Cooling treatment device after reflow soldering of PCB (Printed Circuit Board)

Abstract

The utility model relates to the related technical field of PCB (Printed Circuit Board) welding, in particular to a cooling treatment device after reflow soldering of a PCB, which comprises a working table and a placing table arranged on the working table in a sliding manner, and a plurality of placing positions are formed on the placing table; the cooling device further comprises a cooling box installed on the workbench, an elastic lifting assembly is arranged in the cooling box, and a plurality of fan covers matched with the containing positions are connected to the elastic lifting assembly. According to the utility model, the placing table provided with the PCB after welding is pushed into the cooling box, the elastic upgrading assembly is controlled to move downwards, the pumping assembly is started to work after the fan covers move to abut against the placing table, and cold air is conveyed into the multiple fan covers, so that solder paste on the PCB begins to be solidified; and the elastic lifting assembly moves downwards to deform, so that the air supply amount of the pumping assembly is changed, and the situation that the solder paste on the PCB flows due to the fact that wind force borne by the solder paste on the PCB in the initial state is too large is avoided.

Description

Technical Field

[0001] The utility model relates to the technical field related to PCB board soldering, in particular to a cooling treatment device after PCB board reflow soldering. Background Technique

[0002] ‌PCB board reflow soldering‌ is a soldering technology that uses solder paste (a mixture of solder and flux) to connect electronic components to a printed circuit board (PCB). This technology controls heating to melt the solder for the purpose of permanent bonding. Reflow soldering is one of the most commonly used methods in surface mount technology (SMT) for bonding electronic components to printed circuit boards.

[0003] The process of reflow soldering can be divided into several key zones, each with its specific temperature curve:

[0004] ‌Preheating zone‌: Solvents for reaching the required viscosity and screen printing performance start to evaporate. The temperature rise must be slow to limit boiling and splashing, prevent the formation of small solder balls, and at the same time carry out chemical cleaning actions to remove metal oxides and certain contaminants to ensure good metallurgical bonding.

[0005] ‌Soaking heat zone‌: Solder particles start to melt and liquefy, the "wicking" process of surface solder absorption begins, covering all possible surfaces, and solder joints start to form.

[0006] ‌Reflow zone‌: After all individual solder particles are melted and combine to form liquid solder, the surface tension starts to form the solder joint surface. If the gap between the component pins and the PCB pads exceeds a certain limit, the pins and pads may be separated due to surface tension, resulting in open solder joints.

[0007] ‌Cooling zone‌: After soldering is completed, the solder joints need to be cooled and solidified to form a stable connection.

[0008] Existing cooling methods for reflow soldering mainly include natural cooling and forced cooling. Forced cooling‌ accelerates the cooling speed of the solder paste on the PCB board by adding cooling equipment such as fans and water cooling systems. When cooling, the solder paste on the PCB board is easily affected by the wind speed. An excessive wind speed is likely to blow the solder paste out of shape, and a too small wind speed slows down the solidification of the solder paste, resulting in the solidification of the solder paste on the PCB board not reaching the expected effect, thus affecting the quality of the solder joints. Content of the Utility Model

[0009] The purpose of the utility model is to provide a cooling treatment device after PCB board reflow soldering to solve the problems raised in the above background technique.

[0010] To achieve the above purpose, the utility model provides the following technical solutions:

[0011] Cooling treatment device for PCB board after reflow soldering, including a workbench and a placement table slidably mounted on the workbench, and a plurality of placement positions are formed on the placement table;

[0012] It further includes a cooling box installed on the workbench, elastic lifting components are symmetrically arranged in the cooling box, and a plurality of air hoods adapted to the placement positions are connected to the elastic lifting components;

[0013] A pumping component is installed in the cooling box and communicated with the air hood. When the elastic lifting component performs a lifting action and abuts against the placement table, it deforms to change the air supply volume of the pumping component to the air hood.

[0014] The cooling treatment device for PCB board after reflow soldering as described above: the placement table is driven to move by a first electric telescopic rod installed on the workbench.

[0015] The cooling treatment device for PCB board after reflow soldering as described above: the elastic lifting component includes a lifting cylinder, the lifting cylinder is slidably installed in the cooling box through a connecting plate, the lifting cylinder is driven to move by a second electric telescopic rod installed in the cooling box, a lifting rod is slidably arranged in the lifting cylinder, one end of the lifting rod away from the lifting cylinder is connected to a lifting plate slidably arranged in the cooling box, and the air hood is arranged on the lifting plate and communicated with the lifting plate;

[0016] It further includes a spring, the spring is arranged in the lifting cylinder, one end of the spring abuts against the inner top of the lifting cylinder, and the other end abuts against the lifting rod.

[0017] The cooling treatment device for PCB board after reflow soldering as described above: the pumping component includes an impeller component installed in the cooling box, the impeller component is driven by a motor installed in the cooling box, an air inlet end and an air outlet end are respectively arranged on the impeller component, the air inlet end penetrates through the cooling box and communicates with the outside, and the air outlet end is communicated with a partition box arranged in the cooling box.

[0018] The cooling treatment device for PCB board after reflow soldering as described above: a threaded pushing member is arranged in the partition box, the threaded pushing member includes a lead screw rotatably installed in the partition box, a threaded sleeve is threadedly connected to the lead screw, the threaded sleeve is connected to a partition plate slidably arranged in the partition box, and the partition plate slides relative to the air inlet hole on the partition box.

[0019] The cooling treatment device for the PCB board after reflow soldering as described above: Two independent chambers are formed in the dividing box. One chamber communicates with the outside through a first rigid tube penetrating the cooling box, and a second rigid tube is fixedly connected to the other chamber. A plurality of flexible tubes are distributed along the circumference at the end of the second rigid tube away from the dividing box, and the other ends of the flexible tubes are connected to the lifting plate.

[0020] The cooling treatment device for the PCB board after reflow soldering as described above: The cooling treatment device for the PCB board after reflow soldering further includes a transmission member connecting the screw rod and the lifting cylinder. The transmission member includes a sleeve rotatably installed at the inner top of the cooling box. A transmission shaft is slidably arranged at one end of the sleeve away from the top of the cooling box. A threaded groove is formed on the transmission shaft, and the other end of the transmission shaft is rotatably connected to the lifting plate. The sleeve is rotatably connected to the screw rod through a bevel gear set;

[0021] It further includes a connecting ring. One end of the connecting ring is connected to one of the lifting cylinders, and the other end is sleeved on the transmission shaft and a ball is formed on the inner ring for sliding cooperation with the threaded groove.

[0022] Compared with the prior art, the beneficial effect of the present utility model is that by pushing the placement table with the soldered PCB board into the cooling box, controlling the elastic lifting assembly to move downward, driving the air hood to move synchronously until it abuts against the placement table. At this time, the pumping assembly performs the pumping work to convey cold air into a plurality of air hoods, so that the solder paste on the PCB board begins to solidify. The elastic lifting assembly continues to move downward, causing the elastic lifting assembly to deform, thereby changing the air supply volume of the pumping assembly, making the air supply volume into the air hoods gradually increase. While the solder joints are solidified and the reflow soldering work is completed, it is avoided that the solder paste on the PCB board at the initial state is affected by too much wind force, resulting in the flow of the solder paste. Description of the Drawings

[0023] Figure 1 It is a schematic structural diagram of the cooling treatment device for the PCB board after reflow soldering.

[0024] Figure 2 It is a schematic structural diagram of the placement table and the guide rail in the cooling treatment device for the PCB board after reflow soldering.

[0025] Figure 3 It is a schematic structural diagram of the lifting plate and the air hood in the cooling treatment device for the PCB board after reflow soldering.

[0026] Figure 4 It is a schematic structural diagram of the dividing box and the lifting plate in the cooling treatment device for the PCB board after reflow soldering.

[0027] Figure 5 It is a schematic structural diagram of the dividing box and the elastic lifting assembly in the cooling treatment device for the PCB board after reflow soldering.

[0028] Figure 6 It is a schematic structural diagram of a sleeve and a transmission shaft in a cooling treatment device after the reflow soldering of a PCB board.

[0029] Figure 7 It is a schematic structural diagram of an elastic lifting assembly in a cooling treatment device after the reflow soldering of a PCB board.

[0030] In the figure: 1, workbench; 2, cooling box; 3, first electric telescopic rod; 4, placement table; 5, guide rail; 6, pumping assembly; 7, partition box; 8, first hard pipe; 9, second hard pipe; 10, hose; 11, partition plate; 12, threaded sleeve; 13, lead screw; 14, bevel gear set; 15, lifting plate; 1501, embedded groove; 16, air hood; 17, second electric telescopic rod; 18, connecting plate; 19, lifting cylinder; 20, lifting rod; 21, transmission shaft; 2101, strip-shaped block; 22, sleeve; 2201, strip-shaped groove; 23, connecting ring; 2301, ball; 24, spring. Detailed implementation manners

[0031] Hereinafter, various exemplary embodiments, features and aspects of the present application will be described in detail with reference to the drawings. The same reference numerals in the drawings denote elements having the same or similar functions. Although various aspects of the embodiments are shown in the drawings, the drawings do not have to be drawn to scale unless otherwise specified.

[0032] The special term "exemplary" here means "serving as an example, embodiment or illustration". Any embodiment described as "exemplary" here does not have to be construed as superior to or better than other embodiments.

[0033] In addition, for a better description of the present application, numerous specific details are given in the following detailed embodiments. Those skilled in the art should understand that the present application can also be implemented without some specific details. In some instances, methods, means, and elements well known to those skilled in the art are not described in detail so as to highlight the gist of the present application.

[0034] Please refer to Figures 1 to 7 , in the embodiment of the present utility model, a cooling treatment device after the reflow soldering of a PCB board includes a workbench 1 and a placement table 4 slidably mounted on the workbench 1, and a plurality of placement positions are formed on the placement table 4;

[0035] It further includes a cooling box 2 installed on the workbench 1, elastic lifting assemblies are symmetrically arranged in the cooling box 2, and a plurality of air hoods 16 adapted to the placement positions are connected to the elastic lifting assemblies;

[0036] The pumping assembly 6 is installed in the cooling box 2 and communicated with the air hood 16. After the elastic lifting assembly performs a lifting action and abuts against the placing table 4, it deforms to change the air supply volume of the pumping assembly 6 to the air hood 16.

[0037] Specifically, in this embodiment, for the cooling treatment device for the PCB board after reflow soldering of the present utility model, when the PCB board enters the welding area, the temperature rises rapidly to make the solder paste reach the melting state. The liquid solder wets, diffuses, overflows or reflows on the pads, component ends and pins of the PCB board to form solder joints. In use, the placing table 4 with the welded PCB board is pushed into the cooling box 2, and the elastic lifting assembly is controlled to move downward, driving the air hood 16 to move synchronously until it abuts against the placing table 4. At this time, the pumping assembly 6 performs the air pumping work, delivering cold air into multiple air hoods 16, causing the solder paste on the PCB board to start to solidify. The elastic lifting assembly continues to move downward, causing the elastic lifting assembly to deform, thereby changing the air supply volume of the pumping assembly 6, making the air supply volume to the air hood 16 gradually increase. While the solder joints are solidified and the reflow soldering work is completed, it is avoided that the solder paste on the PCB board at the initial state is affected by too strong wind force, resulting in the flow of the solder paste.

[0038] It should be noted that, in the initial state, when the pumping assembly 6 performs the air pumping work, most of the air will be transferred to the outside. As the cooling work progresses, the solder paste gradually starts to solidify, and the air delivered by the pumping assembly 6 into the air hood 16 gradually increases. When the deformation amount of the elastic lifting assembly reaches the maximum value, the air volume delivered by the pumping assembly 6 into the air hood 16 is stabilized.

[0039] Please refer to Figure 2 , the placing table 4 is driven to move by the first electric telescopic rod 3 installed on the workbench 1.

[0040] Preferably, a set of guide rails 5 are symmetrically arranged on the workbench 1, and multiple groups of rollers slidably matched with the guide rails 5 are rotatably arranged at the bottom of the placing table 4, so that when the first electric telescopic rod 3 extends, the placing table 4 moves relative to the guide rails 5 and enters the cooling box 2.

[0041] Please refer to Figure 5 , the elastic lifting assembly includes a lifting cylinder 19. The lifting cylinder 19 is slidably installed in the cooling box 2 through a connecting plate 18. The lifting cylinder 19 is driven to move by a second electric telescopic rod 17 installed in the cooling box 2. A lifting rod 20 is slidably arranged in the lifting cylinder 19. One end of the lifting rod 20 away from the lifting cylinder 19 is connected to a lifting plate 15 slidably arranged in the cooling box 2. The air hood 16 is arranged on the lifting plate 15 and communicated with the lifting plate 15;

[0042] It further includes a spring 24 which is arranged inside the lifting cylinder 19. One end of the spring 24 abuts against the inner top of the lifting cylinder 19, and the other end abuts against the lifting rod 20.

[0043] Specifically, when the placement table 4 is conveyed to the bottom of the lifting plate 15, the second electric telescopic rod 17 is controlled to work. The lever of the second electric telescopic rod 17 extends to drive the lifting cylinder 19 to move, so that the lifting rod 20 and the lifting plate 15 move synchronously until the wind hood 16 abuts against the placement table 4, making the PCB board in an independent cooling chamber. Under the restriction of the placement table 4, the lifting rod 20 cannot continue to move downward. When the lifting cylinder 19 is controlled to continue to move downward, the spring 24 is compressed to store elastic potential energy. When the lifting cylinder 19 moves downward relative to the lifting rod 20, the air delivery volume of the pumping assembly 6 can be changed to meet the requirement that the cold air received by the PCB board gradually increases.

[0044] Preferably, a plurality of embedded grooves 1501 are formed in the lifting plate 15. Through holes are provided between the embedded grooves 1501 and the wind hood 16, so that the wind hood 16 is communicated with the inside of the embedded grooves 1501 to ensure that the whole surface of the PCB board can receive wind.

[0045] Wherein, an air outlet hole is provided at the bottom of the placement position. The wind delivered by the wind hood 16 cools the PCB board and is discharged to the outside through the air outlet hole.

[0046] Please refer to Figure 4 , the pumping assembly 6 includes an impeller assembly installed in the cooling box 2. The impeller assembly is driven by a motor installed in the cooling box 2. An air inlet end and an air outlet end are respectively arranged on the impeller assembly. The air inlet end penetrates through the cooling box 2 and is communicated with the outside, and the air outlet end is communicated with a partition box 7 arranged in the cooling box 2.

[0047] After the wind hood 16 abuts against the placement table 4, the motor is started to work. The output shaft of the motor is connected to the impeller shaft in the impeller assembly to drive the impeller shaft to rotate, so that the wind outside the cooling box 2 is conveyed into the partition box 7 under the drive of the impeller blades. After being divided by the structure in the partition box 7, the wind delivered by the air outlet end is divided into two streams of wind. One stream of wind is conveyed into the wind hood 16 to cool the PCB board, and the other stream is transferred and conveyed outside the cooling box 2.

[0048] Please refer to Figure 4 and Figure 5 , a threaded pushing member is arranged in the partition box 7. The threaded pushing member includes a lead screw 13 rotatably installed in the partition box 7. A threaded sleeve 12 is threadedly connected to the lead screw 13. The threaded sleeve 12 is connected to a partition plate 11 slidably arranged in the partition box 7. The partition plate 11 slides relative to the air inlet hole on the partition box 7.

[0049] Two independent chambers are formed in the dividing box 7. One chamber communicates with the outside through the first rigid tube 8 penetrating the cooling box 2, and a second rigid tube 9 is fixedly connected to the other chamber. A plurality of flexible tubes 10 are distributed along the circumference at the end of the second rigid tube 9 away from the dividing box 7, and the other ends of the flexible tubes 10 are communicated with the lifting plate 15.

[0050] The cooling treatment device for the PCB board after reflow soldering further includes a transmission member connecting the lead screw 13 and the lifting cylinder 19. The transmission member includes a sleeve 22 rotatably installed at the inner top of the cooling box 2. A transmission shaft 21 is slidably arranged at one end of the sleeve 22 away from the top of the cooling box 2. A threaded groove is formed on the transmission shaft 21, and the other end of the transmission shaft 21 is rotatably connected to the lifting plate 15. The sleeve 22 is rotatably connected to the lead screw 13 through a bevel gear set 14.

[0051] It further includes a connecting ring 23. One end of the connecting ring 23 is connected to one of the lifting cylinders 19, and the other end is sleeved on the transmission shaft 21 and a ball 2301 that is slidably matched with the threaded groove is formed on the inner ring.

[0052] Furthermore, after the air hood 16 abuts against the placement table 4, the motor is started to work to convey the outside air into the air hood 16. At this time, the second electric telescopic rod 17 continues to work. Under the action of the spring 24, the lifting cylinder 19 moves downward relative to the lifting rod 20. At this time, the lifting cylinder 19 also moves downward relative to the transmission shaft 21, so that the ball 2301 on the connecting ring 23 presses against the transmission shaft 21. The transmission shaft 21 rotates under the extrusion of the ball 2301. When the transmission shaft 21 rotates, it drives the sleeve 22 to rotate accordingly. When the sleeve 22 rotates, under the action of the bevel gear set 14, it drives the lead screw 13 to rotate relative to the dividing box 7. When the lead screw 13 rotates, it drives the threaded sleeve 12 to move linearly along the axial direction of the lead screw 13. When the threaded sleeve 12 moves, it drives the dividing plate 11 to move synchronously, so that the dividing plate 11 slides relative to the air inlet hole, so as to change the air intake in the two chambers and meet the requirement that the air volume in the air hood 16 changes from small to large.

[0053] Preferably, a cylindrical cavity is formed at one end of the sleeve 22 close to the transmission shaft 21. At least one group of strip-shaped grooves 2201 are formed in the cylindrical cavity. A strip-shaped block 2101 that is slidably matched with the sleeve 22 is formed on the transmission shaft 21. When the lifting plate 15 moves downward, it drives the transmission shaft 21 to move downward synchronously. Under the action of the strip-shaped grooves 2201 and the strip-shaped block 2101, the sliding connection between the transmission shaft 21 and the sleeve 22 is realized, and when the transmission shaft 21 rotates, it drives the sleeve 22 to rotate synchronously.

[0054] Among them, after the cold air in the partition box 7 enters the first hard pipe 8, it is equally transported to a plurality of hoses 10. When the lifting plate 15 moves downward, the position of the first hard pipe 8 does not change. Under the action of the hoses 10, the movement of the lifting plate 15 does not affect the air intake volume in the air hood 16.

[0055] For those skilled in the art, it is obvious that the present utility model is not limited to the details of the above exemplary embodiments, and without departing from the spirit or basic characteristics of the present utility model, the present utility model can be implemented in other specific forms. Therefore, from any point of view, the embodiments should be regarded as exemplary and non-limiting. The scope of the present utility model is defined by the appended claims rather than the above description. Therefore, all changes falling within the meaning and scope of the equivalent elements of the claims are intended to be included in the present utility model. Any reference signs in the claims should not be construed as limiting the claims involved.

[0056] In addition, it should be understood that although this specification is described according to embodiments, not every embodiment only contains an independent technical solution. This narrative way of the specification is only for clarity. Those skilled in the art should regard the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. Cooling treatment device for a PCB board after reflow soldering, characterized in that, It includes a workbench (1) and a placement table (4) slidably mounted on the workbench (1), and a plurality of placement positions are formed on the placement table (4). It further includes a cooling box (2) mounted on the workbench (1), elastic lifting components are symmetrically arranged in the cooling box (2), and a plurality of wind hoods (16) adapted to the placement positions are connected to the elastic lifting components. A pumping component (6) is mounted in the cooling box (2) and communicated with the wind hood (16). When the elastic lifting component performs a lifting action and abuts against the placement table (4), it deforms to change the air supply volume of the pumping component (6) to the wind hood (16).

2. The cooling treatment device for the PCB board after reflow soldering according to claim 1, wherein, The placement table (4) is driven to move by a first electric telescopic rod (3) mounted on the workbench (1).

3. The cooling treatment device for the PCB board after reflow soldering according to claim 1, characterized in that, The elastic lifting component includes a lifting cylinder (19). The lifting cylinder (19) is slidably mounted in the cooling box (2) through a connecting plate (18). The lifting cylinder (19) is driven to move by a second electric telescopic rod (17) mounted in the cooling box (2). A lifting rod (20) is slidably arranged in the lifting cylinder (19). One end of the lifting rod (20) away from the lifting cylinder (19) is connected to a lifting plate (15) slidably arranged in the cooling box (2). The wind hood (16) is arranged on the lifting plate (15) and communicated with the lifting plate (15). It further includes a spring (24). The spring (24) is arranged in the lifting cylinder (19). One end of the spring (24) abuts against the inner top of the lifting cylinder (19), and the other end abuts against the lifting rod (20).

4. The cooling treatment device for the PCB board after reflow soldering according to claim 3, wherein, The pumping component (6) includes an impeller component mounted in the cooling box (2). The impeller component is driven by a motor mounted in the cooling box (2). An air inlet end and an air outlet end are respectively arranged on the impeller component. The air inlet end penetrates through the cooling box (2) and is communicated with the outside. The air outlet end is communicated with a partition box (7) arranged in the cooling box (2).

5. The cooling treatment device for the PCB board after reflow soldering according to claim 4, characterized in that, A threaded pushing member is arranged in the partition box (7). The threaded pushing member includes a lead screw (13) rotatably mounted in the partition box (7). A threaded sleeve (12) is threadedly connected to the lead screw (13). The threaded sleeve (12) is connected to a partition plate (11) slidably arranged in the partition box (7). The partition plate (11) slides relative to the air inlet hole on the partition box (7).

6. The cooling treatment device for the PCB board after reflow soldering according to claim 5, characterized in that, Two independent chambers are formed in the partition box (7). One chamber is communicated with the outside through a first hard pipe (8) penetrating through the cooling box (2). The other chamber is fixedly communicated with a second hard pipe (9). A plurality of hoses (10) are distributed in a circular pattern at one end of the second hard pipe (9) away from the partition box (7). The other ends of the hoses (10) are communicated with the lifting plate (15).

7. The cooling treatment device for the PCB board after reflow soldering according to claim 5, characterized in that The cooling treatment device after the PCB board is reflow soldered further includes a transmission member connecting the screw rod (13) and the lifting cylinder (19). The transmission member includes a sleeve (22) rotatably installed at the inner top of the cooling box (2). A transmission shaft (21) is slidably arranged at one end of the sleeve (22) away from the top of the cooling box (2). A threaded groove is formed on the transmission shaft (21). The other end of the transmission shaft (21) is rotatably connected to the lifting plate (15). The sleeve (22) is rotatably connected to the screw rod (13) through a bevel gear set (14). It further includes a connecting ring (23). One end of the connecting ring (23) is connected to one of the lifting cylinders (19), and the other end is sleeved on the transmission shaft (21) and balls (2101) that are slidably matched with the threaded groove are formed on the inner ring.

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