclosure, rather than all embodiments. Based on the embodiments in the present disclosure, all other embodiments obtained by those skilled in the art without creative efforts belong to the scope of protection of the present disclosure.
[0035] The embodiments of the present disclosure will be described in detail below with reference to the accompanying drawings.
[0036] Combined Figure 1 and Figure 2 As shown, the embodiment of the present disclosure provides a multifunctional heat dissipation shielding device, which includes a heat dissipation fan 1, a heat conduction exhaust pipe 2, and a shielding heat conduction member 3; the heat dissipation fan 1 has a blown heat dissipation part 11; one end of the heat conduction exhaust pipe 2 is connected to the blown heat dissipation part 11; the shielding heat conduction member 3 includes a heat conduction sheet 31 and an electromagnetic shielding sheet 32 connected to the heat conduction sheet 31; wherein, the other end of the heat conduction exhaust pipe 2 is connected to the heat conduction sheet 31; the heat conduction medium in the heat conduction exhaust pipe 2 can circulate between the blown heat dissipation part 11 and the heat conduction sheet 31.
[0037] The multifunctional heat dissipation shielding device can be specifically applied to the electromagnetic shielding of the memory module in a notebook computer, and specific usage instructions will be given by taking this as an example.
[0038] When the multifunctional heat dissipation shielding device is specifically used, the shielding heat conduction member 3 therein is correspondingly covered on the memory module in the main board, and the heat dissipation fan 1 is controlled to rotate correspondingly to blow and dissipate heat from the blown heat dissipation part 11. The electromagnetic shielding sheet 32 in the shielding heat conduction member 3 can perform electromagnetic shielding on the memory module and reduce radio frequency noise. The heat conduction sheet 31 can transfer the heat absorbed by the shielding heat conduction member 3, and further transfer it to the blown heat dissipation part 11 through the heat conduction exhaust pipe 2. The heat conduction medium in the heat conduction exhaust pipe 2 can be specifically but not limited to an alcohol solution with good heat volatilization performance to improve the heat conduction efficiency of the heat conduction exhaust pipe 2. In this way, the heat in the shielding heat conduction member 3 can finally be blown and dissipated into the ambient air by the heat dissipation fan 1. Without opening heat dissipation pores in the shielding heat conduction member 3, efficient heat dissipation of the shielding heat conduction member 3 can be achieved, and the problem that the heat in the electromagnetic shielding sheet 32 is transferred to the device rear cover, resulting in the device rear cover getting hot, can be effectively avoided.
[0039] Compared with the shielding housing made of metal materials in the prior art, the multifunctional heat dissipation shielding device provided by the embodiment of the present disclosure has the beneficial effects of high heat dissipation efficiency and effectively solving the problem of the device rear cover getting hot.
[0040] In an implementable manner, the heat dissipation fan 1 further includes a metal fan housing 12; one side of the electromagnetic shielding sheet 32 is fixedly connected to the metal fan housing 12, and the other side is fixedly connected to the heat conduction sheet 31.
[0041] Specifically, in combination with Figure 1 and Figure 2 Further detailed description is as follows. The electromagnetic shielding sheet 32 in the shielding heat-conducting member 3 is fixedly connected to the metal fan housing 12 of the radiator fan 1. In this way, the heat in the electromagnetic shielding sheet 32 can also be directly transferred to the metal fan housing 12 through the high-efficiency heat transfer characteristic of the metal. The metal fan housing 12 is directly cooled by the blowing of the radiator fan 1, so as to further improve the heat dissipation effect of the electromagnetic shielding sheet 32; the electromagnetic shielding sheet 32 is fixedly connected to the heat-conducting sheet 31. The specific connection method can be welding or integral connection. In this way, the heat on the other side of the electromagnetic shielding sheet 32 can be effectively conducted to the heat-conducting sheet 31 and transferred by the heat-conducting sheet 31 to the heat-conducting row tube 2 for heat dissipation and cooling.
[0042] The specific setting method of the above electromagnetic shielding sheet 32 can transfer the heat on both sides of itself to the metal fan housing 12 and the heat-conducting sheet 31 respectively through the way of heat conduction, and has the beneficial effect of efficient and rapid heat dissipation through two paths.
[0043] In an implementable embodiment, a retaining wall flange 321 is further bent on the side of the electromagnetic shielding sheet 32 facing away from the heat-conducting sheet 31, and a hollow groove 322 for clamping a conductive foam is provided.
[0044] Specifically, in combination with Figure 1 and Figure 2 Further detailed description is as follows. The side of the electromagnetic shielding sheet 32 facing away from the heat-conducting sheet 31 can be specifically formed with a retaining wall flange 321 by integral stamping and bending, and a hollow groove 322 for clamping a conductive foam. In this way, on the one hand, the hollow groove 322 can improve the ventilation and convection effect of the electromagnetic shielding sheet 32, and on the other hand, the surplus sheet formed when stamping the hollow groove 322 can clamp the conductive foam with the retaining wall flange 321, so as to improve the installation stability of the conductive foam.
[0045] The specific setting method of the above retaining wall flange 321 and hollow groove 322 has the beneficial effects of simple structure, being convenient for installing the conductive foam, and avoiding short circuit when the shielding heat-conducting member 3 is installed and contacted with the main board.
[0046] In an implementable embodiment, a filling gap 321a for pasting a conductive foam is further formed between the retaining wall flange 321 and the side part of the electromagnetic shielding sheet 32.
[0047] Specifically, in combination with Figure 1 and Figure 2For further detailed description, a filling gap 321a for pasting conductive foam is formed between the folded edge 321 of the retaining wall and the side of the electromagnetic shielding sheet 32. In this way, the long strip-shaped filling gap 321a can limit and clamp the conductive foam for pasting and filling. After the conductive foam is pasted and filled, a layer of Mylar can be pasted on the surface of the conductive foam, so as to avoid the risk of short circuit when the shielding and heat-conducting part 3 is installed in contact with the main board. In addition, the other two side edges of the electromagnetic shielding sheet 32 perpendicular to the heat-conducting sheet 31 can also be provided with the above-mentioned retaining wall folded edge 321, conductive foam and Mylar, further ensuring the installation insulation performance between the shielding and heat-conducting part 3 and the main board, and forming multiple radiation and noise path shielding, further improving the shielding effect of the electromagnetic shielding sheet 32 on radiation and noise.
[0048] In an implementable embodiment, the sheet body of the electromagnetic shielding sheet 32 is further provided with a concavo-convex structure part 323 for coating or pasting a heat-conducting interface material.
[0049] Specifically, in combination with Figure 1 and Figure 2 For further detailed description, by setting the above-mentioned concavo-convex structure part 323, local connection with the main board can be achieved by coating or pasting a heat-conducting interface material. On the one hand, it can further conduct the heat dissipated by the main board and improve the heat dissipation and cooling effect on the main board. On the other hand, through the multi-point connection of the concavo-convex structure part 323 with the main board at multiple points, the high-frequency impedance of the module is effectively reduced, the antenna effect of the module is greatly reduced, and the noise (such as CPU / DDR / GPU, etc.) coupled to the module at the board end cannot be effectively radiated, thus greatly reducing the risk of electromagnetic interference.
[0050] In an implementable embodiment, the electromagnetic shielding sheet 32 includes a first shielding part for electromagnetic shielding of the memory module and a second shielding part for electromagnetic shielding of the solid-state drive.
[0051] Specifically, in combination with Figure 1 and Figure 2 For further detailed description, the electromagnetic shielding sheet 32 is specifically divided into a first shielding part and a second shielding part, and the area sizes of the two can be specifically set to be slightly larger than the memory module and the solid-state drive respectively. In this way, the electromagnetic shielding sheet 32 can achieve multiple functions, and only one is needed to realize electromagnetic shielding and heat dissipation and cooling for the memory module and the solid-state drive respectively.
[0052] Of course, the sizes and shapes of the above-mentioned first shielding part and second shielding part can be adaptively adjusted according to the sizes and shapes of the memory module and the solid-state drive to fully meet the shielding and heat dissipation requirements of the two.
[0053] In an implementable embodiment, the electromagnetic shielding sheet 32 further has a connection part 324 for installation and fixation; the electromagnetic shielding sheet 32 can be fixedly connected to the main board through the connection part 324.
[0054] Specifically, in combination with Figure 2 For further detailed description, the above-mentioned connecting portion 324 can be specifically but not limited to be set in the form of "threaded hole + connecting bolt". In this way, by corresponding connection of the connecting bolt with the threaded hole in the main board, the electromagnetic shielding sheet 32 can be fixedly installed on the main board, with simple structure and convenient installation.
[0055] Of course, the above-mentioned connecting portion 324 can also be set in other structural forms. For example, it can be set as a plug-in chuck, and a receiving socket is correspondingly set in the main board. In this way, the plug-in chuck can also be fixedly installed on the main board by the way of hooking and locking the barb of the electromagnetic shielding sheet 32 in the receiving socket.
[0056] In an implementable embodiment, one side of the heat conducting sheet 31 is welded or integrally connected to the electromagnetic shielding sheet 32; and one side plate surface of the heat conducting sheet 31 further has an abutting portion 311 for abutting against the device cover plate.
[0057] Welding one side of the heat conducting sheet 31 to the electromagnetic shielding sheet 32 can enable the heat conducting sheet 31 and the electromagnetic shielding sheet 32 to be processed and manufactured separately. After being fixed by the welding process, the connection stability is good, and the heat conduction performance between the two is also relatively efficient; integrally connecting the heat conducting sheet 31 and the electromagnetic shielding sheet 32 can enable the two to be processed and manufactured by integral stamping, and there is a seamless connection between the two, fully ensuring the heat conduction performance between the two.
[0058] The structure in which the heat conducting sheet 31 is welded or integrally formed with the electromagnetic shielding sheet 32 makes the overall structure of the shielding and heat conducting member 3 more compact, and can fundamentally solve the conflict between the heat dissipation of the whole notebook computer and the electromagnetic shielding. In this way, the height of the "electromagnetic shielding structure" can be the same as that of the "heat dissipation module", which will not affect the heat dissipation of the memory module bar and will not indirectly affect the temperature of the notebook computer back cover.
[0059] In an implementable embodiment, the heat conducting sheet 31 further has an installation portion 312 for installation and fixation; the heat conducting sheet 31 can be fixedly connected to the main board through the installation portion 312.
[0060] Specifically, in combination with Figure 1 For further detailed description, the above-mentioned installation portion 312 can also be specifically but not limited to be set in the form of "threaded hole + connecting bolt". In this way, by corresponding connection of the connecting bolt with the threaded hole in the main board, the heat conducting sheet 31 can be fixedly installed on the main board, with simple structure and convenient installation.
[0061] Of course, the mounting portion 312 may also be configured as other structural forms, for example, as a plug-in card head, and a corresponding receiving socket is provided in the mainboard, so that the plug-in card head can be fixedly mounted on the mainboard by locking the heat conducting sheet 31 with the receiving socket by means of a hook.
[0062] The electromagnetic shielding sheet 32 is connected to the mainboard at multiple points through the connecting portion 324, and the heat conducting sheet 31 is connected to the mainboard at multiple points through the mounting portion 312. This can effectively reduce the high-frequency impedance of the module and greatly reduce the antenna effect of the module. The noise coupled to the module from the board end (such as CPU / DDR / GPU, etc.) cannot be effectively radiated, thereby greatly reducing the risk of electromagnetic interference.
[0063] In one possible implementation manner, the blown heat dissipation portion 11 includes a plurality of heat dissipation fins disposed at intervals; and the plurality of heat dissipation fins are located on a side of the heat conducting exhaust pipe 2 away from the heat dissipation fan 1 .
[0064] Specific, combined Figure 1 To further explain in detail, the blown heat dissipation part 11 is specifically configured as a plurality of spaced heat dissipation fins, and the plurality of heat dissipation fins are located on the side of the heat-conducting exhaust pipe 2 away from the heat dissipation fan 1, so that when the heat dissipation fan 1 blows on the heat-conducting exhaust pipe 2, it can also blow and cool down the plurality of heat dissipation fins at the same time, further improving the heat dissipation and cooling effect of the heat-conducting exhaust pipe 2.
[0065] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the description of the present disclosure, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.
[0066] The above is only a specific embodiment of the present disclosure, but the protection scope of the present disclosure is not limited thereto. Any person skilled in the art who is familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed in the present disclosure, which should be included in the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure should be based on the protection scope of the claims.
Claims
1. A multi-functional heat dissipation and shielding device, characterized in that Comprising: A cooling fan (1) having a blown cooling part (11); A heat-conducting exhaust pipe (2), one end of which is connected to the blown cooling part (11); A shielding heat-conducting member (3), including a heat-conducting sheet (31) and an electromagnetic shielding sheet (32) connected to the heat-conducting sheet (31); Wherein, the other end of the heat-conducting exhaust pipe (2) is connected to the heat-conducting sheet (31); The heat-conducting medium in the heat-conducting exhaust pipe (2) can circulate between the blown cooling part (11) and the heat-conducting sheet (31).
2. The multifunctional heat dissipation shielding device according to claim 1, wherein The cooling fan (1) further includes a metal fan housing (12); One side of the electromagnetic shielding sheet (32) is fixedly connected to the metal fan housing (12), and the other side is fixedly connected to the heat-conducting sheet (31).
3. The multifunctional heat dissipation shielding device according to claim 2, characterized in that, On the side of the electromagnetic shielding sheet (32) facing away from the heat-conducting sheet (31), a retaining wall flange (321) is further bent and a hollow groove (322) for clamping a conductive foam is provided.
4. The multifunctional heat dissipation shielding device according to claim 3, wherein A filling gap (321a) for pasting a conductive foam is further formed between the retaining wall flange (321) and the side part of the electromagnetic shielding sheet (32).
5. The multifunctional heat dissipation and shielding device according to claim 2, wherein In the sheet body of the electromagnetic shielding sheet (32), a concavo-convex structure part (323) for coating or pasting a heat-conducting interface material is further provided.
6. The multifunctional heat dissipation shielding device according to claim 1, characterized in that The electromagnetic shielding sheet (32) includes a first shielding part for electromagnetic shielding of a memory module and a second shielding part for electromagnetic shielding of a solid-state drive.
7. The multi-functional heat dissipation shielding device according to claim 1, characterized in that, The electromagnetic shielding sheet (32) further has a connecting part (324) for installation and fixation; The electromagnetic shielding sheet (32) can be fixedly connected to the main board through the connecting part (324).
8. The multifunctional heat dissipation shielding device according to claim 1, characterized in that One side of the heat-conducting sheet (31) is welded or integrally connected to the electromagnetic shielding sheet (32); And on one side plate surface of the heat-conducting sheet (31), there is a butting part (311) for butting against an equipment cover plate.
9. The multifunctional heat dissipation shielding device according to claim 8, characterized in that, The heat-conducting sheet (31) further has an installation part (312) for installation and fixation; The heat-conducting sheet (31) can be fixedly connected to the main board through the installation part (312).
10. The multi-functional heat dissipation and shielding device according to claim 1, wherein, The blown cooling part (11) includes a plurality of spaced-apart cooling fins; And the plurality of cooling fins are located on the side of the heat-conducting exhaust pipe (2) facing away from the cooling fan (1).