LED lamp bead

Abstract

The utility model provides a light-emitting diode (LED) lamp bead, which comprises a mounting seat, a lamp panel fixed above the mounting seat, an LED lamp bead arranged on the lamp panel, a chip arranged on the lamp panel and used for controlling the LED lamp bead, and a wire rod connected with the chip and the LED lamp bead and positioned in the mounting seat, a clamping groove is arranged below the mounting seat, and a radiating device is arranged in the clamping groove. According to the LED lamp bead provided by the utility model, the heat dissipation device is arranged below the mounting base, so that heat released when the LED lamp bead works can be dissipated in time, and the LED lamp bead can keep working at normal temperature, so that the service life of the LED lamp bead is prolonged, LED light attenuation is reduced, and after the heat dissipation device is mounted, the LED lamp bead with higher power can be used, and different power requirements are met.

Description

Technical Field

[0001] The utility model relates to the technical field of LED lamp beads, and specifically to an LED lamp bead. Background Art

[0002] An LED lamp bead is a new type of light-emitting component with many remarkable advantages. It is small in size but can emit bright and stable light. It performs excellently in energy conservation. Compared with traditional light sources, its energy consumption is greatly reduced, which helps to save energy and reduce electricity bills. The service life of an LED lamp bead is extremely long, up to tens of thousands of hours, reducing the trouble and cost of frequent bulb replacement. It has high luminous efficiency, strong brightness, and rich and diverse light colors, which can meet the needs of different scenarios.

[0003] In terms of durability, it has good seismic and shock resistance performance and can adapt to various environments. Whether it is used in home lighting, commercial places, automotive headlights, electronic displays and other fields, LED lamp beads play an important role and become one of the core components of modern lighting and display technologies, bringing convenience and a rich and colorful lighting experience to our lives.

[0004] For existing LED lamp beads, once the working time is long, the heat will be too high, thus affecting the service life of the LED lamp beads. Summary of the Utility Model

[0005] In order to overcome the above technical problems, the utility model provides an LED lamp bead to improve the problem of too high working temperature.

[0006] In order to achieve the above purpose, the utility model proposes an LED lamp bead, which includes a mounting base, a lamp board fixed above the mounting base, an LED lamp bead mounted on the lamp board, a chip mounted on the lamp board for controlling the LED lamp bead, a wire located in the mounting base connecting the chip and the LED lamp bead, a card slot is provided below the mounting base, and a heat dissipation device is mounted in the card slot.

[0007] Mounting a heat dissipation device below the mounting base can dissipate heat from the LED lamp bead above the mounting base, avoiding the LED lamp bead from being burned out due to too high working temperature. The heat dissipation device is snap-fitted and mounted through the card slot provided below the mounting base, making the heat dissipation device easy to disassemble and install. It allows the mounting base to replace heat dissipation devices with different heat dissipation ratios under different working powers of the LED lamp bead, so as to meet the different working environment requirements of the LED lamp bead.

[0008] Preferably, heat dissipation fins are formed on the heat dissipation device.

[0009] Setting heat dissipation fins can increase the heat dissipation area of the heat dissipation device, thereby more quickly conducting heat to the air and quickly cooling the LED lamp bead.

[0010] Preferably, a ventilation pipeline extending along the length direction of the heat dissipation device and penetrating the heat dissipation device is formed on the heat dissipation device.

[0011] Forming a ventilation pipeline on the heat dissipation device can, on the one hand, increase the heat dissipation area, and on the other hand, facilitate the passage of air through the ventilation pipeline, thereby taking away the conducted heat and achieving a rapid cooling effect.

[0012] Preferably, a blower for assisting ventilation is provided inside the ventilation pipeline.

[0013] Setting a blower inside the ventilation pipeline adopts an active ventilation method, which can achieve cooling more quickly. There is no need to rely on the natural flow of air for cooling, further accelerating the cooling speed.

[0014] Preferably, it further includes a transparent encapsulation cover that is hermetically buckled with the mounting base and covers the lamp board, the LED lamp beads, and the chip.

[0015] Setting a transparent encapsulation cover on the mounting base can observe the actual states of the LED lamp beads, the lamp board, and the chip through the transparent encapsulation cover. If there is damage, it can be replaced in time. The transparent encapsulation cover is buckled and sealed with the mounting base, encapsulating the LED lamp beads and the chip inside, forming a state of isolation inside and outside, isolating the external air and moisture, and preventing corrosion or damage to the internal components.

[0016] Preferably, the transparent encapsulation cover includes a lens part and a covering part, and the lens part is opposite to the position of the LED lamp beads.

[0017] Forming a lens part on the transparent encapsulation cover, with the lens part opposite to the position of the LED lamp beads, can converge or diffuse the light emitted by the LED lamp beads, and the function of the lens part can be set according to actual requirements.

[0018] Preferably, an opaque shielding part is formed on the covering part.

[0019] The function of setting the shielding part is to make the light only pass through the lens part and not be transmitted through other parts, so that the desired lighting effect can be obtained, and there will be no problem that the light at the required irradiation part is not converged or interfered due to diffuse reflection caused by the light transmission of other parts.

[0020] Preferably, the lens part includes a convex lens located on the outer wall of the transparent encapsulation cover and a concave lens located on the inner wall of the transparent encapsulation cover, and an interval space is formed between the convex lens and the concave lens.

[0021] A convex lens structure and a concave lens structure are formed in the lens part, which is equivalent to directionally adjusting the light emitted by the LED lamp bead. It is not only diffusing or converging alone, but also enabling the light to have a set diffusion range at a directional distance, increasing the accuracy of the diffusion effect when the LED lamp bead irradiates.

[0022] Preferably, the wire is hermetically bonded to the mounting base by overmolding.

[0023] The wire is tightly bonded to the mounting base by overmolding, so that air or water in the external environment will not enter the interior of the mounting base, maintaining the internal sealing performance. In addition, by setting the overmolding of the wire as stepped overmolding, a larger bonding area of the wire is provided to reduce the possibility of water seepage of the wire.

[0024] Preferably, the transparent encapsulation cover is hermetically bonded to the mounting base by overmolding.

[0025] The transparent cover is bonded to the mounting base by overmolding to ensure the sealing performance of their mutual bonding.

[0026] For the LED lamp bead provided by the present utility model, by arranging a heat dissipation device below the mounting base, the heat released when the LED lamp bead works can be dissipated in time, enabling the LED lamp bead to work at normal temperature, thereby prolonging the service life of the LED lamp bead, reducing LED light decay. After installing the heat dissipation device, LED lamp beads with higher power can be used to meet different power requirements. Description of the Drawings

[0027] Figure 1 It is a three-dimensional structural schematic diagram of the LED lamp bead provided by the embodiment of the present utility model.

[0028] Description of the Reference Numerals

[0029] 1. Mounting base; 2. LED lamp bead; 3. Chip; 4. Wire; 5. Heat dissipation device; 6. Ventilation pipeline; 7. Transparent encapsulation cover; 8. Lens part. Detailed Embodiment

[0030] The embodiments of the present utility model will be described below with reference to the drawings. The elements and features described in one drawing or one embodiment of the present utility model can be combined with the elements and features shown in one or more other drawings or embodiments. It should be noted that for the sake of clarity, the representation and description of components or processes unrelated to the present utility model and known to those of ordinary skill in the art are omitted in the drawings and the description.

[0031] The present utility model will be further described below with reference to the drawings.

[0032] As Figure 1As shown in the figure, the LED lamp bead provided by the utility model includes a mounting base 1, a lamp board fixed above the mounting base 1, an LED lamp bead 2 mounted on the lamp board, a chip 3 mounted on the lamp board for controlling the LED lamp bead 2, a wire 4 connecting the chip 3 and the LED lamp bead 2 and located inside the mounting base 1, and a card slot is provided below the mounting base 1, and a heat dissipation device 5 is mounted in the card slot.

[0033] Mounting the heat dissipation device 5 below the mounting base 1 can dissipate heat from the LED lamp bead 2 above the mounting base 1, avoiding the LED lamp bead 2 from being burned out due to too high working temperature. The heat dissipation device 5 is snap-fitted and installed through the card slot provided below the mounting base 1, making the heat dissipation device 5 easy to disassemble and install, and allowing different heat dissipation ratio heat dissipation devices 5 to be replaced under different working powers of the LED lamp bead 2, so as to meet the different working environment requirements of the LED lamp bead 2.

[0034] In addition, after the heat dissipation device 5 is snap-fitted and installed with the card slot, the heat dissipation device 5 can also be fixed to the mounting base 1 with screws, making its fixing structure more firm.

[0035] As shown in an embodiment of the utility model, heat dissipation fins are formed on the heat dissipation device 5.

[0036] Setting the heat dissipation fins can increase the heat dissipation area of the heat dissipation device 5, so as to more quickly conduct the heat to the air and quickly cool down the LED lamp bead 2.

[0037] As shown in an embodiment of the utility model, a ventilation pipeline 6 that extends along the length direction of the heat dissipation device 5 and penetrates the heat dissipation device 5 is formed on the heat dissipation device 5.

[0038] Forming the ventilation pipeline 6 on the heat dissipation device 5 can, on the one hand, increase the heat dissipation area, and on the other hand, facilitate the air to pass through the ventilation pipeline 6, so as to take away the conducted heat and achieve a fast cooling effect.

[0039] As shown in an embodiment of the utility model, a fan for assisting ventilation is provided in the ventilation pipeline 6.

[0040] Setting a fan inside the ventilation pipeline 6 adopts an active ventilation method, which can achieve cooling more quickly, without relying on the natural flow of air for cooling, and further speeds up the cooling speed.

[0041] As shown in an embodiment of the utility model, it further includes a transparent encapsulation cover 7 that is hermetically buckled with the mounting base 1 and covers the lamp board, the LED lamp bead 2 and the chip 3.

[0042] A transparent encapsulation cover 7 is provided on the mounting base 1, through which the actual states of the LED lamp beads 2, the lamp board, and the chip 3 can be observed. If there is any damage, it can be replaced in time. The transparent encapsulation cover 7 is snap-fitted and sealed with the mounting base 1 to encapsulate the LED lamp beads 2 and the chip 3 inside, forming a state of isolation between the inside and the outside, isolating the external air and moisture, and preventing corrosion or damage to the internal components.

[0043] As shown in an embodiment of the present utility model, the transparent encapsulation cover 7 includes a lens portion 8 and a covering portion, and the lens portion 8 is opposite to the position of the LED lamp beads 2.

[0044] The lens portion 8 is formed on the transparent encapsulation cover 7 and is opposite to the position of the LED lamp beads 2, which can converge or diffuse the light emitted by the LED lamp beads 2, and the function of the lens portion 8 can be set according to the actual requirements.

[0045] As shown in an embodiment of the present utility model, an opaque shielding portion is formed on the covering portion.

[0046] The function of setting the shielding portion is to make the light only pass through the lens portion 8 and other parts are opaque, so that the desired lighting effect can be obtained, and the problem that the light in the required irradiation part is not converged or interfered due to the diffuse reflection caused by the light transmission of other parts will not occur.

[0047] As shown in an embodiment of the present utility model, the lens portion 8 includes a convex lens located on the outer wall of the transparent encapsulation cover 7 and a concave lens located on the inner wall of the transparent encapsulation cover 7, and a spaced space is formed between the convex lens and the concave lens.

[0048] Forming a convex lens structure and a concave lens structure in the lens portion 8 is equivalent to performing directional adjustment on the light emitted by the LED lamp beads 2, not only diffusing or converging alone, but also enabling the light to have a set diffusion range at a directional distance, increasing the accuracy of the diffusion effect when the LED lamp beads 2 irradiate.

[0049] As shown in an embodiment of the present utility model, the wire 4 and the mounting base 1 are adhesively sealed by encapsulation.

[0050] The wire 4 is tightly adhered to the mounting base 1 by encapsulation, so that the air or water in the external environment will not enter the inside of the mounting base 1, maintaining the internal sealing performance. In addition, by setting the encapsulation of the wire 4 as stepped encapsulation, a larger fitting area of the wire 4 is provided to reduce the possibility of water seepage of the wire 4.

[0051] As shown in an embodiment of the present utility model, the transparent encapsulation cover 7 is adhesively sealed with the mounting base 1 by encapsulation.

[0052] The transparent cover is adhesively bonded to the mounting base 1 by encapsulation to ensure the sealing performance of their mutual adhesion.

[0053] The LED lamp bead 2 provided by the present utility model can dissipate the heat released during the operation of the LED lamp bead 2 in a timely manner by arranging a heat dissipation device 5 below the mounting base 1, enabling the LED lamp bead 2 to work at a normal temperature, thereby prolonging the service life of the LED lamp bead 2, reducing LED light decay. After installing the heat dissipation device 5, a higher-power LED lamp bead 2 can be used to meet different power requirements.

[0054] Although the present utility model and its advantages have been described in detail, it should be understood that various changes, substitutions, and transformations can be made without departing from the spirit and scope of the present utility model as defined by the appended claims. Moreover, the scope of the present application is not limited to the specific embodiments of the processes, devices, means, methods, and steps described in the specification. Those of ordinary skill in the art will readily understand from the disclosure of the present utility model that processes, devices, means, methods, or steps that perform substantially the same function or achieve substantially the same result as the corresponding embodiments described herein can be used according to the present utility model, both existing and those to be developed in the future. Therefore, the appended claims are intended to cover such processes, devices, means, methods, or steps within their scope.

Claims

1. An LED lamp bead, comprising a mounting base (1), a lamp board fixed above the mounting base (1), an LED lamp bead (2) mounted on the lamp board, a chip (3) mounted on the lamp board for controlling the LED lamp bead (2), and a wire (4) connecting the chip (3) and the LED lamp bead (2) and located in the mounting base (1), characterized in that, A card slot is provided below the mounting base (1), and a heat dissipation device (5) is installed in the card slot.

2. The LED lamp bead according to claim 1, wherein, Heat dissipation fins are formed on the heat dissipation device (5).

3. The LED lamp bead according to claim 2, wherein, A ventilation duct (6) extending along the length direction of the heat dissipation device (5) and penetrating the heat dissipation device (5) is formed on the heat dissipation device (5).

4. The LED lamp bead according to claim 3, wherein, A fan for assisting ventilation is provided in the ventilation duct (6).

5. The LED lamp bead according to claim 4, characterized in that, It further includes a transparent encapsulation cover (7) that is hermetically buckled with the mounting base (1) and covers the lamp board, the LED lamp beads (2), and the chip (3).

6. The LED lamp bead according to claim 5, wherein, The transparent encapsulation cover (7) includes a lens part (8) and a covering part, and the lens part (8) is opposite to the position of the LED lamp beads (2).

7. The LED lamp bead according to claim 6, characterized in that, An opaque shielding part is formed on the covering part.

8. The LED lamp bead according to claim 7, characterized in that, The lens part (8) includes a convex lens on the outer wall of the transparent encapsulation cover (7) and a concave lens on the inner wall of the transparent encapsulation cover (7), and an interval space is formed between the convex lens and the concave lens.

9. The LED lamp bead according to claim 8, wherein, The wire (4) and the mounting base (1) are hermetically bonded by encapsulation.

10. The LED lamp bead according to claim 9, characterized in that, The transparent encapsulation cover (7) is hermetically bonded to the mounting base (1) by encapsulation.

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