Anti-condensation double-piezoelectric ceramic dispensing valve

Abstract

The utility model discloses an anti-condensation double piezoelectric ceramic dispensing valve which is characterized by comprising a glue mixing barrel, a glue pipe, a runner assembly, a refrigeration assembly, a nozzle and a driving piece, a first containing cavity and a second containing cavity are arranged in the glue mixing barrel at intervals and used for containing different kinds of glue respectively, and a connector is arranged at the lower end of the glue mixing barrel and used for connecting the first containing cavity and the second containing cavity. The connector is communicated with the first containing cavity and the second containing cavity at the same time, the glue pipe is detachably connected to the connector and used for guiding out glue in the glue mixing barrel, the flow channel assembly is transversely arranged below the glue pipe, a glue passing channel is formed in the flow channel assembly, the lower end of the glue pipe is communicated with the glue passing channel, and the refrigeration assembly comprises a radiator and a cooling piece. The radiator is provided with an assembling channel allowing a glue pipe to penetrate through, the cooling part is arranged on the radiator and used for achieving heat exchange on glue in the glue pipe, the nozzle is arranged on the runner assembly and communicated with a glue passing channel, a firing pin is arranged at the upper end of the nozzle and can move up and down to be used for opening and closing the nozzle, and the driving part is arranged above the runner assembly and used for driving the runner assembly to rotate. According to the glue mixing device, the temperature of mixed glue can be accurately controlled, and the glue is prevented from being condensed and blocked.

Description

Technical Field

[0001] The utility model relates to the field of glue dispensing valves, and in particular to an anti-condensation dual piezoelectric ceramic glue dispensing valve. Background Art

[0002] In industry applications, all machines and equipment used for dispensing, coating, spraying, pouring and sprinkling glue are collectively referred to as dispensing equipment. Dispensing equipment is widely used, and it has been widely used in any process involving dispensing technology and fluid control in industrial production.

[0003] The dispensing valve is one of the important parts in the dispensing equipment, and its main function is to transport the glue medium and control the glue stop. However, for some mixed glues (i.e. AB glue), the temperature of the mixed glue is relatively high after it flows out of the glue barrel, so it will solidify quickly. Keeping it at a lower temperature can improve this situation. In the related art, in order to reduce the temperature of the glue, a sleeve is usually installed outside the glue outlet, and then air is blown into the sleeve to reduce the temperature of the glue by air cooling. This air cooling method has poor cooling effect, and the temperature control is not accurate, making it difficult to control the temperature of the glue within the required range.

[0004] Therefore, it is necessary to make further improvements in the prior art. Utility Model Content

[0005] The utility model aims to solve one of the technical problems in the related art at least to a certain extent. To this end, the purpose of the utility model is to provide an anti-condensation dual piezoelectric ceramic dispensing valve.

[0006] To achieve the above-mentioned purpose, the anti-condensation dual piezoelectric ceramic dispensing valve according to the embodiment of the utility model is characterized in that it includes a mixing barrel, a hose, a flow channel assembly, a refrigeration assembly, a nozzle and a driving component.

[0007] The glue mixing barrel is provided with a first accommodating chamber and a second accommodating chamber for respectively installing different glues. The lower end of the glue mixing barrel is provided with a connecting head, and the connecting head is communicated with the first accommodating chamber and the second accommodating chamber at the same time.

[0008] The rubber hose is detachably connected to the connecting head to guide the glue in the glue mixing barrel.

[0009] The flow channel component is transversely arranged below the rubber tube, a glue passage is arranged in the flow channel component, and the lower end of the rubber tube is connected to the glue passage.

[0010] The refrigeration assembly comprises a radiator and a cooling element. The radiator has an assembly channel for the rubber hose to pass through. The cooling element is arranged on the radiator to realize heat exchange with the glue in the rubber hose.

[0011] The nozzle is provided on the flow channel assembly and is communicated with the glue application channel. A plunger is provided at the upper end of the nozzle, and the plunger can move up and down to open and close the nozzle.

[0012] The driving member is provided above the flow channel assembly and is connected to the upper end of the plunger to drive the plunger to move up and down.

[0013] In addition, the anti-condensation double piezoelectric ceramic dispensing valve according to the above embodiment of the present invention may further have the following additional technical features:

[0014] According to an embodiment of the present invention, the cooling member includes a water-cooled head and a first semiconductor refrigeration sheet.

[0015] The water-cooled head is provided on the radiator. The water-cooled head has a water inlet, a water outlet, and a water cooling channel communicating between the water inlet and the water outlet.

[0016] The first semiconductor refrigeration sheet is clamped between the radiator and the water-cooled head, and the cold surface of the first semiconductor refrigeration sheet is in contact with the radiator, and the hot surface of the first semiconductor refrigeration sheet is in contact with the water-cooled head.

[0017] According to an embodiment of the present invention, the water-cooled head includes a vertical portion and a horizontal portion.

[0018] The vertical portion is vertically attached to the radiator. The water inlet and the water outlet are both provided at the upper end of the vertical portion, and the hot surface of the first semiconductor refrigeration sheet is in contact with the vertical portion.

[0019] The horizontal portion is integrally formed at the lower end of the vertical portion, and the upper surface of the horizontal portion is attached to the bottom surface of the flow channel assembly.

[0020] Wherein, the water cooling channel passes through the vertical portion and the horizontal portion at the same time.

[0021] According to an embodiment of the present invention, a second semiconductor refrigeration sheet is further included. The second semiconductor refrigeration sheet is clamped between the horizontal portion and the flow channel assembly. The cold surface of the second semiconductor refrigeration sheet is in contact with the flow channel assembly, and the hot surface of the second semiconductor refrigeration sheet is in contact with the horizontal portion.

[0022] According to an embodiment of the present invention, the radiator includes a base and a cover plate.

[0023] The cover plate is pivotally provided on the base and defines the assembly channel with the base.

[0024] According to an embodiment of the present utility model, a first groove is provided on the base, and a second groove is provided on the cover plate. The first groove and the second groove face each other to define the assembly channel.

[0025] According to an embodiment of the present utility model, a first cooling block is provided on the base, and a second cooling block is provided on the cover plate. The first cooling block and the second cooling block are arranged opposite to each other.

[0026] The first groove is provided on the first cooling block, and the second groove is provided on the second cooling block.

[0027] Wherein, one end of the first cooling block extends to the back surface of the base and contacts the first cooling member.

[0028] According to an embodiment of the present utility model, an air inlet is provided at one end of the base, and an air inlet channel is provided in the base. The air inlet channel is communicated with the air inlet.

[0029] According to an embodiment of the present utility model, a pushing device is further included. The pushing device is connected to the tail end of the glue mixing barrel to push the glue in the first accommodating cavity and the second accommodating cavity into the glue pipe.

[0030] According to an embodiment of the present utility model, an installation groove is provided in the base. The installation groove penetrates to one end of the base, and a temperature sensor is provided in the installation groove to monitor the temperature of the base in real time.

[0031] For the anti-condensation double piezoelectric ceramic dispensing valve provided by the embodiment of the present utility model, different glues are respectively loaded in the first accommodating cavity and the second accommodating cavity in the glue mixing barrel, realizing precise separation of the glue and preparation before mixing, facilitating subsequent on-demand mixing, improving the flexibility and accuracy of glue use. The detachable design between the glue pipe and the glue mixing barrel connector not only facilitates replacement and maintenance, but also can adjust the length or type of the glue pipe according to actual needs, increasing the applicability and convenience of the equipment. The radiator and the cooling member effectively perform heat exchange on the glue in the glue pipe, preventing the glue from condensing and blocking due to temperature changes, ensuring the stability and continuity of the dispensing process. The striker design on the nozzle, through precise control of the driving member, realizes rapid opening and closing of the nozzle, improving the accuracy and response speed of dispensing, and at the same time avoiding glue dripping or waste.

[0032] The additional aspects and advantages of the present utility model will be partially given in the following description, partially become obvious from the following description, or be understood through the practice of the present utility model. Description of the Drawings

[0033] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on the structures shown in these drawings.

[0034] Figure 1 It is the axonometric view of the overall structure in the embodiment of the present invention;

[0035] Figure 2 It is the side view of the overall structure in the embodiment of the present invention;

[0036] Figure 3 It is the axonometric view of the refrigeration component in the embodiment of the present invention;

[0037] Figure 4 It is the exploded view of the refrigeration component in the embodiment of the present invention;

[0038] Figure 5 It is the open state view of the radiator in the embodiment of the present invention;

[0039] Figure 6 It is the sectional view of the cooling part in the embodiment of the present invention;

[0040] Figure 7 It is another sectional view of the cooling part in the embodiment of the present invention;

[0041] Figure 8 It is the sectional view of the radiator in the embodiment of the present invention;

[0042] Figure 9 It is the sectional view of the glue mixing barrel in the embodiment of the present invention;

[0043] Figure 10 It is the sectional view of the flow channel component in the embodiment of the present invention.

[0044] Reference numerals of the drawings:

[0045] Glue mixing barrel 10;

[0046] First accommodation cavity 101;

[0047] Second accommodation cavity 102;

[0048] Connector 103;

[0049] Hose 104;

[0050] Injecting device 105;

[0051] Flow channel component 20;

[0052] Laminating channel 201;

[0053] Nozzle 202;

[0054] Punch pin 203;

[0055] Refrigeration component 30;

[0056] Radiator 301;

[0057] Base 3011;

[0058] First groove 30111;

[0059] First cooling block 30112;

[0060] Cover plate 3012;

[0061] Second groove 30121;

[0062] Second cooling block 30122;

[0063] Cooling part 302;

[0064] Water-cooled head 3021;

[0065] Vertical part 30211;

[0066] Horizontal part 30212;

[0067] Air inlet 3013;

[0068] Air inlet channel 3014;

[0069] Temperature sensor 3015;

[0070] Water inlet 3022;

[0071] Water outlet 3023;

[0072] Water-cooling channel 3024;

[0073] First semiconductor refrigeration chip 3025;

[0074] Second semiconductor refrigeration chip 3026;

[0075] Driver 40.

[0076] The realization, functional features and advantages of the purpose of the present utility model will be further described with reference to the embodiments and the accompanying drawings. Detailed implementation manners

[0077] Embodiments of the present utility model will be described in detail below. Examples of the embodiments are shown in the accompanying drawings, where the same or similar reference numerals indicate the same or similar elements or elements with the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to explain the present utility model, but should not be construed as limiting the present utility model. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without creative efforts fall within the scope of protection of the present utility model.

[0078] In the description of the present utility model, it should be understood that the orientation or positional relationship indicated by terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "circumferential", "radial", etc. is based on the orientation or positional relationship shown in the accompanying drawings. It is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present utility model.

[0079] In addition, the terms "first" and "second" are only used for descriptive purposes and should not be construed as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present utility model, "a plurality" means two or more, unless otherwise specifically defined.

[0080] In the present utility model, unless otherwise clearly specified and limited, terms such as "install", "connect", "couple", "fix", etc. should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or an integral connection; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0081] In the present utility model, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0082] The anti-condensation dual piezoelectric ceramic dispensing valve according to an embodiment of the utility model is described in detail below with reference to the accompanying drawings.

[0083] Reference Figures 1 to 10 As shown, the anti-condensation dual piezoelectric ceramic dispensing valve provided according to an embodiment of the utility model is characterized in that it includes a mixing barrel 10, a hose 104, a flow channel assembly 20, a refrigeration assembly 30, a nozzle 202 and a driving member 40.

[0084] The glue mixing barrel 10 is provided with a first accommodating chamber 101 and a second accommodating chamber 102 for respectively storing different glues. A connector 103 is provided at the lower end of the glue mixing barrel 10, and the connector 103 is connected to both the first accommodating chamber 101 and the second accommodating chamber 102. That is, the glue in the first accommodating chamber 101 and the glue in the second accommodating chamber 102 can flow out through the connector 103 and mix to form the required mixed glue, i.e., AB glue.

[0085] The rubber hose 104 is detachably connected to the connector 103 to guide the glue in the glue mixing barrel 10. The detachable design facilitates subsequent replacement.

[0086] The flow channel assembly 20 is disposed transversely below the rubber tube 104. A glue passage 201 is disposed inside the flow channel assembly 20. The lower end of the rubber tube 104 is connected to the glue passage 201. The glue passage 201 inside the flow channel assembly 20 is made of Teflon material, which makes the glue passage 201 smoother, which is conducive to the passage of glue and reduces the possibility of blockage.

[0087] The refrigeration assembly 30 comprises a radiator 301 and a cooling element 302 . The radiator 301 has an assembly channel for the rubber hose 104 to pass through. The cooling element 302 is arranged on the radiator 301 to achieve heat exchange for the glue in the rubber hose 104 .

[0088] The nozzle 202 is provided on the flow channel assembly 20 and is communicated with the glue application channel 201. A plunger 203 is provided at the upper end of the nozzle 202. The plunger 203 can move up and down to open and close the nozzle 202.

[0089] The driving member 40 is provided above the flow channel assembly 20 and is connected to the upper end of the plunger 203 to drive the plunger 203 to move up and down. The driving member 40 is a bimorph structure, which is a common structure in the prior art in this field, so no more elaboration will be made here.

[0090] Based on the above, by loading different glues into the first accommodation cavity 101 and the second accommodation cavity 102 in the glue mixing barrel 10, precise separation of the glues and preparation before mixing are achieved, facilitating subsequent on-demand mixing, improving the flexibility and precision of glue use. The detachable design between the glue pipe 104 and the connector 103 of the glue mixing barrel 10 not only facilitates replacement and maintenance but also enables adjustment of the length or type of the glue pipe 104 according to actual needs, increasing the applicability and convenience of the equipment. The radiator 301 and the cooling member 302 effectively perform heat exchange on the glue in the glue pipe 104, preventing the glue from condensing and blocking due to temperature changes, ensuring the stability and continuity of the glue dispensing process. The design of the plunger 203 on the nozzle 202, through precise control of the driving member 40, realizes rapid opening and closing of the nozzle 202, improving the precision and response speed of glue dispensing, and at the same time avoiding glue dripping or waste.

[0091] Preferably, in an embodiment of the present invention, the cooling member 302 includes a water cooling head 3021 and a first thermoelectric cooler 3025.

[0092] The water cooling head 3021 is provided on the radiator 301. The water cooling head 3021 has a water inlet 3022, a water outlet 3023, and a water cooling channel 3024 communicating between the water inlet 3022 and the water outlet 3023. The water inlet 3022 is used for the input of water flow, and the water outlet 3023 is used for the output of water flow.

[0093] The first thermoelectric cooler 3025 is clamped between the radiator 301 and the water cooling head 3021, and the cold surface of the first thermoelectric cooler 3025 is in contact with the radiator 301, and the hot surface of the first thermoelectric cooler 3025 is in contact with the water cooling head 3021.

[0094] In this way, through the internal water-cooling channel 3024 of the water block 3021, using flowing water as the cooling medium, it can quickly and effectively absorb and carry away heat. This efficient heat dissipation method significantly improves the control ability of the temperature of the glue in the rubber hose 104. The first thermoelectric cooler 3025, as an efficient thermoelectric cooling element, can precisely transfer heat from the cold surface (in contact with the radiator 301) to the hot surface (in contact with the water block 3021), thereby achieving precise cooling of the radiator 301. This ability to precisely control the temperature helps to maintain the glue in the rubber hose 104 within the optimal working temperature range, improving the stability and consistency of glue dispensing. The combined use of the water block 3021 and the first thermoelectric cooler 3025 constitutes a dual cooling guarantee. The water block 3021 is responsible for rapid heat dissipation, while the first thermoelectric cooler 3025 is responsible for precise temperature control. The two complement each other and jointly ensure the efficient and stable operation of the cooling component.

[0095] Preferably, in an embodiment of the present invention, the water block 3021 includes a vertical portion 30211 and a horizontal portion 30212.

[0096] The vertical portion 30211 is vertically attached to the radiator 301. Both the water inlet 3022 and the water outlet 3023 are provided at the upper end of the vertical portion 30211. The hot surface of the first thermoelectric cooler 3025 is in contact with the vertical portion 30211.

[0097] The horizontal portion 30212 is integrally formed at the lower end of the vertical portion 30211. The upper surface of the horizontal portion 30212 is attached to the bottom surface of the flow channel assembly 20.

[0098] Wherein, the water-cooling channel 3024 passes through both the vertical portion 30211 and the horizontal portion 30212.

[0099] In this way, by vertically attaching the vertical portion 30211 to the radiator 301, it is ensured that the hot surface of the first thermoelectric cooler 3025 can closely contact and effectively transfer heat to the water block 3021. At the same time, the horizontal portion 30212 is integrally formed at the lower end of the vertical portion 30211 and is attached to the bottom surface of the flow channel assembly 20. This design enables heat to be transferred more directly and efficiently to the key parts that need to be cooled, namely the rubber hose 104 and the flow channel assembly 20, improving the cooling performance and stability of the glue dispensing valve, which is of great significance for improving the overall production efficiency and product quality.

[0100] Preferably, in an embodiment of the present utility model, a second semiconductor refrigeration sheet 3026 is further included. The second semiconductor refrigeration sheet 3026 is clamped between the transverse portion 30212 and the flow channel assembly 20. The cold surface of the second semiconductor refrigeration sheet 3026 is in contact with the flow channel assembly 20, and the hot surface of the second semiconductor refrigeration sheet 3026 is in contact with the transverse portion 30212.

[0101] In this way, with the addition of the second semiconductor refrigeration sheet 3026, the flow channel assembly 20 is cooled more directly. Its cold surface is in contact with the flow channel assembly 20, which can quickly absorb and take away the heat of the glue in the flow channel and the surrounding components, effectively preventing performance degradation or blockage problems caused by excessive glue temperature. This local enhanced cooling method significantly improves the stability and reliability of the dispensing process. By introducing the second semiconductor refrigeration sheet 3026, the refrigeration assembly 30 of this dispensing valve can better adapt to glues with different viscosities and temperature requirements, as well as a wider range of industrial application scenarios. This flexibility and adaptability make this dispensing valve more competitive in the market.

[0102] Preferably, in an embodiment of the present utility model, the radiator 301 includes a base 3011 and a cover plate 3012.

[0103] The cover plate 3012 is pivotally arranged on the base 3011 and defines the assembly channel with the base 3011.

[0104] In this way, the cover plate 3012 is pivotally arranged on the base 3011. This design makes the formation of the assembly channel more flexible and convenient. When it is necessary to install or replace the rubber tube 104, the cover plate 3012 can be simply opened, and the rubber tube 104 can be fixed after passing through the assembly channel. The operation is simple and fast. At the same time, this design also facilitates the cleaning and maintenance of the inside of the radiator 301, improving the maintainability of the equipment. When the cover plate 3012 is closed and closely attached to the base 3011, a relatively closed assembly channel can be formed. This design helps to reduce the influence of the external environment on the inside of the radiator 301, preventing impurities such as dust and water vapor from entering, thereby improving the sealing performance and operating stability of the radiator 301.

[0105] Preferably, in an embodiment of the present utility model, the base 3011 has a first groove 30111, and the cover plate 3012 has a second groove 30121. The first groove 30111 is opposite to the second groove 30121 to define the assembly channel.

[0106] Thus, the precise alignment design of the first groove 30111 and the second groove 30121 ensures the accuracy and stability of the assembly channel. This design not only facilitates the accurate installation and positioning of the rubber tube 104, but also enhances the structural stability between the base 3011 and the cover plate 3012. When the cover plate 3012 is closed and pressed on the base 3011, the side walls of the first groove 30111 and the second groove 30121 will closely wrap around the surface of the rubber tube 104, which is more conducive to heat conduction.

[0107] Preferably, in an embodiment of the present invention, a first cooling block 30112 is provided on the base 3011, a second cooling block 30122 is provided on the cover plate 3012, and the first cooling block 30112 and the second cooling block 30122 are arranged opposite to each other.

[0108] The first groove 30111 is provided on the first cooling block 30112, and the second groove 30121 is provided on the second cooling block 30122.

[0109] Wherein, one end of the first cooling block 30112 extends to the back of the base 3011 and is in contact with the first cooling member 302.

[0110] Thus, the first cooling block 30112 and the second cooling block 30122 directly participate in the heat dissipation process. They are in close contact with the main heat source "rubber tube 104" component of the radiator 301 and can quickly absorb and conduct heat. By being arranged opposite to each other, the two can form a more efficient heat conduction path, accelerating the transfer and dissipation of heat, thereby significantly enhancing the cooling effect. Integrating the first cooling block 30112 and the second cooling block 30122 directly on the base 3011 and the cover plate 3012 reduces the need for additional components and makes the structure of the entire radiator 301 more compact. This design not only saves space but also helps improve the overall performance and stability of the device.

[0111] Preferably, in an embodiment of the present invention, an air inlet 3013 is provided at one end of the base 3011, and an air inlet channel 3014 is provided inside the base 3011. The air inlet channel 3014 is in communication with the air inlet 3013.

[0112] Thus, external cold air is introduced through the air inlet 3013, and the cold air is transported to the inside of the radiator 301 or near the key components to be cooled by using the air inlet channel 3014, realizing active heat dissipation. This design enhances the heat dissipation capacity of the radiator 301. Especially in the case of high-load operation or high ambient temperature, it can more effectively reduce the device temperature and improve the operation stability.

[0113] Preferably, in an embodiment of the present utility model, it further includes a syringe device 105, and the syringe device 105 is connected to the tail end of the glue mixing barrel 10 to inject the glue in the first accommodating cavity 101 and the second accommodating cavity 102 into the glue tube 104.

[0114] In this way, the addition of the syringe device 105 realizes the automation of glue injection, greatly improving the efficiency and accuracy of the dispensing operation. By precisely controlling the thrust, speed, and frequency of the syringe device 105, it can ensure that the glue is pushed into the glue tube 104 at a stable and uniform speed, thus meeting various complex dispensing requirements. Such a syringe device 105 is a conventional technical means in this field and has been widely applied. Therefore, its specific details will not be elaborated here too much.

[0115] Preferably, in an embodiment of the present utility model, an installation groove is provided in the base 3011, the installation groove penetrates to one end of the base 3011, and a temperature sensor 3015 is provided in the installation groove for real-time monitoring of the temperature of the base 3011.

[0116] In this way, the temperature sensor 3015 can monitor the temperature of the base 3011 in real time and accurately, which is an important indicator for evaluating the heat dissipation effect and the operating state of the device. By monitoring the temperature of the base 3011, problems caused by overheating can be discovered and processed in a timely manner to prevent device damage or performance degradation. By real-time monitoring of the temperature of the base 3011, faults that may be caused by overheating can be predicted and prevented. For example, when the temperature approaches or exceeds the set threshold, the system can automatically issue an alarm and take corresponding protection measures, such as shutting down for cooling, switching to a standby system, etc., thus avoiding the occurrence of faults.

[0117] In the description of this specification, the description with reference to terms such as "an embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present utility model. In this specification, the schematic expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in a suitable manner in any one or more embodiments or examples. In addition, without contradiction, those skilled in the art can combine and combine the different embodiments or examples described in this specification and the features of different embodiments or examples.

[0118] The above are only the preferred embodiments of the present utility model, and thus do not limit the patent scope of the present utility model. Any equivalent structural transformation made under the inventive concept of the present utility model by using the content of the specification and drawings of the present utility model, or any direct / indirect application in other related technical fields shall be included within the patent protection scope of the present utility model.

Claims

1. A condensation-proof double piezoelectric ceramic dispensing valve, characterized in that, include: A glue mixing barrel, wherein a first accommodating chamber and a second accommodating chamber are provided in the mixing barrel for respectively storing different glues, and a connector is provided at the lower end of the mixing barrel, and the connector is communicated with the first accommodating chamber and the second accommodating chamber at the same time; A rubber hose, which is detachably connected to the connector and is used to guide the glue in the glue mixing barrel; A flow channel component, the flow channel component is transversely arranged below the rubber tube, a glue passage is arranged in the flow channel component, and the lower end of the rubber tube is connected to the glue passage; A refrigeration assembly, the refrigeration assembly comprising a radiator and a cooling element, the radiator having an assembly channel for the rubber hose to pass through, the cooling element being arranged on the radiator to achieve heat exchange with the glue in the rubber hose; A nozzle, the nozzle is arranged on the flow channel assembly and is connected to the glue passage, a striker is arranged at the upper end of the nozzle, and the striker can move up and down to open and close the nozzle; A driving member is disposed above the flow channel assembly and connected to the upper end of the striker to drive the striker to move up and down.

2. The anti-condensation double piezoelectric ceramic dispensing valve according to claim 1, wherein The cooling element comprises: A water cooling head, the water cooling head is arranged on the radiator, the water cooling head has a water inlet, a water outlet and a water cooling channel connected between the water inlet and the water outlet; The first semiconductor refrigeration plate is sandwiched between the heat sink and the water cooling head, and the cold surface of the first semiconductor refrigeration plate is in contact with the heat sink, and the hot surface of the first semiconductor refrigeration plate is in contact with the water cooling head.

3. The anti-condensation double piezoelectric ceramic dispensing valve according to claim 2, wherein The water cooling head comprises: A vertical portion, wherein the vertical portion is vertically attached to the radiator, the water inlet and the water outlet are both arranged at the upper end of the vertical portion, and the hot surface of the first semiconductor cooling plate is in contact with the vertical portion; A transverse portion, the transverse portion is integrally formed at the lower end of the vertical portion, and the upper surface of the transverse portion is attached to the bottom surface of the flow channel assembly; Wherein, the water cooling channel passes through the vertical portion and the horizontal portion at the same time.

4. The anti-condensation dual piezoelectric ceramic dispensing valve according to claim 3, characterized in that, It also includes a second semiconductor refrigeration plate, which is sandwiched between the transverse part and the flow channel component, the cold surface of the second semiconductor refrigeration plate is in contact with the flow channel component, and the hot surface of the second semiconductor refrigeration plate is in contact with the transverse part.

5. The anti-condensation double piezoelectric ceramic dispensing valve according to claim 1, characterized in that, The radiator comprises: Pedestal; A cover plate is pivotally arranged on the base and defines the assembly channel between the cover plate and the base.

6. The anti-condensation double piezoelectric ceramic dispensing valve according to claim 5, wherein, The base has a first groove, the cover has a second groove, and the first groove is opposite to the second groove to define the assembly channel.

7. The anti-condensation double piezoelectric ceramic dispensing valve according to claim 6, characterized in that, The base is provided with a first cooling block, the cover is provided with a second cooling block, and the first cooling block and the second cooling block are arranged opposite to each other; The first groove is provided on the first cooling block, and the second groove is provided on the second cooling block; One end of the first cooling block extends to the back side of the base and contacts the cooling element.

8. The anti-condensation dual piezoelectric ceramic dispensing valve according to claim 5, characterized in that, The base has an air inlet at one end, and an air inlet channel is arranged inside the base, and the air inlet channel is connected to the air inlet.

9. The anti-condensation dual piezoelectric ceramic dispensing valve according to claim 1, characterized in that, It further includes a syringe device which is connected to the tail end of the glue mixing barrel to syringe the glue in the first accommodation cavity and the second accommodation cavity into the rubber tube.

10. The anti-condensation double piezoelectric ceramic dispensing valve according to claim 5, characterized in that An installation groove is provided in the base, the installation groove penetrates to one end of the base, and a temperature sensor is provided in the installation groove for real-time monitoring of the temperature of the base.

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