Multipath output intermediate frequency power supply
By designing a multi-output intermediate frequency power supply, combining water-cooled heat dissipation and air-cooled heat dissipation, the single output and heat problems of the intermediate frequency power supply are solved, and multiple independent outputs and efficient heat dissipation are achieved to ensure equipment stability and component safety.
Patent Information
- Application Number
- CN202422329447.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-24
- Publication Date
- 2025-07-08
- Estimated Expiration
- 2034-09-24
AI Technical Summary
The existing intermediate frequency power supply only has one output function, which is difficult to cope with multiple output needs, and generates more heat during operation, affecting the normal use of internal high-precision components.
A multi-output intermediate frequency power supply is designed, using a combination of water-cooled heat dissipation and air-cooled heat dissipation, combined with a multi-channel independent output interface, equipped with a Buck voltage/current detection module, PFC power supply current detection module, main processor module, etc., to achieve multiple independent output and efficient heat dissipation.
It realizes multiple independent outputs, adapts to complex power supply conditions, maintains the appropriate internal temperature of the device, protects high-precision components, and ensures stable operation of the equipment.
Smart Images
Figure CN223080365U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of vapor deposition processes, and specifically to a multi-output intermediate frequency power supply. Background Technique
[0002] In physical vapor deposition and chemical vapor deposition processes, intermediate frequency power supplies have become the core equipment for driving key processes. With their stability and high efficiency, they have promoted the rapid development of these technologies. In the physical vapor deposition process, the intermediate frequency power supply usually operates in the frequency range of 40Khz to 200Khz, mainly used for magnetron sputtering deposition; in the chemical vapor deposition process, the intermediate frequency power supply also plays an indispensable role. The plasma generated by it can effectively excite and decompose precursor gases, promoting the formation of active chemical groups. The existing intermediate frequency power supplies at least expose the following defects during use:
[0003] In actual use, a general intermediate frequency power supply only has a single output function. Facing various output requirements, multiple intermediate frequency power supplies need to be prepared to cope with them, and it is difficult to handle equipment that requires multiple inputs. Moreover, the intermediate frequency power supply generates a lot of heat during operation, which may affect the normal use of high-precision components inside the power supply. Therefore, a multi-output intermediate frequency power supply is developed. Content of the Utility Model
[0004] The main purpose of the utility model is to provide a multi-output intermediate frequency power supply, which can effectively solve the problems in the background technique.
[0005] To achieve the above purpose, the technical solution adopted by the utility model is as follows:
[0006] A multi-output intermediate frequency power supply includes a power supply housing. One side of the power supply housing is fixedly connected with an external substrate. The surface of the external substrate is provided with a water inlet and a water outlet. A water-cooling heat dissipation water path is arranged inside the power supply housing. Both ends of the water-cooling heat dissipation water path are connected to the side of the external substrate facing the inside of the power supply housing, and both ends of the water-cooling heat dissipation water path are respectively connected to the outside of the external substrate through the water inlet and the water outlet. A plurality of air-cooling heat dissipation fans are installed on the side of the power supply housing facing away from the external substrate. A group of output interfaces are installed on the surface of the external substrate. A circuit board is fixedly connected between the inner walls of the power supply housing. Each output interface is connected to the inside of the power supply and electrically connected to the circuit board.
[0007] Preferably, the output end of the circuit board is electrically connected to the end of the output interface extending into the power supply housing. A plurality of uniformly distributed Buck voltage / current detection modules are fixedly connected to the top side of the circuit board, and each Buck voltage / current detection module is electrically connected to the circuit board. The bottom surface of the circuit board is in contact with the top side of the water-cooling heat dissipation water path.
[0008] Preferably, a PFC power current detection module and multiple auxiliary processors are fixedly connected to the top side of the circuit board. The PFC power current detection module and the multiple auxiliary processors are both electrically connected to the circuit board, and the PFC power current detection module and the multiple auxiliary processors are both arranged between two adjacent Buck voltage / current detection modules.
[0009] Preferably, a main processor module is inserted into the top side of the circuit board, and multiple time-division multiplexing modules are installed at the top end of one side of the circuit board. The bottom sides of the main processor module and the time-division multiplexing modules are both electrically connected to the circuit board.
[0010] Preferably, an inductor module is fixedly connected between the inner walls of the power supply housing. Multiple inductor module auxiliary cooling fans are installed on the side of the inductor module facing the circuit board. Multiple transformers are installed on one side of the circuit board. The transformers and the inductor module are both electrically connected to the circuit board.
[0011] Preferably, multiple liquid crystal display screens are installed on the side of the power supply housing facing away from the external substrate. All the liquid crystal display screens are electrically connected to the circuit board.
[0012] Compared with the prior art, the present utility model has the following beneficial effects:
[0013] 1. Through the setting of the novel output interface, the present utility model has a multi-channel output function, and each channel output works independently without mutual influence, so as to be able to flexibly respond to relatively complex power supply situations and obtain a wider adaptability.
[0014] 2. Through the setting of the water-cooled heat dissipation water path and the auxiliary cooling fan, the present utility model absorbs the heat generated during the operation of the power supply and timely sends it out of the device through air flow, maintaining a suitable temperature inside the device and maintaining the normal operation of the device. BRIEF DESCRIPTION OF THE DRAWINGS
[0015] Figure 1 is an isometric view of the present utility model;
[0016] Figure 2 is the overall bottom view of the device of the present utility model;
[0017] Figure 3 is a schematic structural view of the external base of the present utility model.
[0018] In the figure: 1. Inductor module; 2. Time-division multiplexing module; 3. Buck voltage / current detection module; 4. PFC power current detection module; 5. Liquid crystal display screen; 6. Air-cooled radiator fan; 7. Transformer; 8. Auxiliary radiator fan; 9. Output interface; 10. Inductor module auxiliary radiator fan; 11. Terminal block; 12. Water-cooled heat dissipation waterway; 13. Electric ball valve; 14. Three-phase power air switch; 15. Input filter; 16. User communication interface; 17. 485 communication interface; 18. 232 communication interface; 19. Water inlet; 20. Water outlet; 21. Network debugging interface; 22. Digital communication interface; 23. Auxiliary processor; 24. Main processor module; 25. External substrate. Detailed implementation manners
[0019] To make the technical means, creative features, achieved purposes and functions of the present utility model easy to understand, the present utility model will be further described below in conjunction with specific implementation manners.
[0020] In the description of the present utility model, it should be noted that the orientation or positional relationship indicated by the terms "upper", "lower", "inner", "outer", "front end", "rear end", "both ends", "one end", "the other end", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation to the present utility model. In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance.
[0021] In the description of the present utility model, it should be noted that unless otherwise clearly defined and limited, the terms "installed", "provided with", "connected", etc. should be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the internal communication of two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific situations.
[0022] Please refer to Figures 1 - 3 , the present utility model provides a technical solution:
[0023] A multi-output intermediate frequency power supply includes a power supply housing. On one side of the power supply housing, an external substrate 25 is fixedly connected. On the surface of the external substrate 25, a water inlet 19 and a water outlet 20 are provided. Inside the power supply housing, a water-cooled heat dissipation water circuit 12 is arranged. Both ends of the water-cooled heat dissipation water circuit 12 are connected to the side of the external substrate 25 facing the inside of the power supply housing, and both ends of the water-cooled heat dissipation water circuit 12 are respectively communicated to the outside of the external substrate 25 through the water inlet 19 and the water outlet 20. On the side of the power supply housing facing away from the external substrate 25, a plurality of air-cooled heat dissipation fans 6 are installed. On the surface of the external substrate 25, two groups of output interfaces 9 are installed, and each group of output interfaces 9 is communicated to the inside of the power supply housing. In this embodiment, each group of output interfaces 9 includes six groups of interfaces, providing six independent power outputs to meet the usage scenarios of different processes and achieving the purpose of multi-channel independent output. At the same time, an electric ball valve 13 is arranged on the water-cooled heat dissipation water circuit 12 to control the flow of the water-cooling system and ensure the high efficiency and stability of water-cooled heat dissipation.
[0024] A circuit board is fixedly connected between the inner walls of the power supply housing. The output end of the circuit board is electrically connected to one end of the output interface 9 extending into the power supply housing. A plurality of evenly distributed Buck voltage / current detection modules 3 are fixedly connected to the top side of the circuit board, and each Buck voltage / current detection module 3 is electrically connected to the circuit board. The bottom surface of the circuit board is in contact with the top side of the water-cooled heat dissipation water path 12. In this embodiment, the circuit connected to the output interface 9 is arranged inside the circuit board and is electrically connected to various precision components. A PFC power current detection module 4 and a plurality of auxiliary processors 23 are fixedly connected to the top side of the circuit board. The PFC power current detection module 4 and the plurality of auxiliary processors 23 are both electrically connected to the circuit board. The PFC power current detection module 4 and the plurality of auxiliary processors 23 are both arranged between two adjacent Buck voltage / current detection modules 3. A main processor module 24 is inserted into the top side of the circuit board, and a plurality of time-division multiplexing modules 2 are installed at one top end side of the circuit board. The bottom sides of the main processor module 24 and the time-division multiplexing modules 2 are both electrically connected to the circuit board. In this embodiment, the Buck voltage / current detection module 3 is used to monitor and control the voltage and current output by the power supply to ensure the stability and accuracy of the output; the PFC power current detection module 4 is used for power factor correction work, that is, PFC, to improve the power supply efficiency and reduce the reactive power loss; the main processor module 24 is located in the core control area of the power supply and is responsible for the main control logic, parameter adjustment and fault diagnosis of the entire system. The module is designed to be detachable for convenient maintenance and upgrade; while the auxiliary processors 23 assist the main processor in data processing and system control to improve the response speed and stability of the overall system. The time-division multiplexing module 2 is used for time multiplexing of multiple signals to optimize the resource utilization rate and the power transmission efficiency. An inductor module 1 is fixedly connected between the inner walls of the power supply housing. A plurality of inductor module auxiliary cooling fans 10 are installed on the side of the inductor module 1 facing the circuit board. A plurality of transformers 7 are installed on one side of the circuit board. The transformers 7 and the inductor module 1 are both electrically connected to the circuit board. In this embodiment, the transformer 7 is used for voltage conversion and isolation and is one of the core components of the intermediate frequency power supply, while the inductor module 1 is responsible for generating and controlling electromagnetic induction during the power conversion process. Usually, these modules are used for energy storage and filtering to ensure the quality of the output electrical energy. In addition, auxiliary cooling fans 8 are arranged between the transformers 7 to help the transformers 7 dissipate heat. A wiring terminal 11 is arranged on one side of the power supply housing for electrical connection to ensure electrical intercommunication between each module and component; a three-phase power air switch 14 electrically connected to the circuit board is arranged on the external substrate 25 as the protection switch of the main power supply, which can quickly cut off the power supply in case of overload or short circuit to protect the safety of the equipment, while an input filter 15 is arranged on the bottom side of the inner wall of the power supply housing for suppressing electromagnetic interference at the power input end, that is, EMI, to ensure the electromagnetic compatibility of the equipment.
[0025] On the side of the power supply housing facing away from the external substrate 25, a plurality of liquid crystal display screens 5 are installed. All the liquid crystal display screens 5 are electrically connected to the circuit substrate and are used to display the operating status, parameter settings, and fault diagnosis information of the device, facilitating user operation and monitoring. The external substrate 25 is also provided with a user communication interface 16, a 485 communication interface 17, a 232 communication interface 18, a network debugging interface 21, and a digital communication interface 22. Among them, the user communication interface 16 is used for communication with external devices, generally for device status monitoring and remote control; the 485 communication interface 17 is a commonly used serial communication interface for reliable data transmission between industrial devices, that is, for long-distance transmission applications; the 232 communication interface 18 is another commonly used serial communication interface, mainly for communication between short-distance devices; the network debugging interface 21 is used for network connection and debugging of the device, facilitating on-site engineers to monitor the power supply status and parameter adjustment; the digital communication interface 22 supports digital signal transmission and is used for communication with other digital devices or control systems.
[0026] The above has shown and described the basic principles, main features, and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited by the above embodiments. What is described in the above embodiments and the specification only illustrates the principle of the present invention. Without departing from the spirit and scope of the present invention, the present invention will have various changes and improvements, and these changes and improvements all fall within the scope of the present invention claimed. The scope of protection claimed by the present invention is defined by the appended embodiments and their equivalents.
Claims
1. A multi-output intermediate frequency power supply, including a power supply housing, characterized in that: One side of the power supply housing is fixedly connected with an external substrate (25). A water inlet (19) and a water outlet (20) are arranged on the surface of the external substrate (25). A water-cooled heat dissipation water path (12) is arranged inside the power supply housing. Both ends of the water-cooled heat dissipation water path (12) are connected to the side of the external substrate (25) facing the inside of the power supply housing, and both ends of the water-cooled heat dissipation water path (12) are respectively communicated to the outside of the external substrate (25) through the water inlet (19) and the water outlet (20). A plurality of air-cooled heat dissipation fans (6) are installed on the side of the power supply housing facing away from the external substrate (25). A group of output interfaces (9) are installed on the surface of the external substrate (25). A circuit board is fixedly connected between the inner walls of the power supply housing. Each output interface (9) is communicated to the inside of the power supply and electrically connected to the circuit board.
2. The multi-output intermediate frequency power supply according to claim 1, wherein: The output end of the circuit board is electrically connected to the end of the output interface (9) extending into the power supply housing. A plurality of uniformly distributed Buck voltage / current detection modules (3) are fixedly connected to the top side of the circuit board, and each of the Buck voltage / current detection modules (3) is electrically connected to the circuit board. The bottom side surface of the circuit board is in contact with the top side of the water-cooled heat dissipation water path (12).
3. The multi-output intermediate frequency power supply according to claim 2, characterized in that: A PFC power current detection module (4) and a plurality of auxiliary processors (23) are fixedly connected to the top side of the circuit board. The PFC power current detection module (4) and the plurality of auxiliary processors (23) are both electrically connected to the circuit board. The PFC power current detection module (4) and the plurality of auxiliary processors (23) are both arranged between two adjacent Buck voltage / current detection modules (3).
4. A multi-output intermediate frequency power supply according to claim 2, characterized in that: A main processor module (24) is inserted into the top side of the circuit board. A plurality of time-division multiplexing modules (2) are installed at the top end of one side of the circuit board. The bottom sides of the main processor module (24) and the time-division multiplexing modules (2) are both electrically connected to the circuit board.
5. The multi-output intermediate frequency power supply according to claim 2, characterized in that: An inductor module (1) is fixedly connected between the inner walls of the power supply housing. A plurality of inductor module auxiliary heat dissipation fans (10) are installed on the side of the inductor module (1) facing the circuit board. A plurality of transformers (7) are installed on one side of the circuit board. The transformers (7) and the inductor module (1) are both electrically connected to the circuit board.
6. A multi-output intermediate frequency power supply according to claim 2, characterized in that: A plurality of liquid crystal display screens (5) are installed on the side of the power supply housing facing away from the external substrate (25). All the liquid crystal display screens (5) are electrically connected to the circuit board.