Heat dissipation device

Abstract

The utility model provides a heat dissipation device, which comprises a substrate body, a cover plate and a three-dimensional liquid cooling fin group, the substrate body is provided with a main heat dissipation area and a secondary heat dissipation area, the main heat dissipation area is provided with a cavity, the cover plate is arranged on the cavity, and the three-dimensional liquid cooling fin group is arranged on the cover plate. The three-dimensional liquid cooling fin group comprises main fins and filling fins, hollow liquid cooling pipe networks are arranged in the main fins and the filling fins, and the liquid cooling pipe networks are communicated with the cavity; the cavity and the liquid cooling pipe network are filled with cooling liquid, and the cooling liquid only occupies partial space of the cavity and the liquid cooling pipe network. According to the heat dissipation device, the heat dissipation performance can be improved, and rapid heat dissipation is achieved; and the technical problems that a traditional heat dissipation device is large in size and large in occupied space can be solved, and therefore miniaturization development is achieved.

Description

Technical Field

[0001] The utility model relates to the technical field of radiators, and particularly to a heat dissipation device. Background Art

[0002] With the development of the electronics industry, the computing speed of electronic components such as central processing units has increased significantly, and the heat generated by them has also increased sharply. In order to ensure the normal operation of electronic components, a heat dissipation device is usually installed on them to dissipate the heat of the electronic components.

[0003] Heat dissipation devices can usually be divided into two types: air-cooled and water-cooled. Air-cooled heat dissipation devices mostly use fin structures to increase the contact area with air to achieve rapid heat dissipation; water-cooled heat dissipation devices rely on the circulation of internal coolant to achieve rapid heat dissipation. In comparison, water-cooled heat dissipation devices have better heat dissipation performance than air-cooled heat dissipation devices. However, existing water-cooled heat dissipation devices usually need to install external circulation equipment (such as a water pump) to achieve the circulation of internal coolant. For example, in the Chinese utility model patent with the publication number CN215766594U and the name "Water-cooled Radiator", it is recorded that "both the water inlet and the water outlet are communicated with the external circulation equipment". This way of connecting external equipment makes the heat dissipation device bulky and takes up a large amount of space, which is not conducive to miniaturization.

[0004] Therefore, the utility model designs a heat dissipation device to overcome the above technical problems. Summary of the Utility Model

[0005] The purpose of the utility model is to overcome the deficiencies in the prior art and provide a heat dissipation device that can not only improve the heat dissipation performance and achieve rapid heat dissipation, but also solve the technical problems of the traditional heat dissipation device being bulky and taking up a large amount of space, so as to realize miniaturized development.

[0006] The purpose of the utility model is achieved by the following technical solutions:

[0007] A heat dissipation device, which includes: a substrate body, a cover plate, and a three-dimensional liquid-cooled fin group. A main heat dissipation area and a secondary heat dissipation area are provided on the substrate body. A cavity is formed on the main heat dissipation area. The cover plate is disposed on the cavity, and the three-dimensional liquid-cooled fin group is disposed on the cover plate;

[0008] The three-dimensional liquid-cooled fin group includes main fins and filling fins. Hollow liquid-cooled pipe networks are provided inside both the main fins and the filling fins. The liquid-cooled pipe networks communicate with the cavity; the cavity and the liquid-cooled pipe networks are filled with coolant, and the coolant only occupies part of the space of the cavity and the liquid-cooled pipe networks.

[0009] In one embodiment, the liquid cooling pipe network has a connection port, a through hole adapted to the connection port is formed on the cover plate, and the liquid cooling pipe network is communicated with the cavity through the through hole.

[0010] The same liquid cooling pipe network has two connection ports arranged side by side, and the coolant in the liquid cooling pipe network only submerges one of the connection ports.

[0011] In one embodiment, in the same liquid cooling pipe network, the liquid cooling pipe network is divided into a condensation area and an evaporation area according to the liquid level position of the coolant therein, and the condensation area and the evaporation area respectively correspond to the two connection ports;

[0012] During use, the coolant in the condensation area changes into a gaseous state, and the coolant in the evaporation area is in a liquid state.

[0013] In one embodiment, a filling pipeline is provided on the filling fin, and on the same filling fin, the filling pipeline is communicated with the liquid cooling pipe network, and a sealing plug is provided at the port of the filling pipeline.

[0014] In one embodiment, two cavities are provided on the main heat dissipation area, and the two cavities are independent of each other. Two independent liquid cooling pipe networks are provided on the same main fin, and the two liquid cooling pipe networks are respectively communicated with the two cavities;

[0015] The number of the cover plates is two, and the two cover plates respectively correspond to the two cavities;

[0016] The number of the filling fins is two. Only one liquid cooling pipe network is provided on each filling fin, and the liquid cooling pipe networks of the two filling fins are respectively communicated with the two cavities; and a filling pipeline communicated with the liquid cooling pipe network is provided on each filling fin.

[0017] In one embodiment, the liquid cooling pipe network is of a honeycomb structure.

[0018] In one embodiment, a plurality of thin plate fins are provided on the secondary heat dissipation area of the substrate body, the plurality of thin plate fins are distributed side by side, and the arrangement direction of the thin plate fins is the same as the arrangement direction of the three-dimensional liquid cooling fin group.

[0019] In one embodiment, a hollow plate and two protective plates are provided on the substrate body. The hollow plate is arranged on the side of the three-dimensional liquid cooling fin group away from the substrate body, and the two protective plates are respectively arranged on both sides of the three-dimensional liquid cooling fin group.

[0020] In summary, the heat dissipation device of the present utility model can not only improve the heat dissipation performance and achieve rapid heat dissipation, but also solve the technical problems of the traditional heat dissipation device being bulky and occupying a large space, thus realizing miniaturization development. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present utility model, and therefore should not be regarded as limiting the scope. For those of ordinary skill in the art, other related drawings can be obtained based on these drawings without creative efforts.

[0022] Figure 1 is a schematic structural diagram of the heat dissipation device of the present utility model;

[0023] Figure 2 is Figure 1 a disassembled schematic diagram of the heat dissipation device shown;

[0024] Figure 3 is Figure 2 a schematic structural diagram of the substrate body shown;

[0025] Figure 4 is Figure 2 a schematic structural diagram of the three-dimensional liquid cooling fin group shown;

[0026] Figure 5 is a schematic structural diagram of the main fin and the substrate body after assembly;

[0027] Figure 6 is a schematic diagram of the cooperation relationship between the main fin and the cavity during use;

[0028] Figure 7 is a schematic structural diagram of the hollowed-out plate and the guard plate in another embodiment;

[0029] Figure 8 is Figure 7 a schematic diagram of the state where the hollowed-out plate and the guard plate shown are installed on the substrate body. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0030] To facilitate the understanding of the present utility model, the present utility model will be described more comprehensively below with reference to the relevant drawings. The preferred embodiments of the present utility model are shown in the drawings. However, the present utility model can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present utility model more thorough and comprehensive.

[0031] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly on the other element or there may also be an intermediate element. When an element is considered to be "connected" to another element, it can be directly connected to the other element or there may be an intermediate element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only and do not represent the only implementation.

[0032] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those of ordinary skill in the technical field to which this utility model belongs. The terms used herein in the specification of this utility model are only for the purpose of describing specific implementations and are not intended to limit this utility model. The term "and / or" used herein includes any and all combinations of one or more of the related listed items.

[0033] This utility model provides a heat dissipation device 1, as Figure 1 and Figure 2 shown, which includes: a substrate body 10, a cover plate 20, and a three-dimensional liquid-cooled fin group 30. As Figure 3 shown, a main heat dissipation area 110 and a secondary heat dissipation area 120 are provided on the substrate body 10. A cavity 111 is formed on the main heat dissipation area 110. The cover plate 20 is disposed on the cavity 111, and the three-dimensional liquid-cooled fin group 30 is disposed on the cover plate 20.

[0034] As Figure 4 shown, the three-dimensional liquid-cooled fin group 30 includes main fins 310 and filling fins 320. The interiors of the main fins 310 and the filling fins 320 are both provided with hollow liquid-cooling pipe networks 301, and the liquid-cooling pipe networks 301 communicate with the cavity 111. The cavity 111 and the liquid-cooling pipe networks 301 are filled with a coolant. It is worth noting that the coolant only occupies a part of the space in the cavity 111 and the liquid-cooling pipe networks 301 because during the working process, the state of the coolant will continuously change between liquid and gas, and some space needs to be reserved for the coolant to change into gas (the specific working principle will be described below).

[0035] In this embodiment, as Figure 5 and Figure 6 shown, the liquid-cooling pipe network 301 has a connection port 302, and a through hole 210 adapted to the connection port 302 is formed on the cover plate 20. The liquid-cooling pipe network 301 is communicated with the cavity 111 through the through hole 210.

[0036] Preferably, the cover plate 20 and the three-dimensional liquid cooling fin group 30 are connected by brazing. Compared with the traditional friction welding method, the brazing method does not require reserving a friction welding area, which is beneficial to reducing the overall size of the product. In addition, the traditional friction welding method is prone to causing deformation of the main fins 310 or the filling fins 320, while the brazing method is not likely to cause deformation, thus being able to better ensure that the liquid cooling pipe network 301 remains unobstructed.

[0037] Preferably, as Figure 5 shown, the same liquid cooling pipe network 301 has two connection ports 302 arranged side by side, and the coolant in the liquid cooling pipe network 301 only submerges one of the connection ports 302.

[0038] The working principle of the heat dissipation device 1 of the present utility model will be described below:

[0039] During use, as Figure 6 shown, one side of the substrate body 10 is closely attached to the externally heating electronic component 2. The heat generated by the electronic component 2 will be transferred to the substrate body 10 and preferentially heat the coolant in the cavity 111. The coolant absorbs heat and evaporates (becomes gaseous water vapor). These gases will rise and enter the liquid cooling pipe network 301 of the main fins 310 and the filling fins 320, and then transfer the heat to the main fins 310 and the filling fins 320. Then, the three-dimensional liquid cooling fin group 30 will volatilize the heat into the air. During this period, the gaseous water vapor releases heat and re-condenses into liquid coolant. The coolant flows along the liquid cooling pipe network 301 under the action of gravity and finally returns to the cavity 111 to achieve circulation;

[0040] Specifically, as Figure 6 shown, in the same liquid cooling pipe network 301, the liquid cooling pipe network 301 can be divided into a condensation area 303 and an evaporation area 304 according to the liquid level position (liquid line) of the coolant therein. The condensation area 303 and the evaporation area 304 respectively correspond to the two connection ports 302. The connection port 302 in the condensation area 303 can be called the air outlet, and the connection port 302 in the evaporation area 304 can be called the return port. When the coolant in the cavity 111 absorbs heat and evaporates into gaseous water vapor, the water vapor enters the condensation area 303 through the air outlet. In the condensation area 303, the water vapor releases heat and changes back into liquid coolant, and then falls back to the evaporation area 304 under the action of gravity and finally returns to the cavity 111 through the return port. That is to say, during the circulation process, the coolant in the cavity 111 will successively pass through the air outlet, the condensation area 303, the evaporation area 304 and the return port, and finally return to the cavity 111 again. And during this period, the coolant experiences the process of changing from liquid to gas and then from gas back to liquid.

[0041] It should be emphasized that, compared with the traditional water-cooled heat dissipation device, the heat dissipation device 1 of the present utility model does not require an external circulation device, and the coolant can complete the circulation inside the heat dissipation device 1, thereby solving the technical problem of large space occupation of the traditional device and realizing the miniaturization of the device. Moreover, in the traditional water-cooled heat dissipation device, the state of the coolant does not change during the circulation process, that is, it always remains in a liquid state; while in the heat dissipation device 1 of the present utility model, the coolant will continuously change between a liquid state and a gaseous state during the circulation process. It is precisely by utilizing the state change of the coolant that rapid heat absorption and heat release can be achieved, improving the heat exchange efficiency, and thus enabling the heat dissipation device 1 to have good heat dissipation performance.

[0042] In this embodiment, as Figure 4 shown, a filling pipeline 321 is provided on the filling fin 320, and on the same filling fin 320, the filling pipeline 321 is communicated with the liquid cooling pipe network 301, and a sealing plug (not shown in the figure) is provided at the port of the filling pipeline 321. During use, the three-dimensional liquid cooling fin group 30 is welded to the cover plate 20, and the cover plate 20 is welded to the cavity 111 of the substrate body 10. After the assembly is completed, the staff then fills an appropriate amount of coolant through the filling pipeline 321. The coolant enters the liquid cooling pipe network 301 of the filling fin 320 from the filling pipeline 321, then enters the cavity 111, and finally enters the liquid cooling pipe network 301 of the main fin 310.

[0043] Preferably, two cavities 111 are provided on the main heat dissipation area 110 (as Figure 3 shown), and the two cavities 111 are independent of each other. Correspondingly, as Figure 5 and Figure 6 shown, two independent liquid cooling pipe networks 301 are provided on the same main fin 310, and the two liquid cooling pipe networks 301 are respectively communicated with the two cavities 111.

[0044] At the same time, the number of the cover plates 20 is two, and the two cover plates 20 respectively correspond to the two cavities 111. As Figure 4 shown, the number of the filling fins 320 is two, and only one liquid cooling pipe network 301 is provided on each filling fin 320, and the liquid cooling pipe networks 301 of the two filling fins 320 are respectively communicated with the two cavities 111. Moreover, a filling pipeline 321 communicated with the liquid cooling pipe network 301 is provided on each filling fin 320.

[0045] After setting two cavities 111, the range of the main heat dissipation area 110 is larger, and the electronic components 2 arranged in upper and lower layers can be cooled simultaneously. When multiple electronic components 2 are distributed in upper and lower layers, in the structure with only one cavity 111, it is easy to have a situation where the lower electronic components 2 are in the condensation area 303 and the upper electronic components 2 are in the evaporation area 304, which will cause uneven heat dissipation of the upper and lower electronic components 2. After setting two cavities 111, the upper and lower electronic components 2 can be both in the condensation area 303, thus achieving the same heat dissipation effect.

[0046] In this embodiment, as Figure 4 shown, the liquid cooling pipe network 301 is in a honeycomb structure. This structure is beneficial to enhancing the anti-bending ability of the main fins 310 and the filling fins 320, and is also beneficial to expanding the contact area with air and facilitating the condensation and reflux of water vapor.

[0047] In this embodiment, as Figure 2 shown, a number of thin plate fins 121 are provided on the secondary heat dissipation area 120 of the substrate body 10. The a number of thin plate fins 121 are arranged side by side, and the arrangement direction of the thin plate fins 121 is the same as the arrangement direction of the three-dimensional liquid cooling fin group 30. During use, part of the heat generated by the electronic components 2 will be transferred to the secondary heat dissipation area 120 and finally transferred to the air through the thin plate fins 121, that is, air-cooled heat dissipation is achieved. The setting of the secondary heat dissipation area 120 can share part of the heat dissipation pressure, thereby improving the overall heat dissipation capacity.

[0048] In one of the embodiments, as Figure 7 and Figure 8 shown, a hollow plate 130 and two protective plates 140 are provided on the substrate body 10. The hollow plate 130 is arranged on the side of the three-dimensional liquid cooling fin group 30 away from the substrate body 10, and the two protective plates 140 are respectively arranged on both sides of the three-dimensional liquid cooling fin group 30. The hollow plate 130 and the protective plates 140 cooperate to form an outer frame, which can protect the three-dimensional liquid cooling fin group 30 to prevent the three-dimensional liquid cooling fin group 30 from being knocked and deformed.

[0049] In summary, the heat dissipation device 1 of the present utility model can not only improve the heat dissipation performance and achieve rapid heat dissipation, but also solve the technical problems of the traditional heat dissipation device being bulky and occupying a large space, thereby realizing miniaturized development.

[0050] The above-described embodiments only represent several implementation manners of the present utility model, and the description thereof is relatively specific and detailed, but it should not be construed as a limitation on the scope of the utility model patent. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present utility model, several modifications and improvements can still be made, and these all belong to the protection scope of the present utility model. Therefore, the protection scope of the utility model patent shall be subject to the appended claims.

Claims

1. A heat dissipation device, characterized in that, Comprising: A substrate body, a cover plate, and a three-dimensional liquid cooling fin group. A main heat dissipation area and a secondary heat dissipation area are provided on the substrate body. A cavity is formed on the main heat dissipation area. The cover plate is disposed on the cavity, and the three-dimensional liquid cooling fin group is disposed on the cover plate. The three-dimensional liquid cooling fin group includes main fins and filling fins. Hollow liquid cooling pipe networks are provided inside both the main fins and the filling fins. The liquid cooling pipe networks communicate with the cavity. The cavity and the liquid cooling pipe networks are filled with a coolant, and the coolant only occupies a part of the space in the cavity and the liquid cooling pipe networks.

2. The heat dissipation device according to claim 1, wherein, The liquid cooling pipe network has a connection port, and a through hole adapted to the connection port is formed on the cover plate. The liquid cooling pipe network is connected to the cavity through the through hole.

3. The heat dissipation device according to claim 2, wherein Two side-by-side connection ports are provided on the same liquid cooling pipe network, and only one of the connection ports is submerged by the coolant in the liquid cooling pipe network.

4. The heat dissipation device according to claim 3, wherein In the same liquid cooling pipe network, the liquid cooling pipe network is divided into a condensation area and an evaporation area according to the liquid level position of the coolant therein. The condensation area and the evaporation area respectively correspond to the two connection ports. During use, the coolant in the condensation area changes into a gaseous state, and the coolant in the evaporation area is in a liquid state.

5. The heat dissipation device according to claim 1, wherein A filling pipeline is provided on the filling fin. On the same filling fin, the filling pipeline communicates with the liquid cooling pipe network, and a plug is provided at the port of the filling pipeline.

6. The heat dissipation device according to claim 1, wherein Two cavities are provided on the main heat dissipation area, and the two cavities are independent of each other. Two independent liquid cooling pipe networks are provided on the same main fin, and the two liquid cooling pipe networks are respectively connected to the two cavities. The number of the cover plates is two, and the two cover plates respectively correspond to the two cavities. The number of the filling fins is two. Only one liquid cooling pipe network is provided on each filling fin. The liquid cooling pipe networks of the two filling fins are respectively connected to the two cavities. And a filling pipeline communicating with the liquid cooling pipe network is provided on each filling fin.

7. The heat dissipation device according to claim 1, characterized in that, The liquid cooling pipe network is of a honeycomb structure.

8. The heat dissipation device according to claim 1, wherein A plurality of thin plate fins are provided on the secondary heat dissipation area of the substrate body. The plurality of thin plate fins are arranged side by side, and the arrangement direction of the thin plate fins is the same as the arrangement direction of the three-dimensional liquid cooling fin group.

9. The heat dissipation device according to claim 1, wherein A hollow plate and two protection plates are provided on the substrate body. The hollow plate is disposed on the side of the three-dimensional liquid cooling fin group away from the substrate body, and the two protection plates are respectively disposed on both sides of the three-dimensional liquid cooling fin group.

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