Wafer positioning jig with specific non-silver plating area

Abstract

The utility model discloses a wafer positioning jig with a specific non-silver plating area, relates to the field of electroplating, and aims to solve the problems that the binding force between conductive adhesive and a wafer is poor, the conductive adhesive is easy to fall off, and the quality of a wafer finished product is influenced, the wafer positioning jig comprises a framework, a lower cover plate is matched on the back surface of the framework, and a lower electrode plate, a middle plate and an upper electrode plate are sequentially matched on the front surface of the framework, a clamping groove for fixing a wafer is formed in the middle piece, a silver plating area and a covering area are arranged on the wafer, silver plating parts are arranged on the upper electrode piece and the lower electrode piece, covering parts are further arranged on the upper electrode piece and the lower electrode piece, an upper cover plate is arranged above the upper electrode piece in a matched mode, and hollow-out parts which do not affect silver plating are arranged on the lower cover plate, the framework and the upper cover plate. And a positioning assembly is arranged among the lower cover plate, the framework, the lower electrode plate, the middle plate, the upper electrode plate and the upper cover plate, and the device has the advantages that silver plating is carried out on a specific area of the wafer, shielding is carried out on a non-specific area, and during dispensing, conductive silver adhesive is directly adhered to the crystal, so that the binding force of the conductive silver adhesive and the wafer is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of electroplating, in particular to a wafer positioning jig with a specific silver-free area. Background Technique

[0002] In the encapsulation of existing chips, the following steps are included:

[0003] 1. Inspection of the base and wafers: Conduct quality inspections on the base and wafers to ensure that the materials meet the production standards.

[0004] 2. Wafer arrangement: Arrange the wafers on the base according to the design requirements to prepare for subsequent processes.

[0005] 3. Wafer cleaning: Clean the wafers with a specific solvent to remove surface impurities and ensure the cleanliness of the wafer surface.

[0006] 4. Wafer baking: Bake the cleaned wafers to remove residual moisture and solvent.

[0007] 5. Silver plating: Place the wafers on a silver plating jig and plate silver on the wafers to improve conductivity and stability.

[0008] 6. Chip dispensing: Dispense conductive adhesive on the wafers for fixing the wafers and connecting circuits.

[0009] 7. Silver adhesive curing: Cure the wafers after dispensing to harden the conductive adhesive and fix the wafers.

[0010] 8. Frequency fine-tuning: Fine-tune the oscillation frequency of the wafers by adjusting their physical parameters to ensure frequency accuracy.

[0011] 9. Encapsulation: Encapsulate the adjusted wafers to protect the wafers and provide electrical connections.

[0012] In the above dispensing process, usually conductive silver adhesive is first used to dispense the bottom adhesive on the base, and then the wafers are placed on the silver adhesive, and the surface adhesive is dispensed on the wafers. From the above process, it can be seen that before chip dispensing, the wafers need to be silver plated. Since a silver layer is laid on the wafer surface, the bonding strength of the silver adhesive after baking on it is lower than that of the silver adhesive directly dispensed on the wafer surface, resulting in a poor bonding force between the conductive adhesive and the wafer, easy to fall off, and affecting the quality of the wafer finished product. Content of the Utility Model

[0013] In view of the above situation, to overcome the defects of the prior art, the utility model provides a wafer positioning jig with a specific silver-free area, which effectively solves the problems that the bonding force between the conductive adhesive and the wafer is poor, easy to fall off, and affects the quality of the wafer finished product through this design.

[0014] To achieve the above object, the present utility model provides the following technical solutions: The present utility model includes a skeleton, a lower cover plate is fitted to the back surface of the skeleton, a lower electrode sheet, an intermediate sheet, and an upper electrode sheet are sequentially fitted to the front surface of the skeleton. A card slot for fixing the wafer is provided in the intermediate sheet. The wafer is provided with a silver-plated area and a covering area. Silver-plated parts for cooperating with the silver-plated area are provided on both the upper electrode sheet and the lower electrode sheet. Covering parts for cooperating with the covering area are also provided on the upper electrode sheet and the lower electrode sheet. An upper cover plate is fitted above the upper electrode sheet. Hollow parts that do not affect silver plating are provided on the lower cover plate, the skeleton, and the upper cover plate. A positioning component is provided between the lower cover plate, the skeleton, the lower electrode sheet, the intermediate sheet, the upper electrode sheet, and the upper cover plate;

[0015] The positioning component includes positioning pins, the positioning pins are fixedly connected to the skeleton, and positioning holes for cooperating with the positioning pins are provided on the lower cover plate, the lower electrode sheet, the intermediate sheet, the upper electrode sheet, and the upper cover plate.

[0016] Preferably, identification areas are provided on the skeleton, the lower cover plate, the lower electrode sheet, the intermediate sheet, the upper electrode sheet, and the upper cover plate. The identification area of the lower cover plate is opposite to the identification area of the skeleton in terms of orientation, and the identification areas of the skeleton, the lower electrode sheet, the intermediate sheet, the upper electrode sheet, and the upper cover plate are opposite to each other in terms of orientation.

[0017] Preferably, the area size of the hollow part is the same as the area size of the card slot.

[0018] Preferably, both ends of the positioning pin are of a tapered structure.

[0019] Preferably, a first positioning groove is formed on the skeleton, the first positioning groove is located outside the positioning pin, and second positioning grooves are formed on the lower cover plate, the lower electrode sheet, the intermediate sheet, the upper electrode sheet, and the upper cover plate, and the second positioning grooves are located outside the positioning holes.

[0020] Preferably, two symmetrically distributed first through holes are formed on the skeleton, the two first through holes are distributed at a ninety-degree angle to the two positioning pins, and second through holes corresponding to the first through holes are formed on the lower cover plate, the lower electrode sheet, the intermediate sheet, the upper electrode sheet, and the upper cover plate.

[0021] The outstanding advantages of the present utility model compared with the prior art:

[0022] The silver-plated parts of the lower electrode sheet and the upper electrode sheet of the present utility model can accurately isolate the silver-plated area of the wafer fixed in the intermediate sheet for precise silver plating. The covering parts prevent the silver layer from spreading into the covering area of the lens. The silver-plated parts silver-plate specific areas of the wafer, and the covering parts block non-specific areas of the wafer. On the premise of ensuring the guiding performance and stability performance of the wafer, the conductive silver glue can be directly adhered to the crystal, improving the bonding force between the conductive silver glue and the wafer. Description of the Drawings

[0023] Figure 1 This is a schematic diagram of the overall structure of the present utility model.

[0024] Figure 2 This is a schematic diagram of the disassembled structure of the present utility model.

[0025] Figure 3 This is a schematic diagram of the front structure of the middle piece of the present utility model.

[0026] Figure 4 This is a schematic diagram of the front structure of the upper electrode piece of the present utility model.

[0027] Reference numerals in the figure: 1. Skeleton; 2. Lower cover plate; 3. Lower electrode piece; 4. Middle piece; 5. Upper electrode piece; 6. Card slot; 7. Silver plating part; 8. Covering part; 9. Hollow part; 10. Positioning pin; 11. Positioning hole; 12. Identification area; 13. First positioning groove; 14. Second positioning groove; 15. First through hole; 16. Second through hole; 17. Upper cover plate. Detailed implementation manners

[0028] Next, in combination with the drawings in the embodiments of the present utility model, the technical solutions in the embodiments of the present utility model will be clearly and completely described. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all of the embodiments; based on the embodiments in the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present utility model.

[0029] Please refer to the attached Figures 1-4 , a wafer positioning fixture with a specific non - silver - plated area in this embodiment: It includes a skeleton 1, a lower cover plate 2 is fitted to the back of the skeleton 1, a lower electrode piece 3, a middle piece 4 and an upper electrode piece 5 are sequentially fitted to the front of the skeleton 1. A card slot 6 for fixing the wafer is provided inside the middle piece 4. The wafer has a silver - plated area and a covering area. Silver plating parts 7 that cooperate with the silver - plated area are provided on both the upper electrode piece 5 and the lower electrode piece 3. Covering parts 8 that cooperate with the covering area are also provided on the upper electrode piece 5 and the lower electrode piece 3. An upper cover plate 17 is fitted above the upper electrode piece 5. Hollow parts 9 that do not affect silver plating are provided on the lower cover plate 2, the skeleton 1 and the upper cover plate 17. A positioning assembly is provided between the lower cover plate 2, the skeleton 1, the lower electrode piece 3, the middle piece 4, the upper electrode piece 5 and the upper cover plate 17;

[0030] The positioning assembly includes a positioning pin 10, the positioning pin 10 is fixedly connected to the skeleton 1, and positioning holes 11 that cooperate with the positioning pin 10 are provided on the lower cover plate 2, the lower electrode piece 3, the middle piece 4, the upper electrode piece 5 and the upper cover plate 17.

[0031] The middle sheet 4 is located between the upper electrode sheet 5 and the lower electrode sheet 3. The card slot 6 in the middle of the middle sheet 4 is used to fix the wafer. The thickness of the middle sheet 4 is the same as that of the wafer. During use, the wafer is clamped in the card slot 6. The upper surface of the wafer is flush with the upper surface of the middle sheet 4, and the lower surface of the wafer is in contact with the lower surface of the middle sheet 4. The upper electrode sheet 5 is placed at the upper end of the middle sheet 4, and the lower electrode sheet 3 is placed below the middle sheet 4. When the lower electrode sheet 3, the middle sheet 4, and the upper electrode sheet 5 are closely attached to each other, the covering parts 8 of the upper electrode sheet 5 and the lower electrode sheet 3 will closely adhere to the covering area of the wafer, further pressing and fixing the wafer. There are silver plating holes in the silver plating parts 7 of the upper electrode sheet 5 and the lower electrode sheet 3. The silver plating holes can allow silver liquid to enter. The silver liquid contacts the silver plating area of the wafer through the silver plating holes, so that the silver plating areas on the upper and lower surfaces of the wafer are completed with silver plating. Further, the shape of the silver plating on the silver plating area is the same as the shape of the silver plating holes. During use, the silver plating holes on the silver plating part 7 can be adjusted according to actual needs. The lower cover plate 2, the skeleton 1, the lower electrode sheet 3, the middle sheet 4, the upper electrode sheet 5, and the upper cover plate 17 are placed in order from bottom to top. The positioning pins 10 on the skeleton 1 extend upwards and downwards. The lower cover plate 2 is stuck on the positioning pins 10 on the lower side of the skeleton 1 through the positioning holes 11. The lower electrode sheet 3, the middle sheet 4, the upper electrode sheet 5, and the upper cover plate 17 are stuck on the positioning pins 10 on the upper side of the skeleton 1 through the positioning holes 11. The lower cover plate 2, the skeleton 1, and the upper cover plate 17 play a role in supporting and fixing the upper electrode sheet 5 and the lower electrode sheet 3. To prevent the silver liquid from entering the silver plating part 7, the lower cover plate 2, the skeleton 1, and the upper cover plate 17 are all provided with hollow parts 9. The hollow parts 9 do not affect the passage of the silver liquid, ensuring the smooth progress of the electroplating work.

[0032] The lower cover plate 2, the skeleton 1, the lower electrode sheet 3, the middle sheet 4, the upper electrode sheet 5, and the upper cover plate 17 are all provided with identification areas 12. The naming of each plate is in the identification area 12. At the same time, through the identification area 12, the front and back sides of the lower cover plate 2, the skeleton 1, the lower electrode sheet 3, the middle sheet 4, the upper electrode sheet 5, and the upper cover plate 17 can be distinguished, which is convenient for users to assemble.

[0033] Further, to facilitate the cooperation between the positioning pins 10 and the positioning holes 11, both ends of the positioning pins 10 are conical structures, which is convenient for the positioning holes 11 to enter the positioning pins 10 during stacking.

[0034] The skeleton 1, the lower cover plate 2, the lower electrode sheet 3, the middle sheet 4, the upper electrode sheet 5, and the upper cover plate 17 are all provided with identification areas 12. The identification areas 12 are used to display the information of the plate and to distinguish the front and back sides of the plate. Among them, the plates of the skeleton 1, the lower electrode sheet 3, the middle sheet 4, the upper electrode sheet 5, and the upper cover plate 17 follow the principle of the front side facing up during stacking. When the lower cover plate 2 and the skeleton 1 are stacked, the back sides of the two are in contact with each other.

[0035] The positioning pins 10 are located on the upper and lower sides of the skeleton 1, and the first through holes 15 are located on the left and right sides of the skeleton 1. The second through holes 16 on the lower cover plate 2, the lower electrode plate 3, the intermediate plate 4, the upper electrode plate 5 and the upper cover plate 17 are also located on the left and right sides. When the lower cover plate 2, the skeleton 1, the lower electrode plate 3, the intermediate plate 4, the upper electrode plate 5 and the upper cover plate 17 are neatly stacked, the first through holes 15 and the second through holes 16 form an unobstructed channel, so as to check whether the six are neatly stacked. Further, during silver plating, positioning posts can also be installed in the silver plating bath. When in use, the first through holes 15 and the second through holes 16 are inserted onto the positioning posts to ensure the stable placement of the jig in the silver plating bath. Further, the first positioning grooves 13 are located on the upper and lower sides of the positioning pins 10, and the upper and lower sides of the lower cover plate 2, the lower electrode plate 3, the intermediate plate 4, the upper electrode plate 5 and the upper cover plate 17 have second positioning grooves 14. The first positioning grooves 13 and the second positioning grooves 14 can facilitate the distinction between the left and right sides and the upper and lower sides of the lower cover plate 2, the skeleton 1, the lower electrode plate 3, the intermediate plate 4, the upper electrode plate 5 and the upper cover plate 17, and are convenient for the user's stacking work.

[0036] Finally, it should be noted that the above are only the preferred embodiments of the present invention and are not used to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, for those skilled in the art, they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements for some of the technical features. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A wafer positioning fixture with a specific non-silver-plated area, characterized in that: It includes a framework (1), a lower cover plate (2) is fitted to the back surface of the framework (1), a lower electrode sheet (3), an intermediate sheet (4) and an upper electrode sheet (5) are sequentially fitted to the front surface of the framework (1), a card slot (6) for fixing a wafer is provided inside the intermediate sheet (4), silver plating areas and covering areas are provided on the wafer, silver plating parts (7) for cooperating with the silver plating areas are provided on both the upper electrode sheet (5) and the lower electrode sheet (3), covering parts (8) for cooperating with the covering areas are further provided on the upper electrode sheet (5) and the lower electrode sheet (3), an upper cover plate (17) is fitted above the upper electrode sheet (5), hollow parts (9) that do not affect silver plating are provided on the lower cover plate (2), the framework (1) and the upper cover plate (17), and a positioning assembly is provided between the lower cover plate (2), the framework (1), the lower electrode sheet (3), the intermediate sheet (4), the upper electrode sheet (5) and the upper cover plate (17); The positioning assembly includes positioning pins (10), the positioning pins (10) are fixedly connected to the framework (1), and positioning holes (11) for cooperating with the positioning pins (10) are provided on the lower cover plate (2), the lower electrode sheet (3), the intermediate sheet (4), the upper electrode sheet (5) and the upper cover plate (17).

2. The wafer positioning fixture with a specific non-silver-plated area according to claim 1, characterized in that: Marking areas (12) are provided on the framework (1), the lower cover plate (2), the lower electrode sheet (3), the intermediate sheet (4), the upper electrode sheet (5) and the upper cover plate (17), the marking area (12) of the lower cover plate (2) is opposite to the marking area (12) of the framework (1) in orientation, and the marking areas (12) of the framework (1), the lower electrode sheet (3), the intermediate sheet (4), the upper electrode sheet (5) and the upper cover plate (17) are opposite to each other in orientation.

3. A wafer positioning jig with a specific non-silver-plated area according to claim 1, characterized in that: The area size of the hollow part (9) is the same as the area size of the card slot (6).

4. A wafer positioning jig with a specific non-silver-plated area according to claim 1, characterized in that: Both ends of the positioning pin (10) are of a conical structure.

5. A wafer positioning jig with a specific non-silver-plated area according to claim 1, characterized in that: A first positioning groove (13) is formed on the framework (1), the first positioning groove (13) is located outside the positioning pin (10), and second positioning grooves (14) are formed on the lower cover plate (2), the lower electrode sheet (3), the intermediate sheet (4), the upper electrode sheet (5) and the upper cover plate (17), and the second positioning grooves (14) are located outside the positioning holes (11).

6. The wafer positioning fixture with a specific non-silver-plated area according to claim 1, characterized in that: Two symmetrically distributed first through holes (15) are formed on the framework (1), the two first through holes (15) are distributed at a ninety-degree angle with the two positioning pins (10), and second through holes (16) corresponding to the first through holes (15) are formed on the lower cover plate (2), the lower electrode sheet (3), the intermediate sheet (4), the upper electrode sheet (5) and the upper cover plate (17).

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