Novel temperature measurement system structure
The surface temperature of the power module is directly monitored through infrared temperature sensors, and combined with selective wave soldering and vacuum welding processes, the problem of low detection accuracy in traditional temperature measurement systems is solved, and a high-precision and compact temperature measurement system structure is achieved.
Patent Information
- Application Number
- CN202422043368.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-22
- Publication Date
- 2025-07-11
- Estimated Expiration
- 2034-08-22
AI Technical Summary
In traditional temperature measurement systems, the temperature detection path is long, resulting in low detection accuracy.
The infrared temperature sensor is used to directly monitor the surface temperature of the power module, and the monitoring area is isolated through a light hood, and the connection is fixed with a selective wave soldering process and a vacuum welding process to reduce the intermediate transfer path.
It improves temperature monitoring accuracy, compact structure, small size, light weight and high reliability.
Smart Images

Figure CN223091393U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of motor controllers, and particularly relates to a novel temperature measurement system structure. Background Art
[0002] The motor controller is an important component in new energy electric vehicles, which is used to control parameters such as the direction, speed, angle, and response time of the motor. The working temperature of the motor controller has a great influence on its performance and stability. Therefore, a temperature measurement system needs to be set in the motor controller to monitor the temperature of the motor controller and ensure the stable operation of the motor controller in combination with the radiator.
[0003] The traditional temperature measurement system uses a thermistor sensor welded to the radiator to obtain the working temperature by detecting the temperature of the radiator. The temperature conduction path is long, resulting in a large deviation in the detected temperature and low temperature detection accuracy. Therefore, a novel temperature measurement system structure is needed to solve the above problems. Summary of the Utility Model
[0004] The purpose of the utility model is to provide a novel temperature measurement system structure to solve the problems existing in the prior art proposed in the above background art.
[0005] To achieve the above purpose, the utility model provides the following technical solutions:
[0006] A novel temperature measurement system structure includes a drive control board, an infrared temperature sensor, and a power module. The infrared temperature sensor is welded to the drive control board and is electrically connected to the circuit on the drive control board. The power module is arranged on one side of the drive control board. The infrared temperature sensor is located on the top of the power module and is used to monitor the surface temperature of the power module. A light-shielding cover is installed on the infrared temperature sensor, and a radiator is installed at the bottom of the power module.
[0007] Preferably, the infrared temperature sensor and the drive control board are fixedly connected by a selective wave soldering process.
[0008] Preferably, the power module selects a large-current IGBT module with a single-tube package and is directly welded to the radiator by a vacuum soldering process.
[0009] Preferably, the power module and the drive control board are fixedly connected by a selective wave soldering process.
[0010] Compared with the prior art, the beneficial effects of the utility model are:
[0011] 1. The utility model directly detects the surface temperature of the power module through an infrared temperature sensor, reduces the intermediate transmission path, has a small temperature detection deviation, and the infrared temperature sensor effectively isolates the focused temperature monitoring area through a light-shielding cover, reducing the monitoring area, thereby improving the temperature monitoring accuracy.
[0012] 2. The infrared temperature sensor of the utility model is integrated onto the drive control board, with a more compact structural layout, and has the characteristics of small volume, light weight, and high reliability. BRIEF DESCRIPTION OF THE DRAWINGS
[0013] Figure 1 is the explosion structure schematic diagram of the utility model.
[0014] Figure 2 is the installation schematic diagram of the infrared temperature sensor of the utility model.
[0015] In the figure: 1-1, drive control board; 1-2, infrared temperature sensor; 1-3, light-shielding cover; 1-4, power module; 1-5, radiator. DETAILED DESCRIPTION OF THE EMBODIMENTS
[0016] In order to make the technical means, creative features, achieved purposes and functions of the utility model easy to understand, the utility model will be further described below in conjunction with specific embodiments.
[0017] Please refer to Figure 1-2 , the utility model provides the following technical solutions:
[0018] A new temperature measurement system structure includes a drive control board 1-1, an infrared temperature sensor 1-2, and a power module 1-4. The infrared temperature sensor 1-2 is welded to the drive control board 1-1 and is electrically connected to the circuit on the drive control board 1-1. The infrared temperature sensor 1-2 and the drive control board 1-1 are fixedly connected through a selective wave soldering process. The infrared temperature sensor 1-2 is integrated onto the drive control board 1-1, making the motor controller structure more compact, with a smaller volume and lower weight.
[0019] The power module 1-4 is arranged on one side of the drive control board 1-1. The power module 1-4 selects a large-current IGBT module with a single-tube package. This design has a compact structure and a small total thermal resistance of the IGBT, greatly improving the system power density; it is directly welded to the radiator 1-5 through a vacuum soldering process, eliminating the traditional thermal grease and reducing the system thermal resistance; the power module 1-4 and the drive control board 1-1 are fixedly connected through a selective wave soldering process.
[0020] The infrared temperature sensor 1-2 is located at the top of the power module 1-4 and is used to monitor the surface temperature of the power module 1-4. A light-shielding cover 1-3 is installed on the infrared temperature sensor 1-2, and a radiator 1-5 is installed at the bottom of the power module 1-4; the infrared temperature sensor 1-2 effectively isolates the focused temperature monitoring area through the light-shielding cover 1-3, reduces the monitoring area, and improves the monitoring accuracy at the same time.
[0021] Although the embodiments of the present invention have been shown and described, it will be understood by those of ordinary skill in the art that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.
Claims
1. A novel temperature measurement system structure, characterized in that, It includes a drive control board (1-1), an infrared temperature sensor (1-2), and a power module (1-4). The infrared temperature sensor (1-2) is soldered on the drive control board (1-1) and electrically connected to the circuit on the drive control board (1-1). The power module (1-4) is disposed on one side of the drive control board (1-1). The infrared temperature sensor (1-2) is located on top of the power module (1-4) and is used to monitor the surface temperature of the power module (1-4). A light-shielding cover (1-3) is installed on the infrared temperature sensor (1-2), and a radiator (1-5) is installed at the bottom of the power module (1-4).
2. The structure of a novel temperature measurement system according to claim 1, wherein: The infrared temperature sensor (1-2) is fixedly connected to the drive control board (1-1) by a selective wave soldering process.
3. The structure of a novel temperature measurement system according to claim 1, characterized in that: The power module (1-4) selects a large-current IGBT module with a single-tube package and is directly soldered to the radiator (1-5) by a vacuum soldering process.
4. A novel temperature measurement system structure according to claim 1, characterized in that: The power module (1-4) is fixedly connected to the drive control board (1-1) by a selective wave soldering process.