Radiator and radiating system

Abstract

The utility model provides a radiator and a radiating system, the radiator comprises a cold conduction fan assembly, a cold conduction profile, a semiconductor chilling plate and a heat pipe radiating assembly, the cold conduction fan assembly is in contact with one side surface of the cold conduction profile, the other side surface of the cold conduction profile is in contact with the cold end surface of the semiconductor chilling plate, and the heat pipe radiating assembly is in contact with the semiconductor chilling plate. The hot end face of the semiconductor chilling plate makes contact with the heat pipe heat dissipation assembly. The cold conduction fan assembly and the heat pipe heat dissipation assembly press the cold conduction profile and the semiconductor chilling plate between the cold conduction fan assembly and the heat pipe heat dissipation assembly. The heat dissipation system comprises a radiator, a temperature sensor and a temperature controller; the temperature sensor is connected with the temperature controller and is used for detecting the temperature in the cabinet body and sending the detected temperature value to the temperature controller; and the temperature controller is used for controlling the semiconductor chilling plate and the cold conducting fan in the radiator. The utility model is applied to various types of electrical cabinets, can meet the heat dissipation requirements of high-power electrical elements, saves the occupied space, and reduces the influence of the external environment temperature on the heat dissipation efficiency.

Description

Technical Field

[0001] The utility model relates to the technical field of heat dissipation, in particular to a radiator and a heat dissipation system. Background Art

[0002] In many industrial and electrical equipment applications, especially in explosion-proof cabinets and sealed cabinets involving high-power electrical components such as inverters, solid-state relays and thyristors, effective heat dissipation management is one of the key factors to ensure long-term stable operation of the system. These high-power electrical components will generate a lot of heat during operation. If they cannot be dissipated in time and effectively, the temperature in the cabinet where they are located will rise sharply, which will not only trigger the overheating protection mechanism of the electrical components, causing equipment alarms and performance degradation, but also directly lead to equipment failure in serious cases, affecting the safety and efficiency of the entire system.

[0003] In the existing technology, in order to meet this challenge, various heat dissipation technologies are often used in the design of explosion-proof cabinets and sealed cabinets, including explosion-proof air conditioning technology, positive pressure circulation technology and heat pipe heat dissipation technology. Among them, heat pipe heat dissipation technology has been promoted and applied due to its advantages of efficient heat conduction, high investment returns, and no subsequent use and maintenance costs. The heat pipe can achieve rapid heat transfer in a confined space through the phase change cycle (evaporation-condensation) of its internal working medium, thereby exporting the heat in the high-temperature area of ​​the cabinet to the external environment for heat dissipation. However, this heat dissipation method faces the dual test of installation space limitation and heat dissipation efficiency when applied to high-power equipment, especially inverters with power exceeding 45KW. Large heat pipe heat dissipation systems are not only bulky and occupy valuable cabinet space, but also greatly reduce heat dissipation efficiency due to high external ambient temperature, especially in high-temperature industrial environments or high-temperature seasons in summer, the condensation effect of the heat pipe heat dissipation end is limited, and its heat dissipation efficiency cannot be effectively exerted. Summary of the invention

[0004] The utility model provides a radiator and a heat dissipation system which can be used for equipment such as power distribution cabinets, control cabinets, explosion-proof cabinets and sealed cabinets, so as to save space while meeting the heat dissipation requirements of high-power electrical components and reduce the influence of external environmental temperature on heat dissipation efficiency.

[0005] The utility model provides a radiator, which comprises a cooling fan assembly, a cooling profile, a semiconductor refrigeration sheet and a heat pipe heat dissipation assembly, wherein the cooling fan assembly contacts one side surface of the cooling profile, the other side surface of the cooling profile contacts the cold end surface of the semiconductor refrigeration sheet, and the hot end surface of the semiconductor refrigeration sheet contacts the heat pipe heat dissipation assembly; the cooling fan assembly and the heat pipe heat dissipation assembly press the cooling profile and the semiconductor refrigeration sheet between the cooling fan assembly and the heat pipe heat dissipation assembly.

[0006] According to the radiator provided by the present utility model, the cold conduction fan assembly includes a cold conduction fan and a fan housing. The cold conduction fan is arranged inside the fan housing, and the fan housing is used to protect and support the cold conduction fan; the fan housing is fixedly connected to the cold conduction profile through fixing bolts.

[0007] Further, one cold conduction fan is correspondingly arranged for each cold conduction profile, or multiple cold conduction profiles share one cold conduction fan.

[0008] According to the radiator provided by the present utility model, the heat pipe heat dissipation assembly includes a heat dissipation heat pipe, a heat absorption plate and heat dissipation fins. One end of the heat dissipation heat pipe in the length direction is connected to the heat absorption plate, and the other end passes out of the heat dissipation fins. The heat dissipation fins are arranged around the outside of the heat dissipation heat pipe; a working liquid is filled in the heat dissipation heat pipe.

[0009] Further, more than one thermoelectric cooler is arranged at intervals on the heat absorption plate

[0010] Further, the radiator further includes a cabinet supporting flange, and the cabinet supporting flange and the heat absorption plate are connected and fastened by flange fastening bolts.

[0011] Further, the heat dissipation heat pipe adopts an L-shaped pipe, which includes a horizontal pipe and a vertical pipe. The horizontal pipe and the vertical pipe are hollow and connected inside, and are integrally bent and formed.

[0012] Furthermore, the included angle between the plane where the vertical pipe and the horizontal pipe are located is designed as a non-right angle, and the vertical pipe is inclined upward relative to the horizontal pipe.

[0013] Furthermore, the horizontal pipe is arranged along a direction parallel to the heat absorption plate and partially embedded in the heat absorption plate.

[0014] The present utility model also provides a heat dissipation system, which includes the radiator, a temperature sensor and a temperature controller described in any one of the above; the temperature sensor is connected to the temperature controller, and is used to detect the temperature inside the cabinet and send the detected temperature value to the temperature controller; the temperature controller is used to control the thermoelectric cooler and the cold conduction fan in the radiator.

[0015] The radiator provided by the present utility model occupies a small installation space inside the cabinet and has a flexible installation position; by arranging a thermoelectric cooler and adopting the form of forced cooling at the cold end face and forced heat dissipation at the hot end face of the thermoelectric cooler, the refrigeration and cooling effect on the space inside the cabinet can be greatly improved; the present utility model can meet the heat dissipation requirements of high-power electrical components while saving occupied space and reducing the influence of the external environment temperature on the heat dissipation efficiency. Description of the Drawings

[0016] To more clearly illustrate the technical solutions in the present utility model or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the drawings in the following description are some embodiments of the present utility model. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0017] Figure 1 is one of the exploded views of the radiator provided by the present utility model;

[0018] Figure 2 is another exploded view of the radiator provided by the present utility model;

[0019] Figure 3 is the schematic diagram of the principle of the thermoelectric cooler in the radiator provided by the present utility model;

[0020] Figure 4 is the schematic diagram of the relative position relationship between the horizontal tube and the vertical tube of the heat dissipation heat pipe in the radiator provided by the present utility model;

[0021] Figure 5 is one of the schematic diagrams of the installation position of the radiator provided by the present utility model on the cabinet;

[0022] Figure 6 is another schematic diagram of the installation position of the radiator provided by the present utility model on the cabinet;

[0023] Figure 7 is the overall structure schematic diagram of a conventional radiator that can replace the heat pipe heat dissipation component in the radiator provided by the present utility model;

[0024] Figure 8 is the top view of a conventional radiator that can replace the heat pipe heat dissipation component in the radiator provided by the present utility model.

[0025] Reference numerals:

[0026] 1, cold conduction fan assembly; 11, cold conduction fan; 12, fan housing; 13, fixing bolt;

[0027] 2, cold conduction profile;

[0028] 3, thermoelectric cooler;

[0029] 4, heat pipe heat dissipation component; 41, heat dissipation heat pipe; 42, heat absorption plate; 43, heat dissipation fins; 44, flange fastening bolt;

[0030] 5, cabinet supporting flange. Detailed implementation manners

[0031] To make the objectives, technical solutions, and advantages of the present utility model clearer, the following will clearly and completely describe the technical solutions in the present utility model with reference to the accompanying drawings in the present utility model. Obviously, the described embodiments are some, but not all, of the embodiments of the present utility model. All other embodiments obtained by those of ordinary skill in the art based on the embodiments in the present utility model without making creative efforts fall within the scope of protection of the present utility model.

[0032] Aiming at the problems existing in the existing heat dissipation technologies of explosion-proof cabinets and sealed cabinets, it is urgent to develop a radiator that can meet the heat dissipation requirements of high-power electrical components, occupies a small space, and is not affected by too high external environmental temperatures. To ensure the safe operation of electrical components while optimizing the heat dissipation structure, improving the heat dissipation efficiency, and adapting to a wider range of environmental temperature conditions, thereby ensuring that the equipment can maintain the best performance under various working conditions, extending the service life, and improving the overall reliability and economy of the equipment.

[0033] The following will be combined with Figure 1 and Figure 2 to describe the radiator provided by the present utility model.

[0034] As Figure 1 shown, the radiator provided by the present utility model is used in equipment such as distribution cabinets, control cabinets, explosion-proof cabinets, and sealed cabinets. It includes a cold conduction fan assembly 1, a cold conduction profile 2, a semiconductor refrigeration sheet 3, and a heat pipe heat dissipation assembly 4. Among them, the cold conduction fan assembly 1 is in contact with one side surface of the cold conduction profile 2, the other side surface of the cold conduction profile 2 is in contact with the cold end surface of the semiconductor refrigeration sheet 3, and the hot end surface of the semiconductor refrigeration sheet 3 is in contact with the heat pipe heat dissipation assembly 4. The cold conduction fan assembly 1 and the heat pipe heat dissipation assembly 4 press the cold conduction profile 2 and the semiconductor refrigeration sheet 3 between them.

[0035] In the present utility model, thermal conductive silicone grease is applied to both the cold end surface and the hot end surface of the semiconductor refrigeration sheet 3 to achieve a better heat conduction effect.

[0036] The radiator provided by the present utility model adopts a composite heat dissipation mechanism, combining fan forced convection, refrigeration of the semiconductor refrigeration sheet 3 and raising the temperature of the heat dissipation side, and heat pipe heat dissipation technology to efficiently and quickly remove a large amount of heat generated by other components such as high-power electrical components in the cabinet.

[0037] In a specific embodiment, as Figure 2As shown in the figure, the heat conduction fan assembly 1 includes a heat conduction fan 11 and a fan housing 12. Among them, the heat conduction fan 11 is arranged inside the fan housing 12, and the fan housing 12 protects and supports the heat conduction fan 11. The fan housing 12 is pressed on the heat conduction profile 2 by fixing bolts 13. The fixing bolts 13 are used to fixedly install the heat conduction fan assembly 1, the heat conduction profile 2, and the semiconductor refrigeration sheet 3 on the heat pipe heat dissipation assembly 4.

[0038] The number of heat conduction fans 11 matches the number of fan housings 12. Specifically, three heat conduction fans 11 can be provided, and three fan housings 12 can also be provided. Generally, the number of heat conduction profiles 2 matches the number of heat conduction fans 11. Each heat conduction profile 2 can be correspondingly provided with one heat conduction fan 11, or multiple heat conduction profiles 2 can share one heat conduction fan 11. The heat conduction profile 2 can expand the heat conduction area of the heat conduction fan assembly 1.

[0039] In a specific embodiment, multiple semiconductor refrigeration sheets 3 can be provided. Generally, each semiconductor refrigeration sheet 3 is equipped with a set of heat conduction profiles 2, or multiple semiconductor refrigeration sheets 3 can share one heat conduction profile 2.

[0040] The working principle of the semiconductor refrigeration sheet 3 is based on the Peltier effect, which is a thermoelectric effect. When an electric current passes through a loop composed of two different conductors or semiconductor materials, heat will be absorbed or released at the joints. In the semiconductor refrigeration sheet 3, a large number of P-N junctions composed of pairs of P-type and N-type semiconductor materials are usually used. As Figure 3 shown in the figure, when electrons flow from the low-energy P-type material to the high-energy N-type material, the electrons will jump from the low energy level to the high energy level. At this time, it is manifested that the electrons need to absorb heat, so a cold surface (i.e., the cold end face of the semiconductor refrigeration sheet 3) is formed at this node; on the contrary, when electrons flow from the high-energy N-type material to the low-energy P-type material, the electrons will jump from the high energy level to the low energy level. At this time, it is manifested that the electrons need to release heat, so a hot surface (i.e., the hot end face of the semiconductor refrigeration sheet 3) is formed at this node.

[0041] The semiconductor refrigeration sheet 3 has the following advantages:

[0042] No moving parts: Since the working principle does not depend on mechanical movement, the semiconductor refrigeration sheet 3 runs without vibration, without noise, and has extremely low maintenance costs.

[0043] Precise control: By adjusting the magnitude of the current, the refrigeration or heating degree of the semiconductor refrigeration sheet 3 can be precisely controlled, realizing rapid response and stable control of temperature.

[0044] Compact and lightweight: The semiconductor refrigeration sheet 3 is small in volume and easy to integrate into various devices, suitable for application scenarios with limited space.

[0045] Environmentally friendly: No chemical refrigerants are required, avoiding potential environmental pollution problems.

[0046] In a specific embodiment, as Figure 2 shown, the heat pipe heat dissipation assembly 4 includes a heat dissipation heat pipe 41, a heat absorption plate 42, and heat dissipation fins 43. Among them, one end of the heat dissipation heat pipe 41 in the length direction is connected to the heat absorption plate 42, and the other end passes through the heat dissipation fins 43, so that the heat dissipation fins 43 are arranged around the outside of the heat dissipation heat pipe 41. The heat dissipation heat pipe 41 is filled with a working liquid.

[0047] In this embodiment, the radiator provided by the present utility model further includes a cabinet supporting flange 5. The cabinet supporting flange 5 and the heat absorption plate 42 can be connected and fastened by flange fastening bolts 44, and the present utility model is installed in supporting on equipment such as distribution cabinets, control cabinets, explosion-proof cabinets, and sealed cabinets to achieve the sealing partition between inside and outside the cabinet.

[0048] Before installing the radiator provided by the present utility model on the cabinet, the components except the flange fastening bolts 44 and the cabinet supporting flange 5 are assembled together as a set. During installation, as Figure 5 and 6 shown, holes are opened on the side plate or top plate of the cabinet. The size of the holes should be such that it is convenient for the cold conduction fan assembly 1 and the cold conduction profile 2 to extend into the cabinet. At the hole position, the cabinet supporting flange 5 is welded on the outer side surface of the cabinet, and then the heat absorption plate 42 in the heat pipe heat dissipation assembly 4 is fixed on the cabinet through the flange fastening bolts 44 and the cabinet supporting flange 5, so that the semiconductor refrigeration sheet 3, the cold conduction profile 2, and the cold conduction fan assembly 1 are located inside the cabinet, and the heat pipe heat dissipation assembly 4 is located outside the cabinet. Specifically, one or more semiconductor refrigeration sheets 3 can be arranged at intervals on the heat absorption plate 42.

[0049] When one end of the heat dissipation heat pipe 41 connected to the heat absorption plate 42 is heated, the working liquid evaporates into a working gas. The working gas carries heat and flows to the opposite end of the end of the heat dissipation heat pipe 41 connected to the heat absorption plate 42, where it condenses back into a liquid state upon encountering cold, and then returns to the end of the heat dissipation heat pipe 41 connected to the heat absorption plate 42 under the action of gravity, and so on in a cycle. Through this evaporation-condensation phase change cycle, the heat pipe heat dissipation assembly 4 can quickly and continuously transfer heat from the heat absorption plate 42 to the heat dissipation fins 43, and then dissipate the heat through the heat dissipation fins 43.

[0050] In this embodiment, specifically, the heat dissipation heat pipe 41 is an L-shaped pipe, which includes a horizontal pipe and a vertical pipe. The interior of the horizontal pipe and the vertical pipe is hollow and connected, and it can be formed by one-piece bending. Among them, the angle between the plane where the vertical pipe is located and the horizontal pipe is designed to be non-right-angled, and the vertical pipe is tilted upwards obliquely, that is, the vertical pipe is inclined upwards relative to the horizontal pipe, so as to facilitate the gravity return of the condensed liquid in the pipe from the vertical pipe to the horizontal pipe when the radiator is installed on the side of the cabinet. Specifically, the angle between the plane where the vertical pipe is located and the horizontal pipe is an obtuse angle, and the angle between the horizontal pipe and the vertical pipe can be 92° to 102°. Preferably, as Figure 4 shown, the angle between the horizontal pipe and the vertical pipe is 97°.

[0051] During installation, the horizontal pipe can be arranged in a direction parallel to the transverse direction of the heat absorption plate 42, and part of it is embedded in the heat absorption plate 42, so as to increase the heat absorption area of the working liquid at the horizontal pipe. The working liquid at the horizontal pipe absorbs heat at the heat absorption plate 42 and then boils and evaporates. After diffusing to the vertical pipe, it is further cooled by the heat dissipation fins 43 and condenses and returns to the horizontal pipe at the heat absorption plate 42.

[0052] The working process of the radiator provided by the present utility model includes the following stages:

[0053] Forced convection stage: The cooling fan 11 circulates the hot air in the cabinet by forced convection; the cold end surface of the semiconductor refrigeration sheet 3 contacts the heat conduction profile 2, which can increase the heat dissipation area to cool the hot air circulated by the cooling fan 11.

[0054] Heat transfer and refrigeration stage: The semiconductor refrigeration sheet 3 (also called thermoelectric refrigeration sheet) utilizes the Peltier effect. When an electric current passes through, a temperature difference will be generated between the hot end surface and the cold end surface of the semiconductor refrigeration sheet 3. The cold end surface of the semiconductor refrigeration sheet 3 absorbs the heat in the hot air and releases this heat at the hot end surface, achieving the effect of active refrigeration.

[0055] Heat pipe heat dissipation stage: The heat released by the hot end surface of the semiconductor refrigeration sheet 3 is transferred to the heat dissipation heat pipe 41. The working liquid in the heat dissipation heat pipe 41 evaporates into a working gas, and the working gas efficiently dissipates the heat through the heat dissipation fins 43 on the outside of the heat dissipation heat pipe 41.

[0056] In the radiator provided by the present utility model, the heat pipe heat dissipation assembly 4 and the cooling fan assembly 1 not only play their respective independent heat dissipation roles, but they also act on the semiconductor refrigeration sheet 3 and the heat conduction profile 2 together through the fixing action of the fan fastening bolts 13, making the contact closer through physical compression. And thermal conductive silicone grease is applied on both sides of the semiconductor refrigeration sheet to further reduce the thermal resistance to a greater extent, and further improve the overall heat exchange efficiency and heat dissipation rate of the radiator. As Figure 5 and Figure 6As shown in the figure, since the radiator provided by the present utility model occupies a relatively small installation space in the cabinet, multiple sets of radiators provided by the present utility model can be installed on one cabinet, and the installation positions are flexible. Compared with the existing through-type heat pipe radiator, the radiator provided by the present utility model greatly reduces the occupation of the space in the cabinet and can be installed on the side or top of the cabinet.

[0057] The radiator provided by the present utility model has a significantly improved refrigeration and cooling effect compared with a simple heat pipe radiator by setting the thermoelectric cooler 3.

[0058] Since the radiator provided by the present utility model adopts the form of forced refrigeration on the cold end face and forced heat dissipation on the hot end face of the thermoelectric cooler 3, the temperature on the hot end face of the thermoelectric cooler 3 is much higher than the temperature in the cabinet and the room temperature. This enables the working liquid in the heat dissipation heat pipe 41 to be designed with a relatively high condensation temperature, no longer restricted by the room temperature, and ensures that when the cabinet is in a high-temperature environment, the heat dissipation heat pipe 41 still has excellent performance of absorbing heat at the heat absorption end inside the cabinet and dissipating heat at the heat dissipation end outside the cabinet.

[0059] The present utility model also provides a heat dissipation system, which includes a radiator, a temperature sensor, and a temperature controller. Among them, the temperature sensor is connected to the temperature controller and is used to detect the temperature inside the cabinet and send the detected temperature value to the temperature controller. The temperature controller compares the received temperature value with a preset temperature threshold inside the cabinet and controls the thermoelectric cooler 3 and the cooling fan 11 in the radiator according to the comparison result. Specifically, the operation of the thermoelectric cooler 3 and the cooling fan 11 can be controlled by controlling the power supply conditions of the thermoelectric cooler 3 and the cooling fan 11.

[0060] Specifically, a set of heat conduction profiles 2 and cooling fans 11 equipped for each thermoelectric cooler 3 can be independently controlled by one temperature controller. Different start temperatures and stop temperatures can be set for each temperature controller, so as to achieve gradient control of the temperature, thereby reducing the start-stop frequency of the radiator and energy waste; or multiple thermoelectric coolers 3 and cooling fans 11 can be controlled by one set of temperature controllers to save the one-time investment.

[0061] Specifically, the heat pipe heat dissipation component 4 adopted by the present utility model can efficiently achieve the purpose of rapid heat dissipation. With the solution of the present utility model, replacing the heat pipe heat dissipation component 4 with a conventional heat dissipation profile in a non-heat pipe form (such as Figure 7 and Figure 8 shown) can also improve the heat dissipation performance of the cabinet to a certain extent, including adding a heat dissipation fan outside the cabinet to enhance the gas convection at the heat pipe radiator or the heat dissipation profile and improve the heat dissipation effect. The heat dissipation fan outside the cabinet and the fan inside the cabinet can be controlled by the temperature controller to start and stop simultaneously. These modifications are regarded as equivalent replacements of some technical features and essentially belong to the spirit and scope of the technical solution of the present utility model.

[0062] The device embodiments described above are merely illustrative. The units described as separate components may or may not be physically separated. The components shown as units may or may not be physical units, that is, they may be located in one place or distributed to multiple network units. Some or all of the modules can be selected according to actual needs to achieve the purpose of the solution of this embodiment. Those of ordinary skill in the art can understand and implement it without creative work.

[0063] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit them. Although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions recorded in the foregoing embodiments or perform equivalent replacements for some of the technical features. These modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A radiator, characterized in that, It includes a cold conduction fan assembly, a cold conduction profile, a semiconductor refrigeration sheet and a heat pipe heat dissipation assembly. The cold conduction fan assembly is in contact with one side surface of the cold conduction profile. The other side surface of the cold conduction profile is in contact with the cold end surface of the semiconductor refrigeration sheet. The hot end surface of the semiconductor refrigeration sheet is in contact with the heat pipe heat dissipation assembly. The cold conduction fan assembly and the heat pipe heat dissipation assembly press the cold conduction profile and the semiconductor refrigeration sheet between them.

2. The radiator according to claim 1, wherein The cold conduction fan assembly includes a cold conduction fan and a fan housing. The cold conduction fan is arranged inside the fan housing. The fan housing is used to protect and support the cold conduction fan. The fan housing is fixedly connected to the cold conduction profile through fixing bolts.

3. The radiator according to claim 2, wherein One cold conduction fan is correspondingly arranged for each cold conduction profile, or multiple cold conduction profiles share one cold conduction fan.

4. The radiator according to claim 1 or 2, characterized in that, The heat pipe heat dissipation assembly includes a heat dissipation heat pipe, a heat absorption plate and heat dissipation fins. One end of the heat dissipation heat pipe in the length direction is connected to the heat absorption plate, and the other end passes through the heat dissipation fins. The heat dissipation fins are arranged around the outside of the heat dissipation heat pipe. The heat dissipation heat pipe is filled with a working liquid.

5. The radiator according to claim 4, characterized in that, More than one semiconductor refrigeration sheet is arranged on the heat absorption plate at intervals.

6. The radiator according to claim 4, characterized in that It also includes a cabinet supporting flange. The cabinet supporting flange and the heat absorption plate are connected and fastened by flange fastening bolts.

7. The radiator according to claim 4, wherein The heat dissipation heat pipe adopts an L-shaped pipe, which includes a horizontal pipe and a vertical pipe. The horizontal pipe and the vertical pipe are internally hollow and connected, and are integrally bent and formed.

8. The radiator according to claim 7, wherein The included angle between the plane where the vertical pipe and the horizontal pipe are located is designed to be non-right-angled, and the vertical pipe is inclined upward relative to the horizontal pipe.

9. The radiator according to claim 7, characterized in that The horizontal pipe is arranged along the direction parallel to the heat absorption plate, and part of it is embedded in the heat absorption plate.

10. A heat dissipation system, characterized in that, It includes a radiator, a temperature sensor and a temperature controller as described in any one of claims 1 to 9. The temperature sensor is connected to the temperature controller. It is used to detect the temperature inside the cabinet and send the detected temperature value to the temperature controller. The temperature controller is used to control the semiconductor refrigeration sheet and the cold conduction fan in the radiator.

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