Cathode plasma electrolytic deposition device for welding strip machining

Abstract

The utility model discloses a cathode plasma electrolytic deposition device for welding strip processing, which is applied to the technical field of welding strip processing and comprises a fixing groove, side plates are welded on two sides of the top of the fixing groove, an electrolytic tank is arranged in the fixing groove, and a welding strip winding drum rotatably connected with the side plates is arranged on one side of the top of the fixing groove. The rolled welding strip is slowly pulled through the collecting winding drum to be subjected to electrolytic deposition of a plating layer in the electrolytic bath, and the welding strip is rolled again after a plating solution is rapidly air-dried through the fan. Therefore, the deposition effect of the electrolytic plating layer of the welding strip can be guaranteed, and the machining efficiency of the welding strip can be improved. The electrolytic bath is pushed to rise through the elastic force of the spring, so that the liquid level of the plating solution rises due to position rise after the plating solution in the electrolytic bath is reduced. Therefore, the liquid level of the plating solution always submerges the solder strip, the plating layer on the surface of the solder strip is deposited comprehensively, and omission is avoided. Meanwhile, the plating solution adding frequency is reduced, and practicability is improved.

Description

Technical Field

[0001] The utility model belongs to the technical field of solder strip processing, and particularly relates to a cathode plasma electrolytic deposition device for solder strip processing. Background Art

[0002] In the existing photovoltaic solder strip processing, in a salt solution for pre-plating metal, with the substrate metal to be plated as the cathode, through electrolysis, cations of the pre-plated metal in the plating solution are deposited on the surface of the substrate metal to form a coating, thereby improving the solderability of the solder strip and reducing the resistivity.

[0003] Currently, the Chinese utility model with the publication number: CN212640624U discloses a tellurium electrolytic deposition device, which includes a liquid preparation kettle, an electrolytic cell and a circulating tank located at a lower position arranged on the same horizontal plane. A conductive copper bar is arranged on the electrolytic cell. The liquid preparation kettle and the electrolytic cell are respectively connected to the circulating tank through overflow pipes. An overflow tank communicating with the overflow pipe is arranged on the upper side of the electrolytic cell. A switch valve and a flow meter are arranged on the overflow pipe. The switch valve and the flow meter are connected to a PLC control cabinet. A rectifying power supply connected to the conductive copper bar is arranged in the PLC control cabinet. A circulating pump is arranged in the circulating tank. A liquid inlet is arranged at the bottom end of the electrolytic cell. The liquid inlet is connected to the circulating pump through a circulating pipe; the electrolyte can be electrolyzed while circulating and flowing during the electrolysis process, which maximally ensures the uniformity of the electrolyte ion concentration during the electrolysis process and improves the electrolysis efficiency and the quality of the electrolytic tellurium product.

[0004] When the existing electrolytic deposition device processes the solder strip, since the solder strip needs to be completely immersed in the plating solution in the electrolytic cell to ensure the comprehensiveness of the coating formed on the surface of the solder strip. However, after the solder strip is taken out of the electrolytic cell, a layer of plating solution will adhere to its surface, which will cause the reduction of the plating solution over a long time, and the liquid level will drop and cannot submerge the solder strip. It is necessary to frequently add the plating solution to the electrolytic cell, and the addition frequency is relatively high, which affects the efficiency. And the existing solder strip electrolytic deposition processing generally puts the solder strip in a roll into the electrolytic cell, and the mutually wound solder strips are relatively tight. The inner solder strip often takes a long time to deposit a coating on the surface, and it is also difficult to ensure the comprehensiveness of the coating. Therefore, the processing effect is poor and the practicability is low. Summary of the Utility Model

[0005] The purpose of the utility model is to provide a cathode plasma electrolytic deposition device for solder strip processing, which has the advantages of improving the deposition effect of the electrolytic coating of the solder strip, reducing the addition frequency of the plating solution, and improving the processing efficiency.

[0006] The above technical object of the utility model is achieved through the following technical solutions: A cathode plasma electrolytic deposition device for solder tape processing, including a fixed tank, both sides of the top of the fixed tank are welded with side plates, an electrolytic tank is arranged inside the fixed tank, one side of the top of the fixed tank is provided with a solder tape reel rotatably connected to the side plate, the top of the electrolytic tank is provided with a fixed bracket fixedly connected to the side plate, both sides of the top of the fixed bracket are rotatably connected with a first fixed reel, both sides inside the electrolytic tank are provided with a second fixed reel rotatably connected to the fixed bracket, and the surface of the solder tape reel is wound with a solder tape slidably connected to the first fixed reel and the second fixed reel respectively.

[0007] By adopting the above technical solutions, the wound solder tape is slowly pulled by the collecting reel to electrolytically deposit a coating inside the electrolytic tank, and after the plating solution is quickly air-dried by the blower, it is re-wound. Thus, both the deposition effect of the electrolytic coating of the solder tape can be ensured, and the processing efficiency of the solder tape can be improved. The electrolytic tank is pushed to rise by the elastic force of the spring, so that when the plating solution inside the electrolytic tank decreases, the liquid level of the plating solution will also rise due to the increase in position. Thus, it is ensured that the liquid level of the plating solution always covers the solder tape, so that the surface coating of the solder tape is deposited comprehensively without omission. At the same time, the frequency of adding the plating solution is reduced, and the practicability is improved.

[0008] The utility model is further arranged as: Four stretching reels rotatably connected to the side plate are arranged on one side of the top of the fixed tank away from the solder tape reel, one ends of the solder tapes away from the solder tape reel are all slidably connected to the surfaces of the four stretching reels, ventilation grooves penetrating through the side plates are arranged at the bottoms of the four stretching reels, and blowers used in cooperation with the solder tapes are bolted inside the ventilation grooves.

[0009] By adopting the above technical solutions, both the deposition effect of the electrolytic coating of the solder tape can be ensured, and the processing efficiency of the solder tape can be improved.

[0010] The utility model is further arranged as: Fixed rods are bolted on both sides inside the fixed tank, sliding sleeves sleeved on the fixed rods in a sliding manner are bolted on both sides outside the electrolytic tank, springs sleeved on the surfaces of the fixed rods are fixedly connected to the bottoms of the sliding sleeves, conductive plug rods are welded on both sides of the bottom of the electrolytic tank, and the bottoms of the conductive plug rods are electrically connected to external devices through wires.

[0011] By adopting the above technical solutions, it is ensured that the liquid level of the plating solution always covers the solder tape, so that the surface coating of the solder tape is deposited comprehensively without omission, and at the same time, the frequency of adding the plating solution is reduced.

[0012] The utility model is further arranged as: A collecting reel rotatably connected to the side plate is arranged on one side of the stretching reel away from the solder tape reel, a motor with an output end fixedly connected to the collecting reel is bolted on one side outside the side plate, and one end of the solder tape away from the solder tape reel is fixedly wound on the surface of the collecting reel.

[0013] With the above technical solution, the motor is started to drive the collecting reel to rotate, so as to continuously pull out the solder tape on the surface of the solder tape reel for electrolytic deposition coating, and then rewind it. The rotation speed of the collecting reel can be adjusted according to the deposition speed of the solder tape coating to ensure the comprehensive deposition of the solder tape coating.

[0014] The utility model is further arranged as follows: a buffer pad bonded to the fixed groove is arranged at the bottom of the electrolytic cell.

[0015] With the above technical solution, the collision between the electrolytic cell and the fixed groove is buffered, thereby reducing vibration and preventing the plating solution inside the electrolytic cell from spilling out.

[0016] The utility model is further arranged as follows: a detection door is bolted to one side outside the fixed groove.

[0017] With the above technical solution, it is convenient to repair and replace the parts inside the fixed groove, improving the practicability.

[0018] The utility model is further arranged as follows: an adsorption cotton used in cooperation with the solder tape is bonded to one side inside the fixed groove.

[0019] With the above technical solution, after the solder tape comes out of the electrolytic cell, the excess plating solution on its surface can be adsorbed, thereby improving the air drying efficiency.

[0020] The utility model is further arranged as follows: a filter screen is bolted to one side of the ventilation groove at the input end of the fan.

[0021] With the above technical solution, dust and impurities are prevented from being inhaled, ensuring the cleanliness of the solder tape surface.

[0022] In summary, the utility model has the following beneficial effects:

[0023] 1. The solder tape wound up is slowly pulled by the collecting reel to electrolytically deposit the coating inside the electrolytic cell, and after the plating solution is quickly air-dried by the fan, it is rewound again. Thus, both the deposition effect of the electrolytic coating of the solder tape can be ensured, and the processing efficiency of the solder tape can be improved;

[0024] 2. The electrolytic cell is pushed to rise by the elastic force of the spring, so that after the plating solution inside the electrolytic cell decreases, the liquid level of the plating solution will also rise due to the rise in position. Thus, it is ensured that the liquid level of the plating solution always covers the solder tape, so that the surface coating of the solder tape is comprehensively deposited without omission. At the same time, the frequency of adding the plating solution is reduced, improving the practicability. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 is a schematic structural diagram of the utility model;

[0026] Figure 2It is a structural sectional view of the present utility model;

[0027] Figure 3 is the present utility model Figure 2 Enlarged view of point A in it.

[0028] Reference numerals: 1, fixed groove; 2, side plate; 3, solder tape reel; 4, collecting reel; 5, electrolytic cell; 6, fixed bracket; 7, first fixed reel; 8, solder tape; 9, second fixed reel; 10, stretching reel; 11, ventilation slot; 12, fan; 13, conductive plug; 14, fixed rod; 15, sliding sleeve; 16, spring; 17, buffer pad; 18, filter screen; 19, inspection door; 20, motor; 21, adsorption cotton. Specific embodiments

[0029] The present utility model will be further described in detail below with reference to the accompanying drawings.

[0030] Embodiment 1:

[0031] Refer to Figure 1 , Figure 2 , Figure 3 , a cathode plasma electrolytic deposition device for solder tape processing, including a fixed groove 1, both sides of the top of the fixed groove 1 are welded with side plates 2, an electrolytic cell 5 is arranged inside the fixed groove 1, a solder tape reel 3 rotatably connected to the side plate 2 is arranged on one side of the top of the fixed groove 1, a fixed bracket 6 fixedly connected to the side plate 2 is arranged on the top of the electrolytic cell 5, both sides of the top of the fixed bracket 6 are rotatably connected with first fixed reels 7, both sides inside the electrolytic cell 5 are provided with second fixed reels 9 rotatably connected to the fixed bracket 6, and the surface of the solder tape reel 3 is wound with a solder tape 8 slidably connected to the first fixed reel 7 and the second fixed reel 9 respectively. The wound solder tape 8 is slowly pulled by the collecting reel 4 to electrolytically deposit a coating inside the electrolytic cell 5, and then the plating solution is quickly dried by the fan 12 and then re-wound. Thus, both the deposition effect of the solder tape electrolytic coating can be ensured and the solder tape processing efficiency can be improved.

[0032] Refer to Figure 1 , Figure 2 , four stretching reels 10 rotatably connected to the side plate 2 are arranged on the side of the top of the fixed groove 1 away from the solder tape reel 3, one end of the solder tape 8 away from the solder tape reel 3 is slidably connected to the surface of the four stretching reels 10, and ventilation slots 11 penetrating through the side plate 2 are arranged at the bottoms of the four stretching reels 10, and a fan 12 cooperating with the solder tape 8 is bolted inside the ventilation slots 11. Both the deposition effect of the solder tape electrolytic coating can be ensured and the solder tape processing efficiency can be improved.

[0033] Refer to Figure 1 , Figure 2, on the side of the stretching reel 10 away from the solder tape reel 3, there is a collecting reel 4 rotatably connected to the side plate 2. On one side outside the side plate 2, there is a motor 20 whose output end is fixedly connected to the collecting reel 4. One end of the solder tape 8 away from the solder tape reel 3 is fixedly wound around the surface of the collecting reel 4. By starting the motor 20 to drive the collecting reel 4 to rotate, the solder tape 8 on the surface of the solder tape reel 3 can be continuously pulled out for electrolytic deposition coating and then rewound. The rotation speed of the collecting reel 4 can be adjusted according to the deposition speed of the solder tape 8 coating to ensure the comprehensive deposition of the solder tape 8 coating.

[0034] Reference Figure 2 , on one side of the inside of the ventilation groove 11 at the input end of the fan 12, there is a filter screen 18 bolted. To prevent the inhalation of dust and impurities and ensure the cleanliness of the surface of the solder tape 8.

[0035] Brief description of the usage process: The solder tape 8 on the surface of the solder tape reel 3 is respectively passed through the first fixed reel 7 and the second fixed reel 9. So that the solder tape 8 can sink into the plating solution inside the electrolytic cell 5. Then it passes through the stretching reel 10, and the other end is fixedly wound around the collecting reel 4. When the collecting reel 4 starts to rotate, it can slowly drive the solder tape 8 to continuously slide inside the electrolytic cell 5. After the conductive plug 13 is energized, the pre-plated metal in the plating solution can be deposited on the surface of the solder tape 8 to form a coating. Then move the solder tape 8 to the position of the stretching reel 10, and start the fan 12 to drive the air to flow inside the ventilation groove 11, thereby blowing the solder tape 8 to quickly dry the coating on the surface of the solder tape 8. So that the electrolytically deposited solder tape 8 can be directly wound onto the surface of the collecting reel 4.

[0036] Embodiment 2:

[0037] Reference Figure 1 、 Figure 2 、 Figure 3 , a cathode plasma electrolytic deposition device for solder tape processing, including a fixed tank 1. On both sides of the top of the fixed tank 1, there are side plates 2 welded. Inside the fixed tank 1, there is an electrolytic cell 5. On one side of the top of the fixed tank 1, there is a solder tape reel 3 rotatably connected to the side plate 2. On the top of the electrolytic cell 5, there is a fixed bracket 6 fixedly connected to the side plate 2. On both sides of the top of the fixed bracket 6, there are first fixed reels 7 rotatably connected. On both sides inside the electrolytic cell 5, there are second fixed reels 9 rotatably connected to the fixed bracket 6. The solder tape 8 wound around the surface of the solder tape reel 3 is slidably connected to the first fixed reel 7 and the second fixed reel 9 respectively. By the elastic force of the spring 16, the electrolytic cell 5 is pushed to rise. After the plating solution inside the electrolytic cell 5 decreases, the liquid level of the plating solution will also rise due to the increase in position. Thus ensuring that the liquid level of the plating solution always covers the solder tape 8, making the coating deposition on the surface of the solder tape 8 comprehensive and without omission. At the same time, reducing the frequency of plating solution addition and improving the practicability.

[0038] Reference Figure 2 、Figure 3 On both sides inside the fixing groove 1, fixing rods 14 are bolted. On both sides outside the electrolytic cell 5, sliding sleeves 15 that are slidably sleeved on the fixing rods 14 are bolted. At the bottom of the sliding sleeve 15, a spring 16 sleeved on the surface of the fixing rod 14 is fixedly connected. On both sides of the bottom of the electrolytic cell 5, conductive insertion rods 13 are welded. The bottom of the conductive insertion rod 13 is electrically connected to external equipment through wires. Ensure that the plating solution level always submerges the solder strip 8, so that the surface coating of the solder strip 8 is deposited comprehensively without omission, and at the same time reduce the frequency of adding the plating solution.

[0039] Reference Figure 2 、 Figure 3 A buffer pad 17 adhesively bonded to the fixing groove 1 is provided at the bottom of the electrolytic cell 5. Buffer the collision between the electrolytic cell 5 and the fixing groove 1, thereby reducing vibration and preventing the plating solution inside the electrolytic cell 5 from spilling out.

[0040] Reference Figure 1 On one side outside the fixing groove 1, a detection door 19 is bolted. Facilitate the maintenance and replacement of the parts inside the fixing groove 1, and improve the practicability.

[0041] Reference Figure 2 On one side inside the fixing groove 1, an adsorption cotton 21 used in cooperation with the solder strip 8 is adhesively bonded. After the solder strip 8 comes out of the electrolytic cell 5, it can adsorb the excess plating solution on its surface, thereby improving the air-drying efficiency.

[0042] Brief description of the usage process: Pass the solder strip 8 on the surface of the solder strip reel 3 through the first fixed reel 7 and the second fixed reel 9 respectively. Make the solder strip 8 sink into the plating solution inside the electrolytic cell 5. When the plating solution inside the electrolytic cell 5 decreases due to adhering to the surface of the solder strip 8, at this time, since the weight of the electrolytic cell 5 decreases due to the reduction of the plating solution, it cannot overcome the elastic force of the spring 16, and the spring 16 will push the sliding sleeve 15 to slide on the surface of the fixing rod 14, so that the electrolytic cell 5 rises, and then the plating solution with the reduced liquid level inside the electrolytic cell 5 also rises. The more the plating solution decreases, the lighter the weight of the electrolytic cell 5, and the liquid level can continue to rise to ensure that the plating solution level always submerges the solder strip 8. Only when the liquid level inside the electrolytic cell 5 is almost dry, it is necessary to refill the plating solution, and after filling the plating solution, the electrolytic cell 5 sinks due to the increase in weight, so that the liquid level returns to the original height.

[0043] This specific embodiment is only an explanation of the present invention, and it is not a limitation of the present invention. Those skilled in the art can make modifications without creative contributions to this embodiment according to needs after reading this specification, but as long as it is within the scope of the claims of the present invention, it is protected by the patent law.

Claims

1. A cathode plasma electrolytic deposition device for solder strip processing, comprising a fixed tank (1), characterized in that: On both sides of the top of the fixed groove (1), side plates (2) are welded. An electrolytic cell (5) is arranged inside the fixed groove (1). On one side of the top of the fixed groove (1), a solder tape reel (3) rotatably connected to the side plate (2) is provided. On the top of the electrolytic cell (5), a fixed bracket (6) fixedly connected to the side plate (2) is provided. On both sides of the top of the fixed bracket (6), first fixed reels (7) are rotatably connected. On both sides inside the electrolytic cell (5), second fixed reels (9) rotatably connected to the fixed bracket (6) are provided. The surface of the solder tape reel (3) is wound with a solder tape (8) slidably connected to the first fixed reel (7) and the second fixed reel (9) respectively.

2. The cathode plasma electrolytic deposition device for solder strip processing according to claim 1, characterized in that: On the side of the top of the fixed groove (1) away from the solder tape reel (3), four stretching reels (10) rotatably connected to the side plate (2) are provided. One end of the solder tape (8) away from the solder tape reel (3) is slidably connected to the surfaces of the four stretching reels (10). At the bottom of the four stretching reels (10), ventilation slots (11) penetrating through the side plate (2) are provided. Inside the ventilation slots (11), a blower (12) used in cooperation with the solder tape (8) is bolted.

3. The cathode plasma electrolytic deposition device for solder strip processing according to claim 1, wherein: On both sides inside the fixed groove (1), fixed rods (14) are bolted. On both sides outside the electrolytic cell (5), sliding sleeves (15) slidably sleeved on the fixed rods (14) are bolted. The bottom of the sliding sleeve (15) is fixedly connected to a spring (16) sleeved on the surface of the fixed rod (14). On both sides of the bottom of the electrolytic cell (5), conductive plug rods (13) are welded. The bottom of the conductive plug rod (13) is electrically connected to an external device through a wire.

4. A cathode plasma electrolytic deposition device for solder strip processing according to claim 2, characterized in that: On the side of the stretching reel (10) away from the solder tape reel (3), a collecting reel (4) rotatably connected to the side plate (2) is provided. On one side outside the side plate (2), a motor (20) with an output end fixedly connected to the collecting reel (4) is bolted. One end of the solder tape (8) away from the solder tape reel (3) is fixedly wound around the surface of the collecting reel (4).

5. A cathode plasma electrolytic deposition device for solder strip processing according to claim 1, characterized in that: A buffer pad (17) bonded to the fixed groove (1) is arranged at the bottom of the electrolytic cell (5).

6. The cathode plasma electrolytic deposition device for solder strip processing according to claim 1, characterized in that: An inspection door (19) is bolted on one side outside the fixed groove (1).

7. A cathode plasma electrolytic deposition device for solder strip processing according to claim 1, characterized in that: An adsorption cotton (21) used in cooperation with the solder tape (8) is bonded to one side inside the fixed groove (1).

8. A cathode plasma electrolytic deposition device for solder strip processing according to claim 2, characterized in that: A filter screen (18) is bolted on the side of the inside of the ventilation slot (11) at the input end of the blower (12).

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