ALD device
By introducing an atmospheric preheating system into the ALD device, the glass substrate is preheated, which solves the problem of slow temperature rise of infrared heaters and improves production efficiency and production capacity.
Patent Information
- Application Number
- CN202421962049.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-13
- Publication Date
- 2025-07-11
- Estimated Expiration
- 2034-08-13
AI Technical Summary
When using glass substrates in existing ALD devices, it is difficult for infrared heaters to heat up quickly, resulting in too long production rhythm and affecting equipment production capacity and output.
The normal pressure preheating system is adopted to preheat the glass substrate during the substrate conveying process through the heating mechanism, reducing the heating time in the vacuum state and improving the heating efficiency.
It significantly improves the production efficiency and capacity of ALD devices, reduces heating time, and improves the production of equipment.
Smart Images
Figure CN223087909U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical fields of photovoltaic and semiconductor, and particularly to an ALD device. Background Art
[0002] In the semiconductor field, the ALD (Atomic Layer Deposition) technology is usually involved, that is, thin film deposition is carried out by an ALD device.
[0003] Before performing the ALD process, the substrate usually needs to be heated to the temperature required by the process. Currently, the substrate usually uses glass material. Due to the transparent characteristics of glass, it is very difficult for current equipment to achieve rapid heating of glass by heating devices such as infrared heaters. That is, it takes a long time to heat the glass substrate to the process temperature, resulting in a long production rhythm and affecting the production capacity and output of the equipment. Summary of the Utility Model
[0004] The utility model provides an ALD device, which can ensure that the temperature of the glass substrate meets the process requirements, while taking into account the production capacity requirements of the equipment and controlling the floor area of the equipment. Through an atmospheric preheating mechanism, the glass substrate is preheated to a specified temperature in advance to reduce the heating time of the glass substrate in the heating chamber under vacuum, so as to achieve the purpose of improving the production capacity of the equipment.
[0005] The embodiments of the utility model can be implemented as follows:
[0006] The ALD device includes a loading and unloading machine, a heating mechanism, a transfer mechanism, and a coating mechanism arranged in sequence.
[0007] The substrate is loaded by the loading and unloading machine, and the loading and unloading machine transports the substrate to the heating mechanism; the heating mechanism transports the substrate from the loading and unloading machine to the transfer mechanism and preheats the substrate while transporting, so as to preheat the substrate in advance; after receiving the substrate transported from the heating mechanism, the transfer mechanism transports the substrate to the coating mechanism. The coating mechanism first heats the substrate to the temperature required for coating, and then performs the coating process on the substrate. After the coating is completed, the coating mechanism transports the substrate to the loading and unloading machine; the loading and unloading machine receives the substrate after coating and unloads the substrate, and then loads a new substrate and transports the substrate to the heating mechanism again, and so on in a cycle.
[0008] The beneficial effects of the ALD device provided by the embodiment of the present utility model include: during the process that the heating mechanism transports the substrate from the loading and unloading machine to the transfer mechanism, the substrate is preheated simultaneously, so as to heat the temperature of the substrate to be close to or equal to the temperature required by the coating process. Therefore, after the transfer mechanism transports the substrate to the coating mechanism, the heating time of the coating mechanism for the substrate is reduced, thereby improving the production efficiency of the ALD device, and thus enhancing the production capacity and output of the ALD device. Description of the Drawings
[0009] In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present utility model, and therefore should not be regarded as limiting the scope. For those of ordinary skill in the art, without creative efforts, other related drawings can also be obtained based on these drawings.
[0010] Figure 1 It is a schematic structural diagram of the ALD device provided by the embodiment of the present utility model.
[0011] Reference numerals: 10 - ALD device; 100 - loading and unloading machine; 200 - heating mechanism; 210 - heating element; 220 - heat insulation box; 221 - first mirror reflector; 300 - transfer mechanism; 310 - elevator; 320 - heat preservation box; 321 - second mirror reflector; 400 - coating mechanism; 410 - ALD process chamber; 411 - spraying system; 420 - heating chamber; 430 - feeding chamber; 440 - discharging chamber; 500 - loading turnover table; 600 - carrier plate; 700 - cooling table. Detailed Embodiments
[0012] To make the objectives, technical solutions, and advantages of the embodiments of the present utility model clearer, the technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the drawings in the embodiments of the present utility model. Obviously, the described embodiments are some, but not all, of the embodiments of the present utility model. Usually, the components of the embodiments of the present utility model described and shown in the drawings here can be arranged and designed in various different configurations.
[0013] Therefore, the following detailed description of the embodiments of the present utility model provided in the drawings is not intended to limit the scope of the present utility model to be protected, but merely represents the selected embodiments of the present utility model. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without creative efforts fall within the scope of protection of the present utility model.
[0014] It should be noted that like reference numerals and letters denote like items in the following figures, and thus, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.
[0015] In the description of the present utility model, it should be noted that if terms such as "upper", "lower", "inner", "outer", etc. are used to indicate the orientation or positional relationship, which is based on the orientation or positional relationship shown in the figures or the orientation or positional relationship in which the utility model product is usually placed during use, it is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus cannot be construed as a limitation to the present utility model.
[0016] In addition, terms such as "first", "second", etc. are only used for distinguishing descriptions and cannot be construed as indicating or implying relative importance.
[0017] It should be noted that, without conflict, the features in the embodiments of the present utility model can be combined with each other.
[0018] In the semiconductor field, ALD (Atomic Layer Deposition) technology is usually involved, that is, thin film deposition is carried out through an ALD device.
[0019] Before performing the ALD process, the substrate usually needs to be heated to the temperature required by the process. Currently, the substrate is usually made of glass. Due to the transparent characteristics of glass, it is very difficult for current equipment using heating devices such as infrared heaters to rapidly heat the glass, that is, it takes a long time, at least about 7 minutes, to heat the substrate to the process temperature, resulting in a long production rhythm, thus affecting the production capacity and output of the equipment.
[0020] Based on the above problems, please refer to Figure 1 , the embodiment of the present utility model provides an ALD device 10, which is applied to the fields of photovoltaic and semiconductor technologies, can ensure that the temperature of the glass substrate meets the process requirements, while taking into account the production capacity requirements of the equipment and controlling the floor area of the equipment. An atmospheric preheating system is added to preheat the glass substrate to a specified temperature in advance, so as to reduce the heating time of the glass substrate in the heating chamber 420 in a vacuum state, so as to achieve the purpose of improving the production capacity of the equipment. For example, when the temperature of the coating process is 85°C to 120°C, the glass substrate can be preheated to 70°C to 80°C in advance through the preheating system. It can be understood that different coating processes require different heating temperatures, and the preheating temperature and coating temperature are determined according to the actual situation, and the temperature is not specifically limited herein.
[0021] Specifically, the ALD device 10 includes a loader / unloader 100, a heating mechanism 200, a transfer mechanism 300, a coating mechanism 400, a loading turntable 500, and a cooling table 700 that are arranged in sequence.
[0022] Among them, the loader / unloader 100, the loading turntable 500, the heating mechanism 200, the transfer mechanism 300, the coating mechanism 400, and the cooling table 700 are arranged in sequence, and the cooling table 700 is also connected to the loader / unloader 100 to achieve automated cyclic production operations on the production line.
[0023] It should be noted that the ALD device 10 further includes a carrier plate 600. The carrier plate 600 is used to carry, fix, and transport the substrate. By conveying the carrier plate 600, the substrate is sequentially transported to the loading turntable 500, the heating mechanism 200, the transfer mechanism 300, the coating mechanism 400, and the cooling table 700, and finally conveyed from the cooling table 700 to the loader / unloader 100 again. The loader / unloader 100 unloads the coated substrate from the carrier plate 600 to achieve unloading, and places a new substrate on the carrier plate 600 to achieve loading.
[0024] It can be understood that after the carrier plate 600 realizes the unloading and loading of the substrate through the loader / unloader 100, it is then conveyed to the loading turntable 500. The loading turntable 500 can play a buffering role to minimize the production capacity loss of other operation units when other individual operation units have abnormalities and need to stop for maintenance.
[0025] Specifically, the loader / unloader 100 is used to convey the carrier plate 600 and the substrate placed on the carrier plate 600 to the heating mechanism 200. The heating mechanism 200 is used to heat the substrate while conveying the carrier plate 600 and the substrate to the transfer mechanism 300. The transfer mechanism 300 is used to receive the carrier plate 600 and the substrate from the heating mechanism 200, and convey the carrier plate 600 and the substrate to the coating mechanism 400 for the coating process. The loader / unloader 100 is also used to receive the substrate that has completed the coating process, unload the received substrate from the carrier plate 600, load the carrier plate 600 again, and convey the carrier plate 600 and the substrate to the heating mechanism 200 again, and cycle in this way.
[0026] In this embodiment, the substrate is loaded onto the carrier plate by the loading and unloading machine 100, and the loading and unloading machine 100 transports the carrier plate 600 and the substrate to the heating mechanism 200; the heating mechanism 200 transports the carrier plate 600 and the substrate from the loading and unloading machine 100 to the transfer mechanism 300, and pre-heats the substrate while transporting, so as to heat the substrate in advance; after the transfer mechanism 300 receives the carrier plate 600 and the substrate transported from the heating mechanism 200, it transports the carrier plate 600 and the substrate to the coating mechanism 400. The coating mechanism 400 first heats the substrate to the temperature required for coating, and then performs the coating process on the substrate. After the coating is completed, the coating mechanism 400 transports the carrier plate 600 and the substrate to the loading and unloading machine 100; the loading and unloading machine 100 receives the substrate that has completed the coating and unloads the substrate from the carrier plate 600. After unloading, a new substrate is loaded onto the carrier plate 600 and the substrate is transported to the heating mechanism 200 again, and this cycle is carried out.
[0027] Therefore, in the ALD device 10 provided by the present utility model, during the process of the heating mechanism 200 transporting the substrate from the loading and unloading machine 100 to the transfer mechanism 300, the substrate is also pre-heated at the same time, so as to heat the temperature of the substrate to be close to or equal to the temperature required for the coating process. Thus, after the transfer mechanism 300 transports the substrate to the coating mechanism 400, the heating time of the coating mechanism 400 for the substrate is reduced, thereby improving the production efficiency of the ALD device 10, and thus enhancing the production capacity and output of the ALD device 10.
[0028] Further, the heating mechanism 200 includes a heating element 210, and the heating element 210 is arranged on the conveying path of the substrate.
[0029] In this embodiment, by arranging the heating element 210 on the conveying path of the substrate from the loading and unloading machine 100 and the transfer mechanism 300, it is ensured that the heating mechanism 200 fully heats the substrate through the heating element 210 during the process of transporting the substrate, so that the temperature of the substrate before entering the coating mechanism 400 can be heated to be close to, equal to, or higher than the temperature required for the coating process.
[0030] It can be understood that usually only heating the substrate to be close to or equal to the temperature required for the coating process is sufficient. Considering the influence of environmental factors on the temperature, heat loss may also occur during the transfer process. Therefore, the temperature of the substrate can also be heated to be slightly higher than the temperature required for the coating process.
[0031] Further, the heating mechanism 200 further includes a heat insulation box 220, the heating element 210 is arranged in the heat insulation box 220, and a first heat insulation layer (not shown in the figure) is arranged in the heat insulation box 220.
[0032] In this embodiment, in order to prevent the heat released by the heating element 210 and the heat of the substrate from dissipating rapidly, the heating element 210 is arranged in the heat insulation box 220, and a first heat insulation layer is arranged on the outer wall of the heat insulation box 220, thereby effectively preventing heat dissipation.
[0033] It should be noted that the heat insulation box 220 has a channel structure. Heating elements 210 such as infrared heating tubes, heating wires or heating plates can be arranged on the four inner side walls of the heat insulation box 220. Since the substrate is placed on the carrier plate 600, during this transportation process, under normal pressure environment, the substrate is heated simultaneously by means of thermal radiation, heat transfer and thermal convection, significantly improving the heating efficiency, so as to maintain a relatively higher temperature environment inside the heat insulation box 220 than the outside.
[0034] In addition, it should also be noted that in the above normal pressure environment, an inert gas can be used to maintain the normal pressure environment. For example, nitrogen can be used to avoid damage to the substrate by air. In addition, compared with heating the substrate in a vacuum state, the heating efficiency of heating the substrate in a normal pressure state is higher.
[0035] Furthermore, a first mirror reflection plate 221 is arranged on the inner wall of the heat insulation box 220.
[0036] In this embodiment, by arranging the first mirror reflection plate 221 on the inner wall of the heat insulation box 220, the thermal radiation energy inside the heat insulation box 220 can be reflected, further preventing the heat dissipation inside the heat insulation box 220.
[0037] It can be understood that the first heat insulation layer is arranged between the inner wall of the heat insulation box 220 and the first mirror reflection plate 221, that is, the first heat insulation layer is superimposed on the first mirror reflection plate 221, which can effectively prevent heat dissipation and has good economy, saving production costs. Of course, in other embodiments of the present invention, other heat insulation measures can also be adopted, which are not specifically limited herein.
[0038] Furthermore, the transfer mechanism 300 includes a lift 310 and a heat insulation box 320. The lift 310 is arranged inside the heat insulation box 320, and a second heat insulation layer (not shown in the figure) is arranged inside the heat insulation box 320.
[0039] In this embodiment, the lift 310 receives the substrate conveyed from the heating mechanism 200, and drives the substrate to rise or fall through the lift 310, so as to smoothly transfer the substrate to the coating mechanism 400.
[0040] In order to prevent the substrate from losing a large amount of heat on the lift 310, the lift 310 is arranged inside the heat insulation box 320, and a second heat insulation layer is arranged inside the heat insulation box 320, thereby effectively preventing the heat dissipation of the substrate.
[0041] Optionally, both the first thermal insulation layer and the second thermal insulation layer can be thermal insulation cotton, and the thickness of the thermal insulation cotton can be set to 20 mm to 60 mm.
[0042] Furthermore, a second mirror reflector 321 is provided on the inner wall of the insulation box 320.
[0043] In this embodiment, by providing the second mirror reflector 321 on the inner wall of the heat insulation box 220, the thermal radiation energy in the insulation box 320 can be reflected, further avoiding heat loss in the insulation box 320.
[0044] It can be understood that the second thermal insulation layer is provided between the inner wall of the insulation box 320 and the second mirror reflector 321, that is, the second thermal insulation layer is superposed on the second mirror reflector 321, which can effectively prevent heat loss and has good economy, saving production costs. Of course, in other embodiments of the present invention, other thermal insulation measures can also be adopted, which are not specifically limited herein.
[0045] Optionally, both the first mirror reflector and the second mirror reflector 321 can be made of mirror stainless steel plates to ensure their structural strength and environmental sealing, and can provide a relatively dust-free environment for the substrate. In addition, holes or grooves can be opened in the thermal insulation layer to provide space for the track of the driving mechanism for transporting the substrate, avoiding the thermal insulation layer from affecting the normal operation of the mechanism.
[0046] Furthermore, the coating mechanism 400 includes an ALD process chamber 410, a heating chamber 420, a feeding chamber 430, and a discharging chamber 440.
[0047] In this embodiment, the feeding chamber 430 is connected to the transfer mechanism 300, the discharging chamber 440 is connected to the cooling table, and the feeding chamber 430, the heating chamber 420, the ALD process chamber 410, and the discharging chamber 440 are connected in sequence.
[0048] It should be noted that the number of the heating chamber 420 and the ALD process chamber 410 can be 1, or multiple can be spliced. The number of the heating chamber 420 and the ALD process chamber 410 is not specifically limited herein.
[0049] In this embodiment, in an atmospheric environment, the carrier plate 600 and the substrate are transported to the feeding chamber 430 by the transfer mechanism 300 for vacuum pumping operation in the feeding chamber 430, so as to provide a vacuum environment for the substrate, and the carrier plate 600 and the substrate are transported to the heating chamber 420 in a vacuum state. After the temperature required by the substrate reaches the preset process temperature, the carrier plate 600 and the substrate are transported to the ALD process chamber 410 for coating process. After the coating process is completed, the carrier plate 600 and the substrate are transported to the discharging chamber 440 to return to the atmospheric state, and finally the carrier plate 600 and the substrate are transported to the cooling table 700 for cooling.
[0050] Specifically, after the substrate enters the discharge chamber 440, the discharge chamber 440 is filled with nitrogen for backpressure, the inlet connecting the discharge chamber 440 to the ALD process chamber 410 is closed, and the outlet is opened so that the substrate is transported to the cooling table 700 in the atmospheric state.
[0051] Furthermore, the coating mechanism further includes a spraying system 411. The spraying system 411 is disposed inside the ALD process chamber 410 and is used to spray-coat the substrate.
[0052] In this embodiment, the metal source, oxygen source, and nitrogen source are evenly sprayed on the substrate through the spraying system 411. The nitrogen source can play a role in isolation and purging to form a uniform film deposition on the substrate, thereby ensuring the smooth progress of the coating process.
[0053] It can be understood that a heater is usually further disposed in the ALD process chamber 410. The heater is used to heat the carrier plate 600 and thereby heat the substrate to the preset temperature required for the coating process, so as to ensure the stable progress of the substrate coating.
[0054] Furthermore, by disposing the feeding chamber 430 before the heating chamber 420, the purpose is to first perform a vacuum pumping operation through the feeding chamber 430 before entering the heating chamber 420 so that the substrate is in the vacuum environment required for the coating process.
[0055] The discharge chamber 440 is connected to the ALD process chamber 410, that is, the discharge chamber 440 is disposed between the ALD process chamber 410 and the cooling table 700. Thus, the discharge chamber 440 restores the atmospheric environment from the vacuum environment, facilitating the transportation of the coated substrate and the carrier plate 600 to the cooling table 700 in the atmospheric environment for cooling, and then transporting them from the cooling table to the loading and unloading machine 100 for loading and unloading operations.
[0056] ALD process chamber. Furthermore, by disposing the heating chamber 420 before the ALD process chamber 410, the heating chamber 420 is used to heat the substrate to the preset temperature required for the coating process. For example, the preset temperature of the ALD coating process can be 85°C to 120°C. Of course, it is not limited thereto and no specific limitation is made here.
[0057] In other words, by disposing the heating chamber 420 between the feeding chamber 430 and the ALD process chamber 410, that is, before transporting the carrier plate 600 and the substrate to the ALD process chamber 410, first heat them through the heating chamber 420 so that the temperature of the substrate is heated to the temperature required for the coating process, and then transport the substrate to the ALD process chamber 410 for the coating process, enabling the substrate to complete film deposition in the evaporation chamber.
[0058] It can be understood that since the carrier plate 600 and the substrate have been preheated in the heating mechanism 200, at this time, the substrate can be quickly heated to the temperature required for the coating process through the heating chamber 420, thereby significantly improving the heating efficiency and increasing the production capacity.
[0059] In addition, it is worth mentioning that since the feeding chamber 430, the heating chamber 420, the ALD process chamber 410, and the discharging chamber 440 are connected in sequence, a vacuum environment can be provided for the substrate through the feeding chamber 430, and vacuum pumping devices can be provided in the heating chamber 420, the ALD process chamber 410, and the discharging chamber 440 to ensure that the substrate completes the coating process in a vacuum environment; of course, in other embodiments, multiple chambers can also be evacuated only through the feeding chamber 430, as long as a vacuum environment can be provided for the substrate, and specific limitations are not made here.
[0060] Furthermore, by providing a cooling table 700 between the discharging chamber 440 and the loading and unloading machine 100, the substrate is cooled on the cooling table 700 first after the coating is completed, and the temperature of the substrate is reduced to a preset temperature before it is transported to the loading and unloading machine 100 for unloading.
[0061] Thus, it can be seen that the loading and unloading machine 100, the heating mechanism 200, the transfer mechanism 300, the feeding chamber 430, the heating chamber 420, the ALD process chamber 410, the discharging chamber 440, and the cooling table 700 are connected in sequence, and the cooling table 700 is also connected to the loading and unloading machine 100, so that the ALD device 10 realizes automated cyclic production operation of the production line, significantly improving the automation degree of the ALD device.
[0062] In summary, the embodiment of the present utility model provides an ALD device 10. The substrate is loaded by the loading and unloading machine 100, and the loading and unloading machine 100 transports the substrate to the heating mechanism 200; the heating mechanism 200 transports the substrate from the loading and unloading machine 100 to the transfer mechanism 300, and pre-heats the substrate while transporting it, so as to heat the substrate in advance; after the transfer mechanism 300 receives the substrate transported from the heating mechanism 200, it transports the substrate to the coating mechanism 400. The coating mechanism 400 first heats the substrate to the temperature required for coating, and then performs the coating process on the substrate. After the coating is completed, the coating mechanism 400 transports the substrate to the loading and unloading machine 100; the loading and unloading machine 100 receives the substrate that has completed coating and unloads the substrate, and then loads a new substrate and transports the substrate to the heating mechanism 200 again, and this cycle is carried out. Therefore, in the ALD device 10 provided by the present utility model, during the process that the heating mechanism 200 transports the substrate from the loading and unloading machine 100 to the transfer mechanism 300, the substrate is also pre-heated at the same time, so as to heat the temperature of the substrate to be close to or equal to the temperature required for the coating process. Thus, after the transfer mechanism 300 transports the substrate to the coating mechanism 400, the heating time of the coating mechanism 400 for the substrate is reduced, thereby improving the production efficiency of the ALD device 10, and thus enhancing the production capacity and output of the ALD device 10.
[0063] As described above, the above is only the specific embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed by the present utility model should be covered by the protection scope of the present utility model. Therefore, the protection scope of the present utility model should be subject to the protection scope of the claimed rights.
Claims
1. An ALD device, characterized in that, It includes a loading and unloading machine (100), a heating mechanism (200), a transfer mechanism (300), and a coating mechanism (400) arranged in sequence. The loading and unloading machine (100) is used to convey a substrate to the heating mechanism (200). The heating mechanism (200) is used to heat the substrate while conveying the substrate to the transfer mechanism (300). The transfer mechanism (300) is used to receive the substrate from the heating mechanism (200) and convey the substrate to the coating mechanism (400) for a coating process. The loading and unloading machine (100) is also used to receive the substrate that has completed the coating process, unload and then load the received substrate and convey it to the heating mechanism (200) again, and cycle in this way.
2. The ALD device according to claim 1, characterized in that, The heating mechanism (200) includes a heating element (210), and the heating element (210) is arranged on the conveying path of the substrate.
3. The ALD device according to claim 2, wherein The heating mechanism (200) further includes a heat insulation box (220). The heating element (210) is arranged in the heat insulation box (220), and a first heat insulation layer is arranged in the heat insulation box (220).
4. The ALD device according to claim 2, characterized in that, The heating mechanism (200) further includes a first mirror reflector (221), and the first mirror reflector (221) is arranged on the periphery of the heating element (210).
5. The ALD apparatus according to claim 1, wherein, The transfer mechanism (300) includes a lift (310) and a heat preservation box (320). The lift (310) is arranged in the heat preservation box (320), and a second heat insulation layer is arranged in the heat preservation box (320).
6. The ALD device according to claim 5, characterized in that, A second mirror reflector (321) is also arranged in the heat preservation box (320).
7. The ALD device according to claim 1, wherein The coating mechanism (400) includes an ALD process chamber (410) and a spraying system (411). The spraying system (411) is arranged in the ALD process chamber (410), and the spraying system (411) is used to spray the substrate.
8. The ALD apparatus according to claim 7, wherein The coating mechanism (400) further includes a heating chamber (420). The heating chamber (420) is arranged between the transfer mechanism (300) and the ALD process chamber (410), and the heating chamber (420) is used to heat the substrate to the temperature required for the coating process.
9. The ALD device according to claim 7, wherein, The coating mechanism (400) further includes a feeding chamber (430) and a discharging chamber (440). The feeding chamber (430) and the discharging chamber (440) are respectively located on both sides of the ALD process chamber (410), and the feeding chamber (430) is connected to the transfer mechanism (300), and the discharging chamber (440) is connected to the loading and unloading machine (100).
10. The ALD apparatus according to claim 1, wherein, The ALD device further includes a cooling table (700). The cooling table (700) is arranged between the coating mechanism (400) and the loading and unloading machine (100), and a cooling device is arranged on the cooling table (700) for dissipating heat from the substrate.