Semiconductor diamond wire multi-wire cutting machine with reinforcing structure

Abstract

The semiconductor diamond wire multi-wire cutting machine with the reinforcing structure comprises a machine body, an air cylinder is fixedly installed on the upper end face of the machine body, and the lower end of the air cylinder penetrates through the machine body and is fixedly connected with a cutting assembly. A cutting table is fixed to the upper surface of the inner side of the machine body, and a cutting groove is formed in the surface of the cutting table; a servo motor is fixed to the upper surface of the inner side of the machine body, the output end of the servo motor is fixed to one end of a two-way lead screw, and the outer side of the two-way lead screw is in threaded connection with a movable plate. According to the semiconductor diamond wire multi-wire cutting machine with the reinforcing structure, the reinforcing effect on a semiconductor is achieved, displacement of the semiconductor during cutting due to high-speed vibration of a diamond wire is avoided, the situation that the semiconductor cutting does not meet the production standard is avoided, cleaning of a cutting groove is achieved, and the production efficiency is improved. Chippings generated during cutting are prevented from being accumulated in the cutting groove, meanwhile, manual regular cleaning of the cutting groove is not needed, and practicability is high.

Description

Technical Field

[0001] The utility model relates to the technical field of diamond wire multi-wire cutting machines, and particularly relates to a semiconductor diamond wire multi-wire cutting machine with a reinforcement structure. Background Technique

[0002] Multi-wire cutting is one of the very effective cutting methods for semiconductors. It has high efficiency and precision. Usually, the high-speed reciprocating motion of the diamond wire is used to achieve the effect of cutting hard and brittle materials such as semiconductors. For example, in the patent with the publication number "CN218985315U" and the patent name "A Diamond Wire Multi-Wire Cutting Machine", when in use, after the tool setting is completed and cutting is carried out, the main baffle is pulled outwards, so that the slide plate slides along the chute, and finally the main baffle is completely pulled out, so that it can rotate along the hinge point. Similarly, after the secondary baffle is pulled out, it also rotates to fit with the machine frame. Then, the connecting plate is pulled upwards so that it is pulled out from the top of the support card, and then it is inserted into the groove at the outlet of the support card and inserted into the top of the secondary baffle. At the same time, the limit handle is placed on the top of the bent end of the main baffle to complete the fixation. When recycling, the connecting plate is first removed. After being fixed, the main baffle and the secondary baffle are respectively rotated and pushed back into the storage box. At this time, the bent end of the main baffle just aligns with the opening of the storage box. However, the above structure still has the following problems in the actual use process:

[0003] In the process of using the above structure, the semiconductor is placed on the workbench, and then the cutting effect is achieved through the cutting assembly. However, in the actual use process, the high-speed vibration of the diamond wire is very easy to drive the cutting object to move, resulting in its easy deviation during the cutting process, thereby affecting the cutting effect.

[0004] Therefore, we have proposed a semiconductor diamond wire multi-wire cutting machine with a reinforcement structure that can well solve the above problems. Summary of the Invention

[0005] The purpose of the utility model is to provide a semiconductor diamond wire multi-wire cutting machine with a reinforcement structure to solve the problem in the above background technique that the high-speed vibration of the diamond wire in the current market is very easy to drive the cutting object to move, resulting in its easy deviation during the cutting process.

[0006] To achieve the above purpose, the utility model provides the following technical solution: A semiconductor diamond wire multi-wire cutting machine with a reinforcement structure, including a machine body, a cylinder is fixedly installed on the upper end surface of the machine body, and the lower end of the cylinder penetrates the machine body and is fixedly connected with a cutting assembly;

[0007] It further includes: a cutting table is fixed on the inner upper surface of the machine body, and a cutting groove is opened on the surface of the cutting table;

[0008] A servo motor is fixed on the inner upper surface of the machine body, and the output end of the servo motor is fixed to one end of a bidirectional lead screw. At the same time, the other end of the bidirectional lead screw is connected to a mounting plate fixed on the inner upper surface of the machine body through a bearing, and a moving plate is threadedly connected to the outer side of the bidirectional lead screw;

[0009] One side of the moving plate is fixed to one end of a connecting rod, and the other end of the connecting rod is fixedly connected to a clamping plate arranged on the upper surface of the cutting table.

[0010] Preferably, two groups of connecting rods are provided, and the connecting rods are arranged in a "C" - shaped structure.

[0011] Preferably, an extrusion rod is fixed in the middle section of the connecting rod, and the inner end of the extrusion rod extends into the cutting table and is fixed to an extrusion disc.

[0012] Preferably, the extrusion disc is arranged inside an air cavity, and the outer side of the extrusion disc is in close fit with the inner wall of the air cavity, and the air cavity is opened inside the cutting table.

[0013] Preferably, two groups of air cavities are provided, and the inner ends of the two groups of air cavities are both connected to one end of a communicating pipe, and the other end of the communicating pipe extends out of the front side of the cutting table and is connected to a blowing head.

[0014] Preferably, the blowing head is fixed on the inner upper surface of the machine body, and the output end of the blowing head faces the cutting groove.

[0015] Preferably, a collection box is installed at the rear side of the cutting table, and the collection box is of a detachable structure, and the upper opening of the collection box is lower than the lowest point of the cutting groove.

[0016] Compared with the prior art, the beneficial effects of the present utility model are as follows: This semiconductor multi - wire cutting machine with a reinforcement structure not only realizes the reinforcement effect on the semiconductor, thereby avoiding the displacement of the semiconductor during cutting due to the high - speed vibration of the diamond wire, thus avoiding the non - compliance of semiconductor cutting with production standards, but also realizes the cleaning of the cutting groove, avoiding the accumulation of debris generated during cutting in the cutting groove. At the same time, there is no need for manual regular cleaning of the cutting groove, and the practicability is high. The specific content is as follows:

[0017] The servo motor rotates through the bidirectional lead screw, thereby driving two threadedly connected moving plates to move inward together, so that the moving plates drive the clamping plates to approach each other through the connecting rods and clamp the semiconductor, thereby realizing the reinforcement effect on the semiconductor, thus avoiding the displacement of the semiconductor during cutting due to the high - speed vibration of the diamond wire, thus avoiding the non - compliance of semiconductor cutting with production standards;

[0018] Further, the cylinder drives the cutting assembly downward, so that the cutting assembly cuts the semiconductor on the cutting table. At the same time, due to the setting of the cutting groove, the diamond wire can move into the cutting groove, so as to achieve the effect of completely cutting the semiconductor;

[0019] The air in the air chamber is squeezed into the connecting pipe by the extrusion rod driving the extrusion disc, then sent into the blowing head by the connecting pipe, and finally blown out by the blowing head, so that the blowing head realizes blowing and cleaning of the cutting groove, thereby realizing the cleaning of the cutting groove, avoiding the accumulation of debris generated during cutting in the cutting groove, and at the same time eliminating the need for manual regular cleaning of the cutting groove, which has good practicability;

[0020] Furthermore, a detachable collection box is arranged on the other side of the cutting groove. After the blowing head blows the debris in the cutting groove to the collection box on the other side for collection, the debris can be cleaned by cleaning the collection box at a later stage;

[0021] After cutting is completed, only need to control the bidirectional lead screw to reverse through the servo motor, so that the bidirectional lead screw drives the two moving plates to move away from each other, so that the moving plates drive the connecting rods to move outward together, and then the connecting rods drive the clamping plates to move away from each other, so that the clamping plates no longer clamp the semiconductor. At this time, the cut semiconductor can be taken down. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 is the front view structural schematic diagram of the present utility model;

[0023] Figure 2 is the front view structural schematic diagram of the present utility model;

[0024] Figure 3 is the front view structural schematic diagram of the connection between the machine body and the blowing head of the present utility model;

[0025] Figure 4 is the rear view structural schematic diagram of the connection between the cutting table and the collection box of the present utility model;

[0026] Figure 5 is the sectional view structural schematic diagram of the cutting table of the present utility model;

[0027] Figure 6 is the front view structural schematic diagram of the connection between the connecting rod and the extrusion rod of the present utility model.

[0028] In the figure: 1, machine body; 2, cylinder; 3, cutting assembly; 4, cutting table; 5, cutting groove; 6, servo motor; 7, bidirectional lead screw; 8, moving plate; 9, connecting rod; 10, clamping plate; 11, extrusion rod; 12, extrusion disc; 13, air chamber; 14, connecting pipe; 15, blowing head; 16, collection box. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0029] The following will clearly and completely describe the technical solutions in the embodiments of the present utility model in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts belong to the protection scope of the present utility model.

[0030] Please refer to Figures 1-6 , the present utility model provides the following technical solutions:

[0031] Embodiment 1: To solve the problem that the high-speed vibration of the diamond wire in the prior art easily drives the cutting object to move, resulting in easy deviation during the cutting process, the following solution is disclosed. It includes a machine body 1, and a cylinder 2 is fixedly installed on the upper end surface of the machine body 1, and the lower end of the cylinder 2 penetrates the machine body 1 and is fixedly connected to a cutting assembly 3; it also includes: a cutting table 4 is fixed on the inner upper surface of the machine body 1, and a cutting groove 5 is formed on the surface of the cutting table 4; a servo motor 6 is fixed on the inner upper surface of the machine body 1, and the output end of the servo motor 6 is fixedly connected to one end of a bidirectional lead screw 7, and the other end of the bidirectional lead screw 7 is connected to a mounting plate fixed on the inner upper surface of the machine body 1 to form a bearing connection, and a moving plate 8 is threadedly connected to the outside of the bidirectional lead screw 7;

[0032] First, place the semiconductor on the cutting table 4, and then start the servo motor 6. Through the servo motor 6, it drives the bidirectional lead screw 7 to rotate. Through the rotation of the bidirectional lead screw 7, it drives the two threadedly connected moving plates 8 to move inward together. When the moving plate 8 moves, it also drives the connecting rod 9 to move together. Due to the "C" - shaped structure of the connecting rod 9, it is convenient for the connecting rod 9 to drive the clamping plate 10 to move together, so that the clamping plates 10 approach each other and clamp the semiconductor, thereby achieving the reinforcement effect on the semiconductor, avoiding the displacement of the semiconductor during cutting due to the high - speed vibration of the diamond wire, and avoiding the semiconductor cutting not meeting the production standards;

[0033] Embodiment 2: Different from Embodiment 1, this embodiment avoids the accumulation of debris generated during cutting in the cutting groove 5, and there is no need for manual regular cleaning of the cutting groove 5, with good practicability. Specifically refer to Figures 3-6, and the inner end of the extrusion rod 11 extends into the cutting table 4 and is fixed to the extrusion disk 12. The extrusion disk 12 is arranged inside the air cavity 13, and the outer side of the extrusion disk 12 is in close fit with the inner wall of the air cavity 13. The air cavity 13 is opened inside the cutting table 4. There are two groups of air cavities 13, and the inner ends of the two groups of air cavities 13 are both connected to one end of the connecting pipe 14. The other end of the connecting pipe 14 extends out of the front side of the cutting table 4 and is connected to the blowing head 15. The blowing head 15 is fixed on the inner upper surface of the machine body 1. At the same time, the output end of the blowing head 15 faces the cutting groove 5. A collection box 16 is installed at the rear side of the cutting table 4, and the collection box 16 is of a detachable structure. The upper end opening of the collection box 16 is lower than the lowest point of the cutting groove 5;

[0034] Subsequently, the cylinder 2 can be started, so that the cylinder 2 drives the cutting assembly 3 downward, so that the cutting assembly 3 cuts the semiconductor on the cutting table 4. At the same time, through the setting of the cutting groove 5, the diamond wire can move into the cutting groove 5, so as to achieve the effect of completely cutting the semiconductor. At the same time, when the connecting rod 9 moves inward, it will also drive the extrusion rod 11 to move together. Through the movement of the extrusion rod 11, the extrusion rod 11 drives the extrusion disk 12 to move in the air cavity 13, so as to squeeze the air in the air cavity 13, so as to send the air in the air cavity 13 into the connecting pipe 14, and then send it into the blowing head 15 by the connecting pipe 14, and finally blow it out by the blowing head 15, so that the blowing head 15 realizes the blowing and cleaning of the cutting groove 5, so as to facilitate blowing the debris in the cutting groove 5 to the collection box 16 on the other side for collection, so as to realize the cleaning of the cutting groove 5, avoid the accumulation of debris generated during cutting in the cutting groove 5, and at the same time, there is no need to manually clean the cutting groove 5 regularly, and the practicability is good;

[0035] Embodiment 3: Different from Embodiment 2, this embodiment is convenient for next use. For details, refer to Figures 2-5 , there are two groups of connecting rods 9, and the connecting rods 9 are arranged in a "C" - shaped structure. The middle section of the connecting rod 9 is fixed with an extrusion rod 11. One side of the moving plate 8 is fixed to one end of the connecting rod 9, and the other end of the connecting rod 9 is fixedly connected to a clamping plate 10 arranged on the upper surface of the cutting table 4;

[0036] After cutting is completed, only need to control the bidirectional lead screw 7 to reverse through the servo motor 6, so that the bidirectional lead screw 7 drives the two moving plates 8 to move away from each other, so that the moving plate 8 drives the connecting rod 9 to move outward together, so that the connecting rod 9 drives the clamping plates 10 to move away from each other, so that the clamping plates 10 no longer clamp the semiconductor. At this time, the cut semiconductor can be taken down. At the same time, when the connecting rod 9 moves outward, it will also drive the extrusion rod 11 to move outward together, so that the extrusion rod 11 drives the extrusion disk 12 to move outward, so that the extrusion disk 12 is reset for next use.

[0037] The content not described in detail in this specification belongs to the prior art well-known to those skilled in the art.

[0038] Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements on some of the technical features. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present utility model shall be included within the protection scope of the present utility model.

Claims

1. A multi-wire cutting machine for semiconductor diamond wires with a reinforcement structure, comprising a machine body (1). A cylinder (2) is fixedly installed on the upper end surface of the machine body (1), and the lower end of the cylinder (2) penetrates through the machine body (1) and is fixedly connected to a cutting assembly (3); It is characterized in that It further includes: A cutting table (4) is fixedly installed on the inner upper surface of the machine body (1), and a cutting groove (5) is formed on the surface of the cutting table (4); A servo motor (6) is fixedly installed on the inner upper surface of the machine body (1). The output end of the servo motor (6) is fixedly connected to one end of a bidirectional lead screw (7). At the same time, the other end of the bidirectional lead screw (7) is connected to a mounting plate fixedly installed on the inner upper surface of the machine body (1) through a bearing. Moreover, a moving plate (8) is threadedly connected to the outer side of the bidirectional lead screw (7); One side of the moving plate (8) is fixedly connected to one end of a connecting rod (9), and the other end of the connecting rod (9) is fixedly connected to a clamping plate (10) arranged on the upper surface of the cutting table (4).

2. The multi-wire cutting machine for semiconductor diamond wires with a reinforcement structure according to claim 1, wherein: There are two groups of the connecting rods (9), and the connecting rods (9) are arranged in a "C" - shaped structure.

3. A multi-wire cutting machine for semiconductor diamond wires with a reinforcement structure according to claim 1, characterized in that: An extrusion rod (11) is fixedly installed in the middle section of the connecting rod (9), and the inner end of the extrusion rod (11) extends into the cutting table (4) and is fixedly connected to an extrusion disc (12).

4. A semiconductor diamond wire multi-wire cutting machine with a reinforcement structure according to claim 3, wherein: The extrusion disc (12) is arranged inside an air cavity (13), and the outer side of the extrusion disc (12) is in close fit with the inner wall of the air cavity (13). The air cavity (13) is formed inside the cutting table (4).

5. The multi-wire cutting machine for semiconductor diamond wire with a reinforcement structure according to claim 4, characterized in that: There are two groups of the air cavities (13), and the inner ends of the two groups of air cavities (13) are respectively connected to one end of a communicating pipe (14). The other end of the communicating pipe (14) extends out of the front side of the cutting table (4) and is connected to a blowing head (15).

6. The multi-wire cutting machine for semiconductor diamond wire with a reinforcement structure according to claim 5, wherein: The blowing head (15) is fixedly installed on the inner upper surface of the machine body (1), and the output end of the blowing head (15) faces the cutting groove (5).

7. A multi-wire cutting machine for semiconductor diamond wires with a reinforcement structure according to claim 1, characterized in that: A collection box (16) is installed at the rear side of the cutting table (4). The collection box (16) is of a detachable structure, and the upper opening of the collection box (16) is lower than the lowest point of the cutting groove (5).

Images